Electro-magnetic devices having multi-thickness elements, and methods of manufacturing electro-magnetic devices having multi-thickness elements

Abstract

This invention provides an electromagnetic device having conductive elements and leads of multiple thicknesses. Templates for fabricating the electromagnetic device are provided, formed by an extrusion process, a scraping process, a forging process, 3D printing, or a machining process. The multi-thickness electromagnetic device may include a conductive element having a thickness-increasing region, and one or more leads having at least one thickness-decreasing region having a thickness smaller than that of the thickness-increasing region. An electromagnetic device may be provided comprising: a conductive element having an increasing thickness, packaged in a body formed of a core material; and leads or lead portions connected to the conductive element, having a decreasing thickness.

Description

Technical Field

[0001] This application relates to the field of electronic components, and more specifically, to electromagnetic devices having multi-thickness elements such as conductive elements and leads for use in devices such as inductors, and to methods for manufacturing multi-thickness electromagnetic devices and electromagnetic devices formed using multi-thickness templates as described herein. [Cross-reference to related applications] []

[0002] This application claims the benefit of U.S. Patent Application No. 17 / 351,782, filed June 18, 2021, which is incorporated herein by reference as if fully set forth herein. Prior Technology

[0003] Electromagnetic devices such as inductors are typically passive, two-terminal electronic components. An inductor typically consists of a conductor, such as a wire, wound into a coil. When current flows through the coil, energy is temporarily stored in the magnetic field within the coil. When the current flowing through the inductor changes, the time-varying magnetic field induces a voltage in the conductor according to Faraday's law of electromagnetic induction.

[0004] Some known inductors are typically formed as a core body of magnetic material in which conductors, such as wound coils, are positioned internally; sometimes the conductors are formed as wound coils. Examples of known inductors include U.S. Patent Nos. 6,198,375 (“Inductor Coil Structure”) and 6,204,744 (“High Current, Low Profile Inductor”), the entire contents of which are incorporated herein by reference.

[0005] Typically, it is necessary to form, set, or adjust the performance characteristics of an electromagnetic device by changing the properties or parameters of certain components, such as wires or coils. Many electromagnetic devices use wound coils made of conductive materials. The characteristics of such devices can be adjusted, for example, by increasing the number of turns of such coils, thereby increasing the number of coils wound. This configuration therefore requires specific mechanics and careful adjustment.

[0006] The design of electromagnetic devices that require coils to be formed as laminated or folded layers requires additional machining and adjustments. Designs that require welding different components together may require additional machining and adjustments and have weaknesses.

[0007] The design of an electromagnetic device with a thicker lead section has the potential to cause the core body surrounding the lead to break when the lead bends around the core body.

[0008] There is a need for a simple, cost-effective, and efficient method to generate consistent electromagnetic devices such as inductors with reduced DC resistance (DCR).

[0009] There is another need for manufacturing electromagnetic devices such as inductors, which are formed in ways such as providing improved performance.

[0010] There is a need for manufacturing electromagnetic devices such as inductors, in which conductive elements such as coils or wires can have varying sizes but are not wound or formed from wound wires. Summary of the Invention

[0011] This article discloses electromagnetic devices having conductive elements and leads of varying thicknesses, and methods for fabricating, forming, or otherwise manufacturing electromagnetic devices of varying thicknesses.

[0012] As used herein, the term "multi-thickness" can refer to having more than one thickness, at least two different thicknesses, multiple thicknesses, varying thicknesses, or a plurality of different thicknesses. In some cases, the thickness can be measured along the length, width, or height, depending on the orientation of the electromagnetic device or lead frame. As used herein, the term "multi-thickness electromagnetic device" refers to an electromagnetic device having a coil, conductor, or conductive element and one or more leads, wherein the coil, conductor, or conductive element and one or more leads have varying thicknesses or different thicknesses, as described in more detail herein. For example, the coil, conductor, or conductive element may have a first thickness, one of the leads may have a second thickness, and another of the leads may have a third thickness, and the first thickness may differ from the second thickness, and / or the first thickness may differ from the third thickness.

[0013] According to one embodiment of the present invention, the electromagnetic device includes a conductive element formed of a conductive material connected to a first lead and a second lead. The conductive element has a first thickness, the first lead has a second thickness, and the second lead has a third thickness. The first thickness may be different from the second thickness. The first thickness may be different from the third thickness. The first thickness may be greater than the second thickness. The first thickness may be greater than the third thickness. The conductive element may be in various shapes.

[0014] A method for manufacturing an electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness. The method may further include, where appropriate, pressing a body around at least a portion of the conductive element and at least a portion of the first lead and at least a portion of the second lead.

[0015] A method for fabricating a template for forming a multi-thickness electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a multi-thickness template, the multi-thickness template including a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion having a third thickness, wherein the first thickness is greater than the second thickness. The template may be in the form of a lead frame.

[0016] According to one aspect of the present invention, a method for manufacturing a template for a multi-thickness electromagnetic device is provided. The method may include extruding a conductive material into a multi-thickness metal extrusion or sheet having regions of varying thickness or height. The extruded conductive material is a single, continuous, adjacent, or monolithic conductive material piece, such as a conductive metal. Preferably, the thickness-increasing region of the extruded conductive material, such as a generally central region, has a greater thickness than the outer or side regions or portions of the extruded conductive material and / or leads. The multi-thickness extruded conductive material may be plated, for example, with nickel as a first layer and tin as a second or outer layer. The multi-thickness extruded conductive material is stamped to form the desired shape of a multi-thickness template having conductive elements connected to a first lead and a second lead. The stamped multi-thickness template thus includes shaped regions, which may be considered coils, coil regions, or wire regions, and are generally referred to as "conductive elements." The conductive elements are formed in the generally thickness-increasing region of the template at the center or inner region of the template. The conductive element, the first lead, and the second lead are all formed from single, continuous, adjacent, or monolithic conductive material components.

[0017] In another embodiment of the invention, a method is provided for fabricating a multi-thickness template for an electromagnetic device. The method includes providing a metal sheet, sheet, or strip of conductive material starting with a uniform thickness or height. The conductive material can be a single, continuous, adjacent, or monolithic conductive material piece. The conductive material is produced by a metal scraping or cutting process using a cutting tool with surfaces of various sizes, such as a blade having a cutting surface at a first height and at least one non-cutting surface at a second, smaller height. The conductive material can be plated, for example, with nickel as a first layer and tin as a second or outer layer. The conductive material is stamped to form the desired shape of a template having conductive elements connected to a first lead and a second lead. The conductive elements associated with the increased thickness region of the multi-thickness template have a thickness greater than the outer or side regions of the multi-thickness template and / or the leads.

