Vibration isolation layers, measurement systems that include the vibration isolation layers, and related methods

Abstract

This document discloses a vibration isolation layer, a measurement system including the vibration isolation layer, and related methods. The vibration isolation layer includes: a platform; and a plurality of vibration isolation mechanisms positioned to support the platform relative to a mounting area supporting the vibration isolation layer. The platform may define a recess configured to support an upper surface of a support assembly including at least one of a probe station and a loader. The platform may define a recess sized to receive at least one area of ​​the probe station and / or the loader. The recess may extend into the platform. The plurality of vibration isolation mechanisms may be positioned to support the platform relative to a mounting area supporting the vibration isolation layer, and / or may be configured to allow relative movement between the platform and the mounting area to provide vibration isolation between the platform and the mounting area.

Description

[Technical Field]

[0001] This disclosure generally relates to vibration isolation layers, measurement systems containing vibration isolation layers, and related methods. [Previous Technology]

[0002] Conventional probe stations can be used to test devices under test (DUTs) in the form of optical and / or optoelectronic devices. These conventional probe stations typically include one or more optical probes. Consistent, repeatable, and / or continuous alignment between the one or more optical probes and the DUT is important, and variations in alignment can lead to variations in test results. Vibrations originating outside the conventional probe station and existing within the test environment where the conventional probe station is mounted can cause misalignment and / or relative movement between the one or more optical probes and the DUT, thereby degrading test quality. Therefore, a measurement system incorporating a vibration isolation layer is required. [Summary of the Invention]

[0003] This document discloses a vibration isolation layer, a measurement system including the vibration isolation layer, and related methods. The vibration isolation layer includes: a platform; and a plurality of vibration isolation mechanisms positioned to support the platform relative to a mounting area supporting the vibration isolation layer. The platform may define a groove configured to support an upper surface of a support assembly, the support assembly including at least one of a probe station and a loader. The platform may define a recess sized to receive at least one area of ​​the probe station and / or the loader. The recess may extend into the platform. The plurality of vibration isolation mechanisms may be positioned to support the platform relative to a mounting area supporting the vibration isolation layer, and / or may be configured to allow relative movement between the platform and the mounting area to provide vibration isolation between the platform and the mounting area.

[0004] The measurement system includes a vibration isolation layer and a support assembly. The support assembly can be supported by an upper surface of a platform. The support assembly may include: a measurement layer configured to test a device under test (DUT) formed on a substrate; and / or an optical measurement layer configured to perform optical testing on the DUT. The optical measurement layer may include an optical measurement layer controller, which is programmed to control the operation of the optical measurement layer and / or the operation of the vibration isolation layer.

[0005] This method includes a method of mounting a measurement system configured to test a device under test (DUT) formed on a substrate, and includes: positioning a vibration isolation layer; positioning a support assembly; vibration isolation of the support assembly; and controlling the operation of the vibration isolation layer. Positioning the vibration isolation layer may include positioning it within a mounting area. Positioning the support assembly may include positioning the support assembly on an upper surface of a platform of the vibration isolation layer. The support assembly may include a probe station and / or an optical measurement layer configured for optical communication with the DUT. The optical measurement layer may include an optical measurement layer controller. Vibration isolation may include vibration isolation of the support assembly from the mounting area via the vibration isolation layer. Control may include controlling the operation of the vibration isolation layer using the optical measurement layer controller.

Implementation Method

[0007] Figures 1 to 4 provide examples of a measurement system 20 according to this disclosure, examples of environmental vibrations experienced by the measurement system 20, examples of vibration damping achievable using the measurement system 20, and examples of a method 200 for mounting the measurement system 20. In each of Figures 1 to 4, elements serving similar or at least substantially similar purposes are labeled with the same numbers, and such elements may not be discussed in detail herein with reference to each of Figures 1 to 4. Similarly, not all elements may be labeled in each of Figures 1 to 4, but element symbols associated with the elements may be used herein for consistency. Elements, components, and / or features discussed herein with reference to one or more of Figures 1 to 4 may be included in any of Figures 1 to 4 and / or used together with any of Figures 1 to 4 without departing from the scope of this disclosure.

[0008] Generally, elements that are likely to be included in a particular specific instance are drawn with solid lines, while elements that are selected as needed may be drawn with dashed lines. However, elements shown with solid lines may not be necessary for all specific instances, and in some specific instances, they may be omitted without departing from the scope of this disclosure.

[0009] Figure 1 is a schematic illustration of an example of the measurement system 20 according to the present disclosure. The measurement system 20 may be positioned and / or installed within a test environment 10, such as a manufacturing plant, wafer fabrication plant, laboratory, and / or cleanroom. In a particular example, the measurement system 20 may be supported by, supported on, positioned on, and / or operatively attached to a mounting area 12 of the test environment, such as the ground.

[0010] The measurement system 20 includes a vibration isolation layer 60, which includes a platform 64 and a vibration isolation mechanism 70, or a plurality of vibration isolation mechanisms 70, examples of which are disclosed herein. The measurement system 20 also includes a support assembly 26, such as a platform supported by the vibration isolation mechanism. The support assembly 26 includes a probe station 30, a measurement layer 40, a loader 96, and / or a translation assembly 98.

[0011] The probe station 30 includes a support surface 92 configured to support the substrate 102. This may include support of the substrate relative to and / or with respect to the measurement layer. The probe station 30 may include any suitable structure that can be adapted, configured, designed, and / or constructed to support the substrate 102 and / or define the support surface 92. As an example, the probe station 30 may include a clamp 90 defining the support surface. Examples of clamps include thermal clamps, temperature-controlled clamps, vacuum clamps, and / or electrically shielded clamps.

[0012] The measurement layer 40 is configured to test the device under test (DUT) 104, examples of which include electronic devices, optical devices and / or optoelectronic devices. The DUT 104 may be formed on the substrate 102, examples of which include wafers, semiconductor wafers, silicon wafers and / or III-V group semiconductor wafers.

[0013] Measurement layer 40 can be configured to test DUT 104 in any suitable manner. As an example, measurement layer 40 may include an electrical measurement layer 42, which can be configured to perform electrical tests on DUT 104. Electrical measurement layer 42 may include a plurality of electrical probes 44, which can be configured to contact, electrically contact, or physically and electrically contact corresponding contact pads 106 of DUT 104 to perform electrical tests on DUT. When measurement layer 40 includes electrical measurement layer 42, probe station 30 and / or its electrical measurement layer 42 may include an electrical signal generation and analysis assembly 46. The electrical signal generation and analysis assembly can be configured to provide electrical test signals to DUT via the plurality of electrical probes 44, and / or receive electrical composite signals from DUT via the plurality of electrical probes. Examples of electrical signal generation and analysis assemblies include current sources, voltage sources, function generators, voltmeters, ammeters, and / or impedance analyzers.

[0014] As discussed in more detail herein, the various components of the measurement system 20 may be manufactured and / or supplied by different manufacturers and / or suppliers. In view of this, and in some instances, the electrical measurement layer 42 may form part of the probe station 30, may be integrated with the probe station 30, may be manufactured by the same manufacturer as the probe station 30, and / or may be supplied by the same supplier as the probe station 30.

