Gas treatment module, gas treatment method and gas phase organic compound treatment method

Abstract

This invention discloses a gas processing module, a gas processing method, and a method for processing gaseous organic compounds. The gas processing module includes a cavity, a gas input unit, a light source, a photocatalyst, a liquid input unit, a gas discharge unit, and a liquid discharge unit. The gas input unit is connected to the interior of the cavity and supplies the gas to be processed, which contains gaseous organic compounds, into the cavity. The light source is disposed in the cavity and provides a first light beam. The photocatalyst is disposed in the cavity; when irradiated by the first light beam, at least a portion of the gaseous organic compounds in the gas to be processed, in contact with the photocatalyst, can generate organic compound products through the action of the photocatalyst. The liquid input unit is connected to the interior of the cavity and provides a solvent to contact the surface of the photocatalyst, allowing the organic compound products to dissolve in the solvent.

Description

Technical Field

[0001] The present invention relates to a gas treatment module, a gas treatment method and a gas phase organic compound treatment method. More specifically, the present invention relates to a gas treatment module, a gas treatment method and a gas phase organic compound treatment method for removing airborne molecular contaminants (AMC) containing volatile organic compounds (VOC) in related processes of the semiconductor industry. Prior Art

[0002] In industrial manufacturing fields such as semiconductor manufacturing, in order to further improve product yield, clean rooms are widely used to manufacture products in a clean, pollution-free, isolated environment.

[0003] In order to meet the environmental requirements of a clean room, fans and filtering equipment are generally installed at the air inlet of the clean room, so that the air flow is driven by the fan through the filter screen of the filtering equipment and then enters the clean room to filter out dust and various organic and inorganic pollutants.

[0004] One of the common removal methods for volatile organic compounds (VOCs) among airborne molecular contaminants (AMCs), such as benzene, acetone, isopropanol, ethyl acetate, dimethyl sulfoxide, ethanolamine, propylene glycol methyl ether, propylene glycol methyl ether acetate, etc., is to use activated carbon materials for adsorption. Among them, activated carbon materials can generate good physical adsorption effects for alkanes, alkenes, ethers, and benzene compounds in VOCs through their pores, but their physical adsorption effects on alcohols, ketones, acids, and esters in VOCs are relatively poor. Therefore, a method of treating them by photocatalytic reaction has been proposed. However, in the conventional technology, when photocatalytic reaction is used for treatment, the product will accumulate on the surface of the photocatalyst, resulting in a decrease in the reaction rate and the overall performance cannot meet the requirements. Summary of the invention

[0005] The purpose of the present invention is to provide a gas processing module which has a better processing effect on gas phase organic compounds in mixed gas.

[0006] Another object of the present invention is to provide a gas treatment method which has a better treatment effect on gas phase organic compounds in mixed gas.

[0007] Another object of the present invention is to provide a method for treating gas phase organic compounds, which has a better treatment effect on gas phase organic compounds.

[0008] The gas treatment module of the present invention comprises a cavity, a gas input unit, a light source, a photocatalyst, a liquid input unit, a gas exhaust unit and a liquid exhaust unit. The gas input unit is connected to the interior of the cavity and can supply the gas to be treated to the cavity, and the gas to be treated includes a gas phase organic compound. The light source is arranged in the cavity and can provide a first light. The photocatalyst is arranged in the cavity, and when irradiated by the first light, the gas phase organic compound of at least part of the gas to be treated that contacts the photocatalyst can generate an organic compound product by the action of the photocatalyst. The liquid input unit is connected to the interior of the cavity and can provide a solvent to contact the surface of the photocatalyst, and the organic compound product can be dissolved in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas phase organic compound in the solvent. The gas exhaust unit is connected to the interior of the cavity and can discharge the gas to be treated that has been separated from the photocatalyst and has contacted the photocatalyst. The liquid discharge unit is connected to the inside of the cavity and can discharge the solvent containing organic compound products separated from the photocatalyst.

[0009] In an embodiment of the present invention, the light source includes continuously providing ultraviolet light as the first light.

[0010] In an embodiment of the present invention, the gas processing module further includes a filtering unit through which the gas to be processed can pass.

[0011] In an embodiment of the present invention, the photocatalyst is disposed on one side of the filter unit, and the light source and the liquid input unit are disposed outside the filter unit and face the photocatalyst.

[0012] In an embodiment of the present invention, the gas processing modules may be a plurality of groups and arranged in series.

