Computing system, computer chassis, and method for preparing a sealed computer system

Abstract

A fanless, hermetically sealed computer chassis for use in hot environments is disclosed. The chassis may include a chassis body having an inner wall and an outer wall. The outer wall may include one or more external heat dissipation elements, such as fins. The chassis may include a partition wall extending vertically from the inner wall. A thermoelectric cooler has one hot side thermally coupled to the inner wall at one end of the partition wall. A printed circuit board (PCB) may be attached to the chassis such that the partition wall contacts the PCB (e.g., via a sealing layer) to divide the interior of the chassis into a first enclosed space and a second enclosed space. The first enclosed space may include the thermoelectric cooler and one or more heat-sensitive components, while the second enclosed space may include one or more heat-resistant components.

Description

Technical Field

[0001] This invention relates generally to computing hardware, and more specifically to heat dissipation technology for sealed chassis. Prior Technology

[0002] Fifth-generation mobile communication technology (5G) is the latest generation of mobile communication technology, an extension of the 4G (LTE) system. The new 5G system offers higher transmission speeds than traditional 4G systems, thus generating more heat. Furthermore, 5G base stations typically consume 2-3 times more power than traditional 4G systems. This higher power consumption leads to increased heat generation. Poor heat dissipation at the base station can not only reduce operating efficiency but also cause equipment problems such as damage, crashes, and network disconnections, all of which severely impact the user experience.

[0003] Current 4G base stations use a baseband unit (BBU) coupled to a remote radio unit (RRU). The baseband unit provides a physical interface with the 4G core network. The remote radio unit is coupled to the baseband unit via a physical communication connection and to one or more wireless devices via an antenna.

[0004] In 5G base stations, the base station uses a central unit (CU) and distributed units (DU), instead of a baseband unit. The central unit and distributed units each provide various wireless processing and control functions. In 5G base stations, active antenna units (AAUs) are used, instead of remote radio units and antennas. The central unit can be located in a more centralized location, while the distributed units and active antenna units can be distributed in various locations. Distributed units and active antenna units are typically installed outdoors. Therefore, distributed units and active antenna units usually need to have certain waterproof, dustproof, and corrosion-resistant capabilities.

[0005] Distribution units and active antenna units are typically mounted in enclosed enclosures with little or no airflow, relying on the enclosure's own heat conduction for cooling. This design is known as a fanless design. Summary of the Invention

[0006] The terminology used in the embodiments and similar terms (e.g., implementation, configuration, feature, example, and option) is intended to refer broadly to all objects of this disclosure and the following claims. Several statements containing these terms should be understood as not limiting the object described herein or the meaning or scope of the following claims. The embodiments of this disclosure covered herein are defined by the following claims and are not part of the content of this invention. This summary is a high-level overview of various features of this disclosure and introduces some concepts further described in the following implementation paragraphs. This summary is not intended to identify key or essential features of the object of the claims, nor is it intended to be used independently to determine the scope of the object of the claims. The object should be understood through reference to appropriate portions of the complete specification of this disclosure, any or all drawings, and each claim.

[0007] The disclosed embodiments include a computing system comprising a chassis. The chassis includes an inner wall and an outer wall. The outer wall includes one or more external heat dissipation elements. The computing system further includes a plurality of heat-generating computing components enclosed within the chassis. The plurality of heat-generating computing components includes at least one thermistor and at least one heat-resistant component. The at least one thermistor has a maximum operating temperature lower than the maximum operating temperature of the at least one heat-resistant component. The computing system further includes a partition wall located within the chassis for dividing the chassis into a first enclosed space and a second enclosed space, such that at least one thermistor is located in the first enclosed space and at least one heat-resistant component is located in the second enclosed space. The computing system further includes a thermoelectric cooler located within the first enclosed space. The thermoelectric cooler has a hot side and a cold side. The hot side is coupled to the inner wall of the chassis. The cold side is located at or near the at least one thermistor. The computing system further includes a thermal coupling material for thermally coupling the cold side to the at least one thermistor.

[0008] The disclosed embodiments include a computer chassis, comprising a body having an inner wall and an outer wall. The computer chassis further includes one or more external heat dissipation elements located on the outer wall. The computer chassis further includes at least one mounting point for mounting a printed circuit board (PCB) to the body. The computer chassis further includes at least one partition wall extending vertically from the inner wall to the PCB, such that when the PCB is mounted in the chassis, the at least one partition wall divides the chassis into a first enclosed space and a second enclosed space. The position of the at least one partition wall is such that at least one heat-sensitive component of the PCB is located in the first enclosed space, and at least one heat-resistant component of the PCB is located in the second enclosed space.

