Test socket

Abstract

An exemplary embodiment of the present invention discloses a hybrid test socket, comprising: a body having a hole through which a first surface facing a terminal of a semiconductor device and a second surface facing a pad of a test device are formed; a contact member inserted into the hole, one end of which contacts a terminal of the semiconductor device and the other end of which contacts a pad of the test device, and having elasticity in a pressing direction; and a first member bonded to one end of the contact member.

Description

[Technical Field]

[0001] The present invention relates to a hybrid test socket, which includes a socket body made of an elastic insulator and a resilient contact pin. [Previous Technology]

[0002] Generally, BGA (ball grid array) or LGA (land grid array) type semiconductor ICs are ultimately inspected using inspection equipment to perform characteristic measurements or defect checks through various electrical tests. At this time, test sockets are used to electrically connect the circuit pattern of the inspection printed circuit board installed in the inspection equipment to the terminals (leads), contact balls, or pads (land) of the BGA or LGA type semiconductor IC.

[0003] Sufficient pressure must be applied to the contacts used in the test socket to ensure reliable contact with the IC leads (terminals). Therefore, the contacts must have sufficient elastic contact force within an appropriate range, and various types of contacts exist to meet these conditions.

[0004] In addition, in the test socket, multiple spring contacts are installed inside the housing according to predetermined rules. Recently, various semiconductor devices have been developed, and customers' demand for spring contacts of various lengths is constantly increasing. However, traditional pogo pin type spring contacts often cannot meet customers' performance requirements.

[0005] For example, if the length of a traditional spring pin type spring contact is made longer according to the customer's requirements, the length of the contact pin that constitutes the spring contact needs to be increased. At the same time, when designing the test socket, the depth of the pin hole to be inserted into the spring contact should also take into account the length of the contact pin and be processed into a diameter that can accommodate the width of the contact pin tip.

[0006] In order to process data quickly and reduce power consumption, spring contacts are becoming thinner and thinner. Therefore, it is not only difficult to process long pin holes with a diameter suitable for accommodating the width of the contact pin tip, but also difficult to process long pin holes with a relatively small diameter suitable for accommodating the width of the contact pin tip. However, the processing cost is very high and it is difficult to ensure quality.

[0007] That is, traditional spring contact components are difficult to meet customers' requirements for spring contact components of various lengths.

[0008] In addition, as another known technology, there is a rubber type socket, which is composed of an insulating body and a conductive silicone part, wherein the insulating body is formed by curing insulating silicone and has elasticity, and the conductive silicone part corresponds to the terminal of the device and penetrates vertically through the insulating body.

[0009] This type of rubber socket is made by placing a silicone mixture of insulating silicone rubber and conductive powder in a predetermined ratio into a mold, and then forming a strong magnetic field at the location where the conductive silicone part is formed. The conductive powder of the silicone mixture will gather at the location where the magnetic field is formed, and finally the molten silicone mixture will be solidified to form a predetermined arrangement of conductive silicone parts on the insulating body.

[0010] Compared to spring-loaded contacts (spring contacts), this type of rubber socket has the disadvantages of slower elastic response and loss of elasticity during repeated testing, significantly reducing its service life. Therefore, its service life is short, and frequent replacement increases replacement costs. Furthermore, due to the characteristic that elastic durability decreases over time, during prolonged (more than a week) continuous compression testing, the elastic repulsion becomes zero or significantly reduced, leading to short circuits. Therefore, it is difficult to conduct long-term testing.

[0011] In addition, the problem with rubber sockets is that their elastic properties are greatly affected by temperature, and because they are mixed with insulating silicone or elastomer, the uniformity of resistance may be reduced. [Summary of the Invention]

[0012] The problem that the invention is intended to solve

[0013] Therefore, the object of the present invention is to provide a hybrid test socket that combines the advantages of spring pin type and rubber type to solve the above-mentioned problems.

