Charging system and method for controlling charging system

Abstract

This charged system includes: a particle adsorption aid that is electrostatically charged and adsorbs particles by means of the electrostatic charge; and a charging device that is disposed inside the substrate conveying device within the range of motion of the robotic arm that conveys the substrate, and that makes the particle adsorption aid electrostatically charged.

Description

[Technical Field]

[0001] This invention relates to an electrified system and a control method for an electrified system. [Previous Technology]

[0002] Auxiliary jigs (also known as fixtures) for adsorbing dust and other particles within a substrate transport device are already known. Japanese Patent Application Publication No. 11-224895 discloses a disc-shaped particle removal auxiliary jig that is charged due to static electricity. Japanese Patent Application Publication No. 11-224895 utilizes a hand of a robotic arm disposed in a substrate transport device to hold the particle removal auxiliary jig, which is disc-shaped like the wafer. In this way, the particle removal auxiliary jig contacts the hand, and particles adhering to the hand are adsorbed by the charged particle removal auxiliary jig. As a result, particles adhering to the hand are removed from the hand.

[0003] Here, as in the method disclosed in Japanese Patent Application Publication No. 11-224895, when removing particles using a particle removal aid that is charged due to static electricity, the particle removal aid must be pre-charged. Furthermore, as in the method disclosed in Japanese Patent Application Publication No. 11-224895, when the robotic arm's hand and the particle removal aid are positioned in a substrate transport device, it is necessary to temporarily open the interior of the substrate transport device and manually charge the particle removal aid. However, once the interior of the substrate transport device is temporarily opened, dust and other particles will enter the interior. Therefore, it is desirable to charge the particle removal aid without opening the interior of the substrate transport device. [Summary of the Invention]

[0004] [Problem to be Solved by the Invention] This invention was made to solve the above-mentioned problem. One object of this invention is to provide a charging system and a control method for charging a particle adsorption auxiliary device without requiring an open substrate conveying device. [Means for Solving the Problem]

[0005] According to the first aspect of the present invention, the charged system comprises: a particle adsorption aid that is charged with static electricity and adsorbs particles by means of the charged static electricity; and a charging device disposed inside the substrate conveying device within the range of motion of the robotic arm that conveys the substrate, and causes the particle removal aid to be charged with static electricity.

[0006] According to the first aspect of the present invention, the charging system, as described above, includes: a charging device disposed inside the substrate transport apparatus within the range of motion of a robotic arm transporting the substrate, which charges the particle adsorption attachment with static electricity. Herein, since the charging device is disposed inside the substrate transport apparatus, the particle adsorption attachment is charged within the internal space of the substrate transport apparatus by the charging device. As a result, the particle adsorption attachment attachment can be charged without opening the substrate transport apparatus.

[0007] The control method of the charged system according to the second aspect of the present invention includes the following steps: by using a charged device disposed inside the substrate conveying device within the range of motion of the robot arm that conveys the substrate, a particle adsorption aid for adsorbing particles is charged with static electricity; and the particle adsorption is performed by using the charged particle adsorption aid.

[0008] According to the second aspect of the present invention, the control method for a charged system, as described above, includes the following steps: using a charged device disposed inside the substrate transport apparatus within the range of motion of a robotic arm transporting the substrate, a particle adsorption aid for adsorbing particles is electrostatically charged. Therefore, since the charged device is disposed inside the substrate transport apparatus, the particle adsorption aid can be charged within the internal space of the substrate transport apparatus. As a result, a control method for a charged system that can charge the particle adsorption aid without opening the substrate transport apparatus can be provided. [Effects of the Invention]

[0009] According to the charging system and the control method of the charging system of the present invention, the particle adsorption aid can be charged without opening the substrate conveying device.

Implementation Method

[0011] [First Embodiment] The first embodiment of the present invention, embodied in the present invention, will be described below with reference to the drawings. Furthermore, in this application specification, the vertical direction is defined as the Z direction. The upper side is defined as the Z1 side, and the lower side as the Z2 side. The direction orthogonal to the Z direction is defined as the X direction. One side of the X direction is defined as the X1 side, and the other side as the X2 side. The direction orthogonal to both the Z and X directions is defined as the Y direction. One side of the Y direction is defined as the Y1 side, and the other side as the Y2 side.

[0012] (Semiconductor Manufacturing Apparatus) First, the semiconductor manufacturing apparatus 500 will be described. As shown in FIG1, the semiconductor manufacturing apparatus 500 is an apparatus for processing a substrate 1 made of semiconductors such as wafers. The semiconductor manufacturing apparatus 500 includes a substrate conveying apparatus 200 and a substrate processing apparatus 300. Furthermore, the semiconductor manufacturing apparatus 500 is, for example, disposed in a cleanroom.

[0013] (Substrate transport apparatus) The substrate transport apparatus 200 will be described in detail. The substrate transport apparatus 200 is, for example, an EFEM (Equipment Front End Module). The substrate transport apparatus 200 includes a front-opening wafer pod (FOUP) 110, a housing 120, a front-opening wafer pod opener 130, an aligner 140, a robot 150, and a control unit 160 shown in FIG2.

[0014] (Front-opening wafer transfer box) The front-opening wafer transfer box 110 is used to house a plurality of substrates 1 before and after processing. The interior of the front-opening wafer transfer box 110 is maintained in a cleanroom-free state. Furthermore, the front-opening wafer transfer box 110 includes a housing 111 and an opening / closing part 112. The housing 111 has a box shape including an opening 111a that opens into the substrate transport device 200. Moreover, the opening / closing part 112 covers the opening 111a of the housing 111. In addition, for example, four front-opening wafer transfer boxes 110 are provided.

[0015] (Housing) Housing 120 includes an internal space 121. The internal space 121 is filled with an ambient gas with a high degree of cleanliness. Robot 150 is disposed in the internal space 121 of housing 120. Housing 120 has, for example, a cuboid shape. The wall 122 on the Y1 side of housing 120 has an opening 122a that connects to the internal space 113 of the front-opening wafer transfer cassette 110. The substrate 1 can move between the front-opening wafer transfer cassette 110 and the substrate transport device 200 via the opening 122a. The wall 123 on the Y2 side of housing 120 has an opening 123a that connects to the internal space 311 of the substrate processing device 300. The substrate 1 can move between the substrate processing device 300 and the substrate transport device 200 via the opening 123a.

