Substrate support

Abstract

A sensor probe includes an elongated body defining an inner cavity with an inner diameter. A printed circuit board is configured to fit within the inner cavity. A first temperature sensing integrated circuit is mounted at a first end of the printed circuit board. A cover is mounted adjacent to the first end of the elongated body of the first temperature sensing integrated circuit. A housing system is configured to receive a second end of the elongated body, wherein the housing system is configured to be mounted on a base plate of a substrate support.

Description

[Technical Field]

[0001] [Cross-reference to related applications] This application is PCT international application No. 62 / 854,476, filed May 30, 2019. The entire contents of the above application are incorporated herein by reference.

[0002] The present invention relates generally to a substrate processing system, and more particularly to a sensor probe for monitoring the temperature of an electrostatic chuck in a substrate processing system. [Previous Technology]

[0003] The prior art description provided herein is intended to generally introduce the background of the present invention. The achievements of the inventors named in this application within the scope of the prior art section, as well as embodiments of the specification that were not qualified as prior art at the time of application, are not intended or implied to be admitted as prior art against the present invention.

[0004] A substrate processing system performs processing on a substrate, such as a semiconductor wafer. Examples of substrate processing include deposition, ashing, etching, cleaning, and / or other processes. A mixture of processing gases may be supplied to a processing chamber to process the substrate. Plasma-ignited gases may be used to enhance the chemical reaction.

[0005] During processing, the substrate is placed on a substrate support within the processing chamber. Temperature variations in the substrate support can affect the processing. For example, the deposition or etching rate may be affected by different temperatures at different locations on the substrate. Therefore, the deposition or etching process may differ at different locations. Some substrate supports include embedded temperature sensors to sense temperatures in multiple zones. In some examples, each of these zones includes one or more redundant temperature sensors that serve as backup in case of sensor failure in that zone. If all temperature sensors in one of these zones fail, the substrate support must be replaced, which can be costly. [Summary of the Invention]

[0006] A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A printed circuit board is configured to fit within the inner cavity. A first temperature sensing integrated circuit is mounted at a first end of the printed circuit board. A cover is mounted adjacent to the first end of the elongated body of the first temperature sensing integrated circuit. A housing system is configured to receive a second end of the elongated body. The housing system is configured to be mounted on a base plate of a substrate support.

[0007] Among other features, the printed circuit board has a width smaller than the inner diameter and a length longer than the elongated body. The inner diameter is less than or equal to 3 mm, and at least two of the three orthogonal dimensions of the first temperature sensing integrated circuit are less than 3 mm.

[0008] Among other features, a potting material connects the cover to the first temperature sensing integrated circuit. The printed circuit board is flexible and is obliquely bent adjacent to the first temperature sensing integrated circuit. The cover includes first and second leads extending from one side of the cover and received within the cavity of the elongated body. The elongated body is complementaryly received within the housing. The elongated body includes a protrusion and further includes a spring located around the elongated body and biased between the cavity of the housing and the protrusion.

[0009] Among other features, the first temperature sensing integrated circuit senses the temperature of a surface in contact with the cover. This surface is a layer within an electrostatic chuck.

[0010] Among other features, the elongated body includes a radially projecting portion to center the elongated body within the cavity of the base plate. The elongated body includes a slot. The slot has an elongated elliptical shape and is aligned in the axial direction of the elongated body.

[0011] Among other features, a shielding layer is disposed on at least one surface of the printed circuit board. The housing defines an inclined surface. An O-ring is disposed between the cavity of the housing and the base plate and abuts against the inclined surface.

[0012] Among other features, the printed circuit board is flexible. A connector is attached to a second end of the printed circuit board. A plurality of wires are connected to wiring on the printed circuit board via the connector. A second temperature sensing integrated circuit is mounted on the printed circuit board between the first temperature sensing integrated circuit and the second end of the printed circuit board.

