Substrate processing system and substrate processing method

Abstract

This invention provides a technique for suppressing pattern collapse formed on a substrate. The substrate processing system of this invention includes a loading / unloading section for loading and unloading a cassette containing a plurality of substrates, a batch processing section for processing a batch containing a plurality of substrates simultaneously with the substrates upright, a single-substrate processing section for processing the batch of substrates one by one in a horizontal state, an interface section for transferring the substrates from the batch processing section to the single-substrate processing section, the interface section including a standby section for horizontally holding the substrate while it is in contact with pure water, and a transport mechanism for transferring the substrates from the batch processing section to the standby section.

Description

Technical Field

[0001] This invention relates to a substrate processing system and a substrate processing method. Prior Technology

[0002] The substrate processing system described in Patent Document 1 includes a batch processing unit and a single-wafer processing unit. The batch processing unit holds semiconductor wafers that have undergone water washing in water. Multiple semiconductor wafers are subjected to chemical treatment while held on a holding stage. A transfer unit picks up the semiconductor wafers one by one from a buffer tank and transfers them to the single-wafer processing unit. The single-wafer processing unit supports the single semiconductor wafer transferred by the transfer unit in a horizontal manner along its main surface and dries the substrate. [Previous Technical Documents] [Patent Literature]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2021-064654 Summary of the Invention

[0004] [The problem the invention aims to solve]

[0005] This invention provides a technique for suppressing pattern collapse formed on substrates such as semiconductor wafers. [Methods for solving problems]

[0006] According to one aspect of the present invention, a substrate processing system includes a loading and unloading section for loading and unloading a cassette containing a plurality of substrates, a batch processing section for processing a batch containing a plurality of substrates together with each substrate in an upright state, a single-substrate processing section for processing the batch of substrates one by one in a horizontal state, and an interface for transferring the substrate from the batch processing section to the single-substrate processing section. The interface has a standby section for horizontally holding the substrate while it is in contact with pure water, and a transport mechanism for transferring the substrate from the batch processing section to the standby section. [Invention Effects]

[0007] Through this invention, the collapse of patterns formed on a substrate can be suppressed. Simple Explanation of the Diagram

[0008] Figure 1 is a schematic top view of the substrate processing system according to the first embodiment. Figures 2(a) and (b) are diagrams showing the second transfer station in the first implementation mode. Figure 3 is a flowchart illustrating the substrate processing method according to the first embodiment. Figure 4 is a schematic three-dimensional diagram showing the movement of the second face. Figure 5 is a schematic three-dimensional diagram showing the movement of the second face. Figure 6 is a schematic three-dimensional diagram showing the movement of the second face. Figure 7 is a schematic three-dimensional diagram showing the movement of the second face. Figure 8 illustrates the operation of the second conveying device. Figures 9(a) to (d) are diagrams illustrating the operation of the second transfer station in the first implementation state (one of them). Figure 10 is a diagram showing the operation of the second transfer station in the first implementation mode (Part 2). Figure 11 is a diagram showing the operation of the second transfer station in the first implementation state (Part 3). Figures 12(a) and (b) are diagrams showing the second transfer station in the second implementation mode. Figure 13 is a schematic perspective view of the second interface of the third embodiment. Figure 14 shows the second transfer station in the fourth implementation. Figure 15 is a diagram showing the operation of the second transfer station in the fourth implementation mode. Figure 16 shows the second transfer station in the fifth embodiment. Figure 17 shows the second transfer station in the sixth embodiment. Figure 18 is a schematic perspective view of the second interface included in the first variant of the first embodiment. Figure 19 is a schematic top view of the substrate processing system according to the second variation of the first embodiment. Implementation

[0009] Hereinafter, with reference to the accompanying drawings, non-limiting exemplary embodiments of the present invention will be described. In the accompanying drawings, the same or corresponding components or parts are labeled with the same or corresponding reference numerals, and repeated descriptions are omitted.

[0010] [First Implementation Example] First, the first embodiment will be described. The first embodiment relates to a substrate processing system.

[0011] (Substrate processing system) Referring to FIG1, a substrate processing system according to an embodiment is described. As shown in FIG1, the substrate processing system 1 according to the first embodiment includes a transfer and loading unit 2, a first interface 3, a batch processing unit 4, a second interface 5, a single-wafer processing unit 6, and a control device 9.

[0012] The loading / unloading section 2 serves as both a loading section and a loading / unloading section. Therefore, the substrate processing system 1 can be miniaturized. The loading / unloading section 2 includes a loading port 21, a storage container 22, a loader 23, and a box handling device 24.

[0013] Loading ports 21 are located on the negative side of the loading / unloading section 2 along the X-axis. A plurality of loading ports 21 (e.g., 4) are arranged along the Y-axis. However, the number of loading ports 21 is not particularly limited. A case C is placed in the loading port 21. The case C holds a plurality of substrates W (e.g., 25 pieces) and moves them into or out of the loading port 21. Inside the case C, the substrates W are horizontally held and vertically held at a second interval P2 (P2 = N × P1) that is N times the first interval P1. N is a natural number of 2 or more; in this embodiment, it is 2, but it can also be 3 or more.

[0014] A plurality of storage units 22 are arranged (e.g., 4) along the Y-axis direction at the center of the X-axis direction of the loading / unloading section 2. A plurality of storage units 22 are arranged adjacent to the first interface section 3 along the Y-axis direction on the positive side of the loading / unloading section 2 in the X-axis direction (e.g., 2). Multiple storage units 22 may also be arranged in the vertical direction. The storage unit 22 temporarily stores and holds a case C containing the substrate W before cleaning, and a case C emptied after the substrate W is removed. Furthermore, the number of storage units 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface 3 and positioned on the X-axis side of the loading / unloading section 2. The loader 23 holds the case C. The loader 23 is provided with a cover opening / closing mechanism (not shown) for opening and closing the cover of the case C. Multiple loaders 23 may be provided. Multiple loaders 23 may also be arranged vertically.

[0016] The box handling device 24 is, for example, a multi-joint handling robot. The box handling device 24 moves the box C between the loading port 21, the storage container 22 and the loader 23.

[0017] The first interface 3 is positioned on the positive side of the transfer-in / transfer-out section 2 along the X-axis. The first interface 3 transports substrates W between the transfer-in / transfer-out section 2, the batch processing section 4, and the single-wafer processing section 6. The first interface 3 includes a substrate transfer device 31, a batch forming section 32, and a first transfer table 33.