[0013] In an embodiment of the present invention, the gas to be processed can pass through a solvent to make at least a portion of the gas phase organic compound form a liquid phase organic compound, and the liquid phase organic compound can generate an organic compound product through the action of a photocatalyst.

[0014] In an embodiment of the present invention, the liquid input unit supplies the solvent in a batch manner.

[0015] In an embodiment of the present invention, the liquid input unit supplies the solvent in a continuous manner.

[0016] In an embodiment of the present invention, the flow rate of the solvent flowing through the surface of the photocatalyst is above 75.6 L / min‧m 2.

[0017] In an embodiment of the present invention, the flow rate of the gas phase organic compound flowing through the surface of the photocatalyst is below 0.7 m / s.

[0018] In an embodiment of the present invention, the liquid input unit sprays the solvent onto the surface of the photocatalyst in a shower manner.

[0019] In an embodiment of the present invention, the liquid input unit allows the solvent to flow through the surface of the photocatalyst in a reciprocating immersion manner.

[0020] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0021] In an embodiment of the present invention, the gas phase organic compound does not include one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

[0022] The gas treatment method of the present invention comprises (S1000) providing a gas to be treated, wherein the gas to be treated contains a gas-phase organic compound; (S2000) allowing the gas to be treated to contact the surface of a photocatalyst so that at least a portion of the gas-phase organic compound generates an organic compound product through the action of the photocatalyst; (S3000) providing a solvent; (S4000) allowing the solvent to contact the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas-phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas-phase organic compound in the solvent; (S5000) separating the gas to be treated that has contacted the photocatalyst and the solvent containing the organic compound product from the photocatalyst.

[0023] In an embodiment of the present invention, step S2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so as to react the gas phase organic compound to generate an organic compound product.

[0024] In an embodiment of the present invention, step S2000 includes allowing the gas phase organic compound to be acted on multiple times by a photocatalyst to generate an organic compound product.

[0025] In an embodiment of the present invention, the gas treatment method further includes (S3200) passing the gas to be treated through a solvent to form at least a portion of the gas phase organic compound into a liquid phase organic compound; and (S3400) allowing the liquid phase organic compound to generate an organic compound product through the action of a photocatalyst.

[0026] In an embodiment of the present invention, step S3400 includes allowing the liquid phase organic compound to be acted on multiple times by a photocatalyst to generate an organic compound product.

[0027] In an embodiment of the present invention, step S3000 includes supplying solvent in a batch manner.

[0028] In an embodiment of the present invention, step S3000 includes supplying the solvent in a continuous manner.

[0029] In an embodiment of the present invention, the flow rate of the solvent flowing through the surface of the photocatalyst is above 75.6 L / min‧m 2.

[0030] In an embodiment of the present invention, the flow rate of the gas phase organic compound flowing through the surface of the photocatalyst is below 0.7 m / s.

[0031] In an embodiment of the present invention, step S3000 includes spraying the solvent on the surface of the photocatalyst in a shower manner.

[0032] In an embodiment of the present invention, step S3000 includes allowing the solvent to flow through the surface of the photocatalyst in a reciprocating immersion manner.

[0033] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0034] In an embodiment of the present invention, the gas phase organic compound does not include one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

[0035] The gas phase organic compound treatment method of the present invention comprises (A1000) providing a gas phase organic compound; (A2000) allowing the gas phase organic compound to generate an organic compound product through the action of a photocatalyst; (A3000) providing a solvent; (A4000) allowing the solvent to contact the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas phase organic compound in the solvent; (A5000) separating the solvent containing the organic compound product from the photocatalyst.

[0036] In an embodiment of the present invention, step A2000 includes continuously providing ultraviolet light to irradiate the photocatalyst so as to react the gas phase organic compound to generate an organic compound product.

[0037] In an embodiment of the present invention, step A2000 includes allowing the gas phase organic compound to be acted on multiple times by a photocatalyst to generate an organic compound product.

[0038] In an embodiment of the present invention, the method for treating a gas phase organic compound further comprises (A3200) passing the gas phase organic compound through a solvent so that at least a portion of the gas phase organic compound forms a liquid phase organic compound; (A3400) allowing the liquid phase organic compound to generate an organic compound product through the action of a photocatalyst.

[0039] In an embodiment of the present invention, step A3400 includes allowing the liquid phase organic compound to be acted on multiple times by a photocatalyst to generate an organic compound product.

[0040] In an embodiment of the present invention, step A1000 comprises providing a gas-phase organic compound together with a solvent.

[0041] In an embodiment of the present invention, step A3000 includes supplying the solvent in a batch manner.