[0016] The front-opening wafer transfer cassette opener 130 will be described. The front-opening wafer transfer cassette opener 130 is disposed on the Y1 side of the substrate transport apparatus 200. The front-opening wafer transfer cassette opener 130 includes an opening / closing part 131 and a front-opening wafer transfer cassette support part 132. The opening / closing part 131 is disposed in the opening 122a of the wall 122 on the Y1 side of the housing 120. By means of the opening / closing mechanism (not shown), the opening / closing part 131 of the front-opening wafer transfer cassette opener 130 and the opening / closing part 112 of the front-opening wafer transfer cassette 110 are opened, and the internal space 113 of the front-opening wafer transfer cassette 110 is connected to the internal space 121 of the housing 120.

[0017] The alignment device 140 will be described. The alignment device 140 is used to mount the substrate 1. The alignment device 140 performs the following functions: adjusting the orientation of the substrate 1 by rotating the substrate 1 so that the notch or orientation plane formed on the substrate 1 is oriented in a predetermined direction; and rotating the substrate 1 while detecting at least one of the edges of the substrate 1 and the eccentricity of the substrate 1 by the line sensor 143. In a first embodiment, the alignment device 140 is disposed in the internal space 121 of the housing 120 of the substrate transport device 200. Furthermore, the notch or orientation plane is an example of a marking portion. Moreover, as shown in FIG3, the alignment device 140 includes a frame 141, a rotating part 142, and a line sensor 143. The frame 141 is a stage for mounting the rotating part 142 and the line sensor 143. The rotating part 142 is used to mount the substrate 1 to rotate the substrate 1. The line sensor 143 detects the notch or orientation plane from the substrate 1 rotated by the rotating part 142.

[0018] The robot 150 will be described below. As shown in FIG1, the robot 150 is disposed in the internal space 121 of the housing 120 of the substrate conveying device 200. The robot 150 is, for example, a horizontal multi-joint type. The robot 150 includes a hand 151 and a robot arm 152. The hand 151 holds the substrate 1. For example, the hand 151 has a Y-shape with its front end forked into two branches. Furthermore, the hand 151 is disposed at the front end of the robot arm 152. The robot arm 152 includes a plurality of linkages.

[0019] The configuration of the control unit 160 will be described. The control unit 160 is a robot controller. As shown in FIG2, the control unit 160 includes a main control unit 161, a servo control unit 162, a drive circuit unit 163, and a memory unit 164. The main control unit 161 and the servo control unit 162 include, for example, a CPU (Central Processing Unit). The main control unit 161 controls the drive unit 152a of the robot arm 152. The servo control unit 162 controls the power to be supplied to the drive unit 152a of the robot arm 152 according to the instructions from the main control unit 161. The drive circuit unit 163 supplies drive power to the drive unit 152a of the robot arm 152. A plurality of drive units 152a of the robot arm 152 are configured, and the drive circuit unit 163 is configured relative to each drive unit 152a of the robot arm 152. Alternatively, the drive circuit unit 163 may be configured as a single unit shared by each drive unit 152a. Each drive unit 152a includes a servo motor, an encoder, and a reducer. The memory unit 164 stores the program executed by the control unit 160.

[0020] (Substrate Processing Apparatus) The substrate processing apparatus 300 will be described. As shown in FIG1, the substrate processing apparatus 300 performs processing on the substrate 1. For example, the substrate processing apparatus 300 performs heat treatment, impurity implantation, thin film formation, photolithography, cleaning, and planarization on the substrate 1. The substrate processing apparatus 300 is arranged adjacent to the substrate transport apparatus 200. The substrate processing apparatus 300 includes a housing 310 having an internal space 311. Furthermore, the wall 312 on the Y1 side of the housing 310 of the substrate processing apparatus 300 is a wall that communicates with the wall 123 on the Y2 side of the housing 120 of the substrate transport apparatus 200. Moreover, the internal space 311 of the substrate processing apparatus 300 has a substrate mounting section 313 for mounting the substrate 1.

[0021] (Electrified System) The electrified system 100 is a system for electrifying the particulate adsorption aid 10. As shown in FIG2, the electrified system 100 includes an alignment device 140, a robot 150, a particulate adsorption aid 10, an electrification device 20, an aid housing container 30, a particulate detection unit 50, a cleaning device 60, and a control unit 160.

[0022] (Particle Adsorption Aid) The particle adsorption aid 10 will be described. The particle adsorption aid 10 is held by the hand 151. Furthermore, the particle adsorption aid 10 is electrostatically charged and adsorbs particles by means of the electrostatic charge. Furthermore, as shown in FIG4, the particle adsorption aid 10 has, for example, a disk shape and has the same diameter as the substrate 1. Furthermore, as shown in FIG5, the particle adsorption aid 10 includes, for example, a semiconductor substrate 11, a positive electrode 12, a negative electrode 13, a bias electrode 14, and an interface 15. The positive electrode 12 and the negative electrode 13 are formed by impurity implantation. The positive electrode 12, the bias electrode 14, and the negative electrode 13 are arranged sequentially on one surface 11a of the semiconductor substrate 11. The interface 15 is arranged on the other surface 11b of the semiconductor substrate 11. The interface 15 connects the positive electrode 12 and the negative electrode 13. Furthermore, the interface 15 is energized by the voltage application portion 22 of the charging device 20 shown in FIG6. In this way, a voltage is applied to the positive electrode 12 and the negative electrode 13, thereby charging one surface 11a of the semiconductor substrate 11.

[0023] (Electrified Device) The electrified device 20 will be described. The electrified device 20 is a device that causes the particle adsorption aid 10 to become electrostatically charged. As shown in FIG6, the electrified device 20 includes a housing 21, a voltage application unit 22, a contact detection unit 23, and an energy storage unit 24 shown in FIG3. The housing 21 has a box shape.

[0024] The voltage application section 22 contacts the interface 15 of the particle adsorption aid 10 to apply a voltage to the particle adsorption aid 10. For example, the voltage application section 22 includes a plurality of probes 22a. The plurality of probes 22a protrude from the hole 21a of the housing 21 to the outside of the housing 21. By contacting the interface 15 of the particle adsorption aid 10 with the plurality of probes 22a, a voltage is applied to the positive electrode 12 and the negative electrode 13.

