Electronic device, power module, and manufacturing method of power module

Abstract

This invention discloses an electronic device, a power module, and a method for manufacturing the power module. The power module includes a substrate, a power chip fixed to an inner metal layer of the substrate, a package encapsulating the substrate and the power chip, and a plurality of heat-conducting elements fixed to an outer metal layer of the substrate. The outer metal layer is exposed outside the package and is coplanar with adjacent surfaces of the package. Each heat-conducting element has a shaped portion and a deformable portion connected to the shaped portion. The plurality of shaped portions are spaced apart from each other and arranged adjacently to form a predetermined pattern. The bottom of each deformable portion is directly connected to the outer metal layer, and the area of ​​a first cross-section of the bottom of the deformable portion is larger than the area of ​​a second cross-section of the shaped portion.

Claims

1. A method for manufacturing a power module, comprising: A die bonding step: fixing a power chip to an inner metal layer of a substrate; wherein the substrate includes an outer metal layer located on the opposite side of the inner metal layer, and the outer metal layer of the substrate is not electrically coupled to the power chip; a packaging step: embedding the substrate and the power chip therein in a package, and exposing a layout plane of the outer metal layer of the substrate outside the package and coplanar with adjacent surfaces of the package; and a patterning step: directly fixing multiple deformable portions of multiple thermal conductive elements to the layout plane, and without any medium between each thermal conductive element and the layout plane; wherein each deformable portion is connected to a shaped portion of the thermal conductive element, and the area of ​​a first cross-section at the bottom of the deformable portion is greater than the area of ​​a second cross-section of the shaped portion; wherein, after the patterning step is performed, the multiple shaped portions are spaced apart and arranged adjacently to form a preset pattern.

2. The method for manufacturing the power module as described in claim 1, wherein, In the patterning step, the area of ​​the first cross-section at the bottom of the deformed portion occupies at least 50% of the layout plane.

3. The method for manufacturing the power module as described in claim 1, wherein, The manufacturing method of the power module further includes a reinforcement step after the die bonding step and before the packaging step: connecting one end of a plurality of support pillars to the substrate and the other end to a carrier, so that the power chip is located between the carrier and the substrate; wherein, in the packaging step, the carrier and the plurality of support pillars are embedded within the package; wherein, in the patterning step, the carrier absorbs an external force applied to the substrate by each of the heat-conducting elements being directly fixed to the layout plane through the plurality of support pillars.

4. A power module comprising: A substrate includes a plate body, an inner metal layer formed on one side of the plate body, and an outer metal layer formed on the other side of the plate body; a power chip fixed to the inner metal layer of the substrate and not electrically coupled to the outer metal layer; wherein the outer metal layer has a layout plane away from the power chip; a package encapsulating the substrate and the power chip therein, the layout plane of the outer metal layer being exposed outside the package and coplanar with adjacent surfaces of the package; and a patterned thermal conductive layer including a plurality of thermal conductive elements directly fixed to the layout plane; wherein no medium is disposed between each thermal conductive element and the layout plane; each thermal conductive element has: a shaped portion; wherein the shaped portions of the plurality of thermal conductive elements are spaced apart from each other and arranged adjacently to jointly form a preset pattern; and a deformable portion connected to the shaped portion at its top and directly connected to the layout plane at its bottom; wherein the area of ​​a first cross-section at the bottom of the deformable portion is larger than the area of ​​a second cross-section of the shaped portion.

5. The power module as described in claim 4, wherein, The area of ​​the first cross-section at the bottom of the deformable portion occupies at least 50% of the layout plane.

6. The power module as described in claim 4, wherein, Each of the heat-conducting elements is in the shape of a long column, and the plurality of heat-conducting elements are arranged in parallel with each other.

7. The power module as described in claim 4, wherein, In at least two of the heat-conducting elements, each of the two configurations includes a C-shaped side surface, and the C-shaped side surfaces of the two configurations are staggered, and a portion of one of the C-shaped side surfaces falls within the space enclosed by the other C-shaped side surface, so as to jointly form an S-shaped space.

8. The power module as described in claim 4, wherein, The plurality of heat-conducting elements and the layout plane together define a heat-conducting channel for a heat-conducting medium to flow through.

9. The power module as described in claim 4, wherein, The layout plane includes a plurality of sub-planes spaced apart from each other, and the plurality of heat-conducting elements are respectively directly fixed to the plurality of sub-planes of the layout plane.

10. The power module as described in claim 4, wherein, The power module further includes: a carrier embedded within the package, with the power chip located between the carrier and the substrate; and a plurality of support pillars connected between the substrate and the carrier and embedded within the package.

11. The power module as described in claim 4, wherein, The power module further includes a plurality of pins fixed to the inner metal layer and electrically coupled to the power chip, with a portion of each pin extending outside the package.

12. An electronic device comprising: A power module includes: a substrate comprising a plate body, an inner metal layer formed on one side of the plate body, and an outer metal layer formed on the other side of the plate body; a power chip fixed to the inner metal layer of the substrate and not electrically coupled to the outer metal layer; wherein the outer metal layer has a layout plane away from the power chip; a package housing encapsulating the substrate and the power chip therein, wherein the layout plane of the outer metal layer is exposed outside the package housing and coplanar with adjacent surfaces of the package housing; and a patterned thermal conductive layer comprising a plurality of thermal conductive elements directly fixed to the layout plane; wherein no medium is disposed between each thermal conductive element and the layout plane; each thermal conductive element has: A configuration portion; wherein the configuration portions of a plurality of the heat-conducting components are spaced apart from each other and arranged adjacently to jointly form a preset pattern; and a deformable portion, connected to the configuration portion at its top and directly connected to the layout plane at its bottom; wherein the area of ​​a first cross-section at the bottom of the deformable portion is greater than the area of ​​a second cross-section of the configuration portion; and a liquid cooling module mounted on the power module; wherein the liquid cooling module has a coolant channel and the patterned heat-conducting layer of the power module is located within the coolant channel.

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