[0018] In another embodiment of the invention, a method is provided for fabricating a multi-thickness template for an electromagnetic device. The method includes providing a metal plate, sheet, or strip of conductive material beginning with a uniform thickness or height. The conductive material is a single, continuous, adjacent, or monolithic conductive material element, such as a metal sheet. The conductive material may be plated, for example, with nickel as a first layer and tin as a second or outer layer. The conductive material is stamped to produce a template comprising a conductive element having a desired shape and leads extending from the conductive element. To produce a multi-thickness template with a conductive element having a thickness greater than the outer or side regions of the conductive material and / or leads, selected outer regions of the template that may contain the leads are planarized, for example, by forging or pressing. In this way, the selected outer regions have a reduced thickness or height compared to the thickness or height of the conductive element.

[0019] In one embodiment of the invention, the conductive element has a reduced thickness compared to the thickness of the first lead and / or the thickness of the second lead. In this embodiment of the invention, a method similar to the described method can be performed, wherein the conductive element has a reduced thickness compared to its thickness, and the first lead or the second lead has an increased thickness.

[0020] In one embodiment of the present invention, an electromagnetic device can be formed using the template disclosed herein.

[0021] In one embodiment of the present invention, the electromagnetic device may be formed only as conductive elements and lead portions of different thicknesses, without any additional core body or core material forming the body around the conductive elements or lead portions.

[0022] An electromagnetic device according to one embodiment of the invention may include a compressed and / or molded powder core or body or core body formed from compressed and / or molded magnetic powder surrounding portions of conductive elements, such as conductive elements and portions of leads adjacent to the conductive elements. The leads may then be positioned and bent to wrap around an outer surface of the body to form a contact point on one outer surface of the body. Preferably, portions of the leads are positioned along a bottom surface of the body to form surface-adhesive leads. In other embodiments, the leads are not bent in this manner.

[0023] The conductive material can be formed into a conductive element having a specific shape such as a serpentine or zigzag shape, and can be formed into an "S" shape or another shape having a curved or curved area such as a circular or elliptical shape, or an omega (Ω) shape. The conductive element can be formed into a selected shape, such as a generally rectangular or horizontal bar shape, an "I" shape or an "H" shape, a "barbell" shape, or another selected shape. The body of the electromagnetic device surrounds the conductive element and can be pressed around the conductive element so that leads extend from one or more surfaces of the body.

[0024] It should be noted that the conductive element of the present invention is formed without the need for winding or providing multiple wire or coil layers. The present invention provides an unwound conductive element with an increased thickness or height region, which is formed as a single piece with attached leads by extrusion, stamping, pressing, and / or cutting of metal sheets. Preferably, no interruption or break is formed in the conductive element along the path from one lead to another. The conductive element is unwound and does not have any portion passing over or under another portion of the conductive element.

[0025] It should be understood that other conductive materials known in this art, such as those used for coils or conductive elements in electromagnetic devices, may also be used without departing from the teachings of this invention. Insulation may also be used around or between the conductive elements and / or leads if a particular application is required.

[0026] The lead wire portion can be aligned along a generally straight path or placed generally along the same plane and can have a selected height and width.

[0027] Leads and conductive elements can be formed simultaneously during the manufacturing process. Conductive elements do not necessarily have to be joined to leads by means such as fusion bonding.

[0028] By applying the teachings described herein, an electromagnetic device can be formed having multiple thicknesses of conductive material provided as a single, continuous, or uniform element.

[0029] The increased thickness of the coil area or conductive elements partially contributes to reducing the DC resistance (DCR) of the inductor.

[0030] The reduced thickness on the external portions (such as the lead portions) makes lead formation easier. Furthermore, the lead portions formed according to the present invention increase the solderable surface area of ​​the lead portions by improving the mounting stability of the component, and further enhance shock and vibration performance. Additionally, the formed lead portions improve heat transfer between the electromagnetic device and, for example, the circuit board or printed circuit board (PCB) on which the device is mounted. Simple Explanation of the Diagram

[0031] The aforementioned features and many accompanying advantages of the present invention will become more readily understood, as these features and advantages become better understood when taken in conjunction with the accompanying drawings and the following detailed description, in which:

[0032] [Figure 1A] An isometric view illustrating the electromagnetic device in partial transparency according to one aspect of the present invention;

[0033] [Figure 1B] illustrates a top view of the electromagnetic device in partial transparency according to one state of the present invention, as shown in Figure 1A;

[0034] [Figure 1C] Explains a side view of the electromagnetic device in partial transparency according to one state of the present invention, as shown in Figure 1A;

[0035] [Figure 2A] An isometric view illustrating the electromagnetic device in a partially transparent state according to one embodiment of the present invention;

[0036] [Figure 2B] illustrates a top view of the electromagnetic device in partial transparency according to one state of the present invention, as shown in Figure 2A;

[0037] [Figure 2C] Explains a side view of the electromagnetic device in partial transparency according to one state of the present invention, as shown in Figure 2A;

[0038] [Figure 3] A flowchart illustrating a method for manufacturing a multi-thickness template and an electromagnetic device according to one aspect of the present invention;

[0039] [Figure 4] illustrates a metal sheet made of conductive material according to the present invention;

[0040] [Figure 5A] illustrates a multi-thickness metal sheet according to one aspect of the present invention;

[0041] [Figure 5B] Explanation of the side view of the multi-thickness metal sheet in Figure 5A;

[0042] [Figure 6] illustrates a multi-thickness template according to one state of the present invention;

[0043] [Figure 7] illustrates a multi-thickness template according to the present invention, wherein the main body is formed around the area of ​​the template;

[0044] [Figure 8] illustrates a multi-thickness template according to one state of the present invention;

[0045] [Figure 9] A flowchart illustrating a method for manufacturing a multi-thickness template and an electromagnetic device according to one aspect of the present invention;

[0046] [Figure 10] illustrates a blade used in a scraping process to form metal sheets of varying thicknesses;

[0047] [Figure 11] A flowchart illustrating a method for manufacturing a multi-thickness template and an electromagnetic device according to one aspect of the present invention;

[0048] [Figure 12] illustrates a template according to one aspect of the present invention;

[0049] [Figure 13] A detailed view illustrating a multi-thickness template with a planarized lead portion according to one embodiment of the present invention;

[0050] [Figure 14] An isometric view illustrating one aspect of the electromagnetic device according to the present invention;

[0051] [Figure 15] An isometric view illustrating an electromagnetic device or template according to one aspect of the present invention; and

[0052] [Figure 16] illustrates a template of one state according to the present invention. Implementation

[0053] Certain terms used in the following description are for convenience only and are not restrictive. The terms "right side," "left side," "top," and "bottom" indicate orientation in the drawing, to which the reference document is made. Unless otherwise specified, the terms "a" and "an" as used in the claims and the corresponding sections of this specification are defined to include one or more of the referenced items. This term includes the specifically mentioned above, its derivatives, and words with similar meanings. The phrase "at least one" following "two or more items such as A, B, or C" means any single item of A, B, or C and any combination thereof. Note that some drawings are shown with partial transparency only for illustrative, explanatory, and demonstrable purposes and are not intended to indicate that the elements themselves will be transparent in their final manufacturing process.