[0018] The substrate transfer device 31 transports substrates W between the cassette C placed in the loader 23, the batch forming unit 32, and the first transfer table 33. The substrate transfer device 31 is composed of a multi-axis (e.g., 6-axis) robotic arm, with a substrate holding arm 31a at its front end. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of substrates W (e.g., 25 substrates). The substrate holding arm 31a can be positioned and oriented arbitrarily in three-dimensional space while holding the substrates W using the holding claws.

[0019] The batch forming section 32 is disposed on the positive side of the first interface section 3 in the X-axis direction. The batch forming section 32 holds a plurality of substrates W at a first interval P1 and forms a batch L.

[0020] The first transfer table 33 is adjacent to the single-chip processing unit 6 and is located on the positive side of the first interface 3 in the Y-axis direction. The first transfer table 33 receives the substrate W from the fourth transport device 61 and temporarily stores it before transferring it to the transfer-out and transfer-in unit 2.

[0021] The batch processing unit 4 is positioned on the positive side of the first interface surface 3 in the X-axis direction. That is, the transfer-in / extraction unit 2, the first interface surface 3, and the batch processing unit 4 are arranged in this order from the negative side of the X-axis direction to the positive side of the X-axis direction. The batch processing unit 4 processes a batch L containing a plurality of substrates (e.g., 50 or 100) at a first interval P1. A batch L is, for example, composed of substrates W in M ​​boxes C. M is a natural number of 2 or more. M can be the same natural number as N, or it can be a natural number different from N. The batch processing unit 4 includes a medicine tank 41, a cleaning solution tank 42, a first conveying device 43, a processing tool 44, and a drive device 45.

[0022] The medicine tank 41 and the cleaning solution tank 42 are arranged along the X-axis. For example, from the positive side of the X-axis to the negative side of the X-axis, the medicine tank 41 and the cleaning solution tank 42 are arranged in this order. Furthermore, the medicine tank 41 and the cleaning solution tank 42 are collectively referred to as treatment tanks. The number of medicine tanks 41 and cleaning solution tanks 42 is not limited to that shown in Figure 1. For example, the medicine tank 41 and the cleaning solution tank 42 are a single group in Figure 1, but they can also be multiple groups.

[0023] The chemical solution tank 41 stores the chemical solution used to impregnate batch L. The chemical solution is, for example, an aqueous phosphoric acid solution (H₃PO₄). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film from the silicon oxide film and the silicon nitride film. The chemical solution is not limited to an aqueous phosphoric acid solution. For example, it can also be DHF (dilute fluorine), BHF (a mixture of fluorine and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), electroplating solution, etc. The chemical solution can also be used for stripping or electroplating. The number of chemical solutions is not particularly limited and can be multiple.

[0024] The cleaning solution tank 42 stores the first cleaning solution for immersing batch L. The first cleaning solution is pure water from which the chemical solution is removed from the substrate W, such as DIW (deionized water).

[0025] The first transport device 43 includes a guide rail 43a and a first transport arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis relative to the processing tank. The guide rail 43a extends from the first interface section 3 in the horizontal direction (X-axis direction) to the batch processing section 4. The first transport arm 43b moves horizontally (X-axis direction) along the guide rail 43a. The first transport arm 43b can also move vertically and rotate about a vertical axis. The first transport arm 43b transports the batch L together between the first interface section 3 and the batch processing section 4.

[0026] The processing device 44 receives and holds the batch L from the first transport arm 43b. The processing device 44 holds the plurality of substrates W in the Y-axis direction at the first interval P1, and holds the plurality of substrates W vertically respectively.

[0027] The drive unit 45 moves the processing device 44 in the X-axis and Z-axis directions. The processing device 44 immerses the batch L in the medicine solution stored in the medicine tank 41, then immerses the batch L in the first cleaning solution stored in the cleaning solution tank 42, and then transfers the batch L to the first transport device 43.

[0028] In this embodiment, the number of processing unit 44 and drive unit 45 is one, but it can also be multiple. In the latter case, one unit immerses batch L in the medicine solution stored in the medicine tank 41, while other units immerse batch L in the first cleaning solution stored in the cleaning solution tank 42. In this case, the drive unit 45 only needs to move the processing unit 44 in the Z-axis direction, without needing to move the processing unit 44 in the X-axis direction.

[0029] The second interface 5 is disposed on the positive side of the batch processing unit 4 in the Y-axis direction. The second interface 5 transports substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface 5 has an impregnation tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.

[0030] The impregnation tank 51 is positioned outside the travel range of the first transport arm 43b. For example, the impregnation tank 51 is positioned offset to the positive side in the Y-axis direction relative to the processing tank. The impregnation tank 51 stores a second cleaning solution for impregnating batch L. The second cleaning solution is, for example, DIW (deionized water). The substrate W is held in the second cleaning solution before being lifted from it by the third transport device 53. Since the substrate W is below the surface of the second cleaning solution, the surface tension of the second cleaning solution does not act on the substrate W, thus preventing the uneven pattern of the substrate W from collapsing.

[0031] The second conveying device 52 has a Y-axis drive device 52a, a Z-axis drive device 52b, and a second conveying arm 52c.

[0032] Y-axis drive unit 52a is disposed on the positive side of the second interface 5 in the X-axis direction. Y-axis drive unit 52a extends from the second interface 5 in the horizontal direction (Y-axis direction) to the batch processing unit 4. Y-axis drive unit 52a moves Z-axis drive unit 52b and second transport arm 52c in the Y-axis direction. Y-axis drive unit 52a may include a ball screw.

[0033] Z-axis drive unit 52b is movably mounted on Y-axis drive unit 52a. Z-axis drive unit 52b moves the second transport arm 52c in the Z-axis direction. Z-axis drive unit 52b may include a ball screw.

[0034] The second transport arm 52c is movably mounted on the Z-axis drive unit 52b. The second transport arm 52c receives and holds batch L from the first transport arm 43b. The second transport arm 52c holds a plurality of substrates W at a first interval P1 in the Y-axis direction and holds the plurality of substrates W in the vertical direction. The second transport arm 52c moves in the Y-axis and Z-axis directions via the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c can move to a plurality of positions including the transfer position A1, the immersion position A2, and the standby position A3 shown in FIG. 7.

[0035] Transfer position A1 refers to the position where batch L is transferred between the first handling arm 43b and the second handling arm 52c. Transfer position A1 is located on the negative side of the Y-axis and the positive side of the Z-axis.