[0025] In the first embodiment, the contact detection unit 23 detects information regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10. Based on the detection by the contact detection unit 23 of information relating to the contact of the voltage application unit 22 with the particulate adsorption aid 10, the charged device 20 begins to apply voltage to the particulate adsorption aid 10 from the voltage application unit 22. For example, the contact detection unit 23 is a contact sensor. Furthermore, the contact detection unit 23 is arranged adjacent to the voltage application unit 22. Furthermore, the contact detection unit 23 and the voltage application unit 22 protrude from the housing 21 at equal heights. For example, the particulate adsorption aid 10 held by the hand 151 contacts the voltage application unit 22, and the particulate adsorption aid 10 also contacts the contact detection unit 23. In this case, the information regarding the contact of the particulate adsorption aid 10 with the contact detection unit 23 relates to the contact of the voltage application unit 22 with the particulate adsorption aid 10. When the contact detection unit 23 detects that the particulate adsorption aid 10 is in contact with the voltage application unit 22, the energized device 20 begins to apply voltage to the particulate adsorption aid 10 from the voltage application unit 22. For example, a switch is provided between the battery storage unit 24 and the voltage application unit 22, and the switch is turned on when the contact detection unit 23 detects that the particulate adsorption aid 10 is in contact with the voltage application unit 22. In this way, voltage is applied to the particulate adsorption aid 10 from the battery storage unit 24 via the voltage application unit 22.

[0026] In this first embodiment, as shown in FIG3, the charged device 20 is disposed within the operating range of the robot arm 152 that transports the substrate 1 inside the substrate transport device 200. Specifically, the charged device 20 is disposed on the alignment device 140. For example, the charged device 20 is disposed above the line sensor 143. Furthermore, the charged device 20 is disposed facing the rotating part 142. Furthermore, the charged device 20 is disposed with the voltage application part 22 facing downward.

[0027] (Auxiliary Device Receiving Container) The auxiliary device receiving container 30 will be described. The auxiliary device receiving container 30 is a container for receiving the particulate adsorption auxiliary device 10. As shown in FIG7, the auxiliary device receiving container 30 includes an opening 32 that opens into the substrate transport device 200. The interior of the auxiliary device receiving container 30 is maintained in a clean state, similar to the front-opening wafer transfer box 110 and the cleanroom. Furthermore, as shown in FIG8, the auxiliary device receiving container 30 includes a housing 34 and an opening / closing part 35. The housing 34 has a box shape including the opening 32 that opens into the substrate transport device 200. The opening / closing part 35 covers the opening 32 of the housing 34. Furthermore, as shown in FIG10, the auxiliary device receiving container 30 is disposed in the substrate transport device 200 at the front-opening wafer transfer box opener 130 for disposing of the front-opening wafer transfer box 110. Next, the opening / closing portion 131 of the front-opening wafer transfer box opener 130 and the opening / closing portion 35 of the auxiliary device receiving container 30 are opened, connecting the internal space 33 of the auxiliary device receiving container 30 with the internal space 121 of the housing 120. Here, the particle adsorption auxiliary device 10 can move between the auxiliary device receiving container 30 and the substrate transport device 200 via the opening 122a of the housing 120. Furthermore, the particle adsorption auxiliary device 10 can move between the substrate transport device 200 and the substrate processing device 300 via the opening 123a of the housing 120. Furthermore, the external shape of the auxiliary device receiving container 30 is the same as that of the front-opening wafer transfer box 110, and the auxiliary device receiving container 30 can accommodate the particle adsorption auxiliary device 10. Specifically, the housing 34 of the auxiliary device receiving container 30 has the same size as the housing 111 of the front-opening wafer transfer box 110 shown in FIG. 1. Therefore, the auxiliary device receiving container 30 can be disposed in the front-opening wafer transfer cassette opener 130 to replace the front-opening wafer transfer cassette 110. Furthermore, the diameter of the particle adsorption auxiliary device 10 is the same as the diameter of the substrate 1. Thus, similar to the case where the substrate 1 is housed in the front-opening wafer transfer cassette 110, the particle adsorption auxiliary device 10 is housed in the auxiliary device receiving container 30. For example, the particle adsorption auxiliary device 10 is supported by the support portion 30a of the auxiliary device receiving container 30. With the particle adsorption auxiliary device 10 housed in the auxiliary device receiving container 30, the interior of the auxiliary device receiving container 30 remains clean.

[0028] The energy storage unit 24 stores the electricity supplied to the voltage application unit 22. As shown in FIG3, the energy storage unit 24 is disposed, for example, inside the housing 21. In the first embodiment, the energy storage unit 24 is charged by the electricity supplied to the alignment unit 140. Specifically, the alignment unit 140 is supplied with electricity from an external power source 144. The energy storage unit 24 is also supplied with electricity from the external power source 144.

[0029] (Particle Detection Unit) In the first embodiment, the particle detection unit 50 detects the degree to which particles are adsorbed by the particle adsorption aid 10 during a series of actions of the robot arm 152. The series of actions of the robot arm 152 will be described later. The particle detection unit 50 includes at least one of a charge detection unit 51 that detects the charge on the particle adsorption aid 10 and an imaging unit 52 that captures images of the particles adsorbed on the particle adsorption aid 10. The charge detection unit 51 is, for example, a surface potentiometer. The surface potentiometer measures the amount of static electricity by utilizing the electrostatic induction phenomenon where charged bodies attract each other when they approach a conductor. The surface potentiometer measures the amount of static electricity in a non-contact state with the particle adsorption aid 10. Furthermore, the particle detection unit 50 is disposed on the alignment unit 140. For example, the particle detection unit 50 is disposed above the frame 141 of the alignment unit 140. Furthermore, the imaging unit 52 is, for example, a high-resolution camera capable of capturing images of particles.

[0030] In the first embodiment, the cleaning device 60 cleans the particulate adsorption aid 10. As shown in FIG1, the cleaning device 60 is disposed, for example, in the internal space 311 of the substrate processing apparatus 300. The substrate processing apparatus 300 is, for example, a rotary dryer. The rotary dryer rotates the particulate adsorption aid 10 and removes the particles adsorbed on the particulate adsorption aid 10 by centrifugal force.