[0014] One of the various objectives of the present invention is to provide a test socket suitable for testing semiconductor devices using high-speed signals. Furthermore, another objective is to provide a test socket that improves noise shielding performance between adjacent pins and the coaxial alignment performance of the pins.

[0015] In addition, one of the various objectives of the present invention is to provide a test socket that can minimize the effects caused by temperature changes (high temperature stability).

[0016] One of the various aspects of the present invention is to provide a hybrid test socket equipped with various types of contact pins according to customer performance requirements.

[0017] Methods used to solve problems

[0018] To address the issues of the present invention, various embodiments may provide a hybrid test socket, comprising: a body having a hole through a first surface facing a terminal of a semiconductor device and a second surface facing a pad of a test device; a contact element inserted into the hole, one end of which contacts a terminal of the semiconductor device and the other end of which contacts a pad of the test device, and having elasticity in a pressing direction; and a first member bonded to one end of the contact element.

[0019] A feature of the present invention is that the first component is further disposed between the inner surface of the hole on the first surface side and around one end of the contact member.

[0020] The present invention may be characterized in that the main body includes: a base forming the shape of a test socket; and an elastic insulator filled inside the base and hardened to form elasticity, wherein the hole is formed by penetrating the elastic insulator.

[0021] The present invention may be characterized in that the contact member includes: a pair of contact pins; and a spring connected between the pair of contact pins for providing elasticity.

[0022] A feature of the present invention is that the pair of contact pins have the same shape and are connected in mutually intersecting directions.

[0023] The present invention may be characterized in that the contact needle includes: a main body portion having a predetermined width and thickness; a head portion having a head portion formed at one end of the main body portion and having contact with the object being inspected; and a leg portion having a leg portion extending along the length direction of the main body portion in a direction opposite to that of the head portion.

[0024] A feature of the present invention is that the head is formed by winding a plate-shaped strip integrally formed with the main body.

[0025] A feature of the present invention is that the head has a plurality of pointed ends formed at its upper end.

[0026] A feature of the present invention is that the first member is disposed between at least a portion of the outer peripheral surface of the head and the inner surface of the hole.

[0027] A feature of the present invention is that the second surface is formed with a stepped hole, such that a step is formed toward the first surface.

[0028] A feature of the present invention is that the diameter of the stepped hole is larger than the diameter of the hole.

[0029] A feature of the present invention is that the first member is bonded in a state where it is disposed on one end face of the contact member, and is wound around one end of the contact member and between the hole and hardened.

[0030] The present invention may be characterized in that the contact member includes: a contact needle; and an elastic member including conductive particles filled between the contact needle and the hole.

[0031] A feature of the present invention is that the contact needle is formed by winding a plate-shaped strip.

[0032] A feature of the present invention is that the conductive particles are arranged by applying a magnetic force to the elastic member while the first member is bonded.

[0033] Each feature of the above embodiments may be combined in other embodiments without contradicting or being exclusive to other embodiments.

[0034] Invention Effects

[0035] According to various embodiments of the present invention, the upper shrinkage of the socket body made of an elastic insulator can be easily controlled.

[0036] In addition, by making it easy to align the position of the contact pins located inside the socket body, the coaxial alignment of the contact pins can be improved.

[0037] Furthermore, by improving the insulation between micro-pitches, noise during testing of high-speed signal semiconductor devices can be reduced.

[0038] The effects of the present invention are not limited to those described above, and other effects not mentioned will be clearly recognized by those skilled in the art from the following description.

Implementation Method

[0046] Specific embodiments of the present invention will now be described with reference to the accompanying drawings. The following detailed description is provided to facilitate a thorough understanding of the methods, apparatus, and / or systems described herein. However, these are merely examples, and the present invention is not limited thereto.

[0047] In describing embodiments of the present invention, detailed descriptions of well-known technologies related to the present invention will be omitted if it is determined that such detailed descriptions would unnecessarily obscure the gist of the present invention. Furthermore, the terminology used below is defined in consideration of the functionality within the present invention, and these may be changed according to the intention or habit of the user or operator. Therefore, definitions should be based on the entire contents of this specification.