[0036] The immersion position A2 is the position where batch L is immersed in the immersion tank 51. The immersion position A2 is further to the positive side of the Y-axis and the negative side of the Z-axis than the transfer position A1.

[0037] The standby position A3 is the position where the second transport arm 52c is idle when batch L is not being transferred or when batch L is being immersed in the immersion tank 51. The standby position A3 is directly below the transfer position A1 (negative side in the Z-axis direction) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c only needs to move upwards (positive side in the Z-axis direction) to reach the transfer position A1, thus increasing throughput. The standby position A3 can also be the same as the immersion position A2. In this case, particles generated during the operation of the first transport device 43 can be prevented from adhering to the second transport arm 52c. The standby position A3 can also be directly above the immersion position A2 (positive side in the Z-axis direction). Thus, by setting the standby position A3 to a position different from the transfer position A1, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] During the operation of the first transport device 43, the second transport device 52 moves the second transport arm 52c to the immersion position A2 or the standby position A3. This prevents the first transport arm 43b from contacting the second transport arm 52c.

[0039] The third transport device 53 is composed of a multi-axis (e.g., 6-axis) robotic arm, with a third transport arm 53a at its front end. The third transport arm 53a has a holding claw (not shown) capable of holding a substrate W. The third transport arm 53a can assume any position and posture in three-dimensional space while holding the substrate W with the holding claw. The third transport device 53 transports the substrate W between the second transport arm 52c located at the immersion position A2 and the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a will not interfere with each other. Therefore, one of the first transport device 43 and the third transport device 53 does not need to accommodate the movement state of the other, and can operate independently. Therefore, the first transport device 43 and the third transport device 53 can be operated at any time, thereby shortening the time required for transporting the substrate W. As a result, the productivity of the substrate processing system 1 is improved. The third transport device 53 functions as one example of a transport mechanism.

[0040] The second transfer table 54 is adjacent to the single-wafer processing unit 6 and is positioned on the negative side of the second interface surface 5 in the X-axis direction. The second transfer table 54 receives the substrate W from the third transport device 53 and temporarily stores it before transferring it to the single-wafer processing unit 6. That is, the substrate W removed from the impregnation tank 51 is placed on the second transfer table 54. The substrate W placed on the second transfer table 54 is preferably, for example, in a state where its surface is wetted by the second cleaning solution. In this case, the surface tension of the second cleaning solution will not act on the substrate W, thus suppressing the collapse of the uneven pattern on the substrate W. The number of second transfer tables 54 can be one or more. Details of the second transfer table 54 will be described later.

[0041] The single-wafer processing unit 6 is located on the negative side of the second interface section 5 in the X-axis direction, and on the positive side of the transfer-in / extraction section 2, the first interface section 3, and the batch processing section 4 in the Y-axis direction. The single-wafer processing unit 6 processes substrates W one by one. The single-wafer processing unit 6 includes a fourth transport device 61, a liquid treatment device 62, and a drying device 63.

[0042] The fourth transport device 61 includes a guide rail 61a and a fourth transport arm 61b. The guide rail 61a is disposed on the negative side of the single-wafer processing unit 6 in the Y-axis direction. The guide rail 61a extends horizontally (X-axis direction) within the single-wafer processing unit 6. The fourth transport arm 61b moves horizontally (X-axis direction) and vertically along the guide rail 61a and rotates about the vertical axis. The fourth transport arm 61b transports substrate W between the second transfer table 54, the liquid treatment device 62, the drying device 63, and the first transfer table 33. The number of fourth transport arms 61b can be one or multiple; in the latter case, the fourth transport device 61 transports multiple (e.g., 5) substrates W together.

[0043] The liquid treatment apparatus 62 is disposed on the positive side of the X-axis and the positive side of the Y-axis of the single-piece processing unit 6. The liquid treatment apparatus 62 is a single-piece type, which processes substrates W one by one using a processing liquid. The liquid treatment apparatus 62 has multiple layers (e.g., 3 layers) arranged in the vertical direction (Z-axis direction). This allows multiple substrates W to be processed simultaneously using the processing liquid. The processing liquid can be of multiple types, for example, pure water such as DIW, and a drying liquid with a surface tension lower than pure water. The drying liquid can be, for example, an alcohol such as IPA (isopropanol).

[0044] The drying device 63 is arranged adjacent to the liquid treatment device 62 on the negative side of the X-axis direction. In this case, it is arranged so that the end face of the monolithic processing unit 6 on the positive side of the Y-axis direction is flush or approximately flush with the end face of the second interface 5 on the positive side of the Y-axis direction. Therefore, almost no unused space is generated, thus reducing the floor area of ​​the substrate processing system 1. In contrast, if the drying device 63 is arranged adjacent to the liquid treatment device 62 on the positive side of the Y-axis direction, the end face of the monolithic processing unit 6 on the positive side of the Y-axis direction will protrude compared to the end face of the second interface 5 on the positive side of the Y-axis direction, resulting in unused space. The drying device 63 is monolithic and uses supercritical fluid to dry the substrates W one by one. The drying device 63 is arranged in multiple layers (e.g., 3 layers) in the vertical direction. In this way, multiple substrates W can be dried simultaneously.

[0045] Neither the liquid treatment device 62 nor the drying device 63 can be single-piece; the liquid treatment device 62 can be single-piece while the drying device 63 can be batch-type. The drying device 63 can dry multiple substrates W together using a supercritical fluid. The number of substrates W processed together in the drying device 63 can be more than, but less than, the number of substrates W processed together in the liquid treatment device 62. Devices other than the liquid treatment device 62 and the drying device 63 can also be arranged in the single-piece processing unit 6.

[0046] The control device 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as memory. The recording medium 92 stores programs that control various processes executed in the substrate processing system 1. The control device 9 causes the CPU 91 to execute the programs stored in the recording medium 92, thereby controlling the operation of the substrate processing system 1. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside through the input interface 93 and sends signals to the outside through the output interface 94.

[0047] The aforementioned program can be stored, for example, on a computer-readable recording medium and installed from that recording medium onto the recording medium 92 of the control device 9. Examples of computer-readable recording media include hard disks (HD), floppy disks (FD), optical discs (CD), magneto-optical discs (MO), and memory cards. Furthermore, the program can also be downloaded from a server via the Internet and installed onto the recording medium 92 of the control device 9.

[0048] In the substrate processing system 1, the substrate W is sequentially transported from the loading / unloading section 2 to the first interface section 3, the batch processing section 4, the second interface section 5 and the single-piece processing section 6, and then returned to the loading / unloading section 2.