[0031] (Operation of the Charged System) Next, the particulate removal operation inside the semiconductor manufacturing apparatus 500, which is composed of the charged system 100, will be described. Furthermore, the operation of the charged system 100 is controlled by the control unit 160. The charging unit 24 of the charged device 20 is pre-charged. Furthermore, the particulate adsorption aid 10 is manually placed in the aid container 30 beforehand. Furthermore, when performing the particulate removal operation, the substrate 1 processing performed by the semiconductor manufacturing apparatus 500 is not performed. Furthermore, as shown in FIG10, the aid container 30 is provided in the front-opening wafer transfer box opener 130 instead of the front-opening wafer transfer box 110. Moreover, one aid container 30 may be provided in the front-opening wafer transfer box opener 130, or multiple aid container 30s may be provided. The following description focuses on an example where one aid container 30 is provided in the front-opening wafer transfer box opener 130.

[0032] As shown in FIG9, in step S1, the control unit 160 activates the opening and closing part 131 of the front-opening wafer transfer box opener 130 and the opening and closing part 35 of the auxiliary tool receiving container 30 by activating the opening and closing mechanism (not shown). The internal space 33 of the auxiliary tool receiving container 30 is connected to the internal space 121 of the housing 120 of the substrate transport device 200.

[0033] In step S2, as shown in FIG10, in the first embodiment, the control unit 160 performs the process of holding the microparticle adsorption aid 10, which has been pre-reserved in the aid receiving container 30, by means of the hand 151 of the robot arm 152. Specifically, the control unit 160 causes the hand 151 to enter the internal space 33 of the aid receiving container 30 through the opening 122a of the housing 120 of the substrate conveying device 200.

[0034] In step S3, as shown in FIG11, the control unit 160 moves the robot arm 152 to move the particle adsorption aid 10 held by the hand 151 to the alignment unit 140. Next, in the first embodiment, the control unit 160 performs a process of moving the robot arm 152 and bringing the particle adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22 to electrify the particle adsorption aid 10. Specifically, the control unit 160 performs a process of moving the robot arm 152 to move the particle adsorption aid 10 held by the hand 151 upward and bring it into contact with the voltage application unit 22 to electrify the particle adsorption aid 10. At this time, the particle adsorption aid 10 not only contacts the voltage application unit 22 but also contacts the contact detection unit 23. Thereby, the electrification device 20 begins to apply voltage to the particle adsorption aid 10 from the voltage application unit 22. Furthermore, the control of the voltage applied by the voltage application unit 22 is performed by the energized device 20, rather than by the control unit 160.

[0035] In step S4, in the first embodiment, after the control unit 160 performs the process of electrifying the particle adsorption aid 10, it performs the process of moving the robot arm 152 and adsorbing particles from at least one of the interior of the substrate transport device 200 and the interior of the substrate processing device 300 by means of the particle adsorption aid 10 held by the hand 151. Specifically, the particle adsorption aid 10 housed in the aid housing 30 moves to the substrate transport device 200 or the substrate processing device 300 through the opening 122a or opening 123a of the housing 120 of the substrate transport device 200. In this way, as shown in FIG12, particles attached to the portion of the aligner 140 for placing the substrate 1 arranged in the interior space 121 of the substrate transport device 200 or the substrate placement portion 313 for placing the substrate 1 in the interior space 311 of the substrate processing device 300 can be adsorbed by the particle adsorption aid 10.

[0036] In step S5, in the first embodiment, the control unit 160 uses the particle detection unit 50 to detect the degree of particle adsorption by the particle adsorption aid 10. Specifically, the control unit 160 temporarily moves the particle adsorption aid 10 above the particle detection unit 50 of the alignment device 140. Then, the control unit 160 uses the particle detection unit 50 to detect the amount of particles adsorbed by the particle adsorption aid 10.

[0037] Furthermore, in step S6, the control unit 160 determines whether particles can be further adsorbed by the particle adsorption aid 10. When the particle detection unit 50 is an imaging unit 52, the control unit 160 uses image processing and other techniques to detect the amount of particles from the image of the particle adsorption aid 10 captured by the imaging unit 52. Next, when the amount of adsorbed particles is less than a predetermined particle amount threshold, the control unit 160 determines that particles can be further adsorbed by the particle adsorption aid 10 and returns to step S4. Furthermore, when the amount of adsorbed particles is greater than the predetermined particle amount threshold, the control unit 160 determines that particles cannot be further adsorbed by the particle adsorption aid 10 and proceeds to step S7. Furthermore, when the particle detection unit 50 is a charge detection unit 51, the charge of the particle adsorption aid 10 is detected by the charge detection unit 51. When the particle adsorption aid 10 detected by the charge detection unit 51 is greater than a predetermined charge threshold, the control unit 160 determines that particles can be further adsorbed by the particle adsorption aid 10 and returns to step S4. Conversely, when the particle adsorption aid 10 detected by the charge detection unit 51 is less than the predetermined charge threshold, the control unit 160 determines that particles cannot be further adsorbed by the particle adsorption aid 10 and proceeds to step S7. In this way, the degree of particle adsorption is detected by the particle detection unit 50 during a series of repeated particle adsorption operations in step S4.

[0038] In step S7, as shown in FIG13, in the first embodiment, after the control unit 160 performs the process of adsorbing particles by the particle adsorption aid 10, it performs the process of moving the particle adsorption aid 10 to the cleaning device 60 by means of the robot arm 152. The cleaning device 60 performs the process of cleaning the moved particle adsorption aid 10.

[0039] Furthermore, in step S8, the control unit 160, as in step S3, charges the particle adsorption aid 10 with static electricity using the charging device 20. Next, in step S9, the control unit 160 performs a process of adsorbing particles in the same target area as in step S4 to confirm whether particle adsorption has been completed in at least one of the target areas for particle adsorption, either inside the substrate transport device 200 or inside the substrate processing device 300. In step S9, the control unit 160 also performs an adsorption operation in step S4, moving the particle adsorption aid 10 in the target area during particle adsorption. For example, as in step S4, the control unit 160 transports the particle adsorption aid 10 held by the hand 151 to the substrate placement section 313 of the substrate processing device 300, which is the target area for particle adsorption, and performs the adsorption operation by placing the particle adsorption aid 10 on the substrate placement section 313.