[0009] The embodiments disclosed herein include a method for preparing a sealed computer system. The method includes providing a computer chassis. The computer chassis includes a body having an inner wall and an outer wall. The computer chassis further includes one or more external heat dissipation elements located on the outer wall. The computer chassis further includes at least one partition wall extending vertically from the inner wall. The method further includes coupling a hot side of a thermoelectric cooler to the inner wall of the computer chassis. The method further includes preparing a cold side of the thermoelectric cooler with a thermal coupling material and securing a printed circuit board to the computer chassis. The printed circuit board has a plurality of heat-generating calculation components, including at least one thermistor and at least one heat-resistant component. The at least one thermistor has a maximum operating temperature lower than the maximum operating temperature of the at least one heat-resistant component. Securing the printed circuit board to the computer chassis includes bringing the printed circuit board to at least one partition wall to define an enclosed space containing the thermoelectric cooler and at least one thermistor. The at least one heat-resistant component is located outside the first enclosed space.

[0010] The foregoing description is not intended to present every embodiment or feature of this disclosure. Rather, it provides only examples of some novel features and characteristics set forth herein. The foregoing description will become apparent, in conjunction with the accompanying drawings and the appended claims, from the following detailed description of representative embodiments and modes for carrying out the invention. Additional features of this disclosure will be apparent to those skilled in the art, given the detailed description of various embodiments with reference to the accompanying drawings and the simplified description of the symbols provided below. Simple Explanation of the Diagram

[0011] The present disclosure and its advantages, along with the accompanying drawings, will be better understood from the following description of exemplary embodiments in conjunction with the accompanying drawings. These drawings illustrate exemplary embodiments only and should therefore not be considered as limiting the various embodiments or the scope of the claims. Figure 1 is a schematic diagram showing a wireless system using a sealed computing system, based on certain features of this disclosure. Figure 2 is a cross-sectional block diagram of a sealed computing system, based on certain features of this disclosure. Figure 3 is a graph showing a comparison of the temperature of the heat-sensitive component of a baseline solution and an improved solution, based on certain features of this disclosure. Figure 4 is a graph showing a comparison of the temperature of a baseline solution and the temperature of the heat-resistant components of an improved solution, based on certain features of this disclosure. Figure 5A is a block diagram showing the average temperature around a printed circuit board that does not have some of the features disclosed herein. Figure 5B is a block diagram showing the average temperature around a printed circuit board according to certain features of this disclosure. Figure 6 is a process diagram showing the preparation of a sealed computing system based on certain features of this disclosure. Implementation

[0012] A fanless, hermetically sealed computer chassis for use in high-temperature environments is disclosed. The chassis may include a body having an outer wall and an inner wall. The outer wall may include external heat dissipation elements, such as heat sink fins. The chassis may include a partition wall extending vertically from the inner wall. A hot side of a thermoelectric cooler may be thermally coupled to the inner wall on one side of the partition wall. A printed circuit board (PCB) may be attached to the chassis such that the partition wall contacts the PCB (e.g., via a sealing layer) to divide the interior of the chassis into a first enclosed space and a second enclosed space. The first enclosed space may include the thermoelectric cooler and one or more heat-sensitive components, while the second enclosed space may include one or more heat-resistant components.

[0013] Placing a thermoelectric cooler (TEC) in an enclosed chassis for cooling is initially counterintuitive. A thermoelectric cooler pumps heat from its cold side to its hot side, but this requires energy (e.g., input energy), and excess energy is released on the hot side. Therefore, the hot side will be hotter than the cold side. In other words, the temperature difference between a nominal temperature and the cold side is smaller than the temperature difference between the nominal temperature and the hot side. Therefore, using a thermoelectric cooler in an enclosed chassis is counterintuitive because it introduces additional heat into the chassis.

[0014] However, according to some features and characteristics disclosed herein, thermoelectric coolers can be placed in an enclosed chassis in a configuration that allows them to selectively cool certain specific components while minimizing the impact on other components within the chassis. In some cases, these specific components may be less heat-resistant (i.e., more heat-sensitive components). Therefore, although the less heat-resistant (more heat-sensitive) components are being cooled by the thermoelectric cooler, the additional heat generated by the thermoelectric cooler may raise the temperature of the heat-resistant components. Therefore, the thermoelectric cooler can be driven to provide additional cooling for heat-sensitive components, provided that the excess heat generated by the thermoelectric cooler does not push the temperature of the heat-resistant components beyond their safe operating range.