[0015] As another example, measurement layer 40 may include an optical measurement layer 50, which can be configured to perform optical testing on DUT 104. Optical measurement layer 50 may include a plurality of optical probes 52, which can be configured for optical communication or non-contact optical communication with the DUT (such as with one or more optical devices 108 of the DUT). When measurement layer 40 includes optical measurement layer 50, probe station 30 and / or its optical measurement layer 50 may include an optical signal generation and analysis assembly 54. The optical signal generation and analysis assembly can be configured to provide optical test signals to the DUT via the plurality of optical probes 52, and / or receive optically synthesized signals from the DUT via the plurality of optical probes. Examples of the optical signal generation and analysis assembly include electromagnetic radiation sources, light sources, lasers, and / or electromagnetic radiation detectors.

[0016] In some instances, the optical measurement layer 50 may include an optical microscope 56. The optical microscope may be configured to collect optical images of at least one of a plurality of optical probes 52 and / or optical images of at least one region of the DUT 104 (such as the optical device 108 of the DUT). Such configuration may allow and / or facilitate optical alignment between the plurality of optical probes and the DUT.

[0017] When the measurement system 20 includes an optical measurement layer 50, the vibration isolation layer 60 can be configured to provide vibration isolation between the platform 64 and the mounting area 12, providing a vibration isolation amount based at least in part on one of the target maximum values ​​of vibrational motion between the plurality of optical probes 52 and the DUT 104 and / or its optical devices 108. In other words, the alignment between the optical measurement layer 50 and / or the optical probes 52 and the DUT 104 can be sensitive, or relatively more sensitive, compared to the electrical measurement layer 42 and / or the alignment between the electrical probes 44 and the DUT. With this in mind, specifically and / or intentionally, the vibration isolation layer 60 can be configured to provide vibration isolation sufficient to allow consistent, reliable, accurate, and / or precise operation of the optical measurement layer 50 within the measurement system 20.

[0018] This can be achieved in any suitable manner. As an example and as discussed, various components of the measurement system 20 may be manufactured and / or supplied by different manufacturers and / or suppliers. In some of these examples, the optical measurement layer 50 may comprise and / or be a modular optical measurement layer that may be manufactured by a first manufacturer. The first manufacturer may be a different manufacturer from a second manufacturer of one or more other components of the measurement system 20 (such as the probe station 30 and / or the electrical measurement layer 42). Alternatively or additionally, the optical measurement layer 50 may be supplied by a first supplier, which may be a different supplier from a second supplier of one or more other components of the measurement system 20 (such as the probe station 30 and / or the electrical measurement layer 42). Alternatively or additionally, the optical measurement layer 50 may be operatively attached to the probe station 30 and / or configured to be repeatedly attached to and separated from the probe station. In some of these examples, the vibration isolation layer 60 may be supplied by the same manufacturer and / or supplier as the optical measurement layer 50 (such as the first supplier). Therefore, the properties and / or characteristics of the vibration isolation layer 60 can be specifically configured based on the required vibration isolation of the optical measurement layer. In other words, the vibration isolation layer 60 can be configured to promote efficient and / or effective operation of the optical measurement layer 50, such as by providing the measurement system 20 with a target, desired, and / or required vibration isolation level based on the maximum relative motion between the optical measurement layer 50, the optical device 108, and / or the optical measurement layer and the optical device, thereby providing the required measurement resolution and / or signal-to-noise ratio for optical measurements performed using the optical measurement layer.

[0019] In some instances, the optical measurement layer 50 may include an optical measurement layer controller 58. The optical measurement layer controller may be programmed to control the operation of the optical measurement layer, such as the operation of the optical probe 52, the optical signal generation and analysis assembly 54, and / or the optical microscope 56. As discussed in more detail herein, the optical measurement layer controller 58 may also be configured to control the operation of the vibration isolation layer 60 and / or one or more of its components to provide the desired vibration isolation for the optical measurement layer.

[0020] The loader 96 is configured to receive a cassette 100 containing a plurality of substrates 102. Each substrate 102 contains a corresponding plurality of DUTs 104. The loader 96 may also be configured to move a selected substrate among the plurality of substrates between the cassette and the probe station to facilitate testing of one or more DUTs formed on the selected substrate by the probe station. In a particular embodiment, the loader may be configured to remove the selected substrate from the cassette and position the selected substrate on the support surface 92 of the probe station. Alternatively or additionally, the loader may be configured to remove the selected substrate from the support surface of the probe station and position the selected substrate within the cassette. Examples of the loader 96 include a docking station, a robotic arm, and / or a transfer robot for the cassette 100.

[0021] The translation assembly 98 is configured to move the support surface 92 and the measurement layer 40 relative to each other to allow and / or facilitate alignment between the measurement layer and the DUT 104. This may include moving the support surface relative to the measurement layer and / or moving the measurement layer relative to the support surface. In some instances, the translation assembly 98 may additionally or alternatively be configured to move the electrical measurement layer 42 and the optical measurement layer 50 relative to each other, and / or allow, facilitate, and / or provide independent movement of the electrical measurement layer and the optical measurement layer. Such configuration may allow and / or facilitate independent alignment between the electrical probe 44 and the DUT, and between the optical probe 52 and the DUT. Examples of the translation assembly 98 include actuators, linear actuators, oscillating drives, manual actuators, and / or electric actuators.

[0022] As discussed and illustrated in Figure 2, vibrations may be present within the test environment 10. Also illustrated in Figure 2, such vibrations may have and / or exhibit characteristic frequencies, such as those based on, responding to, and / or caused by: the configuration of the test environment 10 and / or hardware, equipment, and / or machinery located within, near, and / or mechanically connected to the test environment 10. Such vibrations can adversely affect the testing performed on the DUT 104 by the measurement system 20.

[0023] As an example, such vibrations can cause relative movement and / or at least partial misalignment between the optical probe 52 and the optical device 108 of the DUT 104 and / or between the electrical probe 44 and the contact pad 106 of the DUT. In some instances, this misalignment can be sufficient to make it difficult or even impossible for the measurement system 20 to test the DUT 104, and / or make it difficult or even impossible for the measurement system to test the DUT with the desired accuracy, precision, and / or signal-to-noise ratio. In some instances, this misalignment can introduce additional noise into the tests performed on the DUT 104 by the measurement system 20. It may be necessary to reduce, minimize, and / or eliminate relative movement and / or vibration within the measurement system 20, between the various components of the measurement system 20, and / or between one or more components of the measurement layer 40 and the support surface 92 and / or the DUT 104 supported by the support surface.

[0024] Considering the foregoing, the vibration isolation layer 60 can be configured to reduce the transfer and / or transmission of vibration from the test environment 10 to the support assembly 26 of the measurement system 20 and / or within the support assembly 26 of the measurement system 20. In other words, the vibration isolation layer 60 can be configured to reduce, minimize, and / or eliminate relative motion and / or vibration originating from within the test environment 10 and outside the measurement system 20, within the measurement system 20, between various components of the measurement system 20, within the support assembly 26, between one or more components of the measurement layer 40 and the support surface 92, and / or between one or more components of the optical measurement layer 50 and the DUT 104 supported by the support surface. The vibration isolation layer 60 may also be referred to herein as and / or may be a vibration isolation plate, a vibration isolation assembly, and / or a vibration isolation structure. Figure 3 is a diagram illustrating an example of vibration damping achieved by the vibration isolation mechanism 70 of the vibration isolation layer 60 of the measurement system 20 according to this disclosure.