[0040] Furthermore, in step S10, the control unit 160, similar to step 5S, uses the particle detection unit 50 to detect the degree of particle adsorption by the particle adsorption aid 10. Next, in step S11, it is determined whether the particle adsorption in the target area is sufficient. For example, when the particle detection unit 50 is the imaging unit 52, the control unit 160, similar to step S6, detects the amount of particles from the image of the particle adsorption aid 10 captured by the imaging unit 52. Next, when the amount of adsorbed particles is greater than a predetermined particle amount threshold, the control unit 160 determines that the particle adsorption is insufficient and returns to step S4. Furthermore, when the amount of adsorbed particles is less than the predetermined particle amount threshold, the control unit 160 determines that the particle adsorption is sufficient. When it is determined that the particle adsorption is sufficient, the particle removal operation inside the semiconductor manufacturing apparatus 500 performed by the charged system 100 ends. In addition, the predetermined particle amount threshold in step S11 can be a different value than that in step S6.

[0041] Furthermore, in step S11, it is also possible to determine whether the adsorption of particles in the target area is sufficient based on the detection result of the charge detection unit 51. In this case, the charge of the particle adsorption aid 10 is detected by the charge detection unit 51. When the charge of the particle adsorption aid 10 detected by the charge detection unit 51 is less than a predetermined charge threshold, the control unit 160 determines that the charge has decreased due to the adsorption of particles in the same target area, and determines that particles have been detected. In this case, it is determined that the adsorption of particles is insufficient and returns to step S4. Furthermore, when the charge of the particle adsorption aid 10 detected by the charge detection unit 51 is greater than the predetermined charge threshold, the control unit 160 determines that the adsorption of particles is sufficient without further adsorption of particles, and ends the control process.

[0042] Furthermore, when there are multiple target areas for adsorbing particles, the adsorption of particles can be confirmed for each of the multiple target areas by performing the processing from step S8 to step S11 on each of the multiple target areas.

[0043] [Effects of the First Embodiment] The charging system 100 includes a charging device 20 disposed inside the substrate transport device 200 within the range of motion of the robot arm 152 that transports the substrate 1, and which charges the particle adsorption aid 10 with static electricity. Since the charging device 20 is disposed inside the alignment device 140 disposed inside the substrate transport device 200, the particle adsorption aid 10 can be charged within the interior space of the substrate transport device 200 by means of the charging device 20. As a result, the particle adsorption aid 10 can be charged without opening the substrate transport device 200.

[0044] The charged system 100 includes: a robotic arm 152; a hand 151 mounted on the robotic arm 152 and holding the particle adsorption aid 10; and a control unit 160, which performs processing of particles adsorbed by the charged particle adsorption aid 10 held by the hand 151 and adsorbed into at least one of the interior of the substrate transport device 200 and the interior of the substrate processing device 300. This enables the processing of adsorbing particles by the sufficiently charged particle adsorption aid 10.

[0045] The control unit 160 performs a process that moves the robot arm 152 and brings the particulate adsorption aid 10 held by the hand 151 into contact with the voltage application unit 22 to charge the particulate adsorption aid 10. In this way, since the particulate adsorption aid 10 can be charged by the movement of the robot arm 152 without relying on manual labor, the workload of the operator can be reduced.

[0046] The charging system includes an alignment device 140 disposed inside the substrate transport apparatus 200. The voltage application unit 22 is disposed downward inside the auxiliary device receiving container 30. The control unit 160 performs a process that moves the robot arm 152 and moves the particle adsorption auxiliary device 10 held by the hand 151 upward to contact the voltage application unit 22, thereby charging the particle adsorption auxiliary device 10. In this way, the particle adsorption auxiliary device 10 can be easily charged simply by moving the particle adsorption auxiliary device 10 upward by the robot arm 152. Furthermore, by disposing the charging device 20 in the alignment device 140, unlike the situation where the charging device 20 and the alignment device 140 are disposed separately, the increase in the installation area of ​​the machine inside the substrate transport apparatus 200 can be suppressed even when the charging device 20 is disposed.

[0047] The charged device 20 includes a contact detection unit 23 that detects information regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10. Upon detecting information regarding the contact of the voltage application unit 22 with the particulate adsorption aid 10 by the contact detection unit 23, the charged device 20 begins to apply voltage to the particulate adsorption aid 10 from the voltage application unit 22. Therefore, since the control unit 160 does not need to control the application of voltage to the particulate adsorption aid 10 from the voltage application unit 22, the control burden of the control unit 160 can be reduced.

[0048] The electrified system 100 includes a particle detection unit 50 that detects the degree of particle adsorption by the particle adsorption aid 10 during a series of movements of the robotic arm 152. The control unit 160 determines, based on the detection result of the particle detection unit 50, whether the particle adsorption aid 10 can further adsorb particles, thereby suppressing the continued adsorption of particles when the particle adsorption aid 10 is unable to adsorb particles.

[0049] The particle detection unit 50 includes at least one of a charge detection unit 51 for detecting the charge of the particle adsorption aid 10 and an imaging unit 52 for capturing images of the particles adsorbed on the particle adsorption aid 10. Therefore, when the charge detection unit 51 detects that the charge of the particle adsorption aid 10 is relatively large, the control unit 160 determines that the particle adsorption aid 10 can further adsorb particles. Furthermore, based on the image of the particle adsorption aid 10 captured by the imaging unit 52, if it is detected that there are relatively few particles attached to the particle adsorption aid 10, the control unit 160 can determine that the particle adsorption aid 10 can further adsorb particles.

[0050] The particle detection unit 50 is disposed on the alignment unit 140. In this way, compared with the case where the detection of the degree of particle adsorption and the charging of the particle adsorption aid 10 are carried out in separate locations, the present invention can suppress the enlargement of the charging system 100.

[0051] The electrified system 100 includes a cleaning device 60 for cleaning the particulate adsorption aid 10. After the control unit 160 performs a process of adsorbing particles by the particulate adsorption aid 10, it performs a process of moving the particulate adsorption aid 10 to the cleaning device 60 by the robotic arm 152, and the cleaning device 60 performs a process of cleaning the moved particulate adsorption aid 10. In this way, since the particulate adsorption aid 10 with attached particles can be cleaned, the cleaned particulate adsorption aid 10 can be used electrifiedly during the next particulate adsorption. Therefore, it is not necessary to configure a plurality of particulate adsorption aids 10.

[0052] The charging device 20 includes a power storage unit 40 for storing electricity and charging it by the power supplied to the alignment device 140. Since power is pre-supplied to the alignment device 140, there is no need to separately configure a power supply for charging the power storage unit 40. Therefore, the configuration of the charging system 100 can be simplified.

