Test socket

Abstract

An exemplary embodiment of the present invention discloses a BGA test socket for achieving impedance matching, comprising: contacts including ground pins and signal pins; and a socket body for inserting into and elastically supporting the contacts, and having a plurality of holes. The socket body includes: a first hole for inserting the ground pin; a second hole for inserting the signal pin; and a through hole corresponding to the pin diagram of the test socket, formed between the plurality of contacts. A first shielding plating layer is formed on the inner surface of the through hole by means of a conductive component, and a second shielding plating layer for connecting the first shielding plating layer is formed on the upper and lower surfaces of the socket body by means of a conductive component.

Description

Technical Field

[0001] This invention relates to a test socket for testing semiconductor components. Prior Technology

[0002] Semiconductor components are densely integrated from microcircuits, and undergo testing processes during manufacturing to ensure the proper functioning of each circuit. The testing process uses an inspection device to apply test signals to the terminals of the semiconductor component under test. However, the inspection device is not directly connected to the terminals of the semiconductor component under test; instead, it is connected via a test socket. The test socket consists of probes that connect the various terminals of the semiconductor component to the terminals of the test PCB of the inspection device, and a socket that supports the probes.

[0003] The probes and sockets that make up this test socket vary greatly depending on the operating frequency of the semiconductor components, the terminal type (BGA, LGA, etc.), and the spacing between the terminals.

[0004] Figure 1 is a cross-sectional view of a semiconductor device test socket device according to the prior art. The socket device includes multiple probes 1 and socket bodies 2 and 3 that support the multiple probes 1.

[0005] The socket bodies 2 and 3 are used to electrically insulate multiple probes 1. They consist of an upper body 2 supporting the upper end of the probes 1 and a lower body 3 supporting the lower end of the probes 2. The probes 1 are supported at the upper and lower ends of the socket bodies 2 and 3, and are elastic in the longitudinal direction (vertical direction) to electrically connect the terminals of the semiconductor components mounted on the upper part of the socket assembly to the terminals (pads) of the test PCB mounted on the lower part.

[0006] On the other hand, with the development of semiconductor devices, the speed is constantly increasing and the terminal spacing is constantly decreasing. Crosstalk between probes will become a problem. Therefore, noise shielding between probes has become a very important factor.

[0007] To address these issues, various technologies have been developed for test socket devices. For example, coaxial probes are used where the inner surface of the hole accommodating the probe is electroplated within the socket body of an insulator, or the socket body is made of metal to shield noise between the probes.

[0008] However, these existing socket devices face numerous difficulties in noise shielding between probes due to the miniaturization and high speed of semiconductor components, the rapid increase in terminals, and the fine spacing between terminals, as well as the complex and difficult manufacturing process. Summary of the Invention

[0009] Therefore, the purpose of this invention is to provide a BGA test socket for achieving impedance matching in order to solve the above-mentioned problems.

[0010] One of the various objectives of this invention is to provide a test socket for achieving impedance matching, which transmits maximum power and prevents signal distortion when testing a device optimized for a specific impedance according to customer requirements.

[0011] One of the various objectives of this invention is to provide a test socket with improved noise shielding between finely spaced pins, corresponding to a pin map.

[0012] One of the various objectives of this invention is to provide a test socket that, in order to improve economic efficiency in manufacturing the test socket, employs contacts of the same shape but providing different physical resistance values ​​by means of a difference in diameter.

[0013] [Solutions to the problem]

[0014] Various embodiments of the present invention disclose a BGA test socket for achieving impedance matching, comprising: contacts including ground pins and signal pins; and a socket body that inserts into and elastically supports the contacts, and has a plurality of holes, including: a first hole for inserting the ground pin; a second hole for inserting the signal pin; and through holes corresponding to the pin diagram of the test socket, formed between the plurality of contacts. A first shielding plating layer is formed on the inner surface of the through holes by means of conductive components, and a second shielding plating layer for connecting the first shielding plating layer is formed on the upper and lower surfaces of the socket body by means of conductive components.

