System and method for testing a semiconductor device using a rotating turret system

Abstract

The present invention provides a system (101) and method for testing a semiconductor device (103) using a rotating turret system, the system (101) and method comprising at least one test module (111) of a test station (109) capable of receiving the semiconductor device (103) from a nozzle (107) on the circumference of a rotating turret (105) and linearly transferring the semiconductor device (103) to a tester (203); and returning the semiconductor device (103) to the rotating turret (105) once the testing of the semiconductor device (103) is completed; thereby achieving high testing speed and high throughput using the rotating turret system.

Description

Technical Field

[0001] The present invention provides a system and method for testing semiconductor devices using a rotating turret system, comprising at least one test module of a test station capable of receiving the semiconductor device from a nozzle on the circumference of the rotating turret and linearly transferring the semiconductor device to a tester; and returning the semiconductor device to the rotating turret once the testing of the semiconductor device is completed; thereby achieving high testing speed and high throughput using the rotating turret system. Prior Technology

[0002] In existing technologies, semiconductor devices, such as packaged devices or wafers, undergo various processes in device / die sorting equipment to achieve specific purposes such as defect detection and sorting devices / wafers into various types or sizes. However, the task of testing these semiconductor devices is completed at another location, whereby, after the semiconductor devices have been unpacked, sorted, and repackaged by the wafer sorting equipment, the tapes and reels containing the semiconductor devices are transferred to another device for unpacking, testing, and repackaging. This process is time-consuming, thus significantly impacting production yield due to the need for repeated unpacking and repackaging processes to perform sorting and testing through their respective devices. This also affects the accuracy of semiconductor device sorting or testing tasks, as repeated unpacking and repackaging of semiconductor devices from tapes and reels, and repeated unpacking and repackaging to tapes and reels, may further damage the semiconductor devices.

[0003] CN102921644A by Xu Yinsen et al. discloses a turret test and sorting machine for testing, marking, sorting, and taping extremely small semiconductor devices. Although the working positions have different functions, including a loading position, 1-6 testing positions, and 1-2 rotational orientation correction positions, the time required to perform all tests will create a bottleneck for the operation of the turret, because the tests need to be completed before the turret can continue to operate.

[0004] CN218213067U by Chen Yongsheng et al. discloses a wafer inspection device, specifically a rotating test platform and corresponding workstation; thereby, the turntable rotates at a predetermined angle, and the suction pen element drives the photovoltaic module to move until the photovoltaic module makes electrical contact with the inspection unit. Even though the prior art claims high inspection speed, the time required to perform all tests will create a bottleneck for the operation of the turret, because the tests need to be completed before the turret can continue to operate.

[0005] Therefore, it is advantageous to mitigate these disadvantages by using systems and methods that employ rotating turret systems to test semiconductor devices, providing high-speed testing and high-volume delivery. Summary of the Invention

[0006] Therefore, the main objective of this invention is to provide a system and method for testing semiconductor devices using a rotating turret system, which provides high-speed testing and high-yield throughput.

[0007] Another object of the present invention is to provide a system and method for testing semiconductor devices using a rotating turret system, wherein defective semiconductor devices detected during testing can be tracked within the test station of the rotating turret system.

[0008] Other objects of the invention will become apparent upon understanding the following detailed description of the invention or upon employing the invention in practice.

[0009] According to a preferred embodiment of the present invention, the following is provided:

[0010] A system for testing semiconductor devices using a rotating turret system, comprising:

[0011] A rotating turret having multiple suction nozzles positioned around its circumference, the nozzles being capable of picking up or placing the semiconductor device at specific locations along the circumference of the rotating turret;

[0012] Test station;

[0013] Its features are,

[0014] The test station includes at least one test module;

[0015] The test modules include:

[0016] A test fixture configured to receive and hold the semiconductor device from the nozzle;

[0017] At least one tester;

[0018] Linear connection path,

[0019] The test fixture is attached to a platform configured to be actuated by at least one actuator to move linearly along the linear connection path; thereby moving the test fixture linearly back and forth from a first position below the rotation path of the nozzle to its corresponding at least one test position so that the semiconductor device can be reached by the at least one tester; wherein the at least one test position extends outward from the circumference of the rotating turret within the path of the connection path.