[0054] Figures 1A to 1C illustrate examples of an electromagnetic device 100 that can be formed in one form according to the present invention, including a conductive element 150 having a selected shape. The conductive element may also be referred to as a "coil" or a "coil region". In the specific examples shown in Figures 1A to 1C, when viewed in the orientation shown in Figures 1A and 1B or viewed from above or below, the conductive element 150 includes a serpentine or zigzag conductive element provided as an "S" conductive element, an "S-shaped" conductive element, or an "S-conductive element". A first curved portion C1 has a first end 152 and a second end 153 extending adjacent to one of the leads 140a (also referred to as a "lead portion"), and the first curved portion C1 bends around the center of the conductive element 150. A second curved portion C2 has a first end 155 and a second end 154 extending from the other of the leads 140b (also referred to as "lead portions"), and the second curved portion bends around the center of the conductive element 150 in a direction opposite to that of the first curved portion C1. Each curved portion forms an arc around the center of the conductive element 150. Each curved portion can extend along a circumferential path around the central region of the device. A similar shape configuration of the electromagnetic device is shown and described in U.S. Patent No. 10,854,367, the entire contents of which are incorporated herein by reference as if fully set forth herein. The conductive element 150 has a central portion 151 that passes generally diagonally through and extends between the second ends 153 and 154, connecting the second ends 153 and 154, and preferably passes through the central region of the conductive element. The central portion 151 is generally straight.

[0055] The S-shaped conductive element, or "S"-shaped, illustrates one aspect of the invention. Other configurations are also considered, including arc-shaped, Z-shaped, or N-shaped conductive element configurations. Curved or straight conductive elements are also considered and are within the scope of the invention. A conductive element configuration extending along a meandering path between leads is considered a "serpentine" conductive element, in which a portion of the conductive element passes through the centerline or central portion of the conductive element or electromagnetic body. For example, and not limitingly, S-shaped conductive elements, Z-shaped conductive elements, N-shaped conductive elements, and other shaped conductive elements having a meandering path from one lead to another are considered "serpentine" conductive elements. The shape of the conductive element 150 can be designed to optimize the path length to fit the available space within the electromagnetic body, while minimizing resistance and maximizing inductance. The shape can be designed to increase the ratio of used space to available space within the electromagnetic body. In a specific embodiment of the invention, the conductive element 150 has a top or upper surface that is preferably flat and substantially oriented in a plane. A serpentine conductive element can be considered as a coil or coil region, but it is distinct from a "wound" conductive element formed by a wire or conductive material that is wound around and surrounds the central portion or axis of an electromagnetic core.

[0056] As shown in Figures 1A to 1C, the illustrated electromagnetic device 100 has: a length L1 extending along an X1-X2 axis or direction, wherein X1 is guided in a first direction and X2 is guided in a second direction opposite to the first direction; a length L2 extending along a Y1-Y2 axis or direction, wherein Y1 is guided in a third direction and Y2 is guided in a fourth direction opposite to the third direction; and a first thickness H1 (or height, when viewed from the side as shown in Figure 1C), extending along a Z1-Z2 axis or direction, wherein Z1 is guided in a fifth direction and Z2 is guided in a sixth direction opposite to the fifth direction. For ease of reference, the Z1-Z2 axis is referred to as the "thickness". For ease of reference, one or more regions of the conductive element having increased thickness or height may be referred to as "thickness-increased regions".

[0057] According to one embodiment of the present invention, and as shown in FIG1C, the conductive element 150 has a thickness-increasing region 159, which has a first thickness T1 increasing along the Z1-Z2 axis as shown in FIG1C, compared to the second thickness T2 and the third thickness T3 of the conductive material portions such as leads 140a and 140b, and includes lead portions 156 and 157 positioned adjacent to the outer ends 174 and 175 of the conductive element 150. In this configuration, the conductive element 150, which is substantially "S"-shaped, includes the thickness-increasing region 159. It should be understood that a portion of the conductive element having the thickness-increasing region may also be smaller than the entire conductive element having the "S" shape. For example, the conductive element may be formed having a thicker portion and a thinner portion, wherein each of the thicker portions includes the thickness-increasing region. In this configuration, lead 140a has a thickness T2 along substantially the entire length of lead 140a, and lead 140b has a thickness T3 along substantially the entire length of lead.

[0058] As shown in Figures 1A to 1C, in one embodiment of the present invention, an finished electromagnetic device such as inductor 100 may include a body 133, also referred to as a core body, which is partially transparent and formed around at least a portion of the conductive element and leads, pressed over at least a portion of the conductive element and leads, or otherwise enclosing or surrounding the conductive element and at least the leads. The body may be formed as a first body portion 110 and a second body portion 120. The first body portion 110 and the second body portion 120 enclose portions of the conductive element 150 and leads 140a and 140b, and are formed by pressing around or otherwise accommodating or surrounding portions of the conductive element 150 and leads 140a and 140b to form the finished inductor 100. When compressed around the conductive element and lead portion, the first body portion 110 and the second body portion 120 may include and be considered as a single, monolithic compressed body, and may be simply referred to as the "body" or alternatively the "core body".

[0059] The body 133 may be formed of a magnetic material comprising iron, and may be formed having an upper or top surface 134 and an opposite lower or bottom surface 135, a first side 136 and an opposite second side 137, a first lateral side 170 adjacent to the first lead 140a, and an opposite second lateral side 172 adjacent to the second lead 140b. The body may comprise, for example, iron, metal alloys and / or ferrites, combinations of such materials, or other materials known in electromagnetic device technology and used to form such a body. The first body portion 110 and the second body portion 120 may comprise powdered iron or similar materials. Other acceptable materials known in electromagnetic device technology may be used to form the body or body portions, such as known magnetic materials. For example, a magnetic molding material can be used for the body, comprising powdered iron, fillers, resin, and lubricant, as described in U.S. Patent Nos. 6,198,375 ("Electro-magnetic conductive element structure") and 6,204,744 ("High current, low profile inductor"), the entire contents of which are incorporated herein by reference as if fully set forth herein. The body 133 may be formed from a magnetic material powder comprising one or more of the following materials: iron, iron alloys, and / or ferrites and / or combinations thereof. The body 133 may comprise, for example, iron, metal alloys or ferrites, combinations of such materials, or other materials known in inductor technology and used to form such bodies. Each of the materials listed or referenced in U.S. Patent Nos. 6,198,375 and 6,204,744, including any combination thereof and any equivalents known in such related art, is generally referred to as the “core material” or “core material”. Although the first body portion 110 and the second body portion 120 are considered to be formed in a similar manner and have the same core material, the first body portion 110 and the second body portion 120 may be formed using different processes and from different core materials, as known in the art.