[0042] In an embodiment of the present invention, step A3000 includes supplying a solvent in a continuous manner.

[0043] In an embodiment of the present invention, the flow rate of the solvent flowing through the surface of the photocatalyst is above 75.6 L / min‧m 2.

[0044] In an embodiment of the present invention, the flow rate of the gas phase organic compound flowing through the surface of the photocatalyst is below 0.7 m / s.

[0045] In an embodiment of the present invention, step A3000 includes spraying the solvent on the surface of the photocatalyst in a shower manner.

[0046] In an embodiment of the present invention, step A3000 includes allowing the solvent to flow through the surface of the photocatalyst in a reciprocating immersion manner.

[0047] In an embodiment of the present invention, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene.

[0048] In an embodiment of the present invention, the gas phase organic compound does not include one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds. Simple diagram description

[0049] FIG. 1A is a schematic diagram of an embodiment of a gas processing module of the present invention.

[0050] FIG. 1B is a schematic cross-sectional view taken along line AA′ in FIG. 1A .

[0051] FIG. 1C is a schematic diagram of an embodiment of the present invention in which a liquid input unit in a gas processing module is provided with a spray hole.

[0052] FIG. 2A is a schematic diagram of acetone removal effects with and without water washing.

[0053] FIG. 2B is a schematic diagram of the removal effect of isopropanol, acetone, and toluene with water washing.

[0054] FIG. 3A and FIG. 3B are schematic diagrams showing the removal results of acetone by no water washing, circulating water washing, and continuous water washing.

[0055] FIG3C is a schematic diagram showing the removal results of acetone by continuously flushing the photocatalyst with water at different flow rates.

[0056] FIG. 4 is a schematic flow chart of an embodiment of the gas treatment method of the present invention.

[0057] FIG. 5 and FIG. 6 are schematic flow diagrams of different embodiments of the gas treatment method of the present invention.

[0058] FIG. 7 is a schematic flow diagram of an embodiment of a method for treating a gas-phase organic compound according to the present invention.

[0059] FIG. 8 and FIG. 9 are schematic flow diagrams of different embodiments of the method for treating gas-phase organic compounds of the present invention. Implementation

[0060] The following is a specific embodiment and a diagram to illustrate the implementation of the connection component disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. However, the content disclosed below is not intended to limit the scope of protection of the present invention. Without departing from the principle of the spirit of the present invention, those skilled in the art can implement the present invention with other different embodiments based on different viewpoints and applications. In the accompanying drawings, the thickness of layers, films, panels, regions, etc. is magnified for clarity. Throughout the specification, the same reference numerals represent the same elements. It should be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to another element, or an intermediate element can also exist. On the contrary, when an element is referred to as being "directly on" or "directly connected to" another element, there is no intermediate element. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" can be the presence of other elements between two elements.

[0061] It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, the "first element", "component", "region", "layer" or "part" discussed below may be referred to as a second element, component, region, layer or part without departing from the teachings of this article.

[0062] Additionally, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element, as shown in the figures. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, the elements described as being on the "lower" side of the other elements will be oriented on the "upper" side of the other elements. Thus, the exemplary term "lower" can include both "lower" and "upper" orientations, depending on the particular orientation of the figure. Similarly, if the device in one figure is turned over, the elements described as being "below" or "beneath" other elements will be oriented as being "above" the other elements. Thus, the exemplary terms "below" or "beneath" can include both "upper" and "lower" orientations.

[0063] As used herein, "about", "approximately", or "substantially" includes the stated value and an average value within an acceptable deviation range of a particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately", or "substantially" can select a more acceptable deviation range or standard deviation depending on the optical property, etching property or other property, and can apply to all properties without a single standard deviation.

[0064] As shown in the embodiment of FIG. 1A , the gas treatment module 900 of the present invention comprises a chamber 100, a gas input unit 210, a light source 300, a photocatalyst 400, a liquid input unit 510, a gas exhaust unit 220, and a liquid exhaust unit 520. In one embodiment, the chamber 100 is made of stainless steel, but in different embodiments, the chamber 100 may be made of other alloys, metals, metal oxides, or non-metallic materials such as polymers and glass. The gas input unit 210 is connected to the inside of the chamber 100 and can supply the gas to be treated into the chamber 100. Specifically, in one embodiment, the gas input unit 210 may be an opening on one side of the chamber 100 or an interface connected to an external pipeline, and the gas to be treated may be transported through the gas input unit 210 by a device such as a pump or a fan to supply the gas into the chamber 100.