[0048] The terminology used in the detailed description is for describing embodiments of the invention only and should not be construed as limiting. Unless otherwise expressly stated, the singular form includes the meaning of the plural form.

[0049] In this specification, expressions such as “comprising” or “possessing” are intended to indicate certain features, numbers, steps, operations, elements, parts or combinations thereof, and should not be construed as excluding the presence or possibility of one or more other features, numbers, steps, operations, elements or parts or combinations thereof described.

[0050] In addition, when describing the components of embodiments of the present invention, terms such as first, second, A, B, (a), (b) may be used. These terms are only used to distinguish the component from other components, and the nature, order, or sequence of the components are not limited by these terms.

[0051] Figure 1 is a schematic diagram of a hybrid test socket according to an embodiment of the present invention.

[0052] Hereinafter, a hybrid test socket according to an embodiment of the present invention will be described with reference to FIG1.

[0053] The hybrid test socket may include a body 10 and a contact 30. The body 10 may be formed of a material that is elastic by pressing with a semiconductor device, and the contact 30 may be provided with a component that is physically elastic (e.g., a spring) or formed of a component that is elastic in material (e.g., silicon powder mixed with conductive particles).

[0054] More specifically, a hole may be formed on the body 10, the hole penetrating a first surface 11 facing a terminal of the semiconductor device and a second surface 12 facing a pad of the test device. The diameter d1 of the hole may be greater than or equal to the maximum diameter of the contact 30, such that the contact 30 is inserted into the hole.

[0055] That is, the contact 30 is inserted into the hole, with one end contacting the terminal of the semiconductor device and the other end contacting the pad of the test device, thereby providing elasticity in the pressing direction. The detailed construction of the contact 30 according to an exemplary embodiment of the present invention will now be described in more detail with reference to FIGS. 2 to 8.

[0056] Additionally, the main body 10 may include: a base 11, 12 forming the shape of the test socket; and an elastic insulator 13 that is filled inside the base 11, 12 and then hardened to form an elastic structure.

[0057] The bases 11 and 12 may be formed from the first surface 11 and the second surface 12, and since the hole penetrates the first surface 11 and the second surface 12, it may penetrate the elastic insulator filling the interior of the bases 11 and 12.

[0058] Additionally, the first member 50 may be bonded to one end of the contact member 30. This one end of the contact member 30 may refer to the contact end of the contact member 30 located on the side of the first surface 11 that contacts the terminal of the semiconductor device when the contact member 30 is inserted into the hole.

[0059] The first member 50 can be disposed between the inner surface of the hole formed on the first surface 11 side and around one end of the contact member 30. The first member 50 is made of a soft material and is bonded to the contact member 30 while being disposed on one end face. It is then hardened after being rolled into the area between the contact member 30 and the hole, thus allowing it to be disposed between the inner surface of the hole formed on the first surface 11 side and around one end of the contact member 30. Therefore, the first member 50 can be made of a silicon material whose properties change with heat.

[0060] By having the first component 50, the upper part of the socket body 10, including the elastic insulator 13, can be easily controlled to retract.

[0061] Unlike this embodiment, if the socket body 10 is made of a non-elastic material, such as a typical spring pin socket, the socket body will not shrink. Therefore, when the first member 50 is provided, it will become a factor that hinders the shrinkage force of the spring pin. However, as described above, this embodiment is a hybrid test socket that combines the advantages of a typical spring pin socket (pogo pin type socket) and a silicone rubber type socket. Therefore, the durability can be improved by controlling the upper shrinkage of the socket body 10 using the first member 50.

[0062] In addition, the coaxial alignment of the contact member 30 can be improved by the first member 50 inside the body 10 including the elastic member, thereby improving the alignment of the contact portion of the contact member 30.

[0063] In addition, since the first component 50 is formed of silicon-based material, the insulation between the fine pitches is improved, thereby reducing noise during high-speed signal semiconductor device testing.