[0049] (Details of the construction of the second transfer station) The details of the construction of the second transfer station 54 are described with reference to Figure 2. Figure 2 is a diagram showing the second transfer station 54 in the first embodiment. Figure 2(a) is a top view, and Figure 2(b) is a cross-sectional view. Figure 2(b) corresponds to a cross-sectional view along line IIb-IIb in Figure 2(a).

[0050] As shown in Figure 2, the second transfer station 54 has a pure water supply unit 80, a liquid holding unit 73, and three or more pins 74. In Figure 2(a), the pure water supply unit 80 is omitted.

[0051] The liquid-containing section 73 has a base plate 71 and a wall section 72. The base plate 71 has a circular plate shape. The wall section 72 is formed in a ring shape on the base plate 71. Pins 74 are provided on the base plate 71. In this embodiment, there are three pins 74, but there may also be four or more. The three pins 74 are arranged in an equilateral triangle when viewed from above. The surface including the top of each pin 74 is horizontal. The top of each pin 74 is located above the top of the wall section 72. When viewed from above, the center of the equilateral triangle formed by the three pins 74 is approximately the same as the center of the circular plate-shaped base plate 71. The pins 74 are above the base plate 71 and support the substrate W from below. The pins 74 function as a support component.

[0052] The pure water supply unit 80 includes a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 sprays pure water supplied through the pure water supply line 82. A branch point 85 is provided at the pure water supply line 82, and the return line 83 is connected to the branch point 85. When pure water is not sprayed from the nozzle 81, pure water still flows through the portion of the pure water supply line 82 upstream of the branch point 85 and the return line 83. The pure water supply unit 80 configured in this way supplies pure water to the top surface of the substrate W.

[0053] The second transfer stage 54 has the above configuration and is horizontally held in place while the substrate W is in contact with pure water. The second transfer stage 54 functions as one example of a standby unit.

[0054] (Operation of the substrate processing system) Referring to FIG3, the operation of the substrate processing system 1, i.e., the substrate processing method, according to the first embodiment will be explained. The processing shown in FIG3 is performed under the control of the control device 9.

[0055] First, the case C, containing a plurality of substrates W, is moved into the loading section 2 and placed in the loading port 21. Inside the case C, the substrates W are held horizontally and vertically at a second interval P2 (P2=N×P1). N is a natural number of 2 or more; in this embodiment, it is 2, but it can also be 3 or more.

[0056] Next, the box transport device 24 transports the box C from the loading port 21 to the loader 23. The cover of the box C transported to the loader 23 is opened through the cover opening and closing mechanism.

[0057] Next, the substrate transfer device 31 picks up the substrate W (S101 in FIG3) contained in the box C and transports it to the batch forming unit 32.

[0058] Next, the batch forming unit 32 holds a plurality of substrates W at a first interval P1 (P1=P2 / N) and forms a batch L (S102 in FIG3). A batch L is, for example, composed of M substrates W of cassettes C. The interval between substrates W is reduced from the second interval P2 to the first interval P1, so the number of substrates W processed together can be increased.

[0059] Next, the first conveying device 43 receives batch L from the batch forming unit 32 and conveys it to the processing unit 44.

[0060] Next, the treatment device 44 descends from above the liquid tank 41 and immerses the batch L in the liquid to perform liquid treatment (S103 in Figure 3). Then, the treatment device 44 raises the batch L and pulls it out of the liquid, and then moves it horizontally (negative side of the X-axis direction) towards the top of the cleaning liquid tank 42.

[0061] Next, the processing vessel 44 descends from above the cleaning fluid tank 42 and immerses the batch L in the first cleaning fluid to perform cleaning fluid treatment (S103 in FIG3). Then, the processing vessel 44 raises the batch L and pulls it up from the first cleaning fluid. Next, the first conveying device 43 collects the batch L from the processing vessel 44 and transfers it to the second conveying device 52.

[0062] Next, the second transport arm 52c of the second transport device 52 moves horizontally (positive side of the Y-axis direction) and then descends from above the immersion tank 51, immersing the batch L in the second cleaning solution (S104 in Figure 3). The plurality of substrates W in the batch L are held in the second cleaning solution before being pulled out by the third transport device 53. Since the substrates W are below the surface of the second cleaning solution, the surface tension of the second cleaning solution does not act on the substrates W, thus preventing the uneven patterns on the substrates W from collapsing.

[0063] Next, the third transport device 53 transports the batch of substrates W, which are held in the second cleaning solution by the second transport arm 52c, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54.

[0064] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid treatment device 62.

[0065] Next, the liquid treatment apparatus 62 processes the substrate W one by one using liquid (S105 in FIG3). The liquid can be of several types, for example, pure water such as DIW and a drying liquid with a surface tension lower than that of pure water. The drying liquid can be, for example, an alcohol such as IPA. The liquid treatment apparatus 62 sequentially supplies pure water and drying liquid to the top surface of the substrate W, thereby forming a liquid film of drying liquid.

[0066] Next, the fourth transport device 61 receives the substrate W from the liquid treatment device 62 and holds the substrate W horizontally with the liquid film of the drying liquid facing upwards. The fourth transport device 61 transports the substrate W from the liquid treatment device 62 to the drying device 63.

[0067] Next, the drying apparatus 63 uses supercritical fluid to dry the substrates W one by one (S105 in FIG3). By using supercritical fluid to replace the drying liquid, the surface tension of the drying liquid can be suppressed, which would cause the uneven pattern of the substrate W to collapse. Since supercritical fluid requires a pressure vessel, it is processed one substrate at a time rather than in batches, so as to minimize the size of the pressure vessel.

[0068] Furthermore, the drying apparatus 63 in this embodiment is a single-piece type, but as mentioned above, it can also be a batch type. The batch drying apparatus 63 dries multiple substrates W with liquid films formed on them together using a supercritical fluid. The single-piece drying apparatus 63 has a single transport arm for holding the substrate W, while the batch drying apparatus 63 has multiple transport arms.

[0069] Next, the fourth transport device 61 takes the substrate W from the drying device 63 and transports it to the first transfer table 33.

[0070] Next, the substrate transfer device 31 picks up the substrate W from the first transfer table 33 and stores it in the box C (S106 in FIG3). The box C is then moved out from the transfer-in section 2 while holding multiple substrates W.

[0071] (The action of the second face) Refer to Figures 4-8 to illustrate the movement of the second interface 5. The movement of the second interface 5 is controlled by the control device 9.