[0065] The gas to be treated includes gas phase organic compounds. The gas phase organic compounds include volatile organic compounds (VOC). In one embodiment, the gas phase organic compounds include one or more selected from isopropanol, acetone, and toluene. In different embodiments, in order to avoid reasons such as possible performance reduction, the gas phase organic compounds do not include one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

[0066] In the embodiment shown in FIG. 1A , the light source 300 is disposed in the cavity 100 and can continuously or intermittently provide the first light. The photocatalyst 400 is disposed in the cavity 100. When the first light is irradiated, the gas phase organic compound of the gas to be treated that is at least partially in contact with the photocatalyst 400 can generate an organic compound product through the action of the photocatalyst 400. More specifically, in one embodiment, the light source 300 is a lamp that can emit ultraviolet light with a wavelength less than 400 nm, and the reaction module 900 further includes a filter unit 410 through which the gas to be treated can pass. The photocatalyst 400 is titanium dioxide (TiO 2) disposed at a place where the light can be directly or indirectly irradiated, such as one side of the filter unit 410 of a wind nest ceramic filter. The gas phase organic compound is acetone. When passing through the filter unit 410, the reaction of the following formula (1) and formula (2) can be generated through the action of the photocatalyst 400. In other words, in this embodiment, the organic compound product is formic acid (HCOOH). CH 3COCH 3→HCOOH + CH 3CHO......Formula (1) CH 3CHO→2HCOOH……Formula (2) However, in different embodiments, the light source 300 may be a light emitting device that emits first light of other wavelengths, the photocatalyst 400 is not limited to titanium dioxide, and the organic compound product may be acetic acid, etc.

[0067] FIG. 1B is a schematic cross-sectional view of the AA′ section in FIG. 1A . In the embodiment shown in FIG. 1B , the liquid input unit 510 is connected to the interior of the cavity 100 and can provide a solvent to contact the surface of the photocatalyst 400 . The organic compound product can be dissolved in a solvent such as water, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas phase organic compound in the solvent. Specifically, in one embodiment, the liquid input unit 510 can be a pipeline that penetrates from the outside of the cavity 100, and the solvent can be transported by a device such as a pump or enter the cavity 100 by gravity, and contact the surface of the photocatalyst 400. One end of the pipeline in the cavity 100 can further be provided with a spray hole 511 facing the photocatalyst 400, so that the solvent is sprayed on the surface of the photocatalyst 400 in a shower manner. In different embodiments, one end of the pipeline in the chamber 100 may not face the photocatalyst 400, and the solvent simply flows into and out of the chamber 100, flowing through the surface of the photocatalyst 400 in a reciprocating immersion manner. The liquid input unit 510 may supply the solvent in a batch manner or a continuous manner, that is, the solvent may flow through the surface of the photocatalyst 400 intermittently or continuously.

[0068] In the embodiment shown in FIG. 1B , the gas discharge unit 220 is connected to the interior of the chamber 100 and can discharge the gas to be treated that has been in contact with the photocatalyst and separated from the photocatalyst 400. Specifically, in one embodiment, the gas discharge unit 220 can be an opening on one side of the chamber 100 or an interface connected to an external pipeline, etc. The gas to be treated can be transported through the gas discharge unit 220 by a device such as a pump or a fan to be discharged from the chamber 100. The liquid discharge unit 520 is connected to the interior of the chamber 100 and can discharge the solvent containing the organic compound product that is separated from the photocatalyst 400. Specifically, in one embodiment, the liquid discharge unit 520 can be a pipeline that penetrates from the outside of the chamber 100, and the solvent can be transported by a device such as a pump or by gravity to leave the chamber 100.