[0013] A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A first printed circuit board is configured to fit within the inner cavity. A temperature sensing integrated circuit is mounted on the first printed circuit board. A housing system is configured to receive one end of the elongated body and is configured to be mounted on a base plate of a substrate support. A second printed circuit board is disposed within the housing. A plurality of first conductors connect the first printed circuit board to the second printed circuit board. A plurality of second conductors are configured to connect the second printed circuit board to an external device.

[0014] Among other features, the first printed circuit board has a width smaller than the inner diameter and a length smaller than the length of the elongated body. The second printed circuit board has a length smaller than the length of the housing. The inner diameter is less than or equal to 3 mm, and at least two of the three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm.

[0015] Among other features, the potting material is located inside the elongated body. The first printed circuit board and the temperature sensing integrated circuit are mounted parallel to the length of the elongated body. The temperature sensing integrated circuit senses the temperature of the surface it contacts. This surface is a layer within an electrostatic chuck. The elongated body includes a radial protrusion to center the elongated body within the cavity of the base plate.

[0016] Among other features, the elongated body includes a slot. The slot has an elongated elliptical shape and is aligned in the axial direction of the elongated body. A capacitor is connected to the first printed circuit board. A resistor is connected to the second printed circuit board. A shielding layer is disposed on the surface of the first printed circuit board.

[0017] A sensor probe includes an elongated body defining an inner cavity having an inner diameter. A temperature sensing integrated circuit is configured to fit within the inner cavity. A housing system is configured to receive one end of the elongated body and is configured to be mounted on a base plate of a substrate support. A plurality of conductive systems are configured to pass through the housing and the elongated body and connect the temperature sensing integrated circuit to an external device.

[0018] Among other features, the inner diameter is less than or equal to 3 mm, and at least two of the three orthogonal dimensions of the temperature sensing integrated circuit are less than 3 mm. The potting material is located inside the elongated body. The temperature sensing integrated circuit is mounted parallel to the length of the elongated body. The temperature sensing integrated circuit is mounted perpendicular to the length of the elongated body.

[0019] Among other features, the temperature sensing integrated circuit senses the temperature of a surface in contact with it. This surface is a layer within an electrostatic chuck. The elongated body includes a radial protrusion to center the elongated body within a cavity in the base plate.

[0020] Among other features, the elongated body includes a slot. The slot has an elongated elliptical shape and is aligned in the axial direction of the elongated body. A plurality of solder balls are attached to the temperature sensing integrated circuit. A plurality of conductors are attached to the plurality of solder balls.

[0021] Further applicability of this disclosure will become apparent from the embodiments, the scope of the invention claims, and the drawings. The detailed descriptions and specific examples are intended for illustrative purposes only and are not intended to limit the scope of this disclosure.

Implementation Method

[0040] This invention relates to a sensor probe for sensing the surface of a processing chamber of a substrate. The sensor probe includes a temperature sensing integrated circuit. In some examples, the temperature sensing integrated circuit is housed in a body made of metal and connected to a reference potential (e.g., ground). For example, the body may be grounded to a substrate. Therefore, the body of the sensor probe functions as a Faraday cage, and the sensor probe is unaffected by RF signals (e.g., RF bias signals, electrode signals, etc.) present in the temperature sensing environment. Alternatively, the body may be made of a metallic or non-metallic material, and a ground plane or electromagnetic shield may be used to reduce or further reduce electromagnetic interference (EMI).

[0041] In some examples, the temperature sensing integrated circuit has a small form factor of less than 3 mm in at least two of the three orthogonal dimensions. In some examples, the temperature sensing integrated circuit has a small form factor of less than 2 mm in all three orthogonal dimensions. In some examples, the body of the sensor probe has an outer diameter of less than or equal to 4 mm and an inner diameter of less than or equal to 3 mm.

[0042] Referring now to Figures 1 and 2, an example of a plasma processing chamber in which a sensor probe can be used is shown. As will be understood, sensor probes can be used in various types of semiconductor processing equipment, such as cooling bases, rotary chucks, processing chambers, etc. In Figure 1, an example of a substrate processing system 110 according to the present invention is shown. The substrate processing system 110 includes a processing chamber 122 that surrounds other components of the substrate processing system 110 and contains RF plasma (if used). The substrate processing system 110 includes an upper electrode 124 and a substrate support 126 (e.g., an electrostatic chuck (ESC)). During operation, a substrate 128 is disposed on the substrate support 126.