[0015] A feature of the present invention is that the second shielding coating is formed around the second hole on the upper and lower surfaces of the socket body.

[0016] A feature of the present invention is that the ground pin and the signal pin are formed with the same shape.

[0017] A feature of this invention is that the maximum diameter of the grounding pin and the signal pin are different from each other.

[0018] A feature of the present invention is that the ground pin and the signal pin are formed with different shapes.

[0019] The invention may further include a float plate disposed on one side of the socket body, and having a third hole formed for accommodating the contact end of the contact that contacts the terminal of the BGA in the contact.

[0020] A feature of the present invention is that the float plate includes a fourth hole formed at a position corresponding to the through hole.

[0021] A feature of the present invention is that the inner circumferential surface of the fourth hole is formed with a third shielding coating layer by a conductive component.

[0022] The present invention may be characterized in that the stylus comprises: a pair of stylus pins; and a spring connected between the pair of stylus pins and providing elasticity.

[0023] The present invention may be characterized in that the pair of styluses have different shapes and are connected in intersecting directions.

[0024] Each feature of the above embodiments may be implemented in other embodiments without contradicting or being exclusive to other embodiments.

[0025] [Invention Effects]

[0026] According to various embodiments of the present invention, by forming a shielding plating layer between the via holes surrounding the signal pins, the signal is grounded separately, thereby improving impedance matching and the transmission of high-frequency signals.

[0027] Furthermore, by using shielding material around the contact area on the pin diagram, the noise shielding effect between fine pitches can be improved.

[0028] Furthermore, since the signal pins and ground pins use the same shape but different diameters, it facilitates the manufacture of test sockets.

[0029] Furthermore, the test socket device for testing semiconductor components includes multiple ground probes and multiple signal probes. The device includes an insulating socket body with ground holes and signal holes formed therein; a conductive grounding plating layer formed on the surface of the ground holes; and a conductive shielding element penetrating the upper and lower surfaces of the socket body for shielding noise between adjacent signal probes. Thus, the noise shielding effect between signal probes is excellent and easy to manufacture.

[0030] The effects of the present invention are not limited to those described above, and other effects not mentioned will be clearly recognized by those skilled in the art from the following description. Simple Explanation of the Diagram

[0031] Figure 1 is a cross-sectional view of a semiconductor component test socket device based on the prior art.

[0032] Figure 2 is a schematic diagram of the pinout of a test socket according to an exemplary embodiment of the present invention.

[0033] Figure 3 is a cross-sectional view of AA in Figure 2.

[0034] Figure 4 is a cross-sectional view of BB in Figure 2.

[0035] Figures 5 and 6 are schematic diagrams of contacts according to exemplary embodiments of the present invention.

[0036] Figure 7 is a cross-sectional view of a test socket according to another embodiment of the present invention. Implementation

[0037] Specific embodiments of the present invention will now be described with reference to the accompanying drawings. The detailed description provided below will aid in a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, these are merely examples, and the invention is not limited thereto.

[0038] In describing embodiments of the present invention, detailed descriptions of well-known technologies related to the present invention will be omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Furthermore, the terminology used herein is defined with reference to the functionality of the invention and may be changed according to the intention or habit of the user or operator. Therefore, definitions should be based on the entire contents of this specification.

[0039] The terminology used in the detailed description is for illustrative purposes only and should not be construed as limiting. Unless otherwise expressly stated, the singular form includes the meaning of the plural form.

[0040] In this specification, expressions such as “comprising” or “possessing” are intended to indicate certain features, figures, steps, operations, elements, or parts or combinations thereof, and should not be construed as excluding the presence or possibility of one or more other features, figures, steps, operations, elements, or parts or combinations thereof described.

[0041] Furthermore, when describing components of embodiments of the present invention, terms such as first, second, A, B, a, b, etc., may be used. These terms are only used to distinguish the component from other components, and the nature, order, or sequence of the components are not limited by these terms.