[0060] The region of conductive material located between the increased thickness region T1 of the body 133 and the outer lateral sides 170, 172 can be considered as the starting portion or component of leads 140a and 140b, or as a transitional portion of conductive element 150 having a smaller thickness or height extending between the increased thickness regions to each of the lateral sides 170, 172. For ease of reference, this region is referred to as the first internal lead portion 156 and the second internal lead portion 157, and these portions will be contained within or otherwise surrounded by the body 133, as further described.

[0061] The first main body portion 110 and the second main body portion 120 surround the conductive element and leads, and can be pressed or overmolded around the conductive element 150, initially leaving the leads 140a and 140b exposed until they are folded under the first main body portion 110, as shown in the examples of Figures 1 and 2 in a partially transparent final state. In the finished electromagnetic device or "component", each lead 140a and 140b may have portions extending along the side or side surface of the first main body portion 110 or otherwise, as shown in Figures 1A to 1C. The first lead 140a may terminate at a surface adhesive contact portion 130a, and the second lead 140b may terminate at a surface adhesive contact portion 130b, each bent below the lower surface 135 of the body 133 of the first main body portion 110, as shown in Figures 1A to 1C.

[0062] Consideration has been given to the possibility of forming an electromagnetic device according to the invention without a core body, such as in the case where the leads are bent to form surface-adhesive terminals. An example is shown in FIG. 14. A similar device without a core body in which the leads are straight or unbent and extend straight outward from the conductive element or at an angle is shown in FIG. 15. Thus, FIG. 14 and FIG. 15 show examples of finished electromagnetic devices that may include conductive elements and lead portions of multiple thicknesses as described without any core material or core body surrounding those elements. Electromagnetic device 100' may include a conductive element 150' having a serpentine shape. A first curved portion C1' has a first end 152' and a second end 153' extending adjacent to one of the leads 140a' (also referred to as the "lead portion"), the first curved portion C1' being bent around the center of the conductive element 150'. The second curved portion C2' has a first end 155' and a second end 154' extending from the others in the lead 140b' (also referred to as "lead portions"), and the second curved portion bends around the center of the conductive element 150' in the opposite direction to the first curved portion C1'. Each curved portion forms an arc shape around the center of the conductive element 150'. The curved portions can each extend along a circumferential path around the central region of the device. The conductive element 150' has a central portion 151' that passes through and extends substantially diagonally between the second ends 153' and 154' and connects the second ends 153' and 154', and preferably passes through the central region of the conductive element. The central portion 151' is substantially straight. The first internal lead portion 156' is positioned adjacent to the first end 152'. The second internal lead portion 157' is positioned adjacent to the first end 155'. The conductive element 150' has a thickness-increased region 159'. In Figure 15, leads 140a' and 140b' are shown extending straight outward from conductive element 150'. In Figure 14, leads 140a' and 140b' are bent to form surface-adhesive lead portions 130a' and 130b'. In Figure 15, conductive element 150' has a thickness-increased region with an increased first thickness TH1B compared to the second thickness TH2B located near the outer end 174' and the third thickness TH3B located near the outer end 175'.

[0063] Leads 140a and 140b may each have the same or substantially the same uniform thickness along their entire length.

[0064] In another embodiment of the invention, Figures 2A to 2C illustrate an example of an electromagnetic device 200 comprising a shaped conductive element 250, which can be formed according to one embodiment of the invention. In the illustrative device shown in Figures 2A to 2C, when viewed from top as in Figure 2B, the conductive element 250 comprises a substantially straight conductive element provided as an "I" or "H" shaped conductive element, or a conductive element having a "barbell" shape. This conductive element can be further regarded as or referred to as a coil. In this configuration, the central portion 252 of the conductive element 250 has a width W1 along the Y1-Y2 axis or direction as examined in Figures 2A to 2C, the first side portion 253 has an outer width W2 along the Y1-Y2 axis or direction as examined in Figures 2A to 2C that is greater than the width W1, and the second side portion 254, located on the side of the device 200 opposite to the first side portion 253, has an outer width W3 along the Y1-Y2 axis or direction as examined in Figures 2A to 2C that is greater than the width W1 and may be the same as the width W2. The conductive element 250 may have a generally rectangular shape located between the first side portion 253 and the second side portion 254.

[0065] As shown in Figures 2A to 2C, according to one embodiment of the present invention, compared to the second thickness T2' and third thickness T3' of other portions of the conductive material at the outer ends 274 and 275 of the adjacent conductive element 250, the conductive element 250 has a thickness-increasing region 259 having a first thickness T1' that increases along the Z1-Z2 axis or direction shown in Figure 2C. Other portions of the conductive material include lead portions such as the first internal lead portion 255 and the second internal lead portion 257. In this configuration, the conductive element as a whole, substantially having a "barbell" shape, can have an increased first thickness T1'. It should be understood that a portion of the conductive element having the thickness-increasing region can also be smaller than the entire conductive element having a "barbell" shape. Note that the conductive element 250 is not wound around an axis.

[0066] Although the finished electromagnetic device according to the present invention can be formed without a core body, as shown in Figures 2A to 2C, in one embodiment of the present invention, the finished electromagnetic device 200, such as an inductor, may include a body 233 or a core body, which partially reveals the components formed around, pressed over, or otherwise encased or surrounded by the conductive elements 250 and at least the leads 240a and 240b with partial transparency. The body 233 may also be formed having an upper or top surface 234 and a corresponding lower or bottom surface 235, a first side surface 236 and a corresponding second side surface 237, a first lateral side 270 adjacent to the first lead 240a (or "lead portion"), and a corresponding second lateral side 272 adjacent to the second lead 240b (or "lead portion"). The main body can be formed as a first main body portion 210 and a second main body portion 220. The first main body portion 210 and the second main body portion 220 enclose portions of conductive elements 150 and leads 240a and 240b, are pressed around portions of conductive elements 150 and leads 240a and 240b, or otherwise accommodate components of conductive elements 150 and leads 240a and 240b to form an finished inductor 200. When compressed around portions of conductive elements and leads, the first main body portion 210 and the second main body portion 220 can be considered as a single, monolithic compressed body formed from one or more core materials.

[0067] The first main body portion 210 and the second main body portion 220 surround the conductive element and leads, and can be pressed or overmolded around the conductive element 250, initially leaving the leads 240a and 240b exposed until they are folded under the first main body portion 210, as shown in the examples of Figures 2A to 2C in their partially transparent final state. In the finished electromagnetic device or "component", each lead 240a and 240b can extend along the sides 270 and 272 of the first main body portion 210, as shown in Figures 2A to 2C. The first lead 240a can be terminated with the first contact portion 230a, and the second lead 240b can be terminated with the second contact portion 230b, each contact portion being bent below the lower surface 235 of the body 233 of the first main body portion 210, as shown in Figures 2A to 2C.