[0025] This vibration damping can be achieved in any suitable manner. As an example and as discussed, the vibration isolation layer 60 includes a platform 64 defining an upper surface 66. The support assembly 26 can be supported by the platform 64, can be supported by the upper surface 66, can be positioned on the platform 64, can be positioned on the upper surface 66, can be operatively attached to the platform 64, and / or operatively attached to the upper surface 66. The platform 64 can be relatively large and / or numerous, thereby reducing the likelihood of its vibration. As an example, the platform 64 can define a platform thickness 67 of at least 100 mm, at least 120 mm, at least 140 mm, at least 160 mm, at least 180 mm, at least 200 mm, up to 400 mm, up to 350 mm, up to 300 mm, up to 250 mm, up to 200 mm, and / or up to 150 mm.

[0026] As an additional example, platform 64 may be formed and / or defined by a dense material, examples of which include metals, steel, stainless steel, lead, stone, mineral glass, and / or granite. As an additional example, platform 64 may be formed and / or defined by a platform material having the following densities: at least 2 g / cc, at least 2.5 g / cc, at least 3 g / cc, at least 4 g / cc, at least 5 g / cc, at least 6 g / cc, at least 7 g / cc, at least 8 g / cc, at least 9 g / cc, at least 10 g / cc, at least 11 g / cc, at least 12 g / cc, up to 16 g / cc, up to 14 g / cc, up to 12 g / cc, up to 10 g / cc, up to 8 g / cc, up to 6 g / cc, and / or up to 4 g / cc.

[0027] As an additional example, platform 64 may be formed and / or defined by platform material that does not propagate vibration or dampens vibration. Examples of platform materials include undamped oscillating materials, self-damped materials, and / or vibration-damped materials.

[0028] The vibration isolation layer 60 also includes at least one vibration isolation mechanism 70. Examples of the vibration isolation mechanism 70 include: a passive vibration isolator, a passive air vibration isolator, a passive elastic gas containment volume configured to be inflated to isolate the platform from the installation area, and / or a passive air vibration isolation spring. Further examples of the vibration isolation mechanism 70 include: an active control vibration isolator, an active control air vibration isolator, an active air vibration isolation spring, and / or an active control elastic gas containment volume configured to be selectively inflated to isolate the platform from the installation area.

[0029] In some instances, the vibration isolation layer 60 may include a pressure regulating structure 76, which can be configured to regulate the internal air pressure within the vibration isolation mechanism 70. When the vibration isolation mechanism 70 includes passive and / or active air vibration isolation springs, the vibration isolation layer 60 may also be referred to herein as and / or may be an air spring vibration isolation layer 62. Examples of the pressure regulating structure 76 include pressure regulators, passive pressure regulators, active control pressure regulators, valves, diaphragms, and / or pressure sensors.

[0030] As used herein, the term "passive" in describing components such as the measurement system 20 and / or the vibration isolation layer 60 refers to a component that performs a specified function without control and / or regulation. In other words, the term "passive" means a component that performs a specified function based on or solely on one or more inherent properties of the component. As an example, a passive elastic gas containment volume can passively provide vibration isolation by allowing relative movement between two components interconnected via the passive elastic gas containment volume.

[0031] Conversely, and as used herein, the terms "active" and / or "actively" when used to describe control strategies, regulation strategies, and / or components such as the measurement system 20 and / or vibration isolation layer 60 refer to components that perform a specified function using one or more sensors, controllers, and / or actuators. In other words, the terms "active" and / or "actively" refer to components that perform a specified function at least in part based on detection by one or more corresponding sensors, action by one or more corresponding actuators, and / or orientation by one or more corresponding controllers. As an example, the gas pressure within an actively controlled elastic gas containment volume can be controlled and / or regulated to provide vibration isolation and / or increase or improve vibration isolation when compared to a passive elastic gas containment volume.

[0032] The vibration isolation mechanism 70 can support the platform 64 relative to the mounting area 12, thereby allowing relative movement between the platform and the mounting area. Therefore, the vibration isolation mechanism 70 can reduce the possibility of vibration being transferred from the test environment 10 via the mounting area 12 and reaching and / or entering the probe station 30.

[0033] In some instances, and as discussed, the vibration isolation mechanism 70 may be passive. In other instances, and also as discussed, the vibration isolation mechanism may be active, actively controlled, and / or actively adjustable. In a particular instance, the optical measurement layer controller 58 may at least partially control the operation of the vibration isolation mechanism 70. In a more particular instance, the optical measurement layer controller 58 may be programmed to control and / or adjust the height of the platform 64 by controlling and / or adjusting the height of the vibration isolation mechanism 70. Such a configuration may permit and / or facilitate the loading of the modified cartridge 100 onto the loader 96 and subsequent testing of the DUT 104 by the probe station 30.

[0034] As an example, when the cartridge 100 is positioned on and / or removed from the loader 96, the optical measurement layer controller 58 lowers the platform 64 to a lower height limit and / or lowers the platform 64 against the lower height stop 78. This may include moving the platform or the upper surface 66 of the platform in a downward direction, as specified at 82 in FIG1. ​​Such a configuration can define a fixed and / or predetermined height for the platform 64 and / or the upper surface 66, and / or reduce the possibility of misalignment between the cartridge and the means used to position the cartridge relative to the loader.

[0035] As another example, after the cartridge is positioned on the loader, the optical measurement layer controller 58 can raise the platform 64 to a vibration isolation height. This may include moving the platform or upper surface 66 in an upward direction, as specified at 84 in Figure 1. The vibration isolation height may be the height at which the platform effectively or most effectively isolates the probe station 30 from vibration within the test environment 10.

[0036] As another example, the optical measurement layer controller 58 can be programmed to detect vibrations within the vibration isolation layer 60, within the platform 64, between the platform 64 and the mounting area 12, between the optical probe 52 and the optical device 108, and / or within the optical measurement layer 50. In such a configuration, the optical measurement controller can also or alternatively be programmed to control the operation of the vibration isolation layer 60 based at least in part on the detected vibrations. Vibration can be detected in any suitable manner. As an example, vibration detector 86 can be used to detect vibrations. As another example, vibration can be detected as variations and / or noise in the optical signal transmitted between the optical probe 52 and the optical device 108. Examples of vibration detector 86 include accelerometers, velocity sensors, displacement sensors, and / or piezoelectric sensors.

[0037] As shown by the dashed line in Figure 1, the vibration isolation layer 60 may include an energy dissipation mechanism 80. The energy dissipation mechanism 80 may be configured to dissipate and / or attenuate energy, such as mechanical energy, within the vibration isolation layer and / or between the platform 64 and the mounting area 12. Such a configuration can further reduce motion, harmonic motion, and / or relative low-frequency motion between the platform and the mounting area. As an example, the presence of the energy dissipation mechanism 80 can reduce the relative motion between the probe station and / or the platform and the mounting area in the range of several hertz to tens of hertz. Examples of the energy dissipation mechanism 80 include one or more flexible sliding plates, liquid dampers, gas dampers, and / or shock absorbers.