[0042] Figure 2 is a schematic diagram of the pinout of a test socket according to an exemplary embodiment of the present invention, Figure 3 is a cross-sectional view of AA in Figure 2, and Figure 4 is a cross-sectional view of BB in Figure 2.

[0043] The AA section of Figure 3 shows the section containing ground pin 15, via 13h, signal pin 11, via 13h, and ground pin 15 in sequence from left to right. The BB section of Figure 4 shows the section containing signal pin 11, ground pin 15, and signal pin 11 in sequence from left to right.

[0044] That is, section AA in Figure 3 represents the section with the through hole 13h, and section BB in Figure 4 represents the section without the through hole 13h.

[0045] The following description of a test socket according to an embodiment of the present invention will be made with reference to Figures 2 to 4.

[0046] The test socket 10 can form various pin maps according to the device under test (IC chip or module, etc.). Figure 2 is an example of various pin maps that can be applied to the test socket in this embodiment.

[0047] In a test socket, the pinout provides information about the pin layout of a particular device or chip and defines the function performed by each pin and what electrical connections are made, thereby showing the information needed to properly contact each pin and transmit signals during the test.

[0048] Pin diagrams are especially important for BGA (Ball Grid Array) or other complex packages because the pins in a BGA package are arranged in a small ball grid pattern, making them difficult to approach directly. Therefore, pin diagrams can be used to ensure that test sockets are correctly connected to each pin in the package.

[0049] That is, as mentioned above, the pin diagram may vary depending on the design of the test socket and the pin layout of a particular device or chip, and an accurate pin diagram is required when performing test work so that the correct pins can be accessed to send and receive test signals.

[0050] In addition, a shielding plating layer can be formed on the test socket of this embodiment to improve the insulation between fine pitches when testing high-frequency or high-speed signal semiconductor components.

[0051] More specifically, the test socket includes: contacts having a ground pin 15 and a signal pin 11; and socket bodies 110 and 120, into which the contacts are inserted and elastically supported, forming multiple holes.

[0052] The socket body includes an upper plate 120 and a lower plate 110, and the plurality of holes are formed by passing through the upper plate 120 and the lower plate 110.

[0053] The plurality of holes may include: a first hole 15h for inserting a ground pin 15; a second hole 11h for inserting a signal pin 11; and a via hole 13h, corresponding to the pin diagram of the test socket formed between contacts 11 and 15.

[0054] The first hole 15h and the second hole 11h are formed in the upper plate 120 and the lower plate 110 in the form of step holes, so that the ground pin 15 and the signal pin 11 can be inserted respectively, and can be formed through the socket body by connecting the upper plate 120 and the lower plate 110.

[0055] If we take the grounding pin 15 as an example to explain the stepped hole in more detail, we can form the stepped hole by forming a hole with a diameter d2 corresponding to the maximum diameter of the grounding pin 15 and a hole with a diameter d1 corresponding to the contact portion of the grounding pin in sequence.

[0056] A via 13h can be formed between contacts 11 and 15. That is, according to the reference lines such as the horizontal or vertical axis of the pin diagram, the via 13h can be located between ground pin 15 and ground pin 15, or between ground pin 15 and signal pin 11, or between signal pin 11 and signal pin 11.

[0057] Preferably, the via 13h can be formed around the signal pin 11. In this embodiment, the via 13h can be formed on the top, bottom, left and right sides of the signal pin 11.

[0058] Furthermore, the first shielding plating layer 131 formed on the inner surface of the through hole 13h can prevent crosstalk between fine pitches. More specifically, the first shielding plating layer 131 can be formed on the inner surface of the through hole 13h by means of conductive components, and a second shielding plating layer 133 connecting the first shielding plating layer 131 can be formed on the upper and lower surfaces of the socket bodies 110 and 120 by means of conductive components.

