Resistor composition and method for forming inhibitor pattern
TWI939677BActive Publication Date: 2026-09-21TOKYO OHKA KOGYO CO LTD
Patent Information
- Application Number
- TW112115274
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2022-04-25
- Filing Date
- 2023-04-25
- Publication Date
- 2026-09-21
- Estimated Expiration
- 2043-04-24
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Abstract
This invention relates to a resist composition that, due to exposure, generates acid, thereby altering the solubility of the developer. The composition comprises a substrate component (A) that alters the solubility of the developer through the action of acid, and an acid-generating agent component (B) that generates acid through exposure. The acid-generating agent component (B) includes a first acid-generating agent and a second acid-generating agent. The first acid-generating agent comprises a compound (b1) represented by general formula (b1-1) in the specification, and the second acid-generating agent comprises a compound (b2) represented by general formula (b2-1) in the specification.
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Citation Information
Patent Citations
Resist pattern forming method, and resist composition for negative development
JP2012073565A
Actinic ray-sensitive or radiation-sensitive resin composition, resist film using the same, pattern forming method, method for manufacturing electronic device using the composition and the pattern forming method, and electronic device
JP2014026179A
Pattern forming method, compound, actinic ray-sensitive or radiation-sensitive resin composition and resist film used for the method, method for manufacturing electronic device, and electronic device
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