[0072] First, as shown in Figure 4, the first transport arm 43b receives batch L from the processing unit 44 and moves along the guide rail 43a in the negative X-axis direction to the position where batch L is transferred to the second transport arm 52c. At this time, the second transport arm 52c is in standby position A3. Thus, the first transport arm 43b does not contact the second transport arm 52c, but can move to the position where batch L is transferred to the second transport arm 52c.

[0073] Next, as shown in Figure 5, the second transport arm 52c moves from the standby position A3 to the transfer position A1, and collects and holds the batch L from the first transport arm 43b. That is, as shown by arrow F1 in Figure 8, the second transport arm 52c moves upward (positive side in the Z-axis direction) from the standby position A3, and collects the batch L from the first transport arm 43b.

[0074] Next, as shown in Figure 6, the second transport arm 52c moves from the transfer position A1 to the immersion position A2, immersing the batch L in the immersion tank 51. That is, as shown by arrow F2 in Figure 8, the second transport arm 52c moves horizontally (positive side of the Y-axis) from the transfer position A1 above the immersion tank 51. Next, as shown by arrow F3 in Figure 8, the second transport arm 52c descends from above the immersion tank 51 to the immersion position A2, immersing the batch L in the second cleaning solution stored in the immersion tank 51.

[0075] Next, as shown in Figure 7, the third transport device 53 transports the batch of substrates W held in the second cleaning solution by the second transport arm 52c to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a will not interfere with each other. Therefore, it is not necessary for one of the first transport device 43 and the third transport device 53 to accommodate the operation state of the other, and they can operate independently. That is, there is no need for exclusive control. Therefore, the first transport device 43 and the third transport device 53 can be operated at any time, thus shortening the time required for transporting the substrates W. As a result, the productivity of the substrate processing system 1 is improved.

[0076] Next, after removing all the substrates W of batch L held by the second transport arm 52c, the second transport arm 52c moves to the standby position A3 and remains in standby until the first transport arm 43b transports the next batch L. As shown by arrow F4 in Figure 8, the second transport arm 52c moves upward (upward in the Z-axis direction) from the immersion position A2 to the same height as the standby position A3, and then moves horizontally (negative side in the Y-axis direction) to the standby position A3, as shown by arrow F5 in Figure 8. In this case, the second transport arm 52c moves to the standby position A3 via a position lower than the transfer position A1, thus preventing contact with the first transport arm 43b. Furthermore, the path of the second transport arm 52c moving from the immersion position A2 to the standby position A3 can also be the same as the path of the second transport arm 52c moving from the standby position A3 to the immersion position A2 via the transfer position A1.

[0077] The substrate W, which is transferred from the batch processing unit 4 to the single-piece processing unit 6 through the second interface 5, is held in the second cleaning fluid before being pulled up from the second cleaning fluid by the third transport device 53. Since the substrate W is below the surface of the second cleaning fluid, the surface tension of the second cleaning fluid will not act on the substrate W, thus preventing the uneven pattern of the substrate W from collapsing.

[0078] (Action of the second relay station) Refer to Figure 9 to explain the operation of the second transfer station 54.

[0079] After the substrate W is transported to the second transfer table 54 by the third transport device 53, as shown in FIG9(a), the substrate W is placed on the three pins 74. At this time, a liquid film 75a of the second cleaning solution is formed on the top surface of the substrate W.

[0080] Next, as shown in Figure 9(b), nozzle 81 sprays pure water onto the top surface of substrate W. As a result, a liquid film 75 of pure water is formed on the top surface of substrate W.

[0081] Next, as shown in Figure 9(c), nozzle 81 stops spraying pure water onto substrate W. The state of a pure water film 75 formed on the top surface of substrate W is maintained.

[0082] Next, as shown in Figure 9(d), the substrate W with a liquid film 75 of pure water formed on its top surface is transported to the liquid treatment device 62 via the fourth transport device 61.

[0083] Such an action is performed at the second transfer station 54.

[0084] Even though a liquid film 75a of the second cleaning solution has been formed on the top surface of the substrate W when it is transported to the second transfer table 54 via the third transfer device 53, there is still a concern that the liquid film 75a may decrease due to drying if a longer period of time passes before it is transported to the liquid treatment device 62 via the fourth transfer device 61. The decrease in the liquid film 75a may cause the uneven pattern of the substrate W to collapse. In this embodiment, a liquid film 75 of pure water is formed on the top surface of the substrate W in the second transfer table 54, thus suppressing the collapse of the uneven pattern that occurs with drying.

[0085] Furthermore, if a considerable amount of time has passed between the formation of the liquid film 75 and its transfer to the liquid treatment device 62 via the fourth transport device 61, i.e., a long standby time, it is preferable to re-form the liquid film 75. For example, it is preferable to re-form the liquid film 75 after a predetermined first time interval following its formation. Also, during this process, pure water may accumulate between the bifurcation point 85 of the pure water supply line 82 and the nozzle 81 between the two consecutive formations of the liquid film 75. Therefore, as shown in FIG10, it is preferable to move the nozzle 81 to the side of the substrate W to drain the accumulated pure water before performing the second formation of the liquid film 75. By draining the accumulated pure water, it is possible to suppress the adhesion of particles that may be present in the accumulated pure water to the substrate W.

[0086] Furthermore, regardless of whether the substrate W is waiting on pin 74, as shown in Figure 11, the portion of pure water remaining between the branch point 85 of the pure water supply line 82 and the nozzle 81 can be discharged every second preset time interval. If the substrate W is on pin 74 during drainage, the nozzle 81 can be moved to the side of the substrate W as shown in Figure 10. Also, when the substrate W is transported to the second transfer table 54 via the third transport device 53, the portion of pure water remaining between the branch point 85 of the pure water supply line 82 and the nozzle 81 can be discharged just before the transport begins.

[0087] [Second Implementation Example] Next, the second embodiment will be described. The second embodiment differs from the first embodiment mainly in the configuration of the second transfer station 54. Figure 12 shows the second transfer station 54 of the second embodiment. Figure 12(a) is a top view, and Figure 12(b) is a cross-sectional view. Figure 12(b) corresponds to a cross-sectional view along line XIIb-XIIb in Figure 12(a).

[0088] As shown in Figure 12, the second transfer table 54 included in the second embodiment has a pure water supply unit 80, a liquid holding unit 73, three or more pins 74, a weighing unit 11, and a pin support member 12. The pure water supply unit 80 is omitted in Figure 12(a).