[0038] As shown by the dashed line in Figure 1, the vibration isolation layer 60 may include and / or define a base 68. The base 68 may be shaped, sized, and / or constructed to lower and / or reduce the center of gravity or overall center of gravity of the probe stage 30 and / or the measurement system 20. Such a configuration can further reduce the possibility of motion, relative motion, and / or harmonic motion between the probe stage and / or platform and the mounting area.

[0039] This can be achieved in any suitable manner. As an example, platform 64 may define a recess 65 that extends into the platform and / or defines at least one area of ​​the upper surface 66. As an example, recess 65 may extend into the platform to a critical percentage of platform thickness 67. Examples of critical percentages of platform thickness 67 include at least 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, at least 70%, up to 90%, up to 80%, up to 70%, up to 60%, up to 50%, and / or up to 40%.

[0040] In this configuration, the probe station 30 and / or loader 96 can be at least partially housed in the recess 65. As another example, a plurality of vibration isolation mechanisms 70 can be positioned outside the area occupied by the support assembly 26, the probe station 30, and / or the loader 96. In other words, the vibration isolation mechanisms 70 can be positioned outside the vertical projection of the support assembly, the probe station, and / or the loader onto the mounting area. This configuration allows and / or facilitates the use of relatively tall vibration isolation mechanisms 70 without proportionally increasing the height of the probe station and / or loader. Additionally or alternatively, this configuration can improve the stability of the platform 64 and / or reduce the natural frequency of platform movement.

[0041] As another example, the support assembly 26 or the combination of the support assembly 26 and the platform 64 may define the center of gravity 28, and the spacing 72 between the plurality of vibration isolation mechanisms 70 may be at least a multiple of a threshold value of the height 29 of the center of gravity. Examples of multiples of threshold values ​​include at least 1.5, at least 1.6, at least 1.7, at least 1.8, at least 1.9, at least 2, at least 2.2, at least 2.4, at least 2.6, at least 2.8, at least 3, up to 4, up to 3.8, up to 3.6, up to 3.4, up to 3.2, up to 3, up to 2.8, up to 2.6, up to 2.4, up to 2.2 and / or up to 2. Examples of spacing 72 include the distance between a plurality of vibration isolation mechanisms measured in a plane parallel to the upper surface 66 of platform 64, the average distance between a plurality of vibration isolation mechanisms measured in the plane, and / or the minimum distance between the two closest vibration isolation mechanisms measured in the plane.

[0042] In conventional probe stations, vibration isolation can be provided via relatively larger, more complex, and / or heavier conventional vibration isolation structures. These conventional vibration isolation structures are typically constructed on the ground floor of a building and include a drilled hole typically about one meter deep. This hole is filled with rubber and sealed with a thick granite block, also about one meter thick. While effective in some cases, constructing such conventional vibration isolation structures is expensive and time-consuming. Furthermore, the installation of conventional vibration isolation structures is usually limited to the ground floor, and their size and extent typically make retrofitting such conventional vibration isolation structures into existing facilities prohibitively costly.

[0043] In contrast, the vibration isolation layer 60 according to this disclosure can be economically located and / or utilized within existing facilities and / or on existing installation areas. In this regard, the installation area 12 according to this disclosure can be a flat and / or planar installation area, and / or can be located on the ground other than the bottom layer of the facility. Alternatively or additionally, the installation area 12 may have no or may not include a below-grade recess or hole, which is vertically located below the remainder of the bottom surface, vertically located below the vibration isolation layer, and / or at least partially accommodates and / or houses the vibration isolation layer.

[0044] Figure 4 is a flowchart depicting an example of a method 200 for installing a measurement system according to the present disclosure, the measurement system being configured to test a device under test (DUT) formed on a substrate. Examples of measurement systems and / or their components are disclosed herein with reference to measurement system 20. Method 200 may include obtaining system components at 210, and method 200 includes positioning a vibration isolation layer at 220 and positioning a support assembly at 230. Method 200 also includes vibration isolation of the support assembly at 240, and may include controlling the operation of the vibration isolation layer at 250.

[0045] Obtaining the system components at 210 may include obtaining one or more system components of the measurement system in any suitable manner. As an example, and as discussed in more detail herein, the support assembly may include an optical measurement layer that can be configured for optical communication and / or non-contact optical communication with the DUT. In such examples, obtaining at 210 may include obtaining the optical measurement layer and vibration isolation layer from the same manufacturer and / or from the same supplier. Alternatively or additionally, obtaining at 210 may include obtaining the optical measurement layer and vibration isolation layer from a first manufacturer and / or from a first supplier. In some of these examples, obtaining at 210 may also include obtaining one or more other components of the support assembly, such as probe stations and / or electrical measurement layers, from a second manufacturer and / or from a second supplier different from the first supplier.

[0046] This document discloses an example of a support assembly with reference to support assembly 26. This document discloses an example of an optical measurement layer with reference to optical measurement layer 50. This document discloses an example of a DUT with reference to DUT 104. This document discloses an example of a vibration isolation layer with reference to vibration isolation layer 60. This document discloses an example of a probe station with reference to probe station 30. This document discloses an example of an electrical measurement layer with reference to electrical measurement layer 42.

[0047] Positioning the vibration isolation layer at 220 may include positioning the vibration isolation layer within the installation area. The vibration isolation layer includes a platform and is configured to provide vibration isolation between the platform and the installation area. This document refers to installation area 12 to disclose an example of an installation area. This document refers to platform 64 to disclose an example of a platform.

[0048] Positioning at 220 can be performed in any suitable manner. As an example, positioning at 220 may include positioning the vibration isolation layer on an existing mounting area to adapt the existing mounting area for use with the measurement system. In some of these examples, the existing mounting area may be planar or at least substantially planar. In some examples, the existing mounting area may not have and / or may not include an undermount recess extending vertically below the bottom surface surrounding the existing mounting area. In other words, and as discussed in more detail herein, method 200 may include mounting the measurement system without excavating and / or otherwise forming holes, without filling the holes with an elastic material such as rubber, and / or without positioning granite blocks within the holes. In other words, positioning at 220 may include positioning the vibration isolation layer on or at the level of the bottom surface, directly on it, above it, and / or entirely above it.

[0049] Positioning the support assembly at 230 may include positioning the support assembly on an upper surface of the platform. Examples of upper surfaces are disclosed herein with reference to upper surface 66. Positioning at 230 may include positioning any suitable components and / or subsets of the support assembly individually or as a unit on the platform, as is the scope of this disclosure.

[0050] Vibration isolation of the support assembly at 240 may include vibration isolation of the support assembly from the mounting area via a vibration isolation layer. This may include absorbing vibrations propagating through the mounting area using one or more vibration isolation mechanisms within the vibration isolation layer. Alternatively or concurrently, vibration isolation at 240 may include absorbing and / or dissipating vibrational energy, such as via an energy dissipation mechanism within the vibration isolation layer. Examples of vibration isolation mechanisms and energy dissipation mechanisms are disclosed herein with reference to vibration isolation mechanism 70 and energy dissipation mechanism 80, respectively.