[0020] In another embodiment of the invention, the following is provided:

[0021] A method for testing semiconductor devices using a rotating turret system includes the following steps:

[0022] Before placing the semiconductor device in the test fixture, and before transferring the semiconductor device to a position above at least one test fixture in at least one test module, the semiconductor device is picked up from a suitable position along the circumference of the rotating turret using at least one nozzle; wherein the nozzle is positioned at the circumference of the rotating turret and is capable of picking up or placing the semiconductor device at a specific position along the circumference of the rotating turret; wherein the test fixture is capable of being positioned at a first position below the rotation path of the nozzle;

[0023] The semiconductor device is transferred from the first position to its corresponding test position using the test fixture; wherein the test position extends outward from the circumference of the rotating turret.

[0024] When the test fixture is in the test position, the tester performs any suitable test on the semiconductor device.

[0025] The semiconductor device to be tested is transferred from the test position to the first position using the test fixture;

[0026] At the first position, the semiconductor device is picked up from the test fixture via the suction nozzle and moved to another suitable position along the circumference of the rotating turret. Simple Explanation of the Diagram

[0027] Other aspects and advantages of the invention will become apparent upon examination of the accompanying drawings, in which: Figure 1 shows a top view of a system for testing semiconductor devices using the rotating turret system of the present invention. Figure 2 shows a side view of the test module. Figure 3 is a flowchart of the method for testing semiconductor devices using the rotating turret system of the present invention. Implementation

[0028] In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. However, those skilled in the art will understand that the invention can be practiced without these specific details. In other instances, well-known methods, processes, and / or elements have not been described in detail so as not to obscure the invention.

[0029] The invention will be more clearly understood through the following description of embodiments given by way of example only and with reference to the accompanying drawings, which are not drawn to scale.

[0030] The present invention is a system 101 for testing semiconductor devices 103 using a rotating turret system, comprising a rotating turret 105 with multiple nozzles 107 and a test station 109, as shown in FIG1. ​​The nozzles 107 are disposed on the circumference of the rotating turret 105 and are capable of picking up or placing semiconductor devices 103 at specific positions along the circumference of the rotating turret 105.

[0031] Test station 109 includes at least one of test modules 111, wherein test module 111 includes a test fixture 201, a tester 203, and a connection path 205. The connection path 205 is used for the test fixture 201 to move back and forth from a first position below the rotation path of the nozzle 107 to a corresponding test position reachable by the tester 203, as shown in FIG2. The test position extends outward from the circumference of the rotating turret 105.

[0032] Tester 203 is configured to perform white light testing, crosstalk testing, PXY testing, or a combination thereof.

[0033] The connection path 205 is a guide rail, track, or any other suitable means of guiding the test fixture 201. Preferably, the connection path 205 is a linear path to ensure smooth and rapid movement between the first position and the test position. However, other forms of connection paths are still possible, such as curved paths, as long as the connection path can guide the test fixture 201 back and forth from the first position to the test position.

[0034] The suction nozzle 107 on the rotating turret 105 can reach at least one vibrating bowl 113, at least one semiconductor device positioning station 115, at least one first visual inspection station 117, at least one semiconductor device orientation rotating station, at least one second visual inspection station 121, at least one tape station 123, or a combination thereof.

[0035] As shown in Figure 3, the present invention also provides a method for testing semiconductor devices using a rotating turret system, wherein the testing steps include the following steps. First, before placing the semiconductor device in the test fixture and before transferring the semiconductor device to a position above at least one test fixture in at least one test module, the semiconductor device is picked up from a suitable position along the circumference of the rotating turret by at least one nozzle. The nozzle is positioned at the circumference of the rotating turret, enabling it to pick up or place the semiconductor device at a specific position along the circumference of the rotating turret. The test fixture can be positioned at a first position below the rotation path of the nozzle.