[0069] Furthermore, in one embodiment, the aforementioned acetone as a gas phase organic compound can generate formic acid as an organic compound product through the action of the photocatalyst 400, and at least a part of it is attached to the surface of the photocatalyst 400. Generally speaking, formic acid can undergo the following reaction (3): 2HCOOH+O 2→2CO 2+2H 2O......Formula (3) Decomposed into carbon dioxide and water. However, this reaction rate is relatively slow and can be regarded as a rate-determining step (RDS). The surface of the photocatalyst 400 cannot continue to react with the gas phase organic compound acetone due to the attachment of formic acid, thereby causing a significant decrease in the reaction rate. In contrast, in the present invention, a solvent is provided to contact the surface of the photocatalyst 400, and because the solubility of the organic compound product (formic acid) in the solvent (water) is higher than the solubility of the gas phase organic compound (acetone) in the solvent (water), or the volatility of the organic compound product (formic acid) in the solvent (water) is lower than that of the gas phase organic compound (acetone) in the solvent (water), the formic acid attached to the surface of the photocatalyst 400 can be quickly taken away by water, allowing the photocatalyst 400 to continue to react with acetone, thereby significantly increasing the reaction rate. The time for the gas phase organic compound such as acetone to contact the photocatalyst is preferably longer than the time for the gas phase organic compound to react with the photocatalyst to form an organic compound product such as formic acid, but shorter than the time required for the gas phase organic compound to completely react to form the final reactant such as carbon dioxide and water. From a different perspective, the purpose of the present invention is not to accelerate the complete reaction of the gas phase organic compound, but to use the difference in solubility or volatility between the gas phase organic compound and the organic compound product in the solvent to substantially wash the surface of the photocatalyst 400 with the solvent, remove the organic compound product attached to the surface of the photocatalyst 400, and allow the photocatalyst 400 to continue to react with the gas phase organic compound under ultraviolet light, thereby greatly increasing the reaction rate.

[0070] In different embodiments, the gas to be processed can pass through a solvent to make at least part of the gas phase organic compound form a liquid phase organic compound, and the liquid phase organic compound can generate an organic compound product through the action of a photocatalyst. From a different perspective, the gas to be processed entering the chamber can be washed with water to make at least part of the gas phase organic compound therein dissolve in water to form a liquid phase organic compound, and then the organic compound product can also be generated through the action of a photocatalyst and carried away from the surface of the photocatalyst by water.

[0071] As shown in the embodiments of FIG. 1A to FIG. 1C , the shape, size, arrangement, relative angle, etc. of each component in the gas processing module 900 can be adjusted according to the needs. On the other hand, the gas processing module 900 can also be a plurality of groups and arranged in series to improve the treatment effect and / or treatment capacity of the gas phase organic compound.

[0072] Gas treatment module embodiment 1: A substrate with a length of 150 mm, a width of 150 mm, a thickness of 50 mm, and a pore diameter of 4 mm, made of cordierite, mullite, aluminum titanate, silicon carbide, zirconium oxide, silicon nitride, etc., is used, and a titanium dioxide photocatalyst is arranged on the surface, and a lamp tube emitting ultraviolet light with a wavelength slightly less than 400 nm is used to irradiate the photocatalyst at an angle of 30° and a distance of 150 mm between the lamp tubes, and the distance between the sprinkler heads is 50 mm. When the flow rate of the gas to be treated is 0.4 m3 / min, the results of no water washing and continuous flow of water at a flow rate of 75.6 L / min·m2 through the photocatalyst are shown in Table 1 and Figure 2A below. It can be clearly seen that the average removal amount and average removal efficiency of acetone by continuous water washing are significantly better than those without water washing. It can be proved that the gas treatment module of the present invention has a better removal effect on gas phase organic compounds in mixed gas. Table 1 No water washing Washable Average input concentration of acetone (μg / m 3) 34.1 32.7 Average acetone removal (μg / hr) 447 1964 Average removal efficiency of acetone (%) 10 41

[0073] In the first embodiment of the gas treatment module, the flow rate of the gas to be treated is 0.4 m 3 / min, and water with a flow rate of 75.6 L / min·m 2 continuously flows through the photocatalyst. The removal results of isopropanol, acetone, and toluene are shown in FIG. 2B . It can be clearly seen that the gas treatment module of the present invention has a good removal effect on the above three.

[0074] In the gas treatment module embodiment 1, the flow rate of the gas to be treated is 0.4 m 3 / min, and there is no water washing, circulating water washing, and continuous water washing (using a flow rate of 75.6 L / min·m 2 of water to continuously wash the photocatalyst in a shower manner). The results of acetone removal are shown in Figures 3A and 3B, and it can be clearly seen that continuous water washing has a better effect.

