Electronic package, manufacturing method thereof and electronic component, manufacturing method thereof

Abstract

An electronic package and its manufacturing method, and an electronic component and its manufacturing method, mainly adopt a multi-layer structure design for the insulating module on the first side of the intermediate plate of the electronic component, so as to improve the rigidity and mechanical strength of the electronic component and prevent the electronic component from warping during the thermal process.

Claims

1. An electronic component comprising: An intermediate plate has a first side and a second side opposite to each other, and a plurality of through-hole conductors are formed in the intermediate plate, with the conductors protruding from the first side of the intermediate plate as conductive protrusions; and an insulating module is a multi-layer structure including a passivation layer and an insulating layer, which is formed on the first side of the intermediate plate and covers the side of the conductive protrusion, wherein the end face of the conductive protrusion of the conductor and the surface of the insulating module are flush with each other.

2. The electronic component as described in claim 1, wherein, The passivation layer system comprises silicon nitride, and the insulating layer system comprises titanium nitride.

3. The electronic component as described in claim 1, wherein, The passivation layer covers the side of the conductive protrusion.

4. The electronic component as described in claim 1, wherein, The insulating layer is formed between any two of the complex conductors.

5. The electronic component as described in claim 1, wherein, The insulating layer does not directly contact each of the conductors.

6. The electronic component as claimed in claim 1 further includes conductive bumps formed on the conductive protrusion.

7. The electronic component as described in claim 6, wherein, A conductive layer is formed between the conductive protrusion and the conductive bump, and the conductive layer comprises a titanium-copper alloy.

8. An electronic package, comprising: Coating layer; The electronic component described in any of claims 1 to 7 is embedded in the cladding layer as an electrical bridging element. The circuit structure is a conductive protrusion disposed on the cladding layer and electrically connected to the electronic component; And functional elements are disposed on the circuit structure and electrically connected to the circuit structure, so that the functional elements are electrically bridged to the electronic components through the circuit structure.

9. The electronic package as described in claim 8 further includes a plurality of conductive pillars embedded in the cover layer, which are electrically connected to the circuit structure.

10. The electronic package as claimed in claim 8 further includes a wiring structure formed on the second side of the intermediate plate, which is electrically connected to the conductor.

11. The electronic package as described in claim 10 further includes a plurality of conductive elements formed on the wiring structure.

12. A method for manufacturing an electronic component, comprising: An intermediate plate is provided, having a first side and a second side opposite to each other, and a plurality of through-hole conductors are formed in the intermediate plate, with the conductors protruding from the first side of the intermediate plate as conductive protrusions; and an insulating module is formed on the first side of the intermediate plate, and the insulating module covers the side of the conductive protrusion, wherein the insulating module is a multilayer structure including a passivation layer and an insulating layer, and the end face of the conductive protrusion of the conductor and the surface of the insulating module are flush with each other.

13. The method of manufacturing the electronic component as described in claim 12, wherein, The passivation layer system comprises silicon nitride, and the insulating layer system comprises titanium nitride.

14. The method of manufacturing the electronic component as described in claim 12, wherein, The passivation layer covers the side of the conductive protrusion.

15. A method for manufacturing an electronic component as described in claim 12, wherein, The insulating layer is formed between any two of the complex conductors.

16. The method of manufacturing the electronic component as described in claim 12, wherein, The insulating layer does not directly contact each of the conductors.

17. The method of manufacturing an electronic component as described in claim 12 further includes forming conductive bumps on the conductive protrusions.

18. A method for manufacturing an electronic component as described in claim 17, wherein, A conductive layer is formed between the conductive protrusion and the conductive bump, and the conductive layer comprises a titanium-copper alloy.

19. A method for manufacturing an electronic package, comprising: An electronic component as described in any of claims 1 to 7 is embedded in a cladding layer as an electrical bridging element; A circuit structure is formed on the cladding layer, and the circuit structure is electrically connected to the conductive protrusion of the electronic component; and a functional element is disposed on the circuit structure, and the functional element is electrically connected to the circuit structure, so that the functional element is electrically bridged to the electronic component through the circuit structure.

20. The method of manufacturing an electronic package as described in claim 19 further includes embedding a plurality of conductive pillars in the cover layer, wherein the plurality of conductive pillars are electrically connected to the circuit structure.

21. The method of manufacturing an electronic package as described in claim 19 further includes forming a wiring structure on a second side of the intermediate plate, wherein the wiring structure is electrically connected to the conductor.

22. The method of manufacturing an electronic package as described in claim 21 further includes forming a plurality of conductive elements on the wiring structure.

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