[0051] Controlling the operation of the vibration isolation layer at 250 may include controlling the operation of the vibration isolation layer in any suitable manner. As an example, and as discussed, the support assembly may include an optical measurement layer. In some such examples, the optical measurement layer may include an optical measurement layer controller, which may be programmed to control the operation of one or more components of the optical measurement layer. In some such examples, the optical measurement layer controller may also be programmed to control the operation of the vibration isolation layer. As an example, and as discussed in more detail herein, the vibration isolation layer may include one or more actively controlled vibration isolators, and control at 250 may include controlling the operation of one or more actively controlled vibration isolators using the optical measurement layer controller. Such a configuration may permit and / or facilitate vibration isolation between the optical measurement layer and the mounting area, which is based on the optical measurement layer and / or sufficient for consistent and / or reliable operation of the optical measurement layer.

[0052] As used herein, the term “and / or” placed between the first entity and the second entity means one of the following: (1) the first entity, (2) the second entity, and (3) the first entity and the second entity. Multiple entities listed using “and / or” shall be interpreted in the same manner, i.e., “one or more” entities thus combined. Other entities may exist, whether related to or unrelated to those specifically identified by the “and / or” clause, as needed. Thus, as a non-limiting example, the reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising”, may: in one specific instance, mean only A (including entities other than B as needed); in another specific instance, mean only B (including entities other than A as needed); and in yet another specific instance, mean both A and B (including other entities as needed). These entities can refer to components, actions, structures, steps, operations, values, etc.

[0053] As used herein, the phrase "at least one" referring to a list of one or more entities should be understood to mean at least one entity selected from any one or more entities in the list of entities, but does not necessarily include at least one of each entity specifically listed in the list of entities, and does not exclude any combination of entities in the list of entities. This definition also allows for the existence of entities other than those specifically identified in the list of entities referred to by the phrase "at least one," whether related to or not related to those specifically identified entities. Therefore, as a non-restrictive example, "at least one of A and B" (or equivalently, "at least one of A or B", or equivalently, "at least one of A and / or B") can: in one specific instance, mean at least one (or more than one if necessary) A, without B (and, if necessary, include entities other than B); in another specific instance, mean at least one (or more than one if necessary) B, without A (and, if necessary, include entities other than A); and in yet another specific instance, mean at least one (or more than one if necessary) A and at least one (or more than one if necessary) B (and, if necessary, include other entities). In other words, the phrases "at least one", "one or more", and "and / or" are open-ended expressions that can function as both conjunctions and antonymous conjunctions in practice. For example, each of the following expressions, such as "at least one of A, B and C", "at least one of A, B or C", "one or more of A, B and C", "one or more of A, B or C" and "A, B and / or C", may mean only A, only B, only C, A and B together, A and C together, B and C together, A, B and C together, and, as needed, any of the above combined with at least one other entity.

[0054] Where any patent, patent application or other reference is incorporated herein by reference and (1) defines a term in a manner that is inconsistent with and / or (2) otherwise inconsistent with the non-incorporated portion of this disclosure or any other incorporated reference, the non-incorporated portion of this disclosure shall control the terminology therein or the incorporated disclosure shall be controlled only with respect to the references defining the terminology and / or the original presentation of the incorporated disclosure.

[0055] As used herein, the terms “adapted” and “configured” mean that an element, component, or other subject is designed and / or intended to perform a given function. Therefore, the use of the terms “adapted” and “configured” should not be construed as meaning that a given element, component, or other subject is simply “capable” of performing a given function, but rather that the element, component, and / or other subject is specifically selected, generated, implemented, utilized, programmed, and / or designed for the purpose of performing the function. Elements, components, and / or other described subjects described as adapted to perform a particular function may also be described, or alternatively, as configured to perform that function, and vice versa, within the scope of this disclosure.

[0056] As used herein, the phrases “for example,” “as an example,” and / or the abbreviated term “example,” when used in conjunction with reference to one or more components, features, details, structures, specific instances, and / or methods according to this disclosure, are intended to convey that the described components, features, details, structures, specific instances, and / or methods are illustrative, non-exclusive examples of the components, features, details, structures, specific instances, and / or methods according to this disclosure. Therefore, the described components, features, details, structures, specific instances, and / or methods are not intended to be restrictive, essential, or exclusive / exhaustive; and other components, features, details, structures, specific instances, and / or methods (including structurally and / or functionally similar and / or equivalent components, features, details, structures, specific instances, and / or methods) are also within the scope of this disclosure.

[0057] As used herein, when modifying degree or relation, "at least substantially" may include not only the stated "substantial" degree or relation, but also the entire range of the stated degree or relation. The substantiality of the stated degree or relation may include at least 75% of the stated degree or relation. For example, an object formed at least substantially of a material includes an object formed at least 75% of the object by that material, and also includes an object formed entirely of that material. As another example, a first length that is at least substantially the same as a second length includes a first length within 75% of the second length, and also includes a first length that is the same as the second length.

[0058] Illustrative, non-exclusive examples of vibration isolation layers, measurement systems, and methods according to this disclosure are presented in the following paragraphs. Individual steps of the methods described herein (included in the following paragraphs) may also be referred to as “steps” “for” performing the described actions, within the scope of this disclosure.

[0059] A1. A vibration isolation layer for a measurement system, the vibration isolation layer comprising: a platform defining an upper surface configured to support a support assembly including at least one of a probe station of the measurement system and a loader of the measurement system, and both if necessary; and a vibration isolation mechanism, or a plurality of vibration isolation mechanisms, positioned relative to a mounting area supporting the vibration isolation layer to support the platform, wherein the vibration isolation mechanism is configured to allow relative movement between the platform and the mounting area to provide vibration isolation between the platform and the mounting area.

[0060] A2. Vibration isolation layer as in paragraph A1, wherein the platform defines a recess sized to receive at least one area of ​​at least one of the probe station and the loader.

[0061] A2.1. The vibration isolation layer as described in paragraph A2, wherein the groove extends into the platform to a critical percentage of the platform thickness, wherein, if necessary, the critical percentage is at least one of the following: (i) at least 10%, at least 20%, at least 30%, at least 40%, at least 50%, at least 60%, or at least 70%; and (ii) at most 90%, at most 80%, at most 70%, at most 60%, at most 50%, or at most 40%.

[0062] A3. Vibration isolation layer as described in any of paragraphs A1 to A2.1, wherein the platform defines the platform thickness or average platform thickness, which is at least one of the following: (i) at least 100 mm, at least 120 mm, at least 140 mm, at least 160 mm, at least 180 mm or at least 200 mm, and (ii) at most 400 mm, at most 350 mm, at most 300 mm, at most 250 mm, at most 200 mm or at most 150 mm.

[0063] A4. The vibration isolation layer as described in any of paragraphs A1 to A3, wherein the platform is at least partially or even entirely formed of a platform material, wherein, if necessary, the platform material includes at least one of metal, steel, stainless steel, lead, stone, mineral glass and granite.