[0059] In this structure, the second shielding plating layer 133 can be grounded independently by connecting the through-holes 13h formed around the signal pins 11 on the pin diagram (upper and lower surfaces of the socket body), thereby improving impedance matching and high-frequency signal transmission.

[0060] Furthermore, for example, the first shielding plating layer 131 and the second shielding plating layer 133 can be conductive components such as gold, copper, or nickel, but are not limited to these. Of course, the first shielding plating layer 131 and the second shielding plating layer 133 can also be made of different materials.

[0061] Additionally, ground pin 15 and signal pin 11 can have different resistance values. More specifically, the resistance value of ground pin 15 can be higher than that of signal pin 11, thereby ensuring the accuracy of the signal only during testing at the test socket.

[0062] In this embodiment, the difference in resistance value is formed by the physical difference between the ground pin 15 and the signal pin 11, making it easier to design accurately and optimize the resistance value when testing high-frequency or high-speed signals.

[0063] More specifically, the ground pin 15 and the signal pin 11 may have the same shape, but their maximum diameters may be different. That is, in this embodiment, the difference in resistance between the ground pin 15 and the signal pin 11 is not formed by the difference in shape, but by the difference in diameter (size).

[0064] For example, ground pin 15 and signal pin 11 can be formed with the same shape and height, but different maximum diameters. The maximum diameter of ground pin 15 can be formed smaller than the maximum diameter of signal pin 11. In this way, by forming the pin of signal pin 11 thicker than that of ground pin 15, current flow can be improved and a lower resistance can be formed.

[0065] As described above, by making the maximum diameter of the ground pin 15 smaller than the maximum diameter of the signal pin 11, the resistance value of the ground pin 15 can be made higher than the resistance value of the signal pin 11.

[0066] Of course, the resistance difference between the ground pin 15 and the signal pin 11 is not limited to the above situation. The resistance difference can be formed by making the shapes of the ground pin 15 and the signal pin 11 different.

[0067] Additionally, the test socket of this embodiment may also include a floating plate 130, which is disposed on one side of the socket body and has a third hole formed therein for accommodating the contact end of the contact point where the contacts 11, 15 contact the BGA terminal (ball).

[0068] Since BGA packages have multiple grid-like contacts composed of small balls, which are difficult to contact, the test socket in this embodiment can improve IC semiconductor testing and connectivity through the floating plate 130.

[0069] More specifically, the float plate 130 is connected to the upper plate 130 via a flexible connection structure to ensure stable contact with each ball of the BGA package. Therefore, in this structure, the connection remains stable even if the package moves or is subjected to pressure.

[0070] The third hole has a predetermined diameter d3 to accommodate the ball of the BGA package, and can be formed with a diameter d1 corresponding to the contact end in the contact point that contacts the ball and a stepped hole.

[0071] Figures 5 and 6 are schematic diagrams of contacts according to exemplary embodiments of the present invention.

[0072] The contacts in this embodiment include a signal pin 11 and a ground pin 15. As described above, by way of example, the signal pin 11 and the ground pin 15 have the same shape and structure, only their diameters are different. Therefore, the contacts in this embodiment are described with reference to the signal pin 11 shown in Figures 5 and 6.

[0073] The signal pin 11 includes a first contact pin 11a, a second contact pin 12a and a spring 113, which is a spring pin that is elastic in the pressing direction by means of the spring 113.

[0074] The first contact pin 11a and the second contact pin 12a can be assembled relative to the spring 113 in mutually intersecting directions, so that they are elastically supported by the spring 113.

[0075] Spring 113 can be a helical compression spring with a predetermined thickness in its outer and inner diameters and a predetermined length along the length direction of signal pin 11. It can be located between the first contact pin 11a and the second contact pin 12a in signal pin 11. When the first contact pin 11a and the second contact pin 12a are compressed in the length direction, a restoring force can be provided with reference to spring 113 to restore each contact pin 11a, 12a to its position before compression.