[0089] In the second embodiment, a weighing unit 11 is installed on the center of the base plate 71 of the liquid-containing section 73, and a pin support member 12 is installed on the weighing unit 11. The pin support member 12 has a beam portion 13 and an annular portion 14. The beam portion 13 is a straight member, and its central portion along its long side contacts the top surface of the weighing unit 11. The annular portion 14 is an annular member, and the two ends of the beam portion 13 are connected to the annular portion 14. In top view, the center of the annular portion 14 coincides with the center along the long side of the beam portion 13, and the weighing unit 11 is located at the center of the annular portion 14. Furthermore, a pin 74 is installed on the annular portion 14.

[0090] The other components are the same as those in the first embodiment.

[0091] In the second embodiment, after the substrate W is transported to the second transfer table 54 by the third transport device 53, it is placed on the three pins 74 in the same manner as in the first embodiment (see Figure 9(a)). At this time, a liquid film 75a of the second cleaning fluid is formed on the top surface of the substrate W. Next, the weighing unit 11 measures the total mass (first mass) of the pin support member 12, the pins 74, the substrate W, and the liquid film 75a.

[0092] Next, as in the first embodiment, nozzle 81 sprays pure water onto the top surface of substrate W. As a result, a liquid film 75 of pure water is formed on the top surface of substrate W (see Figure 9(b)).

[0093] Next, similar to the first embodiment, nozzle 81 stops spraying pure water onto substrate W. The state of a pure water film 75 formed on the top surface of substrate W is maintained (see Figure 9(c)). Next, the weighing unit 11 measures the total mass (second mass) of the pin support member 12, pin 74, substrate W, and liquid film 75. Next, the control device 9 calculates the increase in mass from the first mass to the second mass and determines whether this increase is within a predetermined range. The increase in mass from the first mass to the second mass is equivalent to the mass of pure water supplied by the pure water supply unit 80 and remaining on the top surface of substrate W. The mass measuring unit 79a and the control device 9 function as a mass change detection unit.

[0094] If the increase is within a predetermined range, as in the first embodiment, the substrate W with a liquid film 75 of pure water formed on its top surface is transported to the liquid treatment device 62 via the fourth transport device 61 (see Figure 9(d)). If the increase is less than the predetermined range (too little), for example, the nozzle 81 can spray the missing amount of pure water onto the top surface of the substrate W. If the increase is greater than the predetermined range (too much), for example, this situation can be notified, such as by generating a warning sound.

[0095] In the second implementation, such an action is performed on the second transfer station 54.

[0096] The stability of the amount of liquid film 75 formed on the substrate W of the liquid treatment apparatus 62 can be improved through the second embodiment. Furthermore, if the amount is too small, there is a possibility that the substrate W will warp, causing pure water to fall from the top surface of the substrate W. Therefore, it can also be used as an indicator to confirm the warping of the substrate W.

[0097] [Third Implementation Example] Next, the third embodiment will be described. The third embodiment differs from the first embodiment mainly in that the second interface 5 has an avoidance platform. Figure 13 is a schematic perspective view of the second interface 5 of the third embodiment.

[0098] As shown in Figure 13, the second interface 5 included in the third embodiment has an immersion tank 51, a second transport device 52, a third transport device 53, a second transfer table 54, and a avoidance table 55. The avoidance table 55 is disposed on the negative side of the second transfer table 54 in the Z-axis direction. The avoidance table 55 has the same structure as the second transfer table 54, and can hold the substrate W and spray pure water onto the top surface of the substrate W.

[0099] The other components are the same as those in the first embodiment.

[0100] As described above, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid treatment device 62. However, after the fourth transport device 61 receives the substrate W from the second transfer table 54, the liquid treatment device 62 may be unable to receive the substrate W due to malfunction or other reasons. In such a case, the fourth transport device 61 transports the substrate W to the avoidance table 55. Then, in the avoidance table 55, pure water is sprayed onto the top surface of the substrate W to prevent the liquid film 75 on the top surface of the substrate W from disappearing. Then, when the liquid treatment device 62 can receive the substrate W, the fourth transport device 61 receives the substrate W from the avoidance table 55 and transports it to the liquid treatment device 62.

[0101] Furthermore, in order to prevent pure water from accumulating in the supply pipeline that supplies pure water to the avoidance table 55 and causing particles to adhere to the substrate W, similar to the second transfer table 54, it is preferable to properly discharge the accumulating pure water.

[0102] [Fourth Implementation Mode] Next, the fourth embodiment will be described. The fourth embodiment differs from the first embodiment mainly in the configuration of the second transfer station 54. Figure 14 is a diagram showing the second transfer station 54 of the fourth embodiment.

[0103] As shown in Figure 14, the second transfer table 54 included in the fourth embodiment has a pure water supply unit 80, a liquid holding unit 76, an arm 78, and a moving mechanism 79. The arm 78 horizontally holds the substrate W, which is transported by the third transport device 53. The liquid holding unit 76 stores pure water 77. Furthermore, the liquid holding unit 76 has a depth that allows the substrate W, held by the arm 78, to be immersed in the pure water 77. The moving mechanism 79 can be moved to a plurality of positions, including an immersion position B1 that supports the substrate W while it is immersed in the pure water 77 stored in the liquid holding unit 76, and an avoidance position B2 that supports the substrate W outside the pure water 77 stored in the liquid holding unit 76. For example, the avoidance position B2 is located on the positive side of the Z-axis direction of the immersion position B1. The arm 78 functions as a support unit.

[0104] The other components are the same as those in the first embodiment.

[0105] In the fourth embodiment, after the substrate W is transported to the second transfer table 54 by the third transport device 53, the substrate W is placed on the arm 78. At this time, a liquid film 75a of the second cleaning solution is formed on the top surface of the substrate W. Next, the nozzle 81 sprays pure water onto the top surface of the substrate W. As a result, a liquid film 75 of pure water is formed on the top surface of the substrate W. Then, the nozzle 81 stops spraying pure water onto the substrate W. The state of having a liquid film 75 of pure water formed on the top surface of the substrate W is maintained. Next, the substrate W with the liquid film 75 of pure water formed on its top surface is transported to the liquid treatment device 62 by the fourth transport device 61. This operation is performed in the second transfer table 54.