[0068] The following describes, with the aid of examples, a method for fabricating an electromagnetic device or a similar electromagnetic device having multi-thickness elements as illustrated in Figures 1A to 2C or Figures 14 to 16, or a multi-thickness template or similar electromagnetic device that can be used to form an electromagnetic device as illustrated in Figures 1A to 2C, 1A to 2C, or 14 to 16. In some cases, the template may be formed as a lead frame.

[0069] In one embodiment of the present invention, a method for manufacturing an electromagnetic device is illustrated by means of the flowchart provided in FIG3.

[0070] At step 1010, a conductive material is provided. The conductive material may be heated to form a molten conductive material to be shaped as described herein. Examples of conductive materials that may be used include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys thereof. Examples of conductive materials that may be used further include conductive materials provided in the form of wires, such as copper wire, aluminum wire, and platinum wire.

[0071] At step 1012, conductive material is extruded via a metal extrusion process to form a multi-thickness sheet, such as extruding heated or molten conductive material through an opening of a selected shape. The extrusion process may involve forcing a conductive material, such as metal, which is nearly molten or heated, through a die having a desired profile or shape. Figures 5A and 5B illustrate a multi-thickness sheet 310 having: a central region 312 having a thickness-increasing region 314 having an increased first thickness TH1; a first outer portion 316 adjacent to a first side 318 of the thickness-increasing region 314 having a second thickness TH2 less than the thickness TH1; and a second outer portion 320 adjacent to a second side 329 of the thickness-increasing region 314 having a third thickness TH3 less than the thickness TH1. As shown, the first outer portion 316 and the second outer portion 320 may be located on opposite sides of the thickness-increasing region 314. The multi-thickness sheet 310 is used to form a template, as further described.

[0072] At step 1014, a multi-thickness sheet 310 can be plated using electroplating or a similar process, with nickel as the first layer and tin coated on top of the nickel as the second layer. Known plating methods are available for coating nickel and tin layers. These layers provide increased solderability.

[0073] At step 1016, the multi-thickness sheet 310 is stamped or otherwise processed or shaped to form a multi-thickness template 322 for an electromagnetic device, as shown in Figures 1A to 1C. Figure 6 illustrates a multi-thickness template 322 with conductive elements 150 according to the configuration illustrated in Figures 1A to 1C; however, it should be understood that conductive elements of various shapes may be formed without departing from the teachings herein. When stamped or otherwise processed, the template 322 includes a thickness-increasing region associated with a thickness-increasing region 314 having an increased thickness TH1 for forming the multi-thickness sheet 310 of the template 322. The conductive elements 150 may be located in the center or inner region of the template.

[0074] Although Figure 6 illustrates more than one conductive element by way of example, a template may be provided in which only a single conductive element is provided. Alternatively, a template may be used to provide more than two or any number of conductive elements.

[0075] It should be noted that steps 1014 and 1016 can be performed in any order. For example, the multi-thickness sheet 310 can be formed into a multi-thickness template 322 according to step 1016, and it is plated according to step 1014.

[0076] As shown in Figure 6, template 322 includes leads 140a and 140b connected to conductive element 150, wherein the regions forming leads 140a and 140b are associated with a first outer portion 316 having a thickness TH2 and a second outer portion 320 having a third thickness TH3. Therefore, leads 140a and 140b each have a thickness less than the increased thickness TH1 of conductive element 150. The first inner lead portion 156 and the second inner lead portion 157 adjacent to conductive element 150 allow for easy formation of leads, such as by bending. Due to the reduced thickness of the leads, these regions are more easily bent and surface-adhesive leads formed without breakage or fracture. As shown in Figures 1B and 6, leads 140a and 140b may have a width along the Y1-Y2 axis or direction less than the width of conductive element 150.

[0077] As shown, for example, in Figures 1A to 1C and Figure 6, the first internal lead portion 156 of the first lead 140a and the second internal portion 157 of the second lead 140b may have a width (along the Y1-Y2 axis or direction) that is narrower than or smaller than the width of other portions of the leads 140a and 140b, such as the first surface-adhesive contact portion 130a and the second surface-adhesive contact portion 130b.

[0078] The upper surface of the conductive element 150 may be formed such that it is substantially in or along a plane. The lower surface of the conductive element 150 may be formed such that it is substantially in or along a plane. The upper or lower surface of the conductive element may be substantially flat.

[0079] Leads 140a, 140b may be formed to have upper or lower surfaces that are substantially located in or along a plane. The upper or lower surfaces of leads 140a, 140b may be substantially flat.

[0080] As shown in Figure 6, the template 322 can be formed as a lead frame, and at least first and second carrier strips 324, 326 may be included in the relatively outer portions of the lead frame 322. The carrier strips 324, 326 may have progressive holes 328 for alignment with manufacturing equipment. The carrier strips 324, 326 can therefore be considered as present as appropriate.

[0081] It should be noted that the conductive element 150, leads 140a, 140b, and carrier strips 324, 326 (if present) are formed from the same conductive material, which has been pre-shaped to provide a conductive element 150 with an increased thickness relative to the leads 140a, 140b. The conductive element 150 is formed in a pre-selected shape without winding or rotating metal strips or wires. No part of the conductive element 150 passes above or below another part of the conductive element 150. The inductance of the electromagnetic device according to the teachings herein can be adjusted, for example, by changing the thickness, width, shape, or other dimensions of the conductive element; changing the core material; increasing or decreasing the thickness of the core material; changing the density of the core material, such as by thermal or cold pressure; and / or positioning the conductive element within the core body.

[0082] It should be further noted that Figure 15 can also be seen as a template for an electromagnetic device that can be further formed, for example, by trimming or bending leads 140a' and 140b'. In this example, the template is formed by stamping a conductive material of multiple thicknesses into the shape shown in Figure 15.

[0083] In step 1018, if the device will have a core body, one or more core materials, preferably comprising iron and / or ferrite powder, are pressed around the portions of the conductive element 150 and leads 140a, 140b, including the first internal lead portion 156 and the second internal lead portion 157, to form a body 133. To form the body 133, a plated template 322 can be inserted into a press press, wherein one or more core materials are pressed in a desired shape around the coil portion of the lead frame, such as, for example, a generally rectangular shape; however, for illustration purposes, the shape may include rounded corners or edges. Figure 7 illustrates a template 322 with a partially transparent view of the body 133, and shows the body formed around the portions of the conductive element 150 and leads 140a, 140b. It should be noted that if the electromagnetic device will be formed without a core body, step 1018 may be present as appropriate.