[0043] By way of example only, the upper electrode 124 may include a gas distribution device 129 (e.g., a spray head) for introducing and distributing process gases. The gas distribution device 129 may include a rod portion having one end connected to the top surface of the processing chamber. The base is generally cylindrical and extends radially outward from the other end of the rod portion (located at a position spaced apart from the top surface of the processing chamber). The substrate-facing surface or panel of the base portion of the spray head includes a plurality of holes through which precursors, reactants, etching gases, inert gases, carrier gases, other process gases, or exhaust gases flow. Alternatively, the upper electrode 124 may include a conductive plate, and the process gases may be introduced in another manner.

[0044] The substrate support 126 includes a base plate 130, which serves as a lower electrode. The base plate 130 supports a heating plate 132, which may correspond to a ceramic multi-zone heating plate. A thermal resistance layer 134 may be disposed between the heating plate 132 and the base plate 130. The base plate 130 may include one or more channels 136 for allowing coolant to flow through the base plate 130.

[0045] The RF generation system 140 generates and outputs an RF voltage to one of the upper electrode 124 and the lower electrode (e.g., the base plate 130 of the substrate support 126). The other of the upper electrode 124 and the base plate 130 may be DC grounded, AC grounded, or floating. By way of example only, the RF generation system 140 may include an RF generator 142 that generates RF plasma power, which is fed to the upper electrode 124 or the base plate 130 via a matching and distribution network 144. In other examples, plasma may be generated inductively or remotely.

[0046] The gas delivery system 150 includes one or more gas sources 152-1, 152-2, ..., and 152-N (collectively referred to as gas sources 152), where N is an integer greater than zero. The gas sources 152 are connected to the manifold 160 via valves 154-1, 154-2, ..., and 154-N (collectively referred to as valves 154) and MFCs 156-1, 156-2, ..., and 156-N (collectively referred to as MFCs 156). Secondary valves may be used between the MFCs 156 and the manifold 160. Although a single gas delivery system 150 is shown, two or more gas delivery systems may be used.

[0047] The temperature controller 163 can be connected to a plurality of thermal control elements (TCEs) 164 disposed in the heating plate 132. The temperature controller 163 can be used to control the plurality of TCEs 164 to control the temperature of the substrate support 126 and the substrate 128. The temperature controller 163 can communicate with the coolant assembly 166 to control the coolant flowing through the channel 136. For example, the coolant assembly 166 may include a coolant pump, a reservoir, and / or one or more temperature sensors. The temperature controller 163 operates the coolant assembly 166 to selectively allow coolant to flow through the channel 136 to cool the substrate support 126.

[0048] Valve 170 and pump 172 can be used to evacuate reactants from the self-processing chamber 122. System controller 180 can be used to control the components of the substrate processing system 110. One or more sensor probes 190 can be embedded in cavities defined in the substrate support to sense the surface temperature.

[0049] Figure 2 shows another example of the substrate processing system 210. The substrate processing system 210 includes a coil drive circuit 211. A pulse circuit 214 can be used to pulse-on and pulse-off the RF power, or to change the amplitude or level of the RF power. A tuning circuit 213 can be directly connected to one or more induction coils 216. The tuning circuit 213 tunes the output of the RF source 212 to a desired frequency and / or desired phase, matches the impedance of the coils 216, and distributes the power among the coils 216. In some examples, the coil drive circuit 211 is replaced with one of the drive coils described further below, and combined with control of the RF bias voltage.