[0106] Furthermore, if a relatively long time elapses between the formation of the liquid film 75 and its transfer to the liquid treatment device 62 via the fourth transport device 61, i.e., a long standby time, as shown in FIG15, the substrate W and arm 78 are immersed in pure water 77 stored in the liquid holding section 76. For example, after a predetermined third time elapsed since the formation of the liquid film 75, the substrate W and arm 78 are immersed in the pure water 77 stored in the liquid holding section 76. At this time, at least the top surface of the substrate W is positioned deeper than the surface of the pure water 77. For example, such immersion processing is performed after a predetermined first time elapsed since the formation of the liquid film 75. Even in the case of a long standby time, such immersion processing can suppress the collapse of the raised pattern that occurs during drying.

[0107] Furthermore, during the immersion process, pure water can be continuously or intermittently sprayed from the nozzle 81 onto the substrate W. Additionally, a pipeline for supplying pure water and a pipeline for draining water can be connected to the liquid collection section 76 to circulate the pure water 77.

[0108] [Implement 5] Next, the fifth embodiment will be described. The fifth embodiment differs from the fourth embodiment mainly in the configuration of the second transfer station 54. Figure 16 is a diagram showing the second transfer station 54 of the fifth embodiment.

[0109] As shown in Figure 16, the moving mechanism 79 included in the second transfer table 54 of the fifth embodiment has a mass measuring unit 79a. The mass measuring unit 79a is located in the avoidance position B2.

[0110] The other components are the same as those in the fourth embodiment.

[0111] In the fifth embodiment, after the substrate W is transported to the second transfer table 54 by the third transport device 53, it is placed on the arm 78, similar to the fourth embodiment. At this time, a liquid film 75a of the second cleaning solution is formed on the top surface of the substrate W. Next, the mass measuring unit 79a measures the total mass (first mass) of the arm 78, the substrate W, and the liquid film 75a. Next, as in the fourth embodiment, the nozzle 81 sprays pure water onto the top surface of the substrate W. As a result, a liquid film 75 of pure water is formed on the top surface of the substrate W. Next, as in the fourth embodiment, the nozzle 81 stops spraying pure water onto the substrate W. The state of a liquid film 75 of pure water forming on the top surface of the substrate W is maintained. Next, the mass measuring unit 79a measures the total mass (second mass) of the arm 78, the substrate W, and the liquid film 75. Next, the control device 9 calculates the increase from the first mass to the second mass and determines whether this increase is within a predetermined range. The increase in mass from the first mass to the second mass is equivalent to the mass of pure water supplied by the pure water supply unit 80 and remaining on the top surface of the substrate W. The mass measuring unit 79a and the control device 9 function as mass change detection units.

[0112] If the increase is within a predetermined range, as in the fourth embodiment, the substrate W with a pure water film 75 formed on its top surface is transported to the liquid treatment device 62 via the fourth transport device 61. If the increase is less than the predetermined range (too little), for example, the nozzle 81 can spray the missing amount of pure water onto the top surface of the substrate W. If the increase is greater than the predetermined range (too much), for example, this situation can be notified, such as by generating a warning sound.

[0113] In the fifth implementation, such an action is performed on the second transfer station 54.

[0114] [Sixth Implementation Example] Next, the sixth embodiment will be described. The sixth embodiment differs from the fourth embodiment mainly in the configuration of the second transfer station 54. Figure 17 is a diagram showing the second transfer station 54 of the sixth embodiment.

[0115] As shown in Figure 17, the second transfer table 54 included in the sixth embodiment has a liquid-holding section 76 and an arm 78. Furthermore, a pure water supply line 86 and a drain line 87 are connected to the liquid-holding section 76.

[0116] The other components are the same as those in the fourth embodiment.

[0117] In the sixth embodiment, after the substrate W is transported to the second transfer table 54 by the third transport device 53, the substrate W is placed on the arm 78. At this time, a liquid film 75a of the second cleaning solution is formed on the top surface of the substrate W. Next, the substrate W and the arm 78 are immersed in pure water 77 stored in the liquid holding section 76. At this time, the top surface of the substrate W is at least deeper than the liquid surface of the pure water 77. Next, the arm 78 holds the substrate W horizontally and rises. As a result, a liquid film of pure water is formed on the top surface of the substrate W. Then, the substrate W with the liquid film of pure water formed on its top surface is transported to the liquid treatment device 62 by the fourth transport device 61. This operation is performed in the second transfer table 54.

[0118] In the sixth embodiment, after the liquid film 75 is formed, even if a relatively long time has passed before it is transported to the liquid treatment device 62 via the fourth transport device 61, the substrate W and the arm 78 are kept immersed in the pure water 77 stored in the liquid holding section 76. Thus, even if the standby time is long, the collapse of the raised pattern that accompanies drying can be suppressed.

[0119] Alternatively, the substrate W can be transported from the chemical solution tank 41 of the batch processing unit 4 to the second transfer table 54 without passing through the cleaning solution tank 42 and the immersion tank 51, and a pure water film can be formed on the top surface of the substrate W on the second transfer table 54. Alternatively, the substrate W can be directly transported from the second transfer table 54 to the single-wafer processing unit 6.

[0120] The preferred embodiments have been described in detail above, but the present invention is not limited to the embodiments described above, and various modifications and substitutions can be made to the embodiments described above without departing from the scope of the claims.

[0121] In the above-described embodiments, the drying apparatus 63 dries the substrate W using a supercritical fluid, but the drying method is not particularly limited. The drying method can suppress the collapse of the uneven pattern on the substrate W; for example, rotary drying, scanning drying, or water-splashing drying can be used. Rotary drying involves rotating the substrate W and using centrifugal force to eject the liquid film from the substrate W. Scanning drying involves moving the supply position of the drying liquid from the center of the substrate W towards its outer periphery while rotating the substrate W and using centrifugal force to eject the liquid film from the substrate W. In scanning drying, the supply position of a drying gas such as N2 gas can also be moved from the center of the substrate W towards its outer periphery in accordance with the supply position of the drying liquid.

[0122] (First variation) Next, a first variation of the first embodiment will be described. Figure 18 is a schematic perspective view of the second interface 5D included in the first variation of the first embodiment.

[0123] As shown in Figure 18, the second interface 5D included in the first variant of the first embodiment differs from the second interface 5 at the point where the Y-axis drive device 52a is located below the Z-axis drive device 52b. The other configurations of the second interface 5D may be the same as those of the second interface 5.

[0124] As shown in Figure 18, the Y-axis drive device 52a extends from the second interface 5 toward the batch processing unit 4 along the Y-axis direction below the Z-axis drive device 52b. The Z-axis drive device 52b is mounted on the positive side of the Y-axis drive device 52a in the Z-axis direction. The Z-axis drive device 52b is supported by the Y-axis drive device 52a in a manner that allows it to move along the Y-axis direction.