[0075] In the gas treatment module embodiment 1, the flow rate of the gas to be treated is 0.4 m 3 / min, and the photocatalyst is continuously flushed with water at flow rates of 4.27, 50.7, and 75.6 L / min·m 2, respectively. The results of acetone removal are shown in Table 2 and Figure 3C. It can be clearly seen that 75.6 L / min·m 2 has a better effect. Table 2 Flow rate (L / min·m2) Average input concentration of acetone (μg / m 3) Average acetone emission concentration (μg / m 3) Average removal efficiency of acetone (%) 42.7 29.7 26.9 10 50.7 28.3 22.1 twenty two 75.6 32.7 19.3 41

[0076] In the aforementioned gas treatment module embodiment 1, the flow rates of the gas to be treated are 2.5, 1.5, and 0.7 m / s, respectively, and water with a flow rate of 75.6 L / min·m 2 continuously flows through the photocatalyst. The results of acetone removal are shown in Table 3 below. It can be clearly seen that 0.7 m / s has a better effect. Table 3 Gas flow rate (m / s) Average input concentration of acetone (μg / m 3) Average acetone emission concentration (μg / m 3) Average removal efficiency of acetone (%) 2.5 34.5 26.9 22.0 1.5 32.7 19.3 41.0 0.7 34.1 10.2 70.1

[0077] As shown in the schematic flow chart of the embodiment in FIG. 4 , the gas treatment method of the present invention includes, for example, the following steps.

[0078] Step S1000, providing a gas to be treated, the gas to be treated comprising a gas phase organic compound. In one embodiment, this step comprises providing the gas to be treated together with a solvent. More specifically, the gas phase organic compound comprises a volatile organic compound (VOC). In one embodiment, the gas phase organic compound comprises one or more selected from isopropanol, acetone, and toluene. In different embodiments, in order to avoid reasons such as possible performance reduction, the gas phase organic compound does not comprise one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

[0079] Step S2000, making the gas to be treated contact the surface of the photocatalyst, so that at least part of the gas phase organic compound is generated into an organic compound product by the action of the photocatalyst. More specifically, in one embodiment, the gas to be treated is made to contact the surface of the photocatalyst 400 shown in FIG. 1A, so that at least part of the gas phase organic compound is generated into an organic compound product by the action of the photocatalyst 400. In addition, in one embodiment, this step also includes continuously providing ultraviolet light to irradiate the photocatalyst, so that the gas phase organic compound is acted to generate an organic compound product. In another embodiment, this step also includes allowing the gas phase organic compound to be acted on by the photocatalyst multiple times to generate an organic compound product.

[0080] Step S3000, providing a solvent to contact the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas phase organic compound in the solvent. More specifically, in one embodiment, as shown in FIG. 1A, the solvent is contacted with the photocatalyst 400 to dissolve the organic compound product in the solvent. This step may include supplying the solvent in a batch manner or a continuous manner, that is, intermittently or continuously allowing the solvent to flow through the surface of the photocatalyst 400. The flow rate of the solvent flowing through the surface of the photocatalyst is preferably above 75.6L / min‧m 2. The flow rate of the gas phase organic compound flowing through the surface of the photocatalyst is preferably below 0.7m / s. This step may include spraying the solvent on the surface of the photocatalyst in a shower manner or flowing through the surface of the photocatalyst in a reciprocating immersion manner.

[0081] Step S4000, separating the gas to be treated that has contacted the photocatalyst and the solvent containing the organic compound product from the photocatalyst. More specifically, in one embodiment, the gas to be treated that has contacted the photocatalyst 400 and the solvent containing the organic compound product are separated from the photocatalyst 400 as shown in FIG. 1B. Further, the time for the gas phase organic compound such as acetone to contact the photocatalyst should be greater than the time for it to react with the photocatalyst to form an organic compound product such as formic acid, but less than the time required for it to completely react into the final reactant such as carbon dioxide and water.

[0082] In the conventional technology of decomposing gas phase organic compounds using photocatalysts, the surface of the photocatalyst cannot continue to react with the gas phase organic compound due to the attachment of the organic compound product, thus causing a significant decrease in the reaction rate. In contrast, in the present invention, a solvent is provided to contact the surface of the photocatalyst, and because the solubility of the organic compound product (such as formic acid) in the solvent (such as water) is higher than the solubility of the gas phase organic compound (such as acetone) in the solvent, or the volatility of the organic compound product in the solvent is lower than that of the gas phase organic compound in the solvent, the organic compound product attached to the surface of the photocatalyst can be quickly removed by the solvent, allowing the photocatalyst to continue to react with the gas phase organic compound, thereby greatly increasing the reaction rate. From a different perspective, the purpose of the present invention is not to accelerate the complete reaction of the gas phase organic compound, but to utilize the difference in solubility or volatility between the gas phase organic compound and the organic compound product in the solvent, use the solvent to substantially wash the surface of the photocatalyst, remove the organic compound product attached to the surface of the photocatalyst, and allow the photocatalyst to continue to react with the gas phase organic compound, thereby greatly increasing the reaction rate.