[0050] In some examples, the gas filling section 220 may be disposed between the coil 216 and the dielectric window 224 to control the temperature of the dielectric window 224 by means of hot and / or cold air flow. The dielectric window 224 is disposed along one side of the processing chamber 228. The processing chamber 228 further includes a substrate support (or base) 232. The substrate support 232 may include an electrostatic chuck (ESC), a mechanical chuck, or other types of chuck. Processing gas is supplied to the processing chamber 228, and plasma 240 is generated within the processing chamber 228. The plasma 240 etches the exposed surfaces of the substrate 234. A drive circuit 252 (e.g., one of the following) may be used to provide an RF bias voltage to the electrodes in the substrate support 232 during operation.

[0051] A gas delivery system 256 is used to supply a mixture of processing gases to the processing chamber 228. The gas delivery system 256 may include a processing and inert gas source 257, a gas metering system 258 (e.g., valves and mass flow controllers), and a manifold 259. A gas delivery system 260 is used to deliver gas 262 to the charging section 220 via a valve 261. This gas may include cooling gas (air) for cooling the coil 216 and dielectric window 224. A heater / cooler 264 is used to heat / cool the substrate support 232 to a predetermined temperature. A discharge system 265 includes a valve 266 and a pump 267 to remove reactants from the processing chamber 228 by purging or emptying operations.

[0052] Controller 254 can be used to control the etching process. Controller 254 monitors system parameters and controls the delivery, triggering, maintenance, and fading of the gas mixture, removal of reactants, and supply of cooling gas. Furthermore, as detailed below, controller 254 can control various states of coil drive circuit 211 and drive circuit 252. One or more sensor probes 190 can be embedded in a cavity defined in the substrate support to sense the surface temperature.

[0053] Referring now to Figures 3, 4A, and 4B, the substrate support 300 (such as an electrostatic chuck (ESC)) includes a base plate 310 disposed adjacent to the heater layer 314. Although the base plate of the substrate support is shown, sensor probes can be used to sense the surface temperature of other components of the substrate processing equipment. The heater layer 314 includes heaters 316. A ceramic layer 318 containing electrodes 320 is disposed adjacent to the heater layer 314. Sensor probes 190 are embedded in a cylindrical cavity 332.

[0054] In some examples, the sensor probe 190 includes an elongated body 330 having a first end portion 334. The first end portion 334 of the sensor probe 190 has a diameter larger than the diameter of the elongated body 330. The elongated body 330 is received by a threaded housing 336 located at one end of the elongated body 330.

[0055] The threaded housing 336 includes a first portion 338, a second portion 340, and a third portion 344. In some examples, the first portion 338, the second portion 340, and the third portion 344 are cylindrical and include aligned internal cavities. The second portion 340 has a diameter larger than that of the first portion 338. The second portion 340 includes a thread 346, which is received in a threaded hole 348 in the base plate 310 of the substrate support 300. The third portion 344 protrudes outwardly and radially from the base plate 310 to allow the sensor probe 190 to be rotated relative to the base plate 310 to allow insertion and removal.

[0056] A printed circuit board (PCB) 354 (such as a flexible PCB) passes through the elongated body 330 and extends from the third portion 344 of the threaded housing 336. The PCB 354 is connected via a connector 356 (such as a PCB) to one or more conductors 360 for power supply and grounding, and is connected via one or more signal lines to and from the integrated circuit located in the sensor probe 190.

[0057] In FIG. 4A, the elongated body 330 of the sensor probe 190 includes a beveled surface 361, which provides a transition from the diameter of the elongated body 330 to the larger diameter of the first end 334. Spacers 362 protrude radially from the elongated body 330 to uniformly space the elongated body 330 within the cylindrical cavity 332. The beveled surface 372 provides a transition from the first portion 338 of the threaded housing 336 to the second portion 340. In some examples, an O-ring 376 is configured to abut against the beveled surface 372 and function as an RF washer.

[0058] In FIG. 4B, the elongated body 330 includes a radially projecting surface 408 positioned along a first end portion 334. The sensor probe 190 includes a spring 410 located around the first end portion 334 and adjacent to the inner surface of a cavity formed in the threaded housing 336. The spring 410 biases the end portion of the elongated body 330 against a surface to determine the temperature of that surface.