[0053] [Second Embodiment] The aligner 240 of the second embodiment of the present invention will be described.

[0054] As shown in FIG. 14, in the second embodiment, the aligner 140 includes a moving mechanism 241 that moves the particle adsorption aid 10 in the vertical direction to bring the particle adsorption aid 10 into contact with the voltage application portion 22. Furthermore, the moving mechanism 241 moves the particle adsorption aid 10 upward to bring it into contact with the voltage application portion 22 disposed downward in the aligner 140. Specifically, the moving mechanism 241 includes a holding portion 241a that holds the particle adsorption aid 10 from below and a lifting portion 241b that raises and lowers the holding portion 241a. As shown in FIG. 15, the holding portion 241a is, for example, U-shaped and has a flat plate shape when viewed from the Z direction. The lifting portion 241b includes, for example, a drive portion such as a motor to raise and lower the holding portion 241a. That is, the second embodiment differs from the first embodiment. As shown in FIG. 16, the particle adsorption aid 10 is brought into contact with the voltage application portion 22 by the moving mechanism 241 without utilizing the hand 151 of the robot 150. Furthermore, the control of the moving mechanism 241 is performed by the control unit 160. Moreover, after the control unit 160 moves the robotic arm 152 and holds the charged particle adsorption aid 10 by the hand 151, it adsorbs particles from at least one of the interiors of the substrate conveying device 200 and the substrate processing device 300. Furthermore, the other configurations of the second embodiment are the same as those of the first embodiment described above.

[0055] [Effects of the Second Embodiment] The alignment device 240 includes a moving mechanism 241 that moves the particle adsorption aid 10 in the vertical direction so that the particle adsorption aid 10 contacts the voltage application part 22. Therefore, since the particle adsorption aid 10 can be charged by the operation of the alignment device 240 without relying on manual labor, the workload of the operator can be reduced.

[0056] The voltage application part 22 is disposed downward in the alignment device 140, and the moving mechanism 241 moves the particle adsorption aid 10 upward so that it contacts the voltage application part 22. In this way, the particle adsorption aid 10 can be easily charged simply by moving the moving mechanism 241 upward.

[0057] [Modifications] Furthermore, it should be understood that all contents of the embodiments disclosed herein are illustrative and not restrictive embodiments. The scope of the present invention is not limited to the description of the above embodiments but is indicated by the claims, and includes all modifications (modifications) within the scope and meaning of the claims.

[0058] In the first and second embodiments described above, the robot 150 holding the substrate 1 and the robot 150 holding the particle adsorption aid 10 are illustrated as being the same; however, the present invention is not limited thereto. For example, the robot holding the particle adsorption aid 10 and the robot 150 holding the substrate 1 may be configured separately.

[0059] The first and second embodiments described above illustrate that the particulate adsorption aid 10 is housed in the aid housing container 30; however, the present invention is not limited thereto. For example, the particulate adsorption aid 10 may also be disposed in the substrate transport device 200 or the substrate processing device 300 without being housed in the aid housing container 30.

[0060] In the first and second embodiments described above, the voltage application portion 22 of the energized device 20 is arranged downward in the aligner 140; however, the present invention is not limited thereto. For example, the voltage application portion 22 of the energized device 20 may also be arranged upward.

[0061] The first and second embodiments described above illustrate that the charged device 20 starts applying voltage to the particulate adsorption aid 10 from the voltage application part 22 based on information detected by the contact detection unit 23 related to the particulate adsorption aid 10 contacting the voltage application part 22. However, the present invention is not limited thereto. For example, the control unit 160 may also control the application of voltage to the particulate adsorption aid 10 from the voltage application part 22 based on information detected by the contact detection unit 23 related to the particulate adsorption aid 10 contacting the voltage application part 22.

[0062] The first and second embodiments described above illustrate that the charged system 100 includes a particle detection unit 50; however, the present invention is not limited thereto. For example, the charged system 100 may not include a particle detection unit 50. In this case, for example, if one of the series of actions of adsorbing particles by the particle adsorption aid 10 ends once, the action of adsorbing particles ends.

[0063] The first and second embodiments described above illustrate that the particle detection unit 50 is disposed on the aligner 140; however, the present invention is not limited thereto. For example, the particle detection unit 50 may also be disposed on a substrate transport device 200 or a substrate processing device 300 other than the aligner 140.

[0064] The first and second embodiments described above illustrate that the cleaning device 60 is disposed in the substrate processing device 300; however, the present invention is not limited thereto. For example, the cleaning device 60 may also be disposed in the substrate conveying device 200.

[0065] The first and second embodiments described above illustrate that the particle removal operation ends after the particle adsorption aid 10 is cleaned by the cleaning device 60. However, the present invention is not limited to this. For example, after the particle adsorption aid 10 is cleaned by the cleaning device 60, the particle adsorption aid 10 can be re-energized by the charging device 20 to restart the particle removal operation.

[0066] The first and second embodiments described above illustrate charging the charged device 20 by means of power supplied to the aligner 140; however, the present invention is not limited thereto. For example, the charged device 20 may also be charged by means of separate power supplied to the aligner 140.

[0067] The first and second embodiments described above illustrate that the charged device 20 is disposed in the alignment device 140; however, the present invention is not limited thereto. For example, the charged device 20 may also be disposed inside the substrate conveying device 200 within the range of motion of the robot arm outside the alignment device 140. Furthermore, when the charged device 20 is disposed at a relatively high position inside the substrate conveying device 200, the robot arm 152 must move not only horizontally but also vertically.

[0068] The functions of the components disclosed in this specification can be executed using a general-purpose processor, a special-purpose processor, integrated circuit, ASIC (Application Specific Integrated Circuits), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. Since a processor includes transistors and other circuitry, it can be considered a processing circuit or circuit. In this invention, a circuit, unit, or means is hardware that performs the listed functions, or hardware programmed to perform the listed functions. The hardware may also be the hardware disclosed in this specification, or other known hardware programmed or configured to perform the listed functions. When the hardware is conceived as a processor of a type of circuit, the circuit, means, or unit is a combination of hardware and software, with the software used in the configuration of the hardware and / or processor.