[0064] The first component 50 can be appropriately selected according to the customer's needs, and its Shore hardness is between 20A and 80A. When the hardness of the first component 50 is outside the above range, it may be difficult to achieve the above effect.

[0065] For example, when the hardness of the first component 50 is higher than the above range, it may become a factor that hinders the elasticity of the contact 30, and a greater load may be required during testing. In this case, the load-related performance conditions required by the customer may not be met, or the durability of the test socket may be reduced.

[0066] Additionally, a step hole h2 can be formed on the second surface 12. The step hole h2 can be formed by forming a step 121 on the second surface 12 toward the first surface 11. In this shape of the step hole h2, the diameter d2 of the step hole h2 can be formed to be larger than the diameter d1 of the hole.

[0067] These stepped holes h2 can further improve the durability of the hybrid test socket, which is an exemplary embodiment of the present invention, by distributing the load of the test socket repeatedly pressed between the terminals of the semiconductor device and the pads of the test device. If the stepped holes h2 as described in this embodiment are not provided, all the load around the contacts is absorbed by the body, which may result in reduced durability.

[0068] Figure 2 is a schematic diagram of the spring contact pin of Figure 1, Figure 3 is an exploded perspective view of Figure 2, and Figures 4 to 8 are schematic diagrams of the contact pin of Figure 2.

[0069] Hereinafter, a hybrid test socket and a contact element suitable for the hybrid test socket according to an embodiment of the present invention will be described with reference to Figures 1 to 8.

[0070] The contact member 30 in this embodiment may include a spring contact pin structure. That is, it may include two contact pins 31 and 35, and a spring 33 that provides physical elasticity to the contact member 30.

[0071] More specifically, the contact 30 may include a pair of contact pins 31, 35 and a spring 33, with the spring 33 connected between the pair of contact pins 31, 35 to provide elasticity to the contact 30.

[0072] The spring 33 may be a helical compression spring having a predetermined length along the length direction of the contact member 30, and the spring 33 may provide a restoring force between the first contact pin 31 and the second contact pin 35 of the contact member 30, such that when the first contact pin 31 and the second contact pin 35 are compressed in the length direction, each contact pin 31, 35 returns to its position before being compressed relative to the spring 33.

[0073] In this embodiment, a pair of contact pins 31 and 35 have the same shape and can be connected in directions that intersect each other. Alternatively, they can be configured to have different shapes and connected by a spring between them.

[0074] Hereinafter, the pair of contact needles are referred to as the first contact needle 31 and the second contact needle 35. In this embodiment, the pair of contact needles 31 and 35 have the same shape. Therefore, the structure of the contact needle will be described with reference to the first contact needle 31.

[0075] The contact needle 31 may include a main body 312, a head 311 and a leg 313.

[0076] The main body 312 has a space S1 recessed in the longitudinal direction with a predetermined width and length at the center of each of its two sides. A step-shaped locking protrusion (not shown) can be formed at the lower end of the space S1, and the upper end of the space S1 extends to the upper end of the head 311. The locking protrusion (not shown) refers to the structure in which the end of the leg 353 of the second contact pin 35 is locked when the second contact pin 35 is connected in a direction that intersects with the first contact pin 31.

[0077] The head 311 may be composed of a plate-shaped strip, which has the same length on both sides at the upper end of the main body 312 relative to the center of the main body 312, and has an upper tip 3110 formed along the upper front end. The plate-shaped strip may include a first strip section 311a and a second strip section 311b that are equidistant from the center portion 3111 of the main body 312.

[0078] That is, the head 311 can be configured such that the first strip section 311a and the second strip section 311b are respectively wound into a cylindrical shape with a diameter d3 in a semi-circular arc shape with reference to the central portion 3111. Furthermore, the width W1 of the standard central portion 3111 forming each strip winding preferably corresponds to the width of the space S1. This is because if the width W1 of the central portion 3111 is less than or greater than the width of the space S1, the defect rate of the stamping contact pin may increase.

