Electronic module with heat dissipation components for semiconductor devices and manufacturing method thereof
Patent Information
- Application Number
- TW114102313
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-02-14
- Filing Date
- 2025-01-20
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2045-01-19
AI Technical Summary
Conventional electronic modules with heat dissipation surfaces on both sides require precise management of the distance between these surfaces, complicating manufacturing and affecting heat dissipation characteristics due to high-precision positioning needs.
An electronic module design with a protrusion on one substrate extending outward from the other, allowing for precise alignment using an assembly fixture with dedicated mounting portions, ensuring accurate stacking and improved heat dissipation.
The solution enables high-precision mounting of heat dissipation surfaces on both sides, enhancing the module's heat dissipation characteristics by maintaining accurate positioning and alignment during assembly.
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Abstract
Citation Information
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