[0059] The first integrated circuit 420 is mounted on the PCB 354. The first integrated circuit 420 senses a first temperature of the surface to be monitored. In some examples, a second integrated circuit 422 is mounted on the PCB 354. The second integrated circuit 422 senses the temperature of the surface remote from the surface to be monitored, thereby increasing the reliability of the temperature measured by the first integrated circuit 420, so as to perform diagnostic monitoring and / or rationality verification of the first integrated circuit 420.

[0060] In Figure 5, PCB 354 is shown as including a first portion 508, which extends a distance greater than the elongated body 330 of the sensor probe 190. A first integrated circuit 420 is mounted at one end of the first portion 508. If a second integrated circuit 422 is used, it is mounted at a position spaced apart from the integrated circuit 420. A second end 510 of PCB 354 includes a terminal 526 connected to traces 522 (partially shown). PCB 354 includes two or more layers including conductive traces, vias, ground planes, etc., to provide connections from the terminal 526 to the first integrated circuit 420 and / or the second integrated circuit 422.

[0061] Referring now to Figure 6, the elongated body 330 may include one or more slots 610 to facilitate heat transfer. In some examples, the slots 610 have an elongated elliptical shape and are arranged in the axial direction of the elongated body 330.

[0062] Referring now to FIG7, a circuit 700 comprising a first integrated circuit 420, resistors R1 and R2, and capacitor C1 is shown. A voltage supply line V+ is connected to the V+ terminal of the first integrated circuit 420. A first reference potential (e.g., ground) is connected to the GND input and a second input of the first integrated circuit 420. Signal lines S1 and S2 are connected to the SDA and SGL lines of the first integrated circuit 420. Resistors R1 and R2 are connected between the voltage supply line V+ and the signal lines S1 and S2.

[0063] Referring now to FIG8, the first integrated circuit 420 is attached to the PCB 354. Solder bumps 810 connect the pads on the first integrated circuit 420 to the corresponding pads on the PCB 354.

[0064] Referring now to Figures 9A and 9B, the first integrated circuit 420 and PCB 354 are shown attached to the cover 820. In some examples, the cover 820 is made of metal and includes leads 822 and 824 extending from one side therefrom. In Figure 9A, the cover 820 is configured or attached such that the leads 822 and 824 extend laterally to the mounting surface of the PCB 354. In Figure 9B, the cover 820 is configured or attached such that the leads 822 and 824 extend parallel to the mounting surface of the PCB 354.

[0065] Referring now to Figures 10A to 10B, the encapsulation of the first integrated circuit 420 within the cover 820 is shown. Encapsulating material 1010 is applied to encapsulate the cover 820 within the integrated circuit.

[0066] Referring now to Figures 11A to 11B, PCB 354, first integrated circuit 420, and cover 820 are embedded in the cavity 1100 of elongated body 330. In Figure 11A, PCB 354 is bent at a right angle so that the pins 822 and 824 of cover 820 can be embedded at one end of elongated body 330.

[0067] Referring now to Figures 12 and 13, another example of the sensor probe 1200 is shown. In Figure 12, the sensor probe 1200 includes an elongated body 1210 connected to a threaded housing 1214. In some examples, the threaded housing 1214 includes a threaded surface 1216.

[0068] In Figure 13, the first integrated circuit 1320 is mounted on the first PCB 1326 via solder balls 1330. A capacitor 1334 is mounted on the first PCB 1326. The second PCB 1350 is disposed in a threaded housing 1214 and includes a resistor 1360 mounted thereon. One or more wires 1362 provide external connections. One or more wires or rigid PCB traces 1366 provide connections between the first PCB 1326 and the second PCB 1350. Encapsulating material 1370 is located inside the elongated body 1210. The first integrated circuit 1320 senses the temperature of surface 1380.

[0069] Referring now to Figure 14, if additional shielding is required, shielding layer 1410 may be used to cover the upper and / or lower surfaces of PCB 1400 to provide enhanced shielding. In some examples, shielding layer 1410 comprises a metal layer. In some examples, shielding layer 1410 is connected to a reference potential (e.g., ground). In other examples, shielding layer 1410 comprises a plurality of conductors. In some examples, the plurality of conductors are uniformly spaced and form a grid in one or more lateral directions. The plurality of conductors are connected to a reference potential (e.g., ground).