[0015] Therefore, based on some of the features and characteristics disclosed herein, computing devices using these technologies can withstand higher external temperatures, operate more efficiently, and experience less thermal stunting. Furthermore, the improved cooling capacity of thermoelectric coolers allows for more optimized heatsink fin sizes in chassis designs. Additionally, by eliminating the need for internal fans, and reducing or avoiding potentially maintainable moving parts, maintenance costs are lowered, and chassis designs that would make fan maintenance impossible are permitted. For example, in some cases, the chassis can be completely sealed, eliminating the need for any openable maintenance access points to the chassis interior.

[0016] In some cases, the thermoelectric cooler can be controlled by the same printed circuit board that provides selective cooling. The thermoelectric cooler can be coupled to the printed circuit board via a cable and a corresponding connector on the board.

[0017] As described herein, the partition wall extends from the chassis and contacts the printed circuit board (e.g., directly or via a sealing layer) to divide the first enclosed space and the second enclosed space. However, in some alternative embodiments, the partition wall may be coupled to and extend from the printed circuit board so that when the printed circuit board is mounted in the chassis, the partition wall contacts the inner wall of the chassis (e.g., directly or via a sealing layer).

[0018] As used herein, the term "sealed computing system" is intended to include computing systems enclosed in an enclosure that completely or substantially restricts airflow between the internal and external environments, such as an airtight enclosure or a dustproof enclosure. In some cases, the enclosure may completely or substantially restrict fluid flow between the internal and external environments, such as a waterproof enclosure. In some cases, the enclosure may have an Ingress Protection rating (IP rating), indicating the degree to which the enclosure protects against the intrusion of various solids and / or liquids. For example, an IP5X rating is dustproof, limiting dust ingress to a level that does not affect the internal equipment, while an IP6X rating is dustproof, preventing any dust from entering. In some cases, a sealed computing system may have at least an IP2X, IP3X, IP4X, IP5X, or IP6X rating. As another example, an IPX4 rating prevents water splashes from any direction, while an IPX7 rating prevents water ingress when the enclosure is submerged underwater for up to 1 minute. In some cases, the IP rating of a sealed computing system may be at least IPX2, IPX3, IPX4, IPX5, IPX6, IPX7, IPX8, or IPX9.

[0019] Various embodiments are described with reference to the accompanying drawings, throughout which similar reference numerals are used to designate similar or equivalent elements. The drawings are not drawn to scale and are provided solely to illustrate the features and characteristics of this disclosure. It should be understood that many specific details, relationships, and methods are set forth to provide a comprehensive understanding. However, it will be readily apparent to those skilled in the art that various embodiments may be practiced without one or more specific details or in other ways. In some cases, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments are not limited to the order in which actions or events are shown, as some actions may occur in a different order and / or simultaneously with other actions or events. Furthermore, not all actions or events shown are necessary to implement certain features and characteristics of this disclosure.

[0020] For the purposes of this embodiment, unless explicitly stated otherwise, the singular includes the plural and vice versa. The term "including" means "including but not limited to". Furthermore, approximate words such as "about (about), almost, substantially, approximately)" and similar words may be meant herein as, for example, "at", "near, nearly at", "within 3-5% of", "within acceptable manufacturing tolerances", or any logical combination thereof. Additionally, the terms "vertical" or "horizontal" are intended to further include "within 3-5%" in the vertical or horizontal direction, respectively. Furthermore, directional terms such as "top", "bottom", "left", "right", "above", and "below" are intended to relate to the equivalent directions depicted in the reference illustrations; to be understood from the context of the referenced object or element, such as from its usual location; or other such descriptions.

[0021] Figure 1, based on some features of this disclosure, shows a schematic diagram of a fanless, sealed computer system applied to a wireless system 100. The wireless system 100 can be mounted on a mast 106, although in some cases, it can also be mounted elsewhere, such as on a building. The wireless system 100 can be installed outdoors, in environment 108. In environment 108, the wireless system 100 may be affected by extremely high temperatures, such as heat from the surrounding environment and direct sunlight, as well as rain and other climatic phenomena. Therefore, the components of the wireless system 100 may require effective cooling to maintain intended operation.

