Method for producing a thick copper substrate

Abstract

This invention discloses a method for manufacturing a thick copper substrate. The method includes a preliminary step of providing a circuit substrate having a first surface and a second surface opposite to each other, wherein a plurality of copper lines are formed on the first surface of the circuit substrate, and a first thickness of each copper line is not less than 100 micrometers; a first resin ink printing step of filling and covering the plurality of copper lines with resin ink by printing to form a first printed ink layer; a first baking step of baking the circuit substrate with the first printed ink layer; and a lamination step of forming a polypropylene adhesive layer on the first printed ink layer by lamination, thereby forming a thick copper substrate.

Claims

1. A method for manufacturing a thick copper substrate, comprising: a pre-processing step of providing a circuit substrate having a first surface and a second surface opposite to each other, wherein a plurality of copper lines are formed on the first surface of the circuit substrate, and a first thickness of each copper line is not less than 100 micrometers; a first resin ink printing step of filling and covering the plurality of copper lines on the first surface with a resin ink by printing to form a first printed ink layer on the first surface of the circuit substrate; a first baking step of baking the circuit substrate on which the first printed ink layer is formed; and a lamination step of forming a polypropylene adhesive layer on the first printed ink layer by lamination, thereby forming a thick copper substrate.

2. The method for manufacturing a thick copper substrate as described in claim 1, wherein, The first thickness of each of the copper lines is between 127 micrometers and 380 micrometers, the second thickness of the polypropylene adhesive layer is between 2 mils and 32 mils, and the third thickness of the thick copper substrate is between 18 mils and 236 mils.

3. The method for manufacturing a thick copper substrate as described in claim 1, wherein, Based on a total weight of 100 wt% for the resin ink, the resin ink comprises 20 wt% to 25 wt% of triglycidylaminom-cresol, 5 wt% to 10 wt% of epoxy resin, and 60 wt% to 65 wt% of silicon dioxide.

4. The method for manufacturing a thick copper substrate as described in claim 1, wherein, The resin ink has a pencil hardness greater than or equal to 6H, a glass transition temperature between 140°C and 170°C, a first coefficient of thermal expansion between 14 ppm / °C and 24 ppm / °C, and a second coefficient of thermal expansion between 63 ppm / °C and 73 ppm / °C; wherein the first coefficient of thermal expansion is defined as the coefficient of thermal expansion of the resin ink below the glass transition temperature, and the second coefficient of thermal expansion is defined as the coefficient of thermal expansion of the resin ink above the glass transition temperature.

5. The method for manufacturing a thick copper substrate as described in claim 1, wherein, In the first resin ink printing step, the first printed ink layer is formed on the first surface of the circuit board by a squeegee at a squeegee angle between 15 and 30 degrees, a pressure between 0.2 MPa and 0.45 MPa, and a printing speed between 100 mm / s and 450 mm / s.

6. The method for manufacturing a thick copper substrate as described in claim 1, wherein, In the first baking step, the circuit board on which the first printed ink layer is formed is baked at a baking temperature between 90°C and 120°C for 60 to 90 minutes.

7. The method for manufacturing a thick copper substrate as described in claim 1, wherein, After the first baking step and before the lamination step, the method for manufacturing the thick copper substrate further includes a first grinding step to remove a portion of the first printed ink layer by grinding, so that the copper lines located on the first surface are exposed from the first printed ink layer.

8. The method for manufacturing a thick copper substrate as described in claim 1, wherein, In the aforementioned preliminary step, a plurality of copper lines are formed on both the first and second surfaces of the circuit substrate; wherein, after the first baking step and before the lamination step, the printing method for the thick copper substrate further includes a second resin ink printing step and a second baking step; wherein, in the second resin ink printing step, the resin ink is filled between and covers the plurality of copper lines on the second surface by printing, so as to form a second printed ink layer on the second surface of the circuit substrate; wherein, in the second baking step, the circuit substrate on which the first printed ink layer and the second printed ink layer are formed is baked.

9. The method for manufacturing a thick copper substrate as described in claim 8, wherein, In the pressing step, two polypropylene adhesive layers are formed on the first printing ink layer and the second printing ink layer respectively by pressing.

10. A method for manufacturing a thick copper substrate as described in claim 8, wherein, In the second resin ink printing step, the second printed ink layer is formed on the second surface of the circuit board by a squeegee at a squeegee angle between 15 and 30 degrees, a pressure between 0.2 MPa and 0.45 MPa, and a printing speed between 100 mm / s and 450 mm / s.

11. The method for manufacturing a thick copper substrate as described in claim 8, wherein, In the second baking step, the circuit board on which the first printed ink layer and the second printed ink layer are formed is baked at a baking temperature between 90°C and 120°C for 60 minutes to 90 minutes.

12. The method for manufacturing a thick copper substrate as described in claim 8, wherein, After the second baking step and before the lamination step, the method for manufacturing the thick copper substrate further includes a second grinding step, in which a portion of the first printed ink layer and a portion of the second printed ink layer are removed by grinding, so that the copper lines located on the first surface and the copper lines located on the second surface are exposed from the first printed ink layer and the second printed ink layer, respectively.

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