[0083] As shown in the flow chart of the embodiment in FIG5 , the gas treatment method of the present invention further comprises step S1200 , passing the gas to be treated through a filter unit. More specifically, as shown in FIG1B , passing the gas to be treated through a filter unit 410 .

[0084] As shown in the flow diagram of the embodiment in FIG6 , the gas treatment method of the present invention further includes step S1500, passing the gas to be treated through a solvent to make at least part of the gas phase organic compound form a liquid phase organic compound; and step S2500, making the liquid phase organic compound generate an organic compound product through the action of a photocatalyst. From a different perspective, the gas to be treated entering the chamber can be washed with water to make the gas phase organic compound at least partially dissolved in water to form a liquid phase organic compound, and then the organic compound product can also be generated through the action of a photocatalyst and carried away from the surface of the photocatalyst by water. Step S2500 includes making the liquid phase organic compound generate an organic compound product by multiple actions of a photocatalyst.

[0085] In the above-mentioned gas treatment method, the gas to be treated may contain one or more gas phase organic compounds, that is, one or more gas phase organic compounds may be treated at the same time. In one embodiment, the same concept may be applied to the treatment of a single gas phase organic compound and a mixture thereof.

[0086] As shown in the schematic flow chart of the embodiment in FIG. 7 , the gas phase organic compound treatment method of the present invention includes, for example, the following steps.

[0087] Step A1000, providing a gas phase organic compound. In one embodiment, this step includes providing the gas phase organic compound together with a solvent. More specifically, the gas phase organic compound includes volatile organic compounds (VOC). In one embodiment, the gas phase organic compound includes one or more selected from isopropanol, acetone, and toluene. In different embodiments, in order to avoid reasons such as possible performance reduction, the gas phase organic compound does not include one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long chain alkane compounds.

[0088] Step A2000, allowing the gas phase organic compound to generate an organic compound product through the action of a photocatalyst. In one embodiment, this step includes continuously providing ultraviolet light to the photocatalyst to allow the gas phase organic compound to act to generate an organic compound product. In another embodiment, this step includes allowing the gas phase organic compound to act multiple times through the photocatalyst to generate an organic compound product.

[0089] Step A3000, providing a solvent to contact the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gas phase organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gas phase organic compound in the solvent. Step A3000 includes supplying the solvent in a batch or continuous manner. The flow rate of the solvent flowing through the surface of the photocatalyst is preferably above 75.6L / min‧m2. The flow rate of the gas phase organic compound flowing through the surface of the photocatalyst is preferably below 0.7m / s. In one embodiment, this step includes spraying the solvent on the surface of the photocatalyst in a shower manner. In another embodiment, this step includes flowing the solvent through the surface of the photocatalyst in a reciprocating immersion manner.

[0090] Step A4000, separating the solvent containing the organic compound product from the photocatalyst.

[0091] As shown in the schematic flow chart of the embodiment in FIG8 , the gas phase organic compound treatment method of the present invention further comprises step A1200 , wherein the gas phase organic compound passes through a filtering unit.

[0092] As shown in the flow diagram of the embodiment in FIG9 , the gas phase organic compound treatment method of the present invention further comprises step A1500, wherein the gas phase organic compound is passed through a solvent to form at least a portion of the gas phase organic compound into a liquid phase organic compound; and step A2500, wherein the liquid phase organic compound is subjected to the action of a photocatalyst to generate an organic compound product. Step A2500 comprises subjecting the liquid phase organic compound to the action of a photocatalyst multiple times to generate an organic compound product.

[0093] Although the foregoing description and drawings have disclosed the preferred embodiments of the present invention, it must be understood that various additions, numerous modifications and substitutions may be used in the preferred embodiments of the present invention without departing from the spirit and scope of the principles of the present invention as defined by the appended claims. A person skilled in the art of the art to which the present invention belongs will appreciate that the present invention may be used in numerous forms, structures, arrangements, proportions, materials, components and assembly modifications. Therefore, the embodiments disclosed herein should be considered to illustrate the present invention, not to limit the present invention. The scope of the present invention shall be defined by the appended claims, and include their legal equivalents, and shall not be limited to the foregoing description.

