Camera device and manufacturing method thereof

Abstract

A camera device and its manufacturing method are disclosed. The camera device includes a support plate, a flexible circuit board, a photosensitive element, and a fixing adhesive layer. The support plate has a first through hole with a first edge. The flexible circuit board is stacked on the support plate and has a second through hole and an assembly surface. The assembly surface is fixed to the support plate. The second through hole is positioned corresponding to the position of the first through hole and has a second edge. The second through hole is smaller than the first through hole, forming a notch between the first edge of the first through hole in the support plate and the assembly surface of the flexible circuit board. The photosensitive element is located within the first through hole in the support plate and has an outer periphery. The fixing adhesive layer is located within the notch and is adhered to the first hole edge, the assembly surface, the second hole edge, and the outer periphery.

Claims

1. A camera device, comprising: A support plate having a first through hole, the first through hole having a first edge; A flexible circuit board is stacked on a support plate. The flexible circuit board has a second through hole and an assembly surface. The assembly surface is fixed to the support plate. The position of the second through hole corresponds to the position of the first through hole and has a second hole edge. The second through hole is smaller than the first through hole, so that a notch is formed between the first hole edge of the first through hole in the support plate and the assembly surface of the flexible circuit board. A photosensitive element is located in the first through hole in the support plate. The photosensitive element has an outer periphery. A fixing adhesive layer is located in the notch and is adhered to the first hole edge of the first through hole, the assembly surface of the flexible circuit board, the second hole edge of the second through hole, and the outer periphery of the photosensitive element.

2. The camera device as claimed in claim 1, wherein the photosensitive element has a photosensitive surface, and the adhesive layer has a reinforcing block that is adhered to the periphery of the photosensitive surface.

3. The imaging device as claimed in claim 2, wherein the photosensitive surface has a photosensitive area and an electrical connection portion located between the photosensitive area and the reinforcing block.

4. The camera device as claimed in claim 1, wherein the support plate has a bottom surface facing away from the flexible circuit board, and the photosensitive element has a photosensitive surface and a back surface opposite each other, the back surface and the bottom surface being located in the same plane.

5. The camera device as claimed in claim 1, wherein the support plate has a side edge, and one side of the first through hole has an opening located on the side edge.

6. A method for manufacturing a camera device, comprising: Step (a): Set a base layer onto a platform; Step (b): A support plate and a flexible circuit board are placed on the base layer, such that the support plate is stacked between the base layer and the flexible circuit board. The support plate has a first through hole with a first hole edge. The flexible circuit board has a second through hole and an assembly surface. The assembly surface is fixed to the support plate. The position of the second through hole corresponds to the position of the first through hole and has a second hole edge. The second through hole is smaller than the first through hole, so that a notch is formed between the first hole edge of the first through hole of the support plate and the assembly surface of the flexible circuit board. Step (c): Apply an adhesive layer to the base layer corresponding to a local surface area of ​​the first through hole of the support plate; and Step (d): Press a photosensitive element against the adhesive layer, causing the adhesive layer to flow around the photosensitive element to form a fixing adhesive layer, the fixing adhesive layer being located in the step groove, and the fixing adhesive layer being adhered to the first hole edge of the first through hole, the assembly surface of the flexible circuit board, the second hole edge of the second through hole, and one of the outer peripheries of the photosensitive element.

7. A method for manufacturing the camera device as described in claim 6, wherein step (d) further includes: A lens is disposed on the surface of the flexible circuit board, and the lens corresponds to the photosensitive element.

8. A method for manufacturing the camera device as described in claim 6, wherein step (d) further includes: Remove the base layer.

9. A method for manufacturing a camera device as described in claim 6, wherein the substrate in step (a) is a release paper layer.

10. A method of manufacturing a camera device as claimed in claim 6, wherein the flexible circuit board has an edge and a reinforcing piece, the second through hole is adjacent to the edge, the reinforcing piece is connected to the edge, and the position of the reinforcing piece corresponds to the second through hole; the step (d) further includes: Remove the reinforcement patch.

11. A method of manufacturing a camera device as described in claim 10, wherein the length of the reinforcing sheet is greater than the length of the second through hole.

12. A method of manufacturing a camera device as claimed in claim 6, wherein the flexible circuit board has an edge, one side of the second through hole has a notch located on the edge; the adhesive layer in step (c) has an extension that extends out of the notch and overflows the edge.

13. A method for manufacturing a camera device as described in claim 12, wherein step (d) further comprises: Remove the extension.

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