[0070] Referring now to FIG15, sensor probes can also be implemented without the use of a printed circuit board. Although two sensor probes are illustrated to show the positional change of the temperature sensing integrated circuit, one or more sensor probes may be used in a given application. The first and second sensor probes 1510-1 and 1510-2 include integrated circuits 1520-1 and 1520-2, which are respectively located in elongated bodies 1210-1 and 1210-2 and adjacent to the surface ends of elongated bodies 1210-1 and 1210-2. A plurality of solder balls 1530-1 and 1530-2 are respectively provided with connections to integrated circuits 1520-1 and 1520-2. Each of the plurality of wires 1562-1 and 1562-2 is soldered to selected of the plurality of solder balls 1530-1 and 1530-2 to provide one or more external connections to the integrated circuits 1520-1 and 1520-2 via threaded housings 1214-1 and 1214-2 and elongated bodies 1210-1 and 1210-2. In some examples, wires 1562-1 and 1562-2 comprise insulated conductors.

[0071] Encapsulating materials 1570-1 and 1570-2 are respectively located inside the elongated bodies 1210-1 and 1210-2. Integrated circuits 1520-1 and 1520-2 sense the temperature of surface 1580. Integrated circuits 1520-1 and 1520-2 may be arranged parallel to, perpendicular to, or at an angle between the elongated bodies 1210-1 and 1210-2.

[0072] In some examples, the number of solder balls S is equal to the number of wires W, where S and W are integers greater than one. In other examples, S > W or W > S.

[0073] The foregoing description is illustrative in nature and is not intended to limit the scope of this disclosure, its application, or its uses. The broad indications of this disclosure can be implemented in various forms. Therefore, while this disclosure contains specific examples, other variations will become clearer when examining the drawings, specification, and the following claims, and the true scope of this disclosure should not be so limited. It should be understood that one or more steps of the method can be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, while each of the embodiments described above has certain features, any one or more of these features described with respect to any embodiment of this disclosure may be implemented in any other embodiment and / or combined with features of any other embodiment (even if such combination is not described in detail). In other words, the embodiments are not mutually exclusive, and substitutions between one or more embodiments remain within the scope of this disclosure.

[0074] The spatial and functional relationships between components (e.g., modules, circuit elements, semiconductor layers, etc.) are described using various terms including “connection,” “joint,” “coupled,” “adjacent,” “next to,” “above,” “over,” “below,” and “set.” Unless explicitly stated as “direct,” when describing the relationship between the first and second components in the foregoing disclosure, the relationship may be a direct relationship where there are no other intermediary components between the first and second components, or an indirect relationship (spatial or functional) where there are one or more intermediary components between the first and second components. As used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning the logic of using non-exclusionary OR (A OR B OR C), and should not be interpreted as meaning “at least one of A, at least one of B, and at least one of C.”

[0075] In some embodiments, the controller is part of a system that may be part of the examples described above. This system may include semiconductor processing equipment comprising (multiple) processing tools, (multiple) chambers, (multiple) processing platforms, and / or specific processing elements (wafer pedestals, gas flow systems, etc.). Such systems may be integrated with electronic equipment to control the operation of semiconductor wafers or substrates before, during, and after processing. The electronic equipment may be referred to as a "controller" and may control various elements or sub-components of (multiple) systems. Depending on processing requirements and / or system type, the controller may be programmed to control any of the processing disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer (into and out of tools connected or coupled to a specific system and other transfer tools, and / or load locks).

[0076] Broadly speaking, a controller can be defined as an electronic device having a plurality of integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, initiate cleaning operations, initiate endpoint measurements, etc. Integrated circuits may include: chips in the form of firmware storing program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller or system in the form of different individual settings (or program files) that define operating parameters for performing a specific process (on or for a semiconductor wafer). In some embodiments, the operating parameters may be part of a formulation defined by a process engineer to implement one or more processing steps during the manufacture of one or more of the following: (including: coatings, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or substrate grains).