[0022] The wireless system 100 may include an active antenna unit 102 coupled to a distribution unit 104. The distribution unit 104 may include various components located within a chassis, such as a printed circuit board containing a central processing unit (CPU) and other additional components. The distribution unit 104 may include a thermoelectric cooler within its housing, as further described below.

[0023] While some features disclosed herein may be applied to other types of wireless systems as well as non-wireless systems, the wireless system 100 shown in Figure 1 is a 5G wireless system.

[0024] Figure 2 shows a cross-sectional block diagram of a sealed computer system 200, based on some features of this disclosure. The sealed computer system 200 may be the distribution unit 104 in Figure 1, or any other suitable sealed computer system. The sealed computer system 200 may be a fanless design.

[0025] The sealed computer system 200 may include a chassis 202. The chassis 202 may be made of any suitable material. In some cases, the chassis 202 may be made of a thermally conductive material. The chassis 202 may include a plurality of heat sink fins 204 designed to dissipate heat from the internal components of the chassis 202 to the surrounding environment.

[0026] A printed circuit board 214 may be located within a chassis 202 and may be secured to the chassis 202 using any suitable mounting technique, such as screwing screws into corresponding supports (not shown) on the inner wall of the chassis 202. The printed circuit board 214 may include a plurality of components, including one or more heat-susceptible components 220 (e.g., various integrated circuits for managing input / output ports, controlling thermoelectric coolers 208, or performing other functions), and at least one heat-tolerant component 212 (e.g., a central processing unit). The heat-susceptible component 220 may be any component mounted or attached to the printed circuit board that has a lower tolerance to high temperatures than the heat-tolerant component 212. In some cases, the temperature specification range of the heat-susceptible component 220 may not be as high as that of the heat-tolerant component 212 on the same printed circuit board 214.

[0027] The chassis 202 may include a partition wall 210 extending from an inner wall (e.g., an inner surface) of the chassis 202. In some cases, the partition wall 210 may be integral with the chassis 202, but in other cases, the partition wall 210 may also be coupled to the chassis 202. The partition wall 210 and the printed circuit board 214 may divide the interior space of the chassis 202 into at least a first enclosed space 222 and a second enclosed space 224. Each enclosed space (e.g., the first enclosed space 222 and the second enclosed space 224) may be sealed to each other, such that the movement of fluid between these spaces is restricted or completely eliminated. The partition wall 210 may extend to a suitable distance to contact the printed circuit board 214 when the printed circuit board 214 is mounted in the chassis 202. The partition wall 210 may contact the printed circuit board 214 directly, or typically the partition wall 210 contacts the printed circuit board 214 through a sealing layer 218. The sealing layer 218 seals the partition wall 210 to the printed circuit board 214, completely or substantially restricting fluid movement between the first enclosed space 222 and the second enclosed space 224. The sealing layer 218 may have adhesive properties (e.g., for bonding the printed circuit board 214 to the partition wall 210), but is not necessarily required to do so. The sealing layer 218 may be a polishable adhesive that, once cured, has sufficient flexibility to accommodate assembly tolerances.

[0028] The first enclosed space 222 may include a thermally sensitive component 220. A thermoelectric cooler 208 may be located within the first enclosed space 222. The thermoelectric cooler 208 may be fixed to the inner wall of the chassis 202 via, for example, an adhesive layer 206. The adhesive layer 206 may be a thermally conductive adhesive. The thermoelectric cooler 208 may be located within the chassis 202, with its hot side coupled to the inner wall of the chassis 202, while its cold side faces the printed circuit board 214.

[0029] A thermal coupling material 216 can be placed within the first enclosed space 222, allowing heat generated by the heat-sensitive component 220 to be transferred to the cold side of the thermoelectric cooler 208. The heat is then pumped to the hot side of the thermoelectric cooler 208 and enters the chassis 202 via the adhesive layer 206. The heat is then dissipated into the surrounding environment via the outer wall of the chassis 202 and / or the heat dissipation fins 204. The thermal coupling material 216 can fill any gap between the thermoelectric cooler 208 and the heat-sensitive component 220, even if different heat-sensitive components 220 have different heights. Due to the sealing layer 218, the thermal coupling material 216 can remain within the first enclosed space 222 and will not escape into the second enclosed space 224. The thermal coupling material 216 can be a thermal gel. The thermal coupling material 216 can be any highly adaptable thermal interface material. It is important to ensure that there are no gaps between the thermoelectric cooler 208 and the thermal component 220 (and the surrounding printed circuit board 214), as air gaps around the thermoelectric cooler 208 may damage the thermoelectric cooler 208.