[0069] [Style] Those skilled in the art to which this invention pertains should understand that the exemplary embodiments described above are specific examples of the following style.

[0070] (State 1) A charged system comprising: a particulate adsorption aid that is statically charged and adsorbs particulates by means of the static charge; and a charging device disposed inside a substrate conveying device within the range of motion of a robotic arm that conveys the substrate, and which causes the particulate adsorption aid to be statically charged.

[0071] (Sample 2) The charged system as described in Sample 1 includes: the aforementioned robotic arm; a hand mounted on the aforementioned robotic arm and holding the aforementioned particle adsorption aid; and a control unit that performs the following processes: holding the aforementioned particle adsorption aid by the aforementioned hand of the aforementioned robotic arm; and adsorbing particles from at least one of the interior of the aforementioned substrate conveying device and the interior of the aforementioned substrate processing device by the aforementioned particle adsorption aid held by the aforementioned hand and charged.

[0072] (State 3) The electrified system as described in State 2, wherein the electrified device includes a voltage application unit that contacts the aforementioned particle adsorption aid and applies a voltage to the aforementioned particle adsorption aid, and the aforementioned control unit performs a process of moving the aforementioned robot arm and bringing the aforementioned particle adsorption aid held by the aforementioned hand into contact with the aforementioned voltage application unit to electrify the aforementioned particle adsorption aid.

[0073] (State 4) The charging system described in State 3 includes an aligner disposed inside the aforementioned substrate conveying device. The aforementioned voltage application unit is disposed downward in the aforementioned aligner. The aforementioned control unit performs a process of moving the aforementioned robot arm and moving the aforementioned particle adsorption aid held by the aforementioned hand upward so as to contact the aforementioned voltage application unit to charge the aforementioned particle adsorption aid.

[0074] (State 5) The electrified system as described in State 3 or 4, wherein the electrified device includes a contact detection unit that detects information regarding the contact of the voltage application unit with the particle adsorption aid. Based on the detection of information regarding the contact of the voltage application unit with the particle adsorption aid by the contact detection unit, the electrified device begins to apply voltage from the voltage application unit to the particle adsorption aid.

[0075] (State 6) The charging system described in any one of States 2 to 5 includes an aligner disposed inside the aforementioned substrate conveying device. The aforementioned charging device includes a voltage application part that contacts the aforementioned particle adsorption aid to apply a voltage to the aforementioned particle adsorption aid. The aforementioned aligner includes a moving mechanism that moves the aforementioned particle adsorption aid in a vertical direction so that the aforementioned particle adsorption aid contacts the aforementioned voltage application part.

[0076] (State 7) The charged system as described in State 6, wherein the aforementioned voltage application part is disposed downward in the aforementioned alignment device, and the aforementioned moving mechanism moves the aforementioned particle adsorption aid upward to contact the aforementioned voltage application part.

[0077] (State 8) The charged system described in any one of the states 2 to 7 includes a particle detection unit that detects the degree of particle adsorption by the aforementioned particle adsorption aid during a series of movements of the aforementioned robotic arm.

[0078] (State 9) The charged system as described in State 8, wherein the aforementioned particle detection unit includes at least one of a charge detection unit for detecting the charge of the aforementioned particle adsorption aid and an imaging unit for photographing the particles adsorbed on the aforementioned particle adsorption aid.

[0079] (State 10) The charged system as described in State 8 or 9 includes an aligner disposed inside the aforementioned substrate conveying device, and the aforementioned particle detection unit is disposed in the aforementioned aligner.

[0080] (State 11) The charged system described in any one of States 2 to States 10 includes a cleaning device that cleans the aforementioned particulate adsorption aid. After the aforementioned control unit performs a process of adsorbing particulates by the aforementioned particulate adsorption aid, it performs a process of moving the aforementioned particulate adsorption aid to the aforementioned cleaning device by the aforementioned robotic arm. The aforementioned cleaning device performs a process of cleaning the moved aforementioned particulate adsorption aid.

[0081] (State 12) The charging system described in any one of the states 1 to 11 includes an aligner disposed inside the aforementioned substrate transport device. The aforementioned charging device includes an energy storage unit for storing electricity and charging it by means of electricity supplied to the aforementioned aligner.

[0082] (Sample 13) A control method for an electrified system includes the following steps: electrifying a particle adsorption aid that adsorbs particles by means of an electrified device disposed inside a substrate conveying device within the range of motion of a robot arm that conveys the substrate; and adsorbing particles by means of the aforementioned electrostatically charged particle adsorption aid. [Simplified Explanation of the Diagram]

[0010] Figure 1 is a diagram showing a semiconductor manufacturing apparatus according to a first embodiment. Figure 2 is a block diagram showing a charged system according to a first embodiment. Figure 3 is a diagram showing a charged device disposed on an alignment device according to a first embodiment. Figure 4 is a diagram showing a particle adsorption aid according to a first embodiment. Figure 5 is a cross-sectional view along line 1000-1000 of Figure 4. Figure 6 is a diagram showing a charged device according to a first embodiment. Figure 7 is a diagram showing a particle adsorption aid disposed on an aid receiving container according to a first embodiment. Figure 8 is a cross-sectional view of the aid receiving container according to a first embodiment viewed from the side. Figure 9 is a flowchart of a control method for the charged system according to a first embodiment. Figure 10 shows a state in which the particle adsorption aid is held by a hand. Figure 11 shows a state in which a robot arm is moved to bring the particle adsorption aid into contact with the voltage application part of the charged device. Figure 12 shows a state in which particles are removed from the alignment device by the particle adsorption aid. Figure 13 shows the state of the particulate adsorption aid being cleaned by the cleaning device. Figure 14 shows the charging device disposed on the aligner according to the second embodiment. Figure 15 is a view of the aligner according to the second embodiment from above. Figure 16 shows the state in which the moving mechanism of the aligner is moved upward so that the particulate adsorption aid comes into contact with the voltage application part of the charging device.