[0084] In step 1020, the portion of the template adjacent to the lead is trimmed to a selected size and placed around the body 133 to form surface-mount leads, as required by modern circuit board assembly processes. At least a portion of each of leads 140a and 140b is positioned along the side surface of the body 133, and at least the end portions 130 of leads 140a and 140b are bent below a portion of the bottom surface 135 of the body 133 and positioned along a portion of the bottom surface 135 of the body 133. An example of the finished electromagnetic device 100 is shown in FIG1A, as previously described.

[0085] Figure 8 illustrates a template 330 that can be formed according to the steps described in Figure 3 and is associated with the electromagnetic device having conductive element 250 shown in Figures 2A to 2C. As shown in Figure 8, when viewed from top, the template 330 includes conductive element 250, which comprises a straight conductive element provided in the shape of an "I" or "H" or a conductive element having a "barbell" shape. The template can be formed following the steps outlined in Figure 3 and described above. At step 1016, the selected shape of the conductive element 250 is shown in Figures 2A to 2C.

[0086] As shown in Figure 8, template 330 includes conductive element 250 and leads 240a and 240b. If template 330 is formed as a lead frame, carrier strips 332 and 334 may be provided, for example. Conductive element 250 and leads 240a and 240b are all formed from the same single conductive material. Carrier strips 332 and 334 may have progressive holes 336 for alignment with manufacturing equipment. Conductive element 250 may be formed with a thickness-increased region 280 having a thickness TH1a. First lead 240a has a thickness TH2a, and second lead 240b has a third thickness TH3a. Therefore, leads 240a and 240b each have a thickness less than the increased thickness TH1a of conductive element 150. The first inner lead portion 255 and the second inner lead portion 257 adjacent to conductive element 150 have reduced thickness, thereby allowing for easy formation of leads, such as by bending. Because the leads have a reduced thickness, these areas are more easily bent and form surface-adhesive leads without breakage or fracture. As shown, for example, in Figures 2B and 8, the first internal lead portion 255 and the second internal lead portion 257 may have a width (along the Y1-Y2 axis or direction) narrower than or smaller than the width of other portions of leads 240a, 240b, such as the first surface-adhesive contact portion 230a or the second surface-adhesive contact portion 230b.

[0087] The scraping or cutting process can also be used to manufacture electromagnetic devices according to the present invention. The scraping process uses a cutting blade to scrape away the material.

[0088] In one embodiment of the invention, a method for manufacturing an electromagnetic device is illustrated by means of a flowchart provided in FIG. 9. At step 2010, a sheet of conductive material is provided as a starting material, which may be formed from a conductive material, such as through a rolling or pressing process. FIG. 4 illustrates an exemplary conductive material sheet 300. The term "sheet" is also used to capture the concept of a sheet, plate, or strip of conductive material to be used as a starting material for forming the template of the invention. Preferably, the conductive material sheet 300 comprises a metal such as copper. Examples of conductive materials that can be used to form the sheet 300 include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys thereof. The thickness of the metal sheet can be selected such that the thickness increases with the thickness of the conductive element to be formed from the sheet. Further consideration is that the conductive material may be formed or provided as, or may be initiated as, rods, wires, or other configurations or shapes that can be processed or formed according to the teachings herein without departing from the embodiment of the invention. Therefore, although a thin sheet is used as an example, other conductive materials with other shapes can be used to form electromagnetic devices such as those shown and described.

[0089] At step 2012, a scraping process is performed, thereby cutting the sheet with a blade to form a multi-thickness sheet 410.

[0090] Figure 10 illustrates a cutting blade 437 with a raised central cutting portion 439 during the process of cutting a conductive material sheet to form a multi-thickness sheet 410. The resulting multi-thickness sheet 410 has: a central region 412, which is provided as a thickness-increasing region with an increased thickness; a first outer portion 416, adjacent to a first side 418 of the thickness-increasing region 414, having a second thickness less than that of the central region 412; and a second outer portion 420, adjacent to a second side 422 of the thickness-increasing region 414, having a third thickness less than that of the central region but equal to that of the first outer portion 416. As shown, the first outer portion 416 and the second outer portion 420 may be located on opposite sides of the thickness-increasing region 414. The multi-thickness sheet 410 is used to form a template, as further described.

[0091] At step 2014, a multi-thickness sheet can be plated using nickel as the first layer and then tin on top of the nickel as the second layer, either by electroplating or a similar process.

[0092] At step 2016, a multi-thickness sheet 410 is stamped or otherwise processed to form a multi-thickness template for use in an electromagnetic device, as shown in Figures 1A to 1C. At this stage, the process provides a multi-thickness template as shown in Figure 6.

[0093] In step 2018, one or more core materials, preferably comprising iron and / or ferrite powder, are pressed around the portions of the conductive element and leads, including the first internal lead portion and the second internal lead portion, to form a body. At this stage, Figure 7, as previously discussed, illustrates the body 133 formed around the portion of the template. If the core body is not desired, step 2018 may be present as appropriate.

[0094] In step 2020, the portion of the template adjacent to the lead is trimmed to a selected size and positioned around the body to form a surface-mount lead, as required by modern circuit board assembly processes. At least a portion of each lead is positioned along the side surface of the body, and at least the end portion of the lead is bent below a portion of the bottom surface of the body and positioned along a portion of the bottom surface of the body. The illustrative final electromagnetic device 100 is shown in FIG. 1A, as previously described.

[0095] The described scraping process can also be used to form electromagnetic designs with the configurations illustrated in Figures 2A to 2C. The described scraping process can also be used to form conductive elements with various shapes, sizes, orientations, and / or configurations.

[0096] Forging and / or pressing and / or planarization processes can also be used to form the electromagnetic device according to the present invention.

[0097] In one embodiment of the present invention, a method for manufacturing an electromagnetic device is illustrated by means of the flowchart provided in FIG11. In step 3010, a sheet of conductive material is provided as a starting material. The sheet 300 shown in FIG4 illustrates this exemplary conductive material sheet.

[0098] At step 3012, a sheet may be plated using electroplating or a similar process, with nickel as the first layer and tin on top of the nickel as the second layer. In this configuration, the sheet has a uniform thickness at this stage of the process. Thickness refers to the increased thickness of the conductive element, as discussed further.

[0099] In step 3014, a stamping or other processing procedure is performed to form a template of uniform thickness.

[0100] Figure 12 illustrates a template 500 in the forming process, which includes a shaped conductive element 520, a first lead 530a, and a second lead 530b, all formed from the same single conductive material piece forming the sheet. If the template 500 is formed as a lead frame, carrier strips 540 and 542 can be provided. The carrier strips 540 and 542 may have progressive holes 544 for alignment with manufacturing equipment.

[0101] To obtain a multi-thickness template, in step 3016, the first lead 530a and the second lead 530b, or portions of each of these leads, are planarized, for example, by forging or pressing.