[0030] The second enclosed space 224 may include at least one heat-resistant component 212. Heat generated within the second enclosed space 224, for example, heat generated by the heat-resistant component 212, may be transferred to the chassis 202 via, for example, convection, and dissipated into the surrounding environment.

[0031] In some cases, the presence of thermoelectric cooler 208 makes the second enclosed space 224 hotter when thermoelectric cooler 208 is activated than when thermoelectric cooler 208 is deactivated, because thermoelectric cooler 208 itself is a heat-generating component. However, since thermistor 220 is located within the first enclosed space 222 and is actively cooled by thermoelectric cooler 208, the temperature of thermistor 220 can be kept relatively low (compared to when thermoelectric cooler 208 is not used). Therefore, thermoelectric cooler 208 can be used to cool thermistor 220 as long as heat-resistant component 212 remains within specifications (e.g., below its maximum operating temperature).

[0032] In some cases, chassis 202 may include a single thermoelectric cooler 208, although in others it may not be a single one. In some cases, chassis 202 may include one or more partition walls 210. In some cases, one or more partition walls 210 may divide the interior of chassis 202 into more than two enclosed spaces, wherein at least two enclosed spaces are cooled by one or more thermoelectric coolers 208. In some cases, each enclosed space cooled by a thermoelectric cooler 208 may be cooled by a single thermoelectric cooler 208. However, in some cases, an enclosed space cooled by a thermoelectric cooler 208 may also be cooled by multiple thermoelectric coolers 208.

[0033] As shown in Figure 2, both the heat-resistant component 212 and the thermal component 220 are mounted on a single printed circuit board 214. In some cases, either the heat-resistant component 212 and / or the thermal component 220 may be mounted on separate printed circuit boards, or in some cases, they may not be mounted on any printed circuit board (e.g., separately mounted on chassis 202). For example, in some cases, the thermal component 220 is cooled by a thermoelectric cooler 208, and the thermal component 220 may be on a daughterboard, which is coupled to the main board containing the heat-resistant component 212 via a wired connection or socket.

[0034] When an electric current is applied to the thermoelectric cooler 208, heat is absorbed on the cold side and dissipated on the hot side. The amount of heat transfer is proportional to the amount of current applied.

[0035] In some cases, the thermoelectric cooler 208 can be actively controlled, in which case the current applied to the thermoelectric cooler 208 is adjusted based on sensor data, such as data from a temperature sensor 228. Such a temperature sensor 228 may be located within the first enclosed space 222. In some cases, a temperature sensor may also be located elsewhere on the chassis 202 (e.g., in the second enclosed space 224) or outside the chassis 202 (e.g., an ambient air temperature sensor located next to the chassis 202). In some cases, temperature data from an external source may also be used, such as temperature data of the area where the chassis 202 is located, received from a network. In an example of the use of a distribution unit 104 in a 5G wireless system 100 (as shown in Figure 1), a temperature sensor 228 may be located close to the thermal component 220, and the thermoelectric cooler 208 supplies 0.5 amps of current when the sensed temperature is below 55°C; supplies 1 amp of current when the sensed temperature is between 55°C and 65°C; supplies 1.5 amps of current when the sensed temperature is between 65°C and 75°C; and supplies 2 amps of current when the sensed temperature exceeds 75°C.

[0036] In some cases, the thermoelectric cooler 208 can be passively controlled, in which case a predetermined current is applied to the thermoelectric cooler 208. The magnitude of the applied predetermined current can be determined based on the size of the thermoelectric cooler 208, the size of the first enclosed space 222, the size of the second enclosed space 224, the size of the chassis 202, and the heat generated by various heat-generating components inside the chassis 202 (e.g., thermistor 220 and heat-resistant component 212). To determine the appropriate applied current, an example sealed computer system can be simulated. Different currents can be tested to determine the current range that keeps the thermistor 220 and the heat-resistant component 212 below their respective maximum operating temperatures. As the applied current increases, the temperature of the thermistor 220 decreases, while the temperature of the heat-resistant component 212 increases. In some cases, it is ideal to use the lowest possible current, at which both thermistor 220 and heat-resistant component 212 remain below their maximum operating temperatures. These simulations can be based on different ambient temperatures and / or other environmental conditions. When selecting the current, consider the most demanding ambient temperature and / or other environmental conditions that the sealed computer system 200 is expected to experience.