[0076] The first stylus 11a may include a contact portion 111, a body portion 113, and a leg 115.

[0077] The contact portion 111 is formed at one end of the body portion 113. When the semiconductor component IC is tested by the test socket, it can contact the circuit pattern of the test printed circuit board installed in the test device, or contact one of the contact balls or soldering stations of the BGA type or LGA type semiconductor IC.

[0078] In this embodiment, the contact portion 111 can be configured as a crown shape, wherein a plate-shaped strip with multiple pointed portions 1111 is formed by rolling. Exemplarily, the contact portion 111 can be stamped to form a strip shape with multiple pointed portions 1111 and then wound. With this shape, the contact portion 111 can improve its contact capability with BGA terminals.

[0079] The body portion 113 may include: a guide groove S1 formed along the length direction of the body portion 113; and shoulders 1131 protruding from both sides of the body portion 113.

[0080] The shoulder 1131 together with the shoulder 1231 of the second contact pin 12a enables the spring 113 to be elastically supported and connected between the first contact pin 11a and the second contact pin 12a.

[0081] In addition, the signal pin 11 can be supported in the stepped hole formed on the upper plate 120 by the shoulder 1131, or it can be supported in the stepped hole formed on the lower plate 110 by the shoulder 1231.

[0082] When the guide groove S1 is assembled in the direction where the first contact pin 11a and the second contact pin 12a intersect, it guides the leg 125 of the second contact pin 12a, thereby improving the assemblability of the second contact pin 12a and improving the electrical contact capability.

[0083] More specifically, the legs of the second stylus 12a form a predetermined space S2 at a predetermined distance from the body portion 123, and extend to form a symmetrical pair. Each stylus can be interconnected by the predetermined space S2 formed by its legs.

[0084] Additionally, a tip 1251 is formed at one end of the leg 125, a contact surface 1252 is formed from the tip 1251 toward the direction in which the two legs face each other, and a locking protrusion 1253 may be formed in a stepped manner on the leg from the contact surface 1252 toward the outside.

[0085] This structure allows the contact surface 1252 to move along the guide groove S1 while in contact with the bottom surface of the guide groove S1 when the first contact pin 11a and the second contact pin 12a are assembled in the direction of intersection. This improves the assemblability of the first contact pin 11a and the second contact pin 12a, and further improves the electrical contact capability.

[0086] In addition, a slot 1133 is formed in the guide groove S1. When the signal pin 11 is stretched to its maximum by the spring, the locking protrusion 1253 is locked in the slot 1133, thereby preventing the signal pin 11 from separating.

[0087] Furthermore, a groove 1135 is formed at the connection between the body part 113 and the leg part 115, so that when the second contact pin 12a and the first contact pin 11a are connected at an intersection, the connection can be made more easily by contacting the contact surface 1252.

[0088] Furthermore, the structure of the leg 115 of the first stylus 11a is the same as the structure of the leg 125 of the second stylus 12a described above.

[0089] The contact portion 121 of the second stylus 12a can be formed in a shape that gradually narrows as it approaches the contact end 1211.

[0090] The guide groove S1 can be formed to extend from the slot 1233 along the length of the body portion 123 and pass through the contact end 1211. In this structure, when the first contact pin 11a and the second contact pin 12a are assembled in the intersecting direction, the first contact pin 11a moves along the guide groove S1 while the contact surface 1152 of the first contact pin 11a is in contact with the bottom surface of the guide groove S1 of the second contact pin 12a. When the signal pin 11 is compressed to the maximum, the tip 1151 of the first contact pin 11a and the contact end 1121 of the second contact pin 12a are located on the same plane, which can improve the electrical connection with the terminal.

[0091] That is, when the signal pin 11 is compressed, the leg 115 of the first contact pin 11a moves along the guide groove S1 of the second contact pin 12a. When the signal pin 11 is compressed to the maximum, the tip 1151 of the first contact pin 11a and the contact end 1211 of the second contact pin 12a together form an electrical contact point with the test terminal (e.g., PCB pad).