[0077] In some embodiments, the controller may be part of, or coupled to, a computer that is integrated with, coupled to, or networked to the system, or a combination thereof. For example, the controller may be in all or part of a cloud-based or factory mainframe computer system that allows remote access to wafer processing. The computer may enable the system to remotely access the system to monitor the current progress of manufacturing operations, examine the history of past manufacturing operations, examine trends or performance indicators from multiple manufacturing operations, change parameters for the current process, set processing steps after the current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system via a network, which may include a local area network or the Internet. The remote computer may include a user interface that enables access to, or program, parameters and / or settings, and then transmits those parameters and / or settings from the remote computer to the system. In some examples, the controller receives instructions in the form of data, specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool to which the controller is configured to engage or control. Therefore, as described above, the controller can be distributed, for example, by comprising one or more separate controllers connected in a network and operating toward a common purpose (e.g., the process and control described herein). An example of a distributed controller for this purpose would be one or more integrated circuits located on the chamber and communicating with one or more integrated circuits located remotely (e.g., at the work platform level, or as part of a remote computer), which together control the process on the chamber.

[0078] The exemplary system may include, but is not limited to, the following: plasma etching chamber or module, deposition chamber or module, spin wash chamber or module, metal plating chamber or module, cleaning chamber or module, bevel edge etching chamber or module, physical vapor deposition (PVD) chamber or module, chemical vapor deposition (CVD) chamber or module, atomic layer deposition (ALD) chamber or module, atomic layer etching (ALE) chamber or module, ion implantation chamber or module, orbital chamber or module, and any other semiconductor processing system that may be associated with or used in the manufacture and / or processing of semiconductor wafers.

[0079] As described above, depending on the (plural) processing steps to be performed by the tool, the controller may communicate with one or more of the following in the semiconductor manufacturing plant: other tool circuits or modules, other tool elements, cluster tools, other tool interfaces, adjacent tools, adjacent tools, tools throughout the plant, main computer, another controller, or tools used in material transport that transport wafer containers to and from tool locations and / or loading ports. [Simplified Explanation of the Diagram]

[0022] This disclosure will be more fully understood from the embodiments and accompanying drawings, wherein:

[0023] According to the present invention, FIG1 is a functional block diagram of an example of a capacitively coupled plasma (CCP) substrate processing system including sensor probes;

[0024] According to the present invention, FIG2 is a functional block diagram of an example of an inductively coupled plasma (ICP) substrate processing system including sensor probes;

[0025] According to the present invention, FIG3 is a side cross-sectional view of an example of a substrate support including a sensor probe;

[0026] According to the present invention, FIG4A is a side view of an example of a sensor probe;

[0027] According to the present invention, FIG4B is a side cross-sectional view of an example of a sensor probe;

[0028] According to the present invention, FIG5 is a plan view of an example of a printed circuit board;

[0029] According to the present invention, FIG6 is a partially enlarged side view of an example of the main body of the sensor probe;

[0030] According to the present invention, FIG7 is a circuit diagram and functional block diagram of an example of a control circuit including a temperature sensing integrated circuit, a resistor, and a capacitor.

[0031] According to the present invention, FIG8 is a side view showing an example of attaching a temperature sensing integrated circuit to a printed circuit board;

[0032] According to the present invention, Figures 9A and 9B are side views showing an example of attaching a temperature sensing integrated circuit and a printed circuit board to a metal cover.

[0033] According to the present invention, Figures 10A and 10B are side views showing an example of encapsulating a temperature sensing integrated circuit in a cover.

[0034] According to the present invention, Figures 11A and 11B are side views showing an example of embedding a printed circuit board, a temperature sensing integrated circuit, and a cover into the body of a sensor probe.