[0037] Figure 3 is a graph 316 showing the temperature of the thermistor according to certain features of this disclosure, comparing the baseline solution and the improved solution. The thermistor may be the thermistor 220 in Figure 2.

[0038] The baseline solution could be a fanless, hermetic computer system that does not use a thermoelectric cooler. An improved solution would be a fanless, hermetic computer system that uses a thermoelectric cooler, as shown in Figure 2, hermetic computer system 200.

[0039] The thermal component may have a maximum operating temperature of 312, for example, at 75.0°C. This maximum operating temperature of 312 may be defined by the manufacturer.

[0040] Figure 316 shows the temperatures reached by the thermistor components when the sealed computer system operates in a high-temperature environment. As shown in Figure 316, the temperature of the baseline solution 318 exceeds the maximum operating temperature 312, at approximately 79.6°C. However, the improved solution 320, which uses a thermoelectric cooler to cool the thermistor components in the first enclosed space, maintains the temperature of the thermistor components at a relatively low level (e.g., 52.0°C), well below the maximum operating temperature 312. Clearly, the use of a thermoelectric cooler and the first enclosed space disclosed herein significantly improves the thermal management of the thermistor components.

[0041] Figure 4, based on certain features of this disclosure, shows a graph 404 of the temperature of the heat-resistant component, comparing the baseline solution and the improved solution. The heat-resistant component may be the heat-resistant component 212 in Figure 2.

[0042] The baseline solution could be a fanless, hermetic computer system that does not use a thermoelectric cooler. An improved solution is a fanless, hermetic computer system that uses a thermoelectric cooler, as shown in Figure 2, hermetic computer system 200.

[0043] The heat-resistant component may have a maximum operating temperature of 402, for example, 97.3°C. This maximum operating temperature of 402 may be defined by the manufacturer.

[0044] Figure 404 shows the temperatures reached by heat-resistant components when the sealed computer system operates in a high-temperature environment. As shown in Figure 404, the baseline solution 406 reaches a temperature of 91.6°C, which is significantly lower than the maximum operating temperature 402. The improved solution 320 reaches a temperature of 93.1°C, which is slightly higher than the baseline solution 406, but still significantly lower than the maximum operating temperature 402. Therefore, using the improved solution may result in higher operating temperatures for the heat-resistant components, but not enough to adversely affect their operation (e.g., it will not cause the heat-resistant components to exceed specifications).

[0045] Specifically, Figure 404 shows the temperatures of the heat-resistant components in the baseline solution and the improved solution, which have been described with reference to Figure 316 in Figure 3. In other words, for the baseline solution, the temperature of the thermistor reaches 79.6°C and the temperature of the heat-resistant component reaches 91.6°C when the sealed computer system is running; while for the improved solution, the temperature of the thermistor decreases to only 52.0°C and the temperature of the heat-resistant component only slightly increases to 93.1°C when the sealed computer system is running.

[0046] Figure 5A shows a block diagram of the average temperature around a printed circuit board 502 that does not possess certain features of this disclosure. The printed circuit board 502 includes a heat-resistant component 504 and a set of thermally sensitive components 506. A sealed computer system using the printed circuit board 502 can serve as a baseline solution for sealed computer systems, as shown in Figures 3 and 4. For illustrative purposes, higher temperatures are generally represented by a dot plot.

[0047] As shown in Figure 5A, the printed circuit board 502 experiences high temperatures throughout the board, including at the heat-resistant component 504 and the thermistor 506. These high temperatures may not exceed the maximum operating temperature of the heat-resistant component 504, but may exceed the maximum operating temperature of the thermistor 506.

[0048] Figure 5B is a block diagram showing the average temperature around the printed circuit board 512, based on certain features disclosed herein. The printed circuit board 512 includes a heat-resistant component 514 and a set of thermally sensitive components 516. A sealed computer system using the printed circuit board 512 can provide an improved solution for sealed computer systems, as shown in Figures 3 and 4. For illustrative purposes, higher temperatures are generally represented by a dotted graph.

[0049] As shown in Figure 5B, the printed circuit board 512 has a high temperature in most locations, including at the heat-resistant component 514, but the thermistor 516 does not have a high temperature due to the use of a thermoelectric cooler and the partition wall 520. The high temperature of the heat-resistant component 514 may not exceed its maximum operating temperature, while the relatively low temperature of the thermistor 516 is well below its maximum operating temperature.

[0050] Figure 6 is a process diagram showing the preparation of a sealed computer system 600 according to certain features of this disclosure. The sealed computer system prepared in process 600 may be the sealed computer system 200 in Figure 2.