[0036] Second, the test fixture transfers the semiconductor device from a first position to its corresponding test position; wherein the test position extends outward from the circumference of the rotating turret. Third, while the test fixture is in the test position, any suitable test is performed on the semiconductor device by the tester. Fourth, the semiconductor device under test is transferred from the test position to the first position by the test fixture. Thereafter, at the first position, the semiconductor device is picked up from the test fixture by a nozzle and moved to another suitable position along the circumference of the rotating turret.

[0037] Before the nozzles pick up semiconductor devices from a suitable position along the circumference of the rotating turret (i.e., the testing step), the rotating turret system performs the following pre-testing steps. First, multiple semiconductor devices are arranged in a desired orientation. This can be accomplished using a vibrating bowl; wherein multiple semiconductor devices are placed in a bowl-like device with an outlet arranged to allow the semiconductor devices to exit the bowl-like device in the desired orientation; wherein the desired orientation is any orientation suitable for the semiconductor devices used in the next step. Second, the semiconductor devices are transferred to a positioning station via at least one nozzle, thereby performing proper positioning of the semiconductor devices. Third, the semiconductor devices are transferred to a first visual inspection station via at least one nozzle, thereby performing visual inspection on the upper surface of the semiconductor devices. Fourth, semiconductor devices with at least one defect are transferred to a first waste container via at least one nozzle, while semiconductor devices without defects are transferred to an orientation rotation station for rotating the semiconductor devices to an orientation suitable for the testing station.

[0038] Following the testing step (i.e., the step of picking up the semiconductor device from the test fixture via the nozzle at the first position), the rotary turret system can perform the following post-testing steps. First, the semiconductor device is transferred from the test fixture to another alignment rotary station via the nozzle, so that the alignment rotary station rotates the semiconductor device to the same orientation as the tape station. Second, the semiconductor device is transferred from the alignment rotary station to a second visual inspection station via the nozzle, whereby visual inspection is performed on the bottom surface, at least one side surface, or a combination thereof of the semiconductor device. Third, semiconductor devices with at least one defect are transferred to a second waste container, while semiconductor devices without defects are transferred to the tape station for packaging. Fourth, the nozzle is cleaned by blowing air from the nozzle to a nozzle cleaning bin station.

[0039] While the invention has been shown and described herein in a manner considered to be preferred embodiments, illustrating the superior results and advantages obtained by the invention compared to the prior art, the invention is not limited to these specific embodiments. Therefore, the forms of the invention shown and described herein are to be considered illustrative only, and other embodiments, as set forth in the appended claims, may be chosen without departing from the scope of the invention.

[0040] 101: System 105: Rotating Tower 107: Suction nozzle 109: Test Station 111: Test Module 113: Vibrating Bowl 115: Location Station 117: First Visual Inspection Station 119: Rotating Station 121: Second Vision Inspection Station 123: Tape and reel station 201: Test Fixture 203: Tester 205: Connection Path 207: Platform 209: Actuator

Claims

1. A system (101) for testing semiconductor devices (103) using a rotating turret system, comprising: A rotating turret (105) having a plurality of nozzles (107) disposed on the circumference of the rotating turret (105), the nozzles (107) being capable of picking up or placing the semiconductor device (103) at a specific position along the circumference of the rotating turret (105); a test station (109); characterized in that the test station (109) includes a plurality of test modules (111), and the plurality of test modules (111) are disposed on the circumference of the rotating turret (105); wherein the test module (111) includes: a test fixture (201) configured to receive the semiconductor device (103) from the nozzles (107) and hold the semiconductor device (103); at least one tester (203); a connection path (205). The test fixture (201) is attached to a platform (207) configured to be actuated by at least one actuator (209) to move linearly along the connection path (205); thereby moving the test fixture (201) linearly back and forth from a first position below the rotation path of the nozzle (107) to its corresponding at least one test position so that the semiconductor device (103) can be reached by the at least one tester; wherein the at least one test position extends outward from the circumference of the rotating turret (105) within the path of the connection path (205).