[0125] In the second, third, fourth, fifth, or sixth embodiment, a second interface 5D may be provided instead of the second interface 5.

[0126] (Second variation) Next, a second variation of the first embodiment will be described. Figure 19 is a schematic top view of the substrate processing system 1A according to the second variation of the first embodiment. As shown in Figure 19, the substrate processing system 1A can be dried by rotary drying, scanning drying, or water-spraying drying.

[0127] As shown in Figure 19, in the substrate processing system 1A, a liquid treatment device 62 is provided instead of a drying device 63. That is, the substrate processing system 1A has a single-piece processing unit 6A, which includes a fourth transport device 61 and a liquid treatment device 62.

[0128] The liquid treatment apparatus 62 is a single-piece type, which processes substrates W one by one with the processing liquid. The liquid treatment apparatus 62 can perform at least one of rotary drying, scanning drying, and water-repellent drying. The liquid treatment apparatus 62 is arranged in multiple rows (e.g., 2 rows) in the horizontal direction (X-axis direction) and in multiple layers (e.g., 3 layers) in the vertical direction (Z-axis direction). In this way, multiple substrates W can be processed with the processing liquid simultaneously.

[0129] The second, third, fourth, fifth, and sixth embodiments can also be applied to the substrate processing system configured as shown in FIG19.

[0130] 1,1A: Substrate Processing System 2: Moving out and moving in department 3: First interface 4: Batch Processing Department 5.5D: Second interface 6,6A: Single-chip processing unit 9: Control device 11: Weight Measurement Unit 12: Pin support component 13: Beam section 14: Circular part 21: Loading port 22: Storage 23: Loader 24: Carton handling device 31: Substrate transfer device 31a: Substrate holding arm 32: Batch Forming Department 33: First Passing Platform 41: Medicine tank 42: Cleaning fluid tank 43: First transport device 43a: Guide rail 43b: First transport arm 44: Processing tools 45: Drive unit 51: Immersion tank 52: Second transport device 52a: Y-axis drive unit 52b: Z-axis drive unit 52c: Second transport arm 53: Third transport device 53a: Third transport arm 54: Second relay station 55: Avoidance Platform 61: Fourth transport device 61a: Guide rail 61b: Fourth transport arm 62: Liquid treatment device 63: Drying device 71: Base Plate 72: Wall 73, 76: Liquid holding section 74: Sales 75: Liquid film 75a: Liquid film 76: Liquid holding section 77: Pure water 78: Arm 79: Mobile mechanism 79a: Quality Measurement Department 80: Pure Water Supply Department 81: Nozzle 82, 86: Pure water supply pipeline 83: Return pipeline 85: Divergence point 86: Pure water supply pipeline 87: Drainage pipes 91: CPU 92: Recording Media 93: Input Interface 94: Output Interface C: Box L: Batch W: substrate F1~F5: Arrows A1: Passing position A2: Immersion location A3: Standby position B1: Immersion location B2: Avoidance Position

Claims

1. A substrate processing system, comprising: a loading / unloading unit for loading and unloading a cassette containing a plurality of substrates; a batch processing unit for processing a batch containing a plurality of substrates simultaneously with the substrates each upright; a single-piece processing unit for processing the batch of substrates one by one in a horizontal state; and an interface unit for transferring the substrates from the batch processing unit to the single-piece processing unit; the interface unit comprising: a standby unit for horizontally holding the substrates while in contact with pure water; and a conveying mechanism for transferring the substrates from the batch processing unit to the standby unit.

2. The substrate processing system as described in claim 1, wherein, The standby unit includes a pure water supply unit that supplies pure water to the top surface of the substrate.

3. The substrate processing system as described in claim 2, wherein, The standby section further includes: a liquid holding section for holding pure water; and a support section above the liquid holding section for supporting the substrate from below.

4. The substrate processing system as described in claim 3, wherein, The liquid-containing part includes a base plate and an annular wall portion disposed on the base plate; the top of the support portion is located above the top of the wall portion.

5. The substrate processing system as described in claim 3 or 4, wherein, This support department contains more than three sales.

6. The substrate processing system as described in claim 3 or 4, wherein, The pure water supply unit supplies pure water to the substrate supported by the support unit.

7. The substrate processing system as described in claim 3 or 4, wherein, The pure water supply unit supplies pure water to the top surface of the substrate whenever the support unit supports the substrate for a preset first time.

8. The substrate processing system as described in claim 3 or 4, wherein, The pure water supply unit includes: a nozzle for spraying pure water; and a pure water supply line connected to the nozzle; the nozzle sprays out the pure water that has been stored in the pure water supply line after a preset second time interval.

9. The substrate processing system as described in claim 3 or 4, wherein, The pure water supply unit includes: a nozzle for spraying pure water; and a pure water supply line connected to the nozzle; when the substrate is transferred to the standby unit by the transport mechanism, the pure water remaining in the pure water supply line is sprayed out from the nozzle before the substrate is transported to the standby unit.

10. The substrate processing system as described in claim 3, wherein, The liquid-holding section stores pure water; the support section includes an arm that can support the substrate while it is immersed in the pure water stored in the liquid-holding section.

11. The substrate processing system as described in claim 10, wherein, The arm is movable to a plurality of positions, including: an immersion position, in which the substrate is supported while immersed in pure water stored in the liquid container; and an avoidance position, in which the substrate is supported outside the pure water stored in the liquid container; the substrate processing system further includes a moving mechanism for moving the arm.

12. The substrate processing system as described in claim 11, wherein, The moving mechanism moves the arm to the immersion position after a predetermined third time has elapsed in the state where the arm supports the substrate in the avoidance position.

13. The substrate processing system as described in any one of claims 2 to 4 further includes: a mass change detection unit for measuring the mass of pure water supplied by the pure water supply unit and remaining on the top surface of the substrate.

14. The substrate processing system as described in any one of claims 1 to 4, wherein: The interface further includes a avoidance platform, which avoids the substrate after it is removed from the standby section and before it is transferred to the monolithic processing section.

15. A substrate processing method, comprising the following steps: a transfer step, wherein a substrate is transferred from a batch processing unit to a single-piece processing unit, the batch processing unit processing a batch containing a plurality of substrates together with the substrates each in an upright state, and the single-piece processing unit processing the batch of substrates one by one in a horizontal state; the transfer step includes a step of horizontally holding the substrate in contact with pure water.

Images