[0051] In block 602, a computer case is provided. The computer case can be case 202 in Figure 2.

[0052] In block 604, the hot side of a thermoelectric cooler (thermoelectric cooler) may be coupled to the inner wall of a computer chassis. Coupling the hot side of the thermoelectric cooler to the computer chassis may include applying a thermal interface material to the thermoelectric cooler and / or the computer chassis before securing the thermoelectric cooler to the computer chassis (e.g., via fasteners, adhesives, etc.). In some cases, the thermal interface material is an adhesive.

[0053] In block 606, the cold side of the thermoelectric cooler can be prepared. Preparing the cold side may include applying a thermal coupling material to the cold side of the thermoelectric cooler. This thermal coupling material can be any suitable material, such as hot glue. The amount of thermal coupling material applied in block 606 can be determined based on the calculated volume of the enclosed space in which the thermoelectric cooler will be placed, i.e., the volume of the cold side of the thermoelectric cooler and the space between the printed circuit board and its components.

[0054] At block 608, a sealant can be used to treat the partition wall. This sealant can be any suitable material, used to seal the gap between the partition wall and the printed circuit board when the printed circuit board is mounted in chassis 202. In some cases, the sealant is an adhesive. Once cured, the sealant retains sufficient elasticity to account for assembly tolerances. In some cases, the elasticity of the sealant ensures that when the printed circuit board is coupled to chassis 202, the thermal coupling material remains within its enclosed space, even if the amount of thermal coupling material slightly exceeds the available volume of the enclosed space. The sealant forms sealing layer 218 in Figure 2.

[0055] In block 610, the thermoelectric cooler can be electrically coupled to a printed circuit board. Electrically coupling the thermoelectric cooler to the printed circuit board may include inserting the thermoelectric cooler's cable into a corresponding socket on the printed circuit board. For example, any suitable connector can be used to insert the thermoelectric cooler into the printed circuit board. In some cases, the thermoelectric cooler may also be electrically coupled to the printed circuit board in other ways, such as by using one or more spring pins to contact corresponding pads on the printed circuit board during assembly.

[0056] In block 612, the printed circuit board (PCB) can be secured to the computer case. The PCB can be secured to the computer case using any suitable technique, such as screws, clips, adhesives, etc. In some cases, sealing materials can help secure the PCB to the computer case, although this is not always necessary.

[0057] Process 600 includes the blocks shown in Figure 6. In some cases, certain blocks in process 600 may be omitted or combined. In some cases, process 600 may include additional blocks. In some cases, blocks in process 600 may be replaced by alternative blocks. For example, in some cases, process 600 may include blocks 602, 604, 606, 608, and 612, but not block 610. In this case, the thermoelectric cooler may be electrically coupled to other components outside the printed circuit board, such as an external power supply or control board.

[0058] Another example is that, according to process 600 shown in Figure 6, the thermoelectric cooler is coupled to the chassis before the printed circuit board is fixed to the chassis, but this is not necessarily required. In this case, process 600 can couple the thermoelectric cooler to the printed circuit board after block 606, and then add a block to prepare the hot side of the thermoelectric cooler (e.g., by applying a thermal interface material). In this example, at block 612, the hot side of the thermoelectric cooler is thermally coupled to the chassis when the printed circuit board is fixed to the chassis.

[0059] The foregoing description of the embodiments, including the illustrated embodiments, is presented for illustrative and descriptive purposes only and is not intended to exhaustively describe or limit the precise forms disclosed. Many modifications, adaptations, and uses will be apparent to those skilled in the art. Various changes may be made to the disclosed embodiments based on this disclosure without departing from the spirit or scope of this disclosure. Therefore, the breadth and scope of this disclosure should not be limited by any of the foregoing embodiments.

[0060] Although embodiments of this disclosure have been shown and described with respect to one or more implementations, equivalents and modifications will arise upon reading and understanding this specification and the accompanying drawings by those skilled in the art. Furthermore, while specific features of this disclosure may have been disclosed with respect to only one embodiment of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous for any given or particular application.

[0061] While various embodiments of this disclosure have been described above, it should be understood that they are presented by way of example only and not as limiting. Various changes may be made to the embodiments disclosed herein without departing from the spirit or scope of this disclosure. Therefore, the breadth and scope of this disclosure should not be limited by any of the foregoing embodiments. Rather, the scope of this disclosure should be defined by the following claims and their equivalents.

