Sliding latch, method for securing heatsink to printed circuit board of computing system with sliding latch, and computing system

Abstract

A sliding latch is provided for securing a heatsink to a printed circuit board of a computing system. The latch includes a first portion movably positioned on a slide rail of the heatsink. The first portion is configured to slide linearly between a first position and a second position within the slide rail. In the first position, the first portion disengages from a stop structure on the slide rail. In the second position, the first portion engages the stop structure. The latch also includes a second portion configured to engage with a positioning structure on the printed circuit board. In the second position, the second portion engages the positioning structure and securely fixes the heatsink to the printed circuit board. The stop structure is visually or audibly activated when the first portion moves to the second position.

Claims

1. A sliding latch for securing a heat sink to a printed circuit board of a computer system, the sliding latch comprising: a first portion movably positioned in a slide rail of the heat sink, the first portion configured to move linearly between the first position and the second position of the slide rail, the first portion disengaging from the stop structure of the slide rail in the first position and engaging the stop structure in the second position; and a second portion configured to engage with the positioning structure of the printed circuit board, the second portion engaging with the positioning structure in the second position and securely securing the heat sink to the printed circuit board, and the stop structure being visually or audibly indicated when the first portion moves to the second position.

2. The sliding latch as described in claim 1, wherein when the heat sink is securely fixed to the printed circuit board, the heat sink is configured to thermally couple to a microchip embedded on the printed circuit board.

3. The slide as described in claim 1, wherein the slide is made of a polymer material or a metal material.

4. The sliding latch as claimed in claim 1, wherein the first portion includes a textured end, wherein a manual force is applied to the textured end to cause the first portion to slide linearly between the first position and the second position within the slide rail.

5. The sliding latch as claimed in claim 1, wherein the first portion includes an extension end, wherein a manual force is applied to the extension end to cause the first portion to slide linearly between the first position and the second position in the slide rail.

6. The sliding latch as claimed in claim 1, wherein the stop structure includes a sensor communicatively coupled to the printed circuit board, and wherein the sensor is configured to indicate via the printed circuit board that the first portion has moved to the second position.

7. The slide as claimed in claim 1, wherein the slide includes a snap-fit ​​structure, and wherein the snap-fit ​​structure of the slide is configured to engage the stop structure of the slide rail when the first portion moves to the second position.

8. A method for securing a heat sink to a printed circuit board of a computing system using a sliding latch, the method comprising: aligning the sliding latch with a positioning structure of the printed circuit board, wherein a first portion of the sliding latch is movably positioned within a slide rail of the heat sink, and wherein the first portion is configured to linearly slide between a first position and a second position of the slide rail, the first portion disengaging from a stop structure of the slide rail at the first position, and engaging the stop structure at the second position; aligning a second portion of the sliding latch with the positioning structure of the printed circuit board; and applying a force to the sliding latch, the force causing the first portion of the sliding latch to slide within the slide rail and engaging the stop structure of the slide rail, wherein when the first portion moves to the second position, the stop structure is visually or audibly indicated, and the second portion of the sliding latch engages the positioning structure, and the heat sink is securely secured to the printed circuit board.

9. The method as described in claim 8 further comprises: applying a second force to the slide, the second force causing the first portion of the slide to slide in the slide rail to the first position and disengaging the second portion of the slide from the positioning structure; and applying a removal force to the radiator to remove the radiator from the positioning structure.

10. A computing system comprising: a printed circuit board; a positioning structure of the printed circuit board; a heat sink; and a latch for attaching the heat sink to the printed circuit board, the latch comprising: a first portion movably positioned in a slide rail of the heat sink, the first portion configured to move linearly between the first position and the second position within the slide rail, the first portion disengaging from a stop structure of the slide rail in the first position, and engaging the stop structure in the second position; and a second portion configured to engage with the positioning structure of the printed circuit board, the second portion engaging with the positioning structure in the second position and securely fixing the heat sink to the printed circuit board, and the stop structure being visually or audibly indicated when the first portion moves to the second position.

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