Structure of wafer retaining ring

Abstract

The present invention relates to a wafer fixing ring structure, which includes a base, a fixing ring, and a cover. The base includes a grinding part, a fixing part, a through hole, and a groove. The grinding part is disposed on one side of the fixing part, the through hole passes through the grinding part and the fixing part, the groove is disposed on the upper side of the grinding part, and a plurality of venting grooves are disposed on the lower side of the grinding part opposite to the groove. The fixing ring is disposed in the groove, and the cover is disposed on one side of the fixing ring and located in the groove.

Claims

1. A structure for a wafer fixing ring, comprising: a base including a grinding portion, a fixing portion, a through hole, and a groove, wherein the grinding portion is disposed on one side of the fixing portion, the through hole passes through the grinding portion and the fixing portion, the groove is annularly disposed on the upper side of the fixing portion, a plurality of venting grooves are disposed opposite the groove on the lower side of the grinding portion, a plurality of snap-fit ​​portions are disposed at the bottom of the groove, each of the snap-fit ​​portions including a circular hole and an elongated hole, the circular hole communicating with one side of the elongated hole; a fixing ring disposed within the groove, the fixing ring including a plurality of fixing holes, one of the fixing holes corresponding to the circular hole of one of the snap-fit ​​portions, a gap being formed between the fixing ring and the groove, and an adhesive disposed in the gap; and a cover covering one side of the fixing ring and located within the groove; wherein... It also includes a plurality of fasteners, which are respectively disposed in the fastening holes. Each of the fasteners includes a locking part and a locking part. One end of the locking part is connected to the locking part. Furthermore, the locking part is disposed in the round hole and rotates to engage with the elongated hole.

2. The structure of the wafer retaining ring as described in claim 1, wherein the perforation system includes a vertical portion and a tapered portion, one end of the vertical portion is connected to one end of the tapered portion, and the tapered portion tapes from the upper side of the retaining portion toward the vertical portion.

3. The structure of the wafer retaining ring as described in claim 1, wherein the first diameter of the grinding portion is smaller than the second diameter of the retaining portion.

4. The structure of the wafer retaining ring as described in claim 1, wherein the base is made of polyphenylene sulfide (PPS), polyether ether ketone (PEEK), or polycarbonate (PC).

5. The structure of the wafer retaining ring as described in claim 1, wherein the retaining ring is made of stainless steel, low carbon steel, medium carbon steel or high carbon steel.

6. The structure of the wafer retaining ring as described in claim 1, wherein the cover is made of polyphenylene sulfide, polyetheretherketone, polycarbonate, stainless steel, low carbon steel, medium carbon steel or high carbon steel.

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