Resin composition and product of the same

Abstract

A resin composition is disclosed, comprising 100 parts by weight of a vinyl polyphenylene ether resin and 10 to 160 parts by weight of a compound of formula (1). Wherein, n is an integer from 3 to 6, X and Y are each independently arylcyclobutenoxy or aryloxy groups, the number of arylcyclobutenoxy groups is greater than or equal to 3, and the aryloxy groups contain or do not contain an olefin or (meth)acrylate group having 1 to 4 carbon atoms. The use of the resin composition in the preparation of articles and articles made at least in part from the resin composition are also disclosed, the articles comprising prepregs, resin films, laminated printed circuit boards, or cured insulators.

Claims

1. A resin composition comprising 100 parts by weight of a vinyl polyphenylene ether resin and 10 to 160 parts by weight of a compound of formula (1), wherein, n is an integer from 3 to 6, X and Y are each independently arylcyclobutenoxy or aryloxy, the number of arylcyclobutenoxy groups is greater than or equal to 3, and the aryloxy groups may or may not contain olefins or (meth)acrylate groups with 2 to 4 carbon atoms.

2. The resin composition as claimed in claim 1, wherein, The vinyl-containing polyphenylene ether resin includes terminal vinyl benzyl polyphenylene ether resin, terminal methacrylate polyphenylene ether resin, terminal allyl polyphenylene ether resin, or a combination thereof.

3. The resin composition as claimed in claim 1, wherein, The terminal ethylene benzyl polyphenylene ether resin and the terminal methacrylate polyphenylene ether resin respectively include the structures shown in formula (A-1) and formula (A-2): Formula (A-1) Formula (A-2) Wherein, R1 to R14 are each independently H or –CH3, W1 and W2 are each independently C1 to C3 divalent aliphatic groups; b1 is an integer from 0 to 8; Q1 includes the structure shown in formula (B-1), formula (B-2) or formula (B-3): Formula (B-1) Formula (B-2) Formula (B-3) Y1 and Y2 each independently include the structure shown in formula (B-4): Formula (B-4) Wherein, R15 to R30 are each independently H or –CH3; m1 and n1 are each independently an integer from 1 to 30; and A1 is selected from covalent bonds, –CH2–, –CH(CH3)–, –C(CH3)2–, –O–, –S–, –SO2– and carbonyl groups.

4. The resin composition as claimed in claim 1, wherein, The phosphorus content of the compound of formula (1) ranges from 2.0 wt% to 13.0 wt%.

5. The resin composition as claimed in claim 1, wherein, The arylcyclobutenoxy group and the aryl group in the aryloxy group are each independently a substituted or unsubstituted phenyl, biphenyl or naphthyl group.

6. The resin composition as claimed in claim 1, wherein, The structure of the arylcyclobutenoxy group is shown in formula (2) below, and the structure of the aryloxy group is shown in formula (3) below; Formula (2) Formula (3), wherein Ra and Rb are each independently H or alkyl groups with 1 to 4 carbon atoms, m is an integer from 0 to 3, z is an integer from 0 to 4, R is H or olefin or (meth)acrylate group with 2 to 4 carbon atoms, and R31 to R34 are each independently H or hydrocarbon group with 1 to 3 carbon atoms.

7. The resin composition as claimed in claim 6, wherein, R is vinyl, propenyl, allyl, acrylate, or methacrylate.

8. The resin composition as claimed in claim 1, wherein, The compound of formula (1) has the following structures or combinations thereof: Formula (4) Formula (5) Formula (6) Formula (7) Formula (8) Formula (9) Formula (10) Formula (11) Formula (12) Formula (13) Formula (14) Formula (15) Formula (16) Formula (17) Formula (18) Formula (19) Formula (20) Formula (21) Formula (22).

9. The resin composition as claimed in claim 1, wherein, The resin composition further includes at least one of the following: a vinyl crosslinking agent, a maleimide triresin, a styrene-maleic anhydride resin, an epoxy resin, a phenolic resin, a benzo[a] resin, a cyanate ester resin, a polyester resin, a polyamide resin, and a polyimide resin.

10. The resin composition as claimed in claim 9, wherein, The vinyl crosslinking agent includes at least one of styrene, divinylbenzene, divinylnaphthalene, divinylbiphenyl, tributylstyrene, di(vinylbenzyl) ether, 1,2,4-trivinylcyclohexane, di(vinylphenyl)ethane, di(vinylphenyl)hexane, divinylphenyldimethylene ether, divinylphenyldimethylenebenzene, triallyl isocyanurate, triallyl cyanurate, diallyl bisphenol A, butadiene, decanadiene, octadiene, vinylcarbazole, and acrylate.

11. The resin composition as claimed in claim 1, wherein, The resin composition also includes at least one of the following: amine curing agent, flame retardant, inorganic filler, curing accelerator, polymerization inhibitor, dye, solvent, toughening agent, and silane coupling agent.

12. The resin composition as claimed in any one of claims 1 to 11, the resin composition being used for preparing articles, wherein the articles include prepregs, resin films, laminates, printed circuit boards, or cured insulators.

13. An article comprising a prepreg, a resin film, a multilayer printed circuit board, or a cured insulator, wherein, At least a portion of the article is made of a resin composition as described in any one of claims 1 to 11.

14. The article of manufacture as described in claim 13, wherein, The product has one, more, or all of the following characteristics: The inner circuit board substrate without copper on its surface passes the filler test normally; No board breakage occurs during the heat resistance test after moisture absorption, as described in IPC-TM-650 2.6.16.1 and IPC-TM-650 2.4.23; The copper foil tensile strength measured by the method described in IPC-TM-650 2.4.8 is greater than or equal to 3.80 lb / in; The glass transition temperature measured by the method described in IPC-TM-650 2.4.24.4 is greater than or equal to 209°C; The X-axis coefficient of thermal expansion measured by the method described in IPC-TM-650 2.4.24.5 is less than or equal to 11.5 ppm / °C.

Images