[0064] A5. The vibration isolation layer as described in paragraph A4, wherein the platform material defines the platform material density, which is at least one of the following: (i) at least 2 g / cc, at least 2.5 g / cc, at least 3 g / cc, at least 4 g / cc, at least 5 g / cc, at least 6 g / cc, at least 7 g / cc, at least 8 g / cc, at least 9 g / cc, at least 10 g / cc, at least 11 g / cc or at least 12 g / cc; and (ii) at most 16 g / cc, at most 14 g / cc, at most 12 g / cc, at most 10 g / cc, at most 8 g / cc, at most 6 g / cc or at most 4 g / cc.

[0065] A6. The vibration isolation layer as described in any of paragraphs A4 to A5, wherein the platform material is at least one of undamped oscillation material, self-damped material and / or vibration damping material.

[0066] A7. The vibration isolation layer as described in any of paragraphs A1 to A6, wherein the vibration isolation mechanism comprises at least one of the following: a passive vibration isolator, a passive air vibration isolator, a passive air vibration isolation spring, and a passive elastic gas containment volume configured to be inflated to provide vibration isolation between the platform and the installation area.

[0067] A8. A vibration isolation layer as described in any of paragraphs A1 to A7, wherein the vibration isolation mechanism comprises at least one of the following: an active control vibration isolator, an active control air vibration isolator, and an active control elastic gas containment volume configured to be selectively inflated to isolate the platform from the installation area from vibration.

[0068] A9. The vibration isolation layer as described in paragraph A8, wherein the vibration isolation layer further includes a pressure regulating structure configured to regulate the internal pressure within the vibration isolation mechanism.

[0069] A10. A vibration isolation layer as described in any of paragraphs A1 to A9, wherein the vibration isolation layer comprises a plurality of vibration isolation mechanisms, and wherein each of the plurality of vibration isolation mechanisms is located in at least one of the following situations: (i) located outside the area occupied by the support assembly; and (ii) located outside the vertical projection of the support assembly onto the mounting area.

[0070] A11. A vibration isolation layer as described in any of paragraphs A1 to A10, wherein the vibration isolation layer comprises a plurality of vibration isolation mechanisms, wherein the plurality of vibration isolation mechanisms define a spacing, wherein the support assembly defines a center of gravity, and wherein the spacing is at least a multiple of a threshold spacing of the height of the center of gravity.

[0071] A12. The vibration isolation layer as described in paragraph A11, wherein the threshold spacing multiple is at least one of the following: (i) at least 1.5, at least 1.6, at least 1.7, at least 1.8, at least 1.9, at least 2, at least 2.2, at least 2.4, at least 2.6, at least 2.8 or at least 3; and (ii) at most 4, at most 3.8, at most 3.6, at most 3.4, at most 3.2, at most 3, at most 2.8, at most 2.6, at most 2.4, at most 2.2 or at most 2.

[0072] A13. A vibration isolation layer as described in any of paragraphs A11 to A12, wherein the spacing includes at least one of the following: (i) the distance between a plurality of vibration isolation mechanisms measured in a plane parallel to the upper surface of the platform; and (ii) the average distance between a plurality of vibration isolation mechanisms measured in a plane parallel to the upper surface of the platform.

[0073] A14. The vibration isolation layer as described in any of paragraphs A11 to A13, wherein the support assembly further comprises at least one of a platform, a measuring layer and a translation assembly.

[0074] A15. A vibration isolation layer as described in any of paragraphs A1 to A14, wherein the vibration isolation layer further includes an energy dissipation mechanism configured to perform at least one of the following: (i) dissipating mechanical energy between the platform and the mounting area; and (ii) attenuating mechanical movement between the platform and the mounting area.

[0075] A16. The vibration isolation layer as described in paragraph A15, wherein the energy dissipation mechanism comprises at least one of a flexible sliding plate, a plurality of flexible sliding plates, a liquid damper, a gas damper, and a shock absorber.

[0076] A17. The vibration isolation layer as described in any of paragraphs A1 to A16, wherein the vibration isolation layer further includes a base that supports the vibration isolation mechanism relative to the installation area.

[0077] A18. The vibration isolation layer as described in paragraph A17, wherein the vibration isolation layer comprises a plurality of vibration isolation mechanisms, and wherein a base supports the plurality of vibration isolation mechanisms outside the area occupied by one of the probe stations.

[0078] B1. A measurement system comprising: a vibration isolation layer as described in any one of paragraphs A1 to A18; and a support assembly supported by a vibration isolation mechanism via a platform, wherein the support assembly comprises at least one of: (i) a probe station comprising a support surface configured to support a substrate; (ii) a measurement layer configured to test a device under test (DUT) formed on a substrate; (iii) a loader configured to receive a cassette comprising a plurality of substrates, wherein each of the plurality of substrates comprises a corresponding plurality of DUTs; and (iv) a translation assembly configured to move the support surface and the measurement layer relative to each other to facilitate alignment between the measurement layer and the DUT.

[0079] B2. The measurement system as described in paragraph B1, wherein the probe station includes a clamp that defines a support surface.

[0080] B3. The measurement system as described in paragraph B2, wherein the clamp includes at least one of a thermal clamp, a temperature-controlled clamp, a vacuum clamp, and an electrically shielded clamp.

[0081] B4. A measurement system as described in any of paragraphs B1 to B3, wherein the translation assembly is configured to perform at least one of the following: (i) moving the support surface relative to the measurement layer; and (ii) moving the measurement layer relative to the support surface.

[0082] B5. A measurement system as described in any of paragraphs B1 to B4, wherein the translation assembly includes at least one of a linear actuator and a oscillating drive.

[0083] B6. A measurement system as described in any of paragraphs B1 to B5, wherein the measurement layer includes an electrical measurement layer configured to perform electrical tests on the DUT.

[0084] B7. The measurement system as described in paragraph B5, wherein the electrical measurement layer comprises a plurality of electrical probes configured to electrically contact or physically contact the corresponding contact pads of the DUT to perform electrical testing on the DUT.

[0085] B8. The measurement system as described in paragraph B7, wherein the probe station further includes an electrical signal generation and analysis assembly configured to perform at least one of the following: providing electrical test signals to the DUT via a plurality of electrical probes; and receiving electrical composite signals from the DUT via a plurality of electrical probes.

[0086] B9. A measurement system as described in any of paragraphs B6 to B8, wherein the electrical measurement layer forms part of a probe station.

[0087] B10. A measurement system as described in any of paragraphs B1 to B9, wherein the probe station includes an optical measurement layer configured to perform optical testing on the DUT.

[0088] B11. The measurement system as described in paragraph B10, wherein the optical measurement layer comprises a plurality of optical probes configured for optical communication or non-contact optical communication with the DUT.

[0089] B12. The measurement system of paragraph B11, wherein the optical measurement layer includes an optical signal generation and analysis assembly configured to perform at least one of the following: providing optical test signals to the DUT via a plurality of optical probes; and receiving optical composite signals from the DUT via a plurality of optical probes.

[0090] B13. A measurement system as described in any of paragraphs B11 to B12, wherein the optical measurement layer includes an optical microscope configured to collect optical images of at least one of a plurality of optical probes and at least one region of the DUT, wherein the optical microscope is configured, if necessary, to facilitate optical alignment between the plurality of optical probes and the DUT.