[0079] In addition, the head 311 can be formed into a cylindrical crown shape by means of the tip 3110. In this shape and structure of the head 311, the ball portion of the BGA is stably grounded and pressed against the test socket, thereby improving the test accuracy.

[0080] In addition, the legs 313 may be formed by a pair extending symmetrically from the main body 312, and a predetermined space S2 is formed between the pair of legs, so that when the first contact pin 31 and the second contact pin 35 are connected in a mutually intersecting direction, each leg can be guided respectively.

[0081] In addition, when assembling the contact member 30, in order to facilitate the assembly of the second contact pin 35 in the direction intersecting with the first contact pin 31, an inclined surface 3120 may be formed on the portion of the pair of legs 313 extending from the main body 312.

[0082] More specifically, the leg portion 313 may include: a corner portion 3131, which may have a locking member formed at its end, wherein when the contact member 30 is compressed in the pressing direction, the locking member is located on the same plane as the tip portion 3110 and makes electrical contact with the terminal; a guide surface 3132 that extends at a predetermined angle from the corner portion 3131 and faces each other; and a bend portion 3133 that forms a step from the guide surface 3132 toward the outside of the space S2.

[0083] In this structure, when each contact pin is assembled, the guide surface 3132 contacts and connects with the inclined surface 3120, so a pair of contact pins can be easily assembled, and when each contact pin is assembled, the bent portion 3133 is locked in the locking protrusion (not shown), thereby preventing accidental separation after a pair of contact pins are connected.

[0084] Figure 9 is a manufacturing process diagram of the hybrid test socket in Figure 1.

[0085] The manufacturing process of a hybrid test socket according to an embodiment of the present invention will now be described with reference to FIG9.

[0086] Referring to part (a) of Figure 9, the body of the test socket may have a hole h1 formed in an elastic insulator 13, which is hardened by jig operation or laser processing. The diameter d1 of the formed hole may be equal to or greater than the diameter d3 of the head of the contact pin.

[0087] Refer to part (b) and part (c) of FIG9. After inserting the contact 30 into the hole h1, the film 51 of the first member 50 is attached to the upper part of the first surface 11, so that the first member 50 can be disposed between the inner surface of the hole on the first surface 11 side and around one end of the contact 30.

[0088] More specifically, the film 51 can be hot-pressed so that the first member 50 can be well rolled into the space between the inner surface of the hole on the first surface 11 side and the periphery of one end of the contact member 30. The hot-compressed first member 50 can be disposed between at least a portion of the outer peripheral surface of the head 311 and the inner surface of the hole h1. Furthermore, when the first member 50 is compressed, the tip 3110 is exposed due to its shape, allowing it to penetrate the first member 50.

[0089] In this state, the first component 50 is hardened, as shown in part (d) of FIG9, completing the manufacturing process of the hybrid test socket of the exemplary embodiment of the present invention.

[0090] FIG10 is a schematic diagram of a hybrid test socket according to another embodiment of the present invention, and FIG11 is a schematic diagram of the contact pin of FIG10.

[0091] Hereinafter, Figures 10 and 11 show a hybrid test socket using contact elements of different forms than those in Figures 1 to 9, and mainly explain the differences from the above embodiments.

[0092] The contact 70 used in the hybrid test socket of this embodiment is a contact pin 71 that is manufactured by stamping in a plate shape and is wound up. The contact pin 71 is formed in a shape similar to a spiral compression spring, and its end can be formed into a crown shape by multiple tips 711.

[0093] By means of this shape and structure, the contact 70 of this embodiment can perform the function of a spring acting on the spring contact pin by means of the contact pin 71.

[0094] Furthermore, as the sheet is wound and formed, a space can be formed inside the contact 70, and this space can be filled with an elastic member 73 containing conductive particles. More specifically, the elastic member 73 can be formed by filling and hardening silicone containing metallic conductive particles between the contact pin 71 and the hole.