[0062] 100: Wireless System 102: Active antenna element 104: Distribution Unit 106: pole 108: Environment 200: Sealed Computer System 202: Chassis 204: Heat dissipation fins 206: Adhesive layer 208: Thermoelectric Cooler 210: Partition wall 212: Heat-resistant components 214: Printed Circuit Board 216: Thermal coupling materials 218: Sealing layer 220: Thermal components 222: First Enclosed Space 224: Second Enclosed Space 228: Temperature sensor 312: Maximum operating temperature 316: Chart 318: Benchmark Solution 320: Improvement Solutions 402: Maximum operating temperature 404: Chart 406: Benchmark Solution 502: Printed Circuit Board 504: Heat-resistant components 506: Thermal components 512: Printed Circuit Board 514: Heat-resistant components 516: Thermal components 520: Partition Wall 600: Process 602, 604, 606, 608, 610, 612: Squares

Claims

1. A computing system, comprising: A chassis including an inner wall and an outer wall, the outer wall including one or more external heat dissipation elements; a printed circuit board fixed to the chassis; a plurality of heat-generating computing components enclosed within the chassis, the plurality of heat-generating computing components including at least one thermistor and at least one heat-resistant component, the at least one thermistor having a maximum operating temperature lower than the maximum operating temperature of the at least one heat-resistant component; a partition wall located within the chassis, extending from the inner wall of the chassis, the partition wall and the printed circuit board dividing the chassis into a first enclosed space and a second enclosed space, such that the at least one thermistor is located in the first enclosed space and the at least one heat-resistant component is located in the second enclosed space; a thermoelectric cooler located within the first enclosed space and having a hot side and a cold side, the hot side being coupled to the inner wall of the chassis, and the cold side being located at or near the at least one thermistor; And a thermal coupling material for thermally coupling the cold side to the at least one heat-sensitive component.

2. The computing system as claimed in claim 1 further includes a sealing material that couples the partition wall to the printed circuit board on which the at least one thermal component is mounted.

3. The computing system as described in claim 2, wherein the sealing material is an adhesive.

4. The computing system as described in claim 1, wherein the partition wall extends from the inner wall of the chassis.

5. The computing system as described in claim 4, wherein the partition wall is integrally formed with the inner wall of the chassis.

6. The computing system as claimed in claim 1, wherein the at least one thermal component comprises: A first heat-sensitive component having a first height and defining a first gap between a first heat-resistant component and the cold side of the thermoelectric cooler; a second heat-sensitive component having a second height and defining a second gap between a second heat-resistant component and the cold side of the thermoelectric cooler, wherein the first gap is larger than the second gap.

7. The computing system as claimed in claim 1, wherein the plurality of heat-generating computing components are mounted on a printed circuit board, and wherein the thermoelectric cooler is controlled by an electrical connection to the printed circuit board.

8. The computing system as claimed in claim 7 further includes a thermal sensor located within the first enclosed space and configured to adjust the power supplied to the thermoelectric cooler based on a sensed temperature within the first enclosed space.

9. A computer case, comprising: A chassis having an inner wall and an outer wall; one or more external heat dissipation elements located on the outer wall; at least one mounting point for mounting a printed circuit board to the chassis; and at least one partition wall extending vertically from the inner wall to the printed circuit board, such that when the printed circuit board is mounted in the chassis, the at least one partition wall divides the chassis into a first enclosed space and a second enclosed space, the position of the at least one partition wall such that at least one thermally sensitive component of the printed circuit board is located in the first enclosed space, and at least one heat-resistant component of the printed circuit board is located in the second enclosed space.

10. A method for preparing a sealed computer system, comprising: A computer chassis is provided, the computer chassis comprising: a body having an inner wall and an outer wall; one or more external heat dissipation elements located on the outer wall; and at least one partition wall extending vertically from the inner wall; coupling a hot side of a thermoelectric cooler to the inner wall of the computer chassis; preparing a cold side of the thermoelectric cooler with a thermal coupling material; and securing a printed circuit board to the computer chassis, the printed circuit board having a plurality of heat-generating calculation components, including at least one thermistor and at least one heat-resistant component, the at least one thermistor having a maximum operating temperature lower than the maximum operating temperature of the at least one heat-resistant component, wherein securing the printed circuit board to the computer chassis includes bringing the printed circuit board to the at least one partition wall to define a first enclosed space containing the thermoelectric cooler and the at least one thermistor, the at least one heat-resistant component being located outside the first enclosed space.

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