[0091] B14. A measurement system as described in any of paragraphs B11 to B13, wherein the vibration isolation layer is configured to provide vibration isolation between the platform and the mounting area to provide a vibration isolation amount based at least in part on the target maximum value of vibrational motion between the plurality of optical probes and the DUT.

[0092] B15. A measurement system as described in any of paragraphs B10 to B14, wherein the optical measurement layer is a modular optical measurement layer operatively attached to the remainder of the probe station.

[0093] B16. A measurement system as described in any of paragraphs B10 to B15, wherein the optical measurement layer further includes an optical measurement layer controller, the optical measurement layer controller being programmed to control the operation of the optical measurement layer.

[0094] B17. The measurement system as described in paragraph B16, wherein the optical measurement layer controller is also programmed to control the operation of the vibration isolation layer.

[0095] B18. The measurement system of paragraph B17, wherein the optical measurement layer controller is programmed to adjust the height of the platform via a vibration isolation mechanism, wherein, as needed, the optical measurement layer controller is programmed to perform at least one of the following: (i) when the cartridge is positioned on the loader, performing at least one of the operations of lowering the platform to a lower height limit and lowering the platform against a lower height stop; (ii) when the cartridge is being removed from the loader, performing at least one of the operations of lowering the platform to a lower height limit and lowering the platform against a lower height stop; and (iii) before testing the DUT, raising the platform to a vibration isolation height at which the platform effectively isolates the support assembly from vibration.

[0096] B19. A measurement system as described in any of paragraphs B1 to B18, wherein a loader is configured to move a selected substrate among a plurality of substrates between a cartridge and a probe station to facilitate testing of one or more DUTs formed on the selected substrate by the probe station, wherein, as needed, the loader is configured to perform at least one of the following: (i) removing the selected substrate from the cartridge and positioning the selected substrate on one of the support surfaces of the probe station; and (ii) removing the selected substrate from the support surface of the probe station and positioning the selected substrate within the cartridge.

[0097] B20. A measuring system as described in any of paragraphs B1 to B19, wherein the measuring system includes a mounting area, and wherein the mounting area is at least one of the following: (i) a planar or at least substantially planar mounting area; and (ii) has no or does not include an undermount recess located vertically below the remainder of the bottom surface surrounding the mounting area.

[0098] B21. The measurement system of any of paragraphs B1 to B20, wherein the vibration isolation layer and one of the optical measurement layers of the measurement system are provided by a first supplier or by the same supplier.

[0099] B22. The measurement system as described in paragraph B21, wherein at least one of the remaining components of the probe station is supplied by a second supplier or by another supplier different from the first supplier.

[0100] C1. A method of mounting a measurement system configured to test a device under test (DUT) formed on a substrate, the method comprising: positioning a vibration isolation layer in a mounting area, wherein the vibration isolation layer includes a platform, and further wherein the vibration isolation layer is configured to vibrationally isolate the platform from the mounting area; positioning a support assembly on an upper surface of the platform; and vibrationally isolating the support assembly from the mounting area via the vibration isolation layer.

[0101] C2. The method as described in paragraph C1, wherein the support assembly includes a probe station, and further wherein the positioning support assembly includes positioning the probe station on the upper surface.

[0102] C3. The method of paragraph C2, wherein the support assembly includes an optical measurement layer configured for optical communication or non-contact optical communication with the DUT, wherein the optical measurement layer includes an optical measurement layer controller, and further wherein the method includes controlling the operation of the vibration isolation layer using the optical measurement layer controller.

[0103] C4. The method as described in paragraph C3, wherein the method further comprises obtaining a vibration isolation layer optical measurement layer from a first manufacturer and obtaining a probe station from a second manufacturer different from the first manufacturer.

[0104] C5. The method of any one of paragraphs C1 to C3, wherein the positioning vibration isolation layer comprises positioning on an existing installation area, wherein the existing installation area is, as required, at least one of the following: (i) is a planar or at least substantially planar existing installation area; and (ii) has no or does not contain an undermount recess located vertically below the remainder of the bottom surface surrounding the existing installation area.

[0105] C6. The method of any of paragraphs C1 to C5, wherein the measurement system comprises any suitable structure, function and / or feature of any of the measurement systems of any of paragraphs B1 to B22. Industrial Applicability

[0106] The vibration isolation layer, measurement system and method disclosed herein are applicable to the semiconductor manufacturing and testing industry.

[0107] It is believed that the disclosures described above cover multiple distinct inventions with independent utility. Although each of these inventions has been disclosed in a preferred form, the specific examples disclosed and described herein are not intended to be limiting, as numerous variations are possible. The subject matter of this invention includes all novel and non-obvious combinations and sub-combinations of the various elements, features, functions, and / or attributes disclosed herein. Similarly, where the claims describe an "a" or "a first" element or its equivalent, the claims should be understood to include one or more such elements, neither requiring nor excluding two or more such elements.

[0108] It is believed that the following claims specifically indicate that certain combinations and sub-combinations relate to one of the disclosed inventions and are novel and not obvious. Inventions embodied in other combinations and sub-combinations of features, functions, elements, and / or attributes can be claimed by amending the current claims or presenting new claims in this or related applications. Such amended or new claims, whether relating to different or the same invention, and regardless of whether their scope differs from, is broader than, narrower than, or equal to the scope of the original claims, are also considered to be included within the subject matter of the disclosed invention. [Simplified Explanation of the Diagram]

[0006] [Figure 1] is a schematic diagram of an example of a measurement system according to the present disclosure. [Figure 2] is a diagram illustrating an example of vibration in a test environment of the measurement system according to the present disclosure. [Figure 3] is a diagram illustrating an example of vibration damping achieved by a vibration isolation mechanism of a vibration isolation layer of a measurement system according to the present disclosure. [Figure 4] is a flowchart depicting an example of a method for installing a measurement system according to the present disclosure, which is configured to test a device under test (DUT) formed on a substrate.

Claims

1. A vibration isolation layer for a measurement system, the vibration isolation layer comprising: A platform defined to support an upper surface of a support assembly including at least one of a probe station and a loader of the measurement system, wherein the platform defines a recess sized to receive at least a region of the probe station and the loader, wherein the recess extends into the platform to a critical percentage of the platform thickness, and further wherein the critical percentage is at least 10%; and a plurality of vibration isolation mechanisms positioned relative to a mounting area supporting the vibration isolation layer to support the platform, wherein the plurality of vibration isolation mechanisms are configured to allow relative movement between the platform and the mounting area to provide vibration isolation between the platform and the mounting area.

2. The vibration isolation layer of claim 1, wherein each of the plurality of vibration isolation mechanisms is in at least one of the following situations: (i) located outside one of the occupied areas of the support assembly; and (ii) located outside one of the vertical projections of the support assembly on the mounting area.

3. The vibration isolation layer as claimed in claim 1, wherein the platform defines a platform thickness of at least 100 mm and at most 400 mm.

4. The vibration isolation layer of claim 1, wherein each of the plurality of vibration isolation mechanisms includes at least one of the following: a passive vibration isolator, a passive air vibration isolator, a passive air vibration isolation spring, and a passive elastic gas containment volume configured to be inflated to provide vibration isolation between the platform and the installation area.

