Antenna package and vehicle-mounted antenna device
Patent Information
- Application Number
- TW114112457
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-09-11
- Estimated Expiration
- 2045-03-30
Smart Images

Figure TWG2TB001910490_001 
Figure TWG2TB001910490_002 
Figure TWG2TB001910490_003
Abstract
Claims
1. An antenna package comprising: a first outer substrate; a second outer substrate; and a surrounding wall comprising: a support structure disposed between the first outer substrate and the second outer substrate, wherein the first outer substrate, the second outer substrate, and the support structure define an accommodating space, the support structure having an inner wall surface and a support groove recessed from the inner wall surface, wherein the support groove communicates with the accommodating space; and an antenna module located within the accommodating space and disposed within the support groove, wherein multiple gaps exist between the antenna module and the first outer substrate, and between the antenna module and the second outer substrate.
2. The antenna package as claimed in claim 1, wherein the surrounding wall further comprises: a positioning structure disposed between the first outer substrate and the second outer substrate, wherein the positioning structure, together with the first outer substrate, the second outer substrate, and the support structure, defines the accommodating space, and the positioning structure has a positioning groove communicating with the accommodating space; wherein the support groove has a first depth, and the positioning groove has a second depth, wherein the first depth and the second depth are different; wherein the antenna module is disposed within the positioning groove and includes a positioning portion cooperating with the positioning groove.
3. The antenna package as described in claim 2, wherein the positioning groove further has a third depth, which is different from the second depth.
4. The antenna package as claimed in claim 1, wherein the surrounding wall further comprises: a heat dissipation structure comprising: a body disposed between the first outer substrate and the second outer substrate, wherein the body, the first outer substrate, the second outer substrate, and the support structure together define the accommodating space; and a protrusion connected to the body and extending from the body in a direction away from the body, wherein the protrusion is located within the accommodating space; wherein a side edge of the antenna module abuts against the protrusion, and a gap exists between the antenna module and the body, the gap communicating with the gaps.
5. The antenna package as described in claim 4, wherein the heat dissipation structure further includes a carrier portion connected to the protrusion and extending in the direction thereof, and the antenna module is disposed on the carrier portion.
6. The antenna package as claimed in claim 1, wherein the antenna module includes an inner substrate, the distance between the inner substrate and the first outer substrate being in the range of 2 mm to 10 mm.
7. The antenna package as claimed in claim 1, wherein the antenna module includes an antenna element, and the vertical projection of the surrounding wall on the first outer substrate does not overlap with the vertical projection of the antenna element on the first outer substrate.
8. The antenna package as described in claim 1, wherein the surrounding wall is integrally formed.
9. The antenna package as claimed in claim 1, wherein the surrounding wall has a notch communicating with the accommodating space; wherein the antenna package further comprises: a closure disposed between the first outer substrate and the second outer substrate, and closing the notch.
10. A vehicle-mounted antenna device, comprising: an antenna package including: a first outer substrate; a second outer substrate; a surrounding wall including: a support structure disposed between the first outer substrate and the second outer substrate, wherein the first outer substrate, the second outer substrate, and the support structure define an accommodating space, the support structure having an inner wall surface and a support groove recessed from the inner wall surface, wherein the support groove communicates with the accommodating space; and an antenna module located within the accommodating space and disposed within the support groove, wherein multiple gaps exist between the antenna module and the first outer substrate, and between the antenna module and the second outer substrate; wherein the antenna package is integrated with a window of a vehicle body.
Citation Information
Patent Citations
Chip package and manufacturing method thereof and semiconductor electroplating system
TW201639111A
Wireless communications package with integrated antennas and air cavity
US20160049723A1
