Electronic package and manufacturing method thereof

Abstract

An electronic package and its manufacturing method are disclosed, comprising disposing of at least one electronic component on a substrate, and then disposing of an antenna module on the substrate to cover the periphery of the electronic component. The antenna module includes an insulating cover, a cavity, an insulating layer, conductive vias, and an antenna structure. The insulating cover covers the periphery of the electronic component, the electronic component is located within the cavity, the insulating layer is formed on the wall of the cavity, the conductive vias are formed in the insulating cover to penetrate the insulating cover, and the antenna structure is formed on the insulating cover to sequentially electrically connect the conductive vias and the substrate. The insulating layer is located between the antenna structure and the electronic component. Therefore, this invention can provide good electromagnetic interference (EMI) protection, isolation, or shielding for electronic components.

Claims

1. An electronic package, comprising: substrate; Electronic components are mounted on this substrate; The antenna module is disposed on the substrate to cover the electronic component. The antenna module includes a single insulating cover, a first cavity, a first insulating layer, a first conductive through-hole, and a first antenna structure. The single insulating cover directly contacts the entire upper and side surfaces of the first insulating layer to cover the periphery of the electronic component. The single insulating cover is not formed in the first cavity. The electronic component is located in the first cavity but does not directly contact the single insulating cover. The first insulating layer is formed on the wall of the first cavity. The first conductive through-hole is formed in the single insulating cover to penetrate the single insulating cover and directly contact the substrate. The first antenna structure is formed on the single insulating cover to sequentially electrically connect the directly contacting first conductive through-hole and the substrate. The first insulating layer is located between the first antenna structure and the electronic component, and only the single insulating cover is formed on the upper and side surfaces of the first insulating layer.

2. The electronic package as described in claim 1, wherein, The single insulating cover is a glass insulating cover, and the first conductive perforation is a glass perforation containing conductive material.

3. The electronic package as described in claim 1, wherein, The antenna module further includes a second cavity, with the plurality of electronic components located in the first cavity and the second cavity respectively, and the first isolation layer is located between the first antenna structure and the electronic components in the first cavity.

4. The electronic package as described in claim 3, wherein, The antenna module further includes a second isolation layer formed on the wall of the second cavity, and the second isolation layer is located between the first antenna structure and the electronic component in the second cavity.

5. The electronic package as described in claim 1, wherein, The antenna module further includes a second conductive through-hole and a second antenna structure. The second conductive through-hole is formed in the single insulating cover to penetrate the single insulating cover, and the second antenna structure is formed on the single insulating cover to be electrically connected to the second conductive through-hole and the substrate.

6. The electronic package as described in claim 1, wherein, The first antenna structure is an antenna array composed of multiple antenna blocks, and the first isolation layer is located between the antenna array and the electronic component.

7. The electronic package as described in claim 1, wherein, The antenna module further includes a second cavity, the first antenna structure is an antenna array composed of multiple antenna blocks, and the multiple electronic components are respectively located in the first cavity and the second cavity.

8. The electronic package as described in claim 1, wherein, The antenna module further includes an insulating substrate and an antenna signal enhancement structure. The insulating substrate is formed on the single insulating cover and the first antenna structure, and the antenna signal enhancement structure is formed on the insulating substrate.

9. The electronic package as described in claim 8, wherein, The first antenna structure is a first antenna array composed of a plurality of first antenna blocks, and the antenna signal enhancement structure is a second antenna array composed of a plurality of second antenna blocks, wherein the plurality of first antenna blocks corresponds to the plurality of second antenna blocks.

10. The electronic package as described in claim 8, wherein, The first antenna structure is separated from the antenna signal enhancement structure by a gap, and the gap is half the wavelength of the antenna signal of the first antenna structure or ±10%.

11. A method for manufacturing an electronic package, comprising: Electronic components are mounted on a substrate; The method involves mounting an antenna module on the substrate to cover the electronic component. The antenna module includes a single insulating cover, a first cavity, a first insulating layer, a first conductive via, and a first antenna structure. The single insulating cover directly contacts the entire upper and side surfaces of the first insulating layer to cover the periphery of the electronic component. The single insulating cover is not formed within the first cavity, and the electronic component is located within the first cavity without directly contacting the single insulating cover. The first insulating layer is formed on the wall of the first cavity. The first conductive via is formed in the single insulating cover to penetrate the single insulating cover and directly contact the substrate. The first antenna structure is formed on the single insulating cover to sequentially and electrically connect the directly contacting first conductive via and the substrate. The first insulating layer is located between the first antenna structure and the electronic component, and only the single insulating cover is formed on the upper and side surfaces of the first insulating layer.

12. The method for manufacturing an electronic package as described in claim 11, wherein, The single insulating cover is a glass insulating cover, and the first conductive perforation is a glass perforation containing conductive material.

13. The method for manufacturing an electronic package as described in claim 11, wherein, The antenna module further includes a second cavity, with the plurality of electronic components located in the first cavity and the second cavity respectively, and the first isolation layer is located between the first antenna structure and the electronic components in the first cavity.

14. The method for manufacturing an electronic package as described in claim 13, wherein, The antenna module further includes a second isolation layer formed on the wall of the second cavity, and the second isolation layer is located between the first antenna structure and the electronic component in the second cavity.

15. The method for manufacturing an electronic package as described in claim 11, wherein, The antenna module further includes a second conductive through-hole and a second antenna structure. The second conductive through-hole is formed in the single insulating cover to penetrate the single insulating cover, and the second antenna structure is formed on the single insulating cover to be electrically connected to the second conductive through-hole and the substrate.

16. The method for manufacturing an electronic package as described in claim 11, wherein, The first antenna structure is an antenna array composed of multiple antenna blocks, and the first isolation layer is located between the antenna array and the electronic component.

17. The method for manufacturing an electronic package as described in claim 11, wherein, The antenna module further includes a second cavity, the first antenna structure is an antenna array composed of multiple antenna blocks, and the multiple electronic components are respectively located in the first cavity and the second cavity.

18. The method for manufacturing an electronic package as described in claim 11, wherein, The antenna module further includes an insulating substrate and an antenna signal enhancement structure. The insulating substrate is formed on the single insulating cover and the first antenna structure, and the antenna signal enhancement structure is formed on the insulating substrate.

19. A method for manufacturing an electronic package as described in claim 18, wherein, The first antenna structure is a first antenna array composed of a plurality of first antenna blocks, and the antenna signal enhancement structure is a second antenna array composed of a plurality of second antenna blocks, wherein the plurality of first antenna blocks corresponds to the plurality of second antenna blocks.

20. A method for manufacturing an electronic package as described in claim 18, wherein, The first antenna structure is separated from the antenna signal enhancement structure by a gap, and the gap is half the wavelength of the antenna signal of the first antenna structure or ±10%.

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