[0035] According to the present invention, FIG12 is a side view showing another example of a sensor probe;

[0036] According to the present invention, FIG13 is a side cross-sectional view of another example of a display sensor probe;

[0037] According to the present invention, FIG14 is a side cross-sectional view of a PCB having a metal layer for EMI shielding; and

[0038] According to the present invention, FIG15 is a side cross-sectional view of another example of a display sensor probe.

[0039] In the diagram, component symbols may be reused to distinguish similar and / or identical components.

Claims

1. A substrate support comprising: a plurality of plates including a first plate disposed on a second plate; and at least one sensor probe extending through the second plate and detecting the temperature of the first plate, each of the at least one sensor probe including a housing extending at least partially within the second plate; an elongated body defining an inner cavity and including a first end and a second end, wherein the first end is received within the housing; a printed circuit board disposed within and extending along the inner cavity, and including a first end and a second end, wherein the second end of the printed circuit board is disposed at the second end of the elongated body; and a first temperature sensing integrated circuit mounted at the second end of the printed circuit board.

2. The substrate support of claim 1, wherein the printed circuit board has a width smaller than the inner diameter of the elongated body and a length longer than the elongated body.

3. The substrate support of claim 1, wherein the printed circuit board is flexible and bends at an angle near the first temperature sensing integrated circuit.

4. The substrate support of claim 1 further includes a cover mounted on the second end of the elongated body adjacent to the first temperature sensing integrated circuit.

5. The substrate support of claim 4, wherein the cover includes first and second leads extending from one side of the cover and received within the cavity of the elongated body.

6. The substrate support as described in claim 4, wherein: The first temperature sensing integrated circuit senses the temperature of the surface in contact with the cover; and the surface is a layer within an electrostatic chuck.

7. The substrate support of claim 1, wherein the elongated body includes a protrusion and further includes a spring located around the elongated body and biased between the cavity of the housing and the protrusion.

8. The substrate support of claim 1, wherein the elongated body includes a radial protrusion configured to center the elongated body in the cavity of the second plate.

9. The substrate support as claimed in claim 1, wherein: The elongated body includes a slot for heat transfer; and the slot has an elongated elliptical shape and is arranged in the axial direction of the elongated body.

10. The substrate support of claim 1 further includes a shielding layer disposed on at least one surface of the printed circuit board.

11. The substrate support of claim 1, wherein the housing defines an inclined surface, and the housing further includes an O-ring configured to abut against the inclined surface between the housing and the cavity of the second plate.

12. The substrate support of claim 1 further comprises: a connector connected to the first end of the printed circuit board; and a plurality of wires connected to wirings on the printed circuit board via the connector.

13. The substrate support of claim 1 further includes a second temperature sensing integrated circuit mounted on the printed circuit board between the first temperature sensing integrated circuit and the second end of the printed circuit board.

14. The substrate support as claimed in claim 1, wherein: The surface of the first temperature sensing integrated circuit is mounted on a mounting surface of the printed circuit board; and the surface of the first temperature sensing integrated circuit extends parallel to the mounting surface of the printed circuit board.

15. The substrate support as claimed in claim 1, wherein: The first portion of the surface of the printed circuit board extends from the first end of the elongated body to the second end of the elongated body; The second portion of the surface of the printed circuit board extends perpendicularly to the first portion of the surface of the printed circuit board; and the first temperature sensing integrated circuit is mounted on the second portion of the surface of the printed circuit board.

16. The substrate support of claim 1, wherein the first temperature sensing integrated circuit senses the temperature of the surface in contact with it.

17. The substrate support of claim 16, wherein the surface is the surface of the first plate.

18. The substrate support of claim 1, wherein the second end of the elongated body contacts the first plate.

19. The substrate support of claim 1, wherein the first temperature sensing integrated circuit includes a plurality of solder balls attached to the printed circuit board.

20. The substrate support of claim 1, wherein the first temperature sensing integrated circuit measures the temperature of the second board.

21. The substrate support of claim 1, wherein the housing system is locked into the second plate.

22. The substrate support of claim 1, wherein the housing is mounted on the second plate.

23. The substrate support of claim 1, wherein the housing and the elongated system are configured to be at least partially mounted within the second plate.

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