[0095] Additionally, the first member 50 may be disposed between the end of the contact member 70, including the tip portion 711, and the hole. For this structure, the first member 50 may be hot-pressed onto the first surface 11 as described above.

[0096] However, since the contact 70 in this embodiment is in a state where the interior is filled with an elastic member 73 containing conductive particles, it is necessary to arrange the conductive particles by magnetism to improve the electrical contact capability of the contact 70.

[0097] Therefore, in order to simplify the process and make it easy to roll in and position the first component 50 between the end of the contact 70 and the hole, the conductive particles can be arranged by applying a magnetic force to the elastic component 73 while the first component 50 is being bonded. That is, the process of hot extruding the film and the process of applying magnetism to the conductive particles can be performed simultaneously.

[0098] Although various embodiments of the present invention have been described in detail above, those skilled in the art will understand that various modifications can be made to the above embodiments without departing from the scope of the present invention. Therefore, the scope of the present invention should not be limited to the described embodiments, but should be determined not only by the appended claims but also by equivalents thereof. [Simplified Explanation of the Diagram]

[0039] Figure 1 is a schematic diagram of a hybrid test socket according to an embodiment of the present invention.

[0040] Figure 2 is a schematic diagram of the spring contact pin in Figure 1.

[0041] Figure 3 is an exploded three-dimensional view of Figure 2.

[0042] Figures 4 to 8 are schematic diagrams of the contact needle in Figure 2.

[0043] Figure 9 is a schematic diagram of the manufacturing process of the hybrid test socket in Figure 1.

[0044] Figure 10 is a schematic diagram of a hybrid test socket according to another embodiment of the present invention.

[0045] Figure 11 is a schematic diagram of the contact pin in Figure 10.

Claims

1. A hybrid test socket, comprising: A main body having a hole extending through a first surface facing a terminal of a semiconductor device and a second surface facing a pad of a test device; a contact inserted into the hole, one end contacting a terminal of the semiconductor device and the other end contacting a pad of the test device, and having elasticity in a pressing direction; and a first member disposed between the inner surface of the hole on the first surface side and around one end of the contact member bonded together; wherein the main body includes: a base forming the shape of a test socket; and an elastic insulator filled inside the base and hardened to form elasticity, the hole being formed through the elastic insulator; wherein the second surface has a stepped hole forming a step toward the first surface.

2. The hybrid test socket as described in claim 1, wherein, The contact includes: a pair of contact pins; and a spring connected between the pair of contact pins to provide elasticity.

3. The hybrid test socket as described in claim 2, wherein, The pair of contact pins have the same shape and are connected in a direction that intersects each other.

4. The hybrid test socket as described in claim 3, wherein, The contact needle includes: a main body portion having a predetermined width and thickness; a head portion formed at one end of the main body portion and in contact with the object being inspected; and a leg portion extending along the length of the main body portion in a direction opposite to that of the head portion.

5. The hybrid test socket as described in claim 4, wherein, The head is formed by winding a plate-shaped strip integrally molded with the main body.

6. The hybrid test socket as described in claim 5, wherein, The head has multiple pointed tips at its upper end.

7. The hybrid test socket as described in claim 6, wherein, The first component is disposed between at least a portion of the outer peripheral surface of the head and the inner surface of the hole.

8. The hybrid test socket as described in claim 1, wherein, The diameter of the stepped hole is larger than the diameter of the hole.

9. The hybrid test socket as described in claim 1, wherein, The first component is bonded in a state where it is disposed on one end face of the contact, and is wound around one end of the contact and between the hole and hardened.

10. The hybrid test socket as described in claim 1, wherein, The contact includes: a contact pin; and an elastic member including conductive particles filling the space between the contact pin and the hole.

11. The hybrid test socket as described in claim 10, wherein, The contact needle is formed by winding a plate-shaped strip.

12. The hybrid test socket as described in claim 10, wherein, The conductive particles are aligned by applying a magnetic force to the elastic member while the first member is bonded together.

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