[0094] 100: Cavity 210: Gas input unit 220: Gas exhaust unit 300: Light source 400: Photocatalyst 410: Filter unit 510: Liquid input unit 511: Spray hole 520: Liquid discharge unit 900: Processing module

[0095] (none)

Claims

1. A gas processing module, comprising: a cavity; a gas input unit communicating with the interior of the cavity and capable of supplying a gas to be processed into the cavity, the gas to be processed comprising a gaseous organic compound; a light source disposed in the cavity and capable of providing a first light beam; a photocatalyst disposed in the cavity, wherein, when irradiated by the first light beam, the gaseous organic compound in the gas to be processed, which is at least partially in contact with the photocatalyst, can generate an organic compound product through the action of the photocatalyst; a liquid input unit communicating with the interior of the cavity and capable of providing a solvent to contact the surface of the photocatalyst, wherein the organic compound product is soluble in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gaseous organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gaseous organic compound in the solvent; and a gas exhaust unit communicating with the interior of the cavity and capable of exhausting the gas to be processed that has been in contact with the photocatalyst and is separated from it. A liquid discharge unit, connected to the interior of the cavity, is provided to discharge the solvent containing the organic compound product separated from the photocatalyst; wherein... The gas to be treated can pass through the solvent, causing at least a portion of the gaseous organic compound to form a liquid organic compound; and the liquid organic compound can generate the organic compound product through the action of the photocatalyst.

2. The gas processing module as claimed in claim 1, wherein the light source includes continuously providing ultraviolet light as the first ray.

3. The gas processing module as described in claim 1 further includes a filter unit through which the gas to be processed can pass.

4. The gas processing module as claimed in claim 3, wherein the photocatalyst is disposed on one side of the filter unit, and the light source and the liquid input unit are disposed on the outside of the filter unit and facing the photocatalyst.

5. The gas processing module as described in claim 1 may be a complex array and configured in series.

6. The gas processing module as claimed in claim 1, wherein the liquid input unit supplies the solvent in batches.

7. The gas processing module as claimed in claim 1, wherein the liquid input unit supplies the solvent in a continuous manner.

8. The gas processing module as claimed in claim 7, wherein the solvent flows through the surface of the photocatalyst at a rate of 75.6 L / min‧m2 or higher.

9. The gas processing module as claimed in claim 1, wherein the flow velocity of the gaseous organic compound across the surface of the photocatalyst is less than 0.7 m / s.

10. The gas processing module as claimed in claim 1, wherein the liquid input unit sprays the solvent onto the surface of the photocatalyst in a shower-like manner.

11. The gas processing module as claimed in claim 1, wherein the liquid input unit causes the solvent to flow over the surface of the photocatalyst in a repetitive immersion manner.

12. The gas processing module as claimed in claim 1, wherein the gaseous organic compound comprises one or more selected from isopropanol, acetone, and toluene.

13. The gas processing module as claimed in claim 1, wherein the gaseous organic compound does not contain one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

14. A gas treatment method, comprising: (S1000) providing a gas to be treated, the gas to be treated comprising a gaseous organic compound; (S2000) contacting the gas to be treated with the surface of a photocatalyst, causing at least a portion of the gaseous organic compound to generate an organic compound product by the action of the photocatalyst; (S3000) providing a solvent; (S3200) passing the gas to be treated through the solvent, causing at least a portion of the gaseous organic compound to form a liquid organic compound; (S3400) causing the liquid organic compound to generate the organic compound product by the action of the photocatalyst; (S4000) contacting the solvent with the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gaseous organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gaseous organic compound in the solvent; (S5000) Separate the gas to be treated that has come into contact with the photocatalyst and the solvent containing the organic compound product from the photocatalyst.

15. The gas treatment method of claim 14, wherein step S2000 comprises continuously providing ultraviolet light to the photocatalyst to cause the gaseous organic compound to react and generate the organic compound product.

16. The gas processing method as claimed in claim 14, further comprising: (S1200) passing the gas to be processed through a filter unit.

17. The gas processing method of claim 14, wherein step S2000 comprises subjecting the gaseous organic compound to multiple reactions by the photocatalyst to generate the organic compound product.

18. The gas treatment method of claim 14, wherein step S3400 comprises subjecting the liquid-phase organic compound to multiple reactions by the photocatalyst to generate the organic compound product.

19. The gas processing method as claimed in claim 14, wherein step S3000 includes supplying the solvent in batches.

20. The gas processing method as claimed in claim 14, wherein step S3000 comprises supplying the solvent in a continuous manner.

21. The gas treatment method as claimed in claim 20, wherein the solvent flows through the surface of the photocatalyst at a rate of 75.6 L / min‧m2 or higher.

22. The gas processing method as claimed in claim 14, wherein the flow velocity of the gaseous organic compound across the surface of the photocatalyst is less than 0.7