2. The system (101) for testing semiconductor devices (103) using a rotating turret system as described in claim 1, wherein, The tester (203) is configured to perform white light testing, crosstalk testing, or a combination thereof.

3. The system (101) for testing semiconductor devices (103) using a rotating turret system as described in claim 1, wherein, The connection path (205) is a guide rail, track, or any other suitable device for guiding the test fixture (201).

4. The system (101) for testing semiconductor devices (103) using a rotating turret system as described in claim 1, wherein, The suction nozzle (107) on the rotating turret (105) can reach at least one vibrating bowl (113), at least one semiconductor device positioning station (115), at least one first visual inspection station (117), at least one semiconductor device orientation rotating station (119); at least one second visual inspection station (121); at least one tape station (123) or a combination thereof.

5. A method for testing a semiconductor device using a rotating turret system, employing the system for testing semiconductor devices using a rotating turret system as described in claim 1, the method comprising the steps of: picking up the semiconductor device from a suitable position along the circumference of a rotating turret using at least one nozzle before placing the semiconductor device in a test fixture and before transferring the semiconductor device to a position above at least one test fixture in at least one test module; wherein the nozzle is positioned at the circumference of the rotating turret and is capable of picking up or placing the semiconductor device at a specific position along the circumference of the rotating turret; wherein the test fixture is capable of being positioned at a first position below the rotation path of the nozzle; transferring the semiconductor device from the first position to its corresponding test position using the test fixture; wherein the test position extends outward from the circumference of the rotating turret; performing any suitable test on the semiconductor device by a tester while the test fixture is at the test position; transferring the semiconductor device to be tested from the test position to the first position using the test fixture; and picking up the semiconductor device from the test fixture at the first position using the nozzle to another suitable position along the circumference of the rotating turret.

6. The method for testing a semiconductor device as claimed in claim 5, further comprising the following steps prior to picking up the semiconductor device from a suitable position along the circumference of the rotating turret: (i) arranging a plurality of semiconductor devices in a desired orientation; (ii) transferring the semiconductor devices to a positioning station (115) via at least one nozzle; (iii) transferring the semiconductor devices to a first visual inspection station via at least one nozzle, thereby visually inspecting the upper surface of the semiconductor devices; (iv) transferring semiconductor devices with at least one defect to a first waste container and transferring semiconductor devices without defects to an orientation rotation station for rotating the semiconductor devices to an orientation suitable for the testing station.

7. The method for testing a semiconductor device as claimed in claim 6, after the step of picking up the semiconductor device from the test fixture at the first position via the nozzle, further comprises the following steps: transferring the semiconductor device from the test fixture to another alignment rotation station via the nozzle, such that the alignment rotation station rotates the semiconductor device to the same orientation as the tape station; transferring the semiconductor device from the alignment rotation station to a second visual inspection station via the nozzle, thereby visually inspecting the bottom surface, at least one side surface, or a combination thereof of the semiconductor device; transferring a semiconductor device having at least one defect to a second waste container, and transferring a semiconductor device without defects to the tape station for packaging; cleaning the nozzle by blowing air from the nozzle to a nozzle cleaning bin station.

8. The method for testing a semiconductor device as described in claim 6, wherein, The step of arranging a plurality of semiconductor devices in a desired orientation is performed using a vibrating bowl; wherein the plurality of semiconductor devices are placed in a bowl-shaped device having an outlet arranged to allow the semiconductor devices to exit the bowl-shaped device through the outlet in the desired orientation; wherein the desired orientation is any orientation of the semiconductor devices suitable for use in the next step.

Images