Claims

1. A charged system comprising: a particulate adsorption aid that is electrostatically charged and adsorbs particulates by means of the electrostatic charge; a charging device disposed inside a substrate conveying apparatus within the range of motion of a robotic arm that conveys the substrate, and charging the particulate adsorption aid with electrostatic charge; the robotic arm; a hand mounted on the robotic arm and holding the particulate adsorption aid; a control unit that performs the following processes: holding the particulate adsorption aid by means of the hand of the robotic arm; and adsorbing particulates at least one of the interior of the substrate conveying apparatus and the interior of a substrate processing apparatus by means of the particulate adsorption aid held by means of the hand and charged; and an alignment device disposed inside the substrate conveying apparatus; wherein the charging device includes a voltage application part that contacts the particulate adsorption aid and applies a voltage to the particulate adsorption aid, and the control unit performs the process of moving the robotic arm and bringing the particulate adsorption aid held by means of the hand into contact with the voltage application part to charge the particulate adsorption aid; The aforementioned voltage application unit is disposed downward in the aforementioned alignment unit, and the aforementioned control unit performs a process of moving the aforementioned robot arm and moving the aforementioned particle adsorption aid held by the aforementioned hand upward so that it contacts the aforementioned voltage application unit to electrify the aforementioned particle adsorption aid.

2. A charged system comprising: a particulate adsorption aid that is electrostatically charged and adsorbs particulates by means of the electrostatic charge; a charging device disposed inside a substrate conveying apparatus within the range of motion of a robotic arm that conveys the substrate, and charging the particulate adsorption aid with electrostatic charge; the robotic arm; a hand mounted on the robotic arm and holding the particulate adsorption aid; and a control unit that performs the following processing: holding the particulate adsorption aid by the hand of the robotic arm; and adsorbing particulates from at least one of the interior of the substrate conveying apparatus and the interior of a substrate processing apparatus by means of the particulate adsorption aid held by the hand and charged; the charging device includes a voltage application unit that contacts the particulate adsorption aid and applies a voltage to the particulate adsorption aid; and the control unit performs the processing of moving the robotic arm and bringing the particulate adsorption aid held by the hand into contact with the voltage application unit to charge the particulate adsorption aid. The aforementioned charged device includes a contact detection unit that detects information about the aforementioned voltage application unit contacting the aforementioned particulate adsorption aid. Based on the information detected by the aforementioned contact detection unit about the aforementioned voltage application unit contacting the aforementioned particulate adsorption aid, the aforementioned charged device begins to apply voltage from the aforementioned voltage application unit to the aforementioned particulate adsorption aid.

3. A charged system comprising: a particle adsorption aid that is electrostatically charged and adsorbs particles by means of the electrostatic charge; a charging device disposed inside a substrate conveying apparatus within the range of motion of a robotic arm that conveys the substrate, and charging the particle adsorption aid with electrostatic charge; the robotic arm; a hand mounted on the robotic arm and holding the particle adsorption aid; a control unit that performs the following processes: holding the particle adsorption aid by the hand of the robotic arm; and adsorbing particles from at least one of the interior of the substrate conveying apparatus and the interior of a substrate processing apparatus by means of the charged particle adsorption aid held by the hand; and an alignment device disposed inside the substrate conveying apparatus, wherein the charging device includes a voltage application part that contacts the particle adsorption aid to apply a voltage to the particle adsorption aid, and the alignment device includes a moving mechanism that moves the particle adsorption aid in a vertical direction to contact the particle adsorption aid with the voltage application part.

4. The energized system as described in claim 3, wherein, The aforementioned voltage application part is disposed downward in the aforementioned alignment device, and the aforementioned moving mechanism moves the aforementioned particle adsorption aid upward to contact the aforementioned voltage application part.

5. A charged system comprising: a particle adsorption aid that is electrostatically charged and adsorbs particles by means of the electrostatic charge; a charging device disposed inside a substrate conveying apparatus within the range of motion of a robotic arm that conveys the substrate, and charging the particle adsorption aid with electrostatic charge; the robotic arm; a hand mounted on the robotic arm and holding the particle adsorption aid; a control unit that performs the following processes: holding the particle adsorption aid by the hand of the robotic arm; and adsorbing particles from at least one of the interior of the substrate conveying apparatus and the interior of a substrate processing apparatus by means of the charged particle adsorption aid held by the hand; a particle detection unit that detects the degree of particle adsorption by the particle adsorption aid during a series of movements of the robotic arm; and an alignment unit disposed inside the substrate conveying apparatus; the particle detection unit is disposed on the alignment unit.

6. The energized system as described in claim 5, wherein, The aforementioned particle detection unit includes at least one of a charge detection unit for detecting the charge of the aforementioned particle adsorption aid and an imaging unit for photographing the particles adsorbed on the aforementioned particle adsorption aid.

7. A charged system comprising: a particulate adsorption aid that is electrostatically charged and adsorbs particulates by means of the electrostatic charge; a charging device disposed inside a substrate conveying apparatus within the range of motion of a robotic arm that conveys the substrate, and charging the particulate adsorption aid with electrostatic charge; the robotic arm; a hand mounted on the robotic arm and holding the particulate adsorption aid; a control unit that performs the following processes: holding the particulate adsorption aid by the hand of the robotic arm; and adsorbing particulates from at least one of the interior of the substrate conveying apparatus and the interior of a substrate processing apparatus by means of the particulate adsorption aid held by the hand and charged; and a cleaning device that cleans the particulate adsorption aid, wherein after performing the process of adsorbing particulates by the particulate adsorption aid, the control unit performs the process of moving the particulate adsorption aid to the cleaning device by means of the robotic arm, and the cleaning device performs the process of cleaning the moved particulate adsorption aid.

8. A charged system comprising: a particulate adsorption aid that is electrostatically charged and adsorbs particulates by means of the electrostatic charge; a charging device disposed inside a substrate conveying device within the range of motion of a robotic arm that conveys the substrate, and which charges the particulate adsorption aid; and an aligner disposed inside the substrate conveying device, wherein the charging device includes a power storage unit for storing power and charging the aligner by means of power supplied to the aligner.

9. A control method for an electrified system, comprising the following steps: holding a particle adsorption aid by a hand mounted on a robot arm; electrifying the particle adsorption aid by a voltage application portion disposed downwardly on the electrified device, the electrified device being disposed in an alignment device within the operating range of the robot arm transporting the substrate; and adsorbing particles from at least one of the interior of the substrate transport device and the interior of a substrate processing device by means of the electrostatically charged particle adsorption aid held by the hand; wherein... The aforementioned robotic arm is moved and the aforementioned particle adsorption aid held by the aforementioned hand is moved upward so that it comes into contact with the aforementioned voltage application part, thereby energizing the aforementioned particle adsorption aid.

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