[0092] Figure 7 is a cross-sectional view of a test socket according to another embodiment of the present invention. This embodiment features a test socket on the floating plate 130 that also forms a shielding plating layer to improve noise signal shielding and impedance matching between finely spaced areas. The differences between this embodiment and the one described above in conjunction with Figures 2 to 6 will be explained below with reference to Figure 7.

[0093] In this embodiment, the float plate 130 may include a plurality of fourth holes 1301 penetrating the float plate 130.

[0094] More specifically, the fourth hole 1301 can be formed in the float plate 130 at a position corresponding to the through hole 13h formed on the socket body 110, 120, and a third shielding plating layer 1302 made of conductive material can be formed on the inner surface of the fourth hole 1301. In this structure, by extending the shielding plating layer to the contact end of the contact (the part in contact with the BGA terminal), the noise signal shielding and impedance matching effect between fine pitches can be further improved.

[0095] Although various embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications can be made to the above embodiments without departing from the scope of the invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the appended claims but also by their equivalents.

[0096] 1: Probe 2: Socket body 3: Socket body 10: Test socket 11: Signal pins, contacts 110: Lower panel, socket body 111:Contact Department 1111: Tip 1121: Contact end 11a: Stimulus, First Stimulus 11h: Second hole 113: Ontology part 1131: Shoulder 1133: Card Slot 1135: Groove 115: Legs 1151: Tip 1152: Contact surface 1153: Locking protrusion 12a: Stimulus, second stimulus 120: Upper plate, socket body 121:Contact Department 1211: Contact end 123: Ontology part 1231: Shoulder 1233: Card slot 1235: Groove 125: Legs 1251: Tip 1252: Contact surface 1253: Locking protrusion 130: Floating Board 1301: Fourth hole 1302: Third shielding coating layer 131: First shielding coating layer 13h: Through hole 133: Second shielding coating layer 15: Grounding pin, contact 150: Floating Board 15h: First hole d1, d2, d3: Diameter S1: Guide groove S2: Space

Claims

1. A BGA test socket for achieving impedance matching, wherein, include: A contact includes a ground pin and a signal pin; The device includes a socket body that inserts into and elastically supports the contact, and has multiple holes, including: a first hole for inserting the ground pin; a second hole for inserting the signal pin; a through hole corresponding to the pin diagram of the test socket, formed between the multiple contacts; and a float plate disposed on one side of the socket body, and having a third hole for accommodating the contact end of the contact that contacts the BGA terminal. A first shielding plating layer is formed on the inner surface of the through hole by means of a conductive component, and a second shielding plating layer for connecting the first shielding plating layer is formed on the upper and lower surfaces of the socket body by means of a conductive component.

2. The BGA test socket for impedance matching as described in claim 1, wherein, The second shielding coating is formed around the second hole on the upper and lower surfaces of the socket body.

3. The BGA test socket for impedance matching as described in claim 2, wherein, The ground pin and the signal pin are formed with the same shape.

4. A BGA test socket for impedance matching as described in claim 3, wherein, The ground pin and the signal pin have different maximum diameters.

5. A BGA test socket for impedance matching as described in claim 2, wherein, The ground pin and the signal pin are formed with different shapes.

6. A BGA test socket for achieving impedance matching as described in claim 1, wherein, The float plate includes a fourth hole formed at a position corresponding to the through hole.

7. A BGA test socket for achieving impedance matching as described in claim 6, wherein, The inner circumferential surface of the fourth hole is coated with a third shielding layer formed by conductive components.

8. A BGA test socket for achieving impedance matching as described in claim 1, wherein, The contact includes: a pair of contact pins; and a spring connected between the pair of contact pins and providing elasticity.

9. A BGA test socket for achieving impedance matching as described in claim 8, wherein, The pair of styluses have different shapes and are connected in intersecting directions.

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