5. The vibration isolation layer of claim 1, wherein each of the plurality of vibration isolation mechanisms includes at least one of the following: an active control vibration isolator, an active control air vibration isolator, and an active control elastic gas containment volume configured to selectively inflate for vibration isolation of the platform from the installation area.

6. The vibration isolation layer of claim 5, wherein the vibration isolation layer further includes a pressure regulating structure configured to regulate an internal pressure within the vibration isolation mechanism.

7. The vibration isolation layer of claim 1, wherein the plurality of vibration isolation mechanisms define a spacing, wherein the support assembly defines a center of gravity, wherein the spacing is a multiple of at least one threshold spacing of one height of the center of gravity, and further wherein the threshold spacing multiple is at least 1.

5.

8. The vibration isolation layer of claim 1, wherein the vibration isolation layer further comprises an energy dissipation mechanism configured to perform at least one of the following: (i) dissipating mechanical energy between the platform and the mounting area; and (ii) attenuating mechanical motion between the platform and the mounting area.

9. The vibration isolation layer of claim 8, wherein the energy dissipation mechanism comprises at least one of a flexible sliding plate, a plurality of flexible sliding plates, a liquid damper, a gas damper, and a shock absorber.

10. The vibration isolation layer of claim 1, wherein the vibration isolation layer further includes a base for supporting one of the plurality of vibration isolation mechanisms relative to the mounting area, and wherein the base supports the plurality of vibration isolation mechanisms outside the area occupied by one of the support assemblies.

11. The vibration isolation layer of claim 1, wherein the groove defines at least one region of the upper surface.

12. A measurement system comprising: Vibration isolation layer as requested in any of items 1 to 11; The support assembly, supported by the vibration isolation mechanism via the platform, includes at least one of the following: (i) a probe station including a support surface configured to support a substrate; (ii) a measurement layer configured to test a device under test (DUT) formed on the substrate; (iii) a loader configured to receive a cassette containing a plurality of substrates, wherein each of the plurality of substrates contains a corresponding plurality of DUTs; and (iv) a translation assembly configured to move the support surface and the measurement layer relative to each other to facilitate alignment between the measurement layer and the DUT.

13. The measuring system of claim 12, wherein the measuring system includes the mounting area, and wherein the mounting area is at least one of the following: (i) a planar mounting area; and (ii) without a recessed groove vertically located below the remainder of a bottom surface surrounding the mounting area.

14. A measurement system comprising: A vibration isolation layer comprising: (i) a platform defining an upper surface; and (ii) a plurality of vibration isolation mechanisms positioned relative to a mounting area supporting the vibration isolation layer to support the platform, wherein the plurality of vibration isolation mechanisms are configured to allow relative movement between the platform and the mounting area to isolate the platform from the mounting area; and a support assembly supported by the upper surface of the platform, wherein the support assembly includes a measurement layer configured to test a device under test (DUT) formed on a substrate, wherein the support assembly includes an optical measurement layer configured to perform optical testing on the DUT, wherein the optical measurement layer further includes an optical measurement layer controller programmed to control the operation of the optical measurement layer, and wherein the optical measurement layer controller is also programmed to control the operation of the vibration isolation layer; The upper surface is configured to support the support assembly, wherein the support assembly further includes at least one of a probe station of the measurement system and a loader of the measurement system, wherein the platform defines a recess sized to receive at least one region of at least one of the probe station and the loader, wherein the recess extends into the platform to a critical percentage of the platform thickness, and further wherein the critical percentage is at least 10%.

15. The measurement system of claim 14, wherein the optical measurement layer controller is programmed to adjust the height of one of the platforms by controlling the plurality of vibration isolation mechanisms.

16. The measurement system of claim 15, wherein the loader is configured to receive a cassette comprising a plurality of substrates, and wherein the optical measurement layer controller is programmed to perform at least one of the following: (i) when the cassette is positioned on the loader, performing at least one of operations to lower the platform to a lower height limit and to lower the platform against a lower height stop; (ii) when the cassette is being removed from the loader, performing at least one of operations to lower the platform to the lower height limit and to lower the platform against the lower height stop; and (iii) before testing the DUT, raising the platform to a vibration isolation height at which the platform effectively isolates the support assembly from vibration.

17. The measurement system of claim 14, wherein the optical measurement layer includes a plurality of optical probes configured for optical communication with the DUT, and further wherein the optical measurement layer includes an optical signal generation and analysis assembly configured to perform at least one of the following: providing an optical test signal to the DUT via the plurality of optical probes; and receiving an optical composite signal from the DUT via the plurality of optical probes.

18. The measurement system of claim 17, wherein the optical measurement layer includes an optical microscope configured to collect an optical image of at least one of the plurality of optical probes and at least one region of the DUT, to facilitate optical alignment between the plurality of optical probes and the DUT.

19. The measurement system of claim 17, wherein the vibration isolation layer is configured to provide vibration isolation between the platform and the mounting area to provide a vibration isolation amount based at least in part on one of the target maximum values ​​of vibrational motion between the plurality of optical probes and the DUT.

20. The measurement system of claim 14, wherein the optical measurement layer is a modular optical measurement layer operatively attached to the remainder of the measurement system.

21. The measurement system of claim 14, wherein the measurement layer includes an electrical measurement layer configured to perform electrical testing on the DUT, and further wherein the electrical measurement layer includes a plurality of electrical probes configured to electrically contact corresponding contact pads of the DUT to perform electrical testing on the DUT.

22. The measuring system of claim 14, wherein the measuring system includes the mounting area, and wherein the mounting area is at least one of the following: (i) a planar mounting area; and (ii) without a recessed groove vertically located below the remainder of a bottom surface surrounding the mounting area.

23. The measuring system of claim 14, wherein the groove defines at least one region of the upper surface.

24. A method of assembling a measurement system configured to test a device under test (DUT) formed on a substrate, the method comprising: A vibration isolation layer is positioned in an installation area, wherein the vibration isolation layer includes a platform defining an upper surface of a support assembly configured to support a measurement system, the support assembly including at least one of a probe station of the measurement system and a loader of the measurement system, wherein the platform defines a recess sized to receive at least one area of ​​the probe station and the loader, wherein the recess extends into the platform to a critical percentage of the platform thickness, and further wherein the critical percentage is at least 10%, and further wherein the vibration isolation layer is configured to isolate the platform from the installation area; the support assembly is positioned on the upper surface of the platform, wherein the support assembly includes the probe station and an optical measurement layer configured for optical communication with the DUT, wherein the optical measurement layer includes an optical measurement layer controller, and further wherein positioning the support assembly includes positioning the probe station and the optical measurement layer on the upper surface such that at least one area of ​​the probe station is received within the recess; The vibration isolation layer isolates the support assembly from the mounting area; and the operation of the vibration isolation layer is controlled by the optical measurement layer controller.

25. The method of claim 24, wherein the mounting area does not have a recessed groove vertically located below the remainder of a bottom surface surrounding the mounting area.

26. The method of claim 24, wherein the method further comprises obtaining the vibration isolation layer and the optical measurement layer from a first manufacturer, and obtaining the probe station from a second manufacturer different from the first manufacturer.

27. The method of claim 24, wherein the groove defines at least one region of the upper surface.

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