[0102] Figure 13 illustrates a detailed view of a portion of template 500, wherein the first lead 530a and the second lead 530b are planarized or compressed, thereby providing leads with a reduced thickness compared to the thickness of conductive element 520. Various processes such as stamping, molding, roll forming, or grinding can be used to produce the reduced thickness portion.

[0103] After planarizing the first lead 530a and the second lead 530b, the template 500 has: a conductive element 520 having a central region 512 formed as a thickness-increasing region 514 having the thickness of the original sheet; a first lead 530a having a reduced thickness less than the thickness of the central region 512; and a second lead 530b having a reduced thickness less than the thickness of the central region 512 but the same as the thickness of the first lead 530a. Carrier strips 540 and 542 may have the same thickness as the conductive element 520 if these regions are also not planarized.

[0104] In step 3018, one or more core materials, preferably comprising iron and / or ferrite powder, are pressed around portions of the conductive element 520 and leads 530a, 530b to form a body 546. To form the body 546, a plated template 500 can be inserted into a press press, wherein one or more core materials are pressed in a desired shape around the coil portion of the lead frame, such as, for example, a generally rectangular shape; however, for illustration purposes, the shape may include rounded corners or edges. At this stage, the lead body and frame are similar to the configuration of FIG. 7 previously described. If a core body is not desired, step 3018 may be present as appropriate.

[0105] In step 3020, the portion of the template adjacent to the lead is trimmed to a selected size and placed around the body 546 to form a surface-mount lead, which is required by modern circuit board assembly processes. At least a portion of each of the leads 530a and 530b is positioned along the side surface of the body 133, and at least the end portions of the leads 530a and 530b are bent below a portion of the bottom surface of the body 546 and positioned along a portion of the bottom surface of the body 546.

[0106] Considering the steps used in Figure 11, a template including conductive elements can be formed, which, when viewed from top as in Figures 2A to 2C, include straight conductive elements provided as "I" or "H" shaped conductive elements or conductive elements having a "barbell" shape.

[0107] Furthermore, conductive elements with increased thickness regions can be formed starting with a template of substantially uniform thickness, such as that shown in Figure 12, and the conductive element 520 can be built up by plating. For example, copper plating can be applied over or on top of the conductive element 520 until a certain thickness is achieved. This "building" process can be achieved by, for example, 3D printing plating materials or by other methods known in the metalworking industry (such as sputtering) to deposit metal onto the conductive element 520.

[0108] The methods described herein can also be used to form electromagnetic devices having shaped conductive elements with a reduced thickness compared to one or more of the leads. For example, referring to FIG. 3, as in step 1012, an extrusion process can form a multi-thickness sheet, wherein the central portion of the sheet has a reduced thickness, and the outer sides of the sheet have a greater thickness than the central portion. By other examples, referring to FIG. 9, at step 2012, a scraping process can form a multi-thickness sheet, wherein the central portion of the sheet has a reduced thickness, and the outer sides of the sheet have a greater thickness than the central portion. By other examples, referring to FIG. 11, at step 3016, a planarization process can planarize the conductive element instead of the leads, thereby producing a conductive element with a reduced thickness compared to the leads.

[0109] Therefore, as illustrated, with the example in Figure 16, the template 700 is stamped from a conductive material of uniform thickness, such as the sheet shown in Figure 4. Stamping or other forming processes form a conductive element 750, which can be a serpentine conductive element, along with first leads 740a and second leads 740b, all formed from the same conductive material. In this configuration, the conductive element 750 is stamped, pressed, forged, or scraped to produce an electromagnetic device with a reduced thickness compared to leads 740a and 740b. The conductive element 750 can be serpentine, barbell-shaped, or another selected shape, and can be generally flat, having one or more surfaces along or in a plane. Leads 740a and 740b can be bent or trimmed as known in the art or as described herein. A core body can be molded around portions of the conductive element 750 and the leads.

[0110] The conductive material or sheet of conductive material can be formed such that the region to be formed of the conductive element can have a different hardness than the region to be formed of the first lead portion or the second lead portion. For example, the first portion of the conductive material can have a first hardness (e.g., semi-hard), and the second portion of the conductive material can have a second hardness (e.g., annealed softness). Alternatively, the first portion of the conductive material can have a first hardness (e.g., Vickers hardness 100 HV10), and the second portion of the conductive material can have a second hardness (e.g., Vickers hardness 30 HV10).

[0111] It should be understood that the surfaces of the conductive elements and / or leads described herein may be slightly or slightly rounded, bowed, or wavy based on the manufacturing process used to form the conductive elements, and the side edges may be rounded, bowed, or wavy. Acceptable metals used to form the conductive elements and leads may be copper, aluminum, platinum, or other metals known in the art for use as electromagnetic conductive elements. As used herein, "flat" means "generally flat," that is, within normal manufacturing tolerances. It should be understood that, based on the manufacturing process used to form the conductive elements, the flat surfaces of the conductive elements and / or leads may be slightly or slightly rounded, bowed, wavy, or wavy, and the side edges may be slightly or slightly rounded, bowed, wavy, or wavy, while still being considered "flat."

[0112] The increased thickness of conductive elements described herein is used to reduce the DC resistance (DCR) of electromagnetic devices, such as inductors containing such conductive elements.

[0113] The templates described herein are provided in multiple thicknesses within a single piece. The templates described herein can also be formed using 3D printing technology.

[0114] The reduced thickness of the lead or lead portion of the template allows for easier lead formation, such as by shaping and / or bending. Additionally, the thinner but wider lead portion provides improved heat transfer during mounting to the circuit board and further enhances mounting strength against impacts and vibrations attributable to the width of the surface-mounted lead or terminal.

[0115] It should be understood that the foregoing is presented by way of illustration only and not by way of limitation. Various substitutions and modifications can be made to the described specific examples without departing from the spirit and scope of the invention. Therefore, since the invention has been described in detail, it should be understood and will be apparent to those skilled in the art that many physical changes can be made without altering the concept of the invention and the principles in which it is practiced; only a few of these physical changes are exemplified in the detailed description of the invention. It should also be understood that numerous specific examples, only a portion of which are preferred embodiments, are possible, with respect to which these specific examples do not alter the concept of the invention and the principles in which it is practiced. Therefore, the specific examples of the invention and the configurations chosen as appropriate are considered in all respects to be illustrative and / or descriptive rather than restrictive, and the scope of the invention is indicated by the appended claims rather than by the foregoing description, and all alternative specific examples and variations of this specific example appearing in the equivalent sense and within the scope of those claims are therefore included therein.

[0116] 100': Electromagnetic device 100: Electromagnetic devices / inductors 110: First Main Body 120: Second Main Body 130: End portion 130a: First surface adhesive contact portion 130a': Surface-mounted lead wire portion 130b: Second surface adhesive contact portion 130b': Surface-mounted lead portion 133: Main Body 134: Top surface 135: Bottom surface 136: First side 137: Second side 140a: Lead wire 140a': Lead wire 140b: Lead wire 140b': Lead wire 150: Conductive element 150': Conductive element 151: Central Part 152: First end 152': First end 153: Second end 153': Second end 154: Second end 154': Second end 155: First end 155': Second end 155': First end 156: Lead wire section / First internal lead wire section 156': First internal lead section 157: Lead wire section / Second internal lead wire section 157': Second internal lead section 159: Thickness Increase Area 159': Thickness Increase Area 170: First transverse side 172: Second transverse side 174: Lateral end 174': Lateral end 175: Lateral end 175': Lateral end 200: Electromagnetic devices / inductors 210: First Main Body 220: Second Main Body 230a: First surface adhesive contact portion 230b: Second surface adhesive contact portion 233: Main Body 234: Top surface 235: Bottom surface 236: First side view 237: Second side view 240a: First lead 240b: Second lead 250: Conductive element 252: Central Part 253: First side view 254: Second side section 255: First internal lead section 257: Second internal lead section 259: Thickness Increase Area 270: First transverse side 272: Second transverse side 274: Lateral end 275: Lateral end 280: Thickness Increase Area 300: Conductive material sheet 310: Multi-thickness thin film 312: Central Area 314: Thickness Increase Area 316: First outer part 318: First Side View 320: Second outer part 322: Multi-thickness template 324: First carrier strip 326: Second carrier strip 328: Progressive aperture 329: Second side view 330: Template 332: Carrier strip 334: Carrier strip 336: Progressive aperture 410: Multi-thickness thin film 412: Central Area 416: First outer part 418: First side view 420: Second outer part 422: Second side view 437: Cutting Blade 439: Central Cut Section 500: Template 512: Central Area 514: Thickness Increase Area 520: Conductive element 530a: First lead 530b: Second lead 540: Carrier strip 542: Carrier strip 544: Progressive aperture 546: Main Body 700: Template 740a: Lead wire 740b: Lead wire 750: Conductive element 1010: Steps 1012: Steps 1014: Steps 1016: Steps 1018: Steps 1020: Steps 2010: Steps 2012: Steps 2014: Steps 2016: Steps 2018: Steps 2020: Steps 3010: Steps 3012: Steps 3014: Steps 3016: Steps 3018: Steps 3020: Steps C1: First curved surface section C1': First curved surface portion C2: Second curved surface section C2': Second curved surface portion H1: First thickness L1: Length L2: Length T1: First thickness T1': First thickness T2: Second thickness T2': Second thickness T3: Third Thickness T3': Third thickness TH1: First Thickness TH1a: Thickness TH2: Second thickness TH2a: Thickness TH2B: Second Thickness TH3: Third Thickness TH3a: Third thickness TH3B: Third Thickness W1: Width W2: Width W3: Width X1-X2: Axis Y1-Y2: Axis Z1-Z2: Axis

Claims

1. A method for manufacturing a multi-thickness electromagnetic device, comprising the steps of: providing a conductive material; forming the conductive material into a multi-thickness sheet by performing an extrusion process, a scraping process, or a planarization process, the multi-thickness sheet including a first portion having a first thickness, a second portion having a second thickness, and a third portion having a third thickness; and forming a multi-thickness template by: forming the first portion of the multi-thickness sheet into a conductive element, the conductive element being configured as a coil portion of an inductor; forming the second portion of the multi-thickness sheet into a first lead portion; and forming the third portion of the multi-thickness sheet into a second lead portion; wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness.

2. The method of request item 1, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness.

3. The method of claim 1, further comprising forming a core body comprising magnetic material surrounding the conductive element, at least a portion of the first lead portion, and at least a portion of the second lead portion.

4. The method of claim 1, wherein the conductive element has a serpentine shape, a generally rectangular shape, an I-shape, an H-shape, or a barbell shape.

5. The method of claim 1, wherein the conductive element, the first lead portion and the second lead portion are formed of a continuous, non-wound conductive material.

6. The method of claim 1, wherein no part of the conductive element passes over or under another part of the conductive element.

7. The method of claim 1, wherein the first lead portion has a thickness that is substantially uniform along the entire length of the first lead portion, and the second lead portion has a thickness that is substantially uniform along the entire length of the second lead portion.

8. The method of claim 1, wherein the first lead portion has a first width adjacent to the conductive element and a second width at the end of the first lead portion, and wherein the second width is different from the first width.

9. The method of claim 1, wherein the second lead portion has a first width adjacent to the conductive element and a second width at the end of the second lead portion, and wherein the second width is greater than the first width.

10. A method for manufacturing an electromagnetic device, comprising the steps of: providing a conductive material; forming the conductive material into a multi-thickness sheet, the multi-thickness sheet comprising a first portion for forming a conductive element having a first thickness, a second portion for forming a first lead portion having a second thickness, and a third portion for forming a second lead portion having a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness; forming a multi-thickness template by: forming the first portion of the multi-thickness sheet as a conductive element, the conductive element being configured as a coil portion of an inductor; forming the second portion of the multi-thickness sheet as a first lead portion; And the third portion of the multi-thickness sheet is formed as the second lead portion; Furthermore, a core material containing magnetic material is pressed around the conductive element and at least a portion of the first lead portion and at least a portion of the second lead portion to form a body.

11. The method of claim 10, further comprising the steps of trimming the first lead portion and trimming the second lead portion.

12. The method of claim 11, further comprising the steps of positioning at least a portion of the first lead portion along the outer surface of the body and extending at least a portion of the first lead portion along the bottom surface of the body, and further comprising the steps of positioning at least a portion of the second lead portion along the outer surface of the body and extending at least a portion of the second lead portion along the bottom surface of the body.

13. The method of claim 10, wherein the step of forming the conductive material into the multi-thickness sheet includes performing an extrusion process.

14. The method of claim 10, wherein the step of forming the conductive material into the multi-thickness sheet includes performing a scraping process.

15. The method of claim 10, wherein the step of forming the conductive material into the multi-thickness sheet includes performing a planarization process.

16. The method of claim 10, wherein the step of forming the conductive material into the multiple thickness sheet comprises stamping the multiple thickness sheet to form the conductive element, the first lead portion and the second lead portion.

17. The method of claim 10, wherein the conductive element has a serpentine shape, a generally rectangular shape, an I-shape, an H-shape, or a barbell shape.

18. The method of claim 10, wherein the conductive element, the first lead portion and the second lead portion are formed of a continuous, non-wound conductive material.

19. The method of claim 10, wherein no part of the conductive element passes over or under another part of the conductive element.

20. The method of claim 10, further comprising the step of plating the conductive material, the multi-thickness sheet, or the multi-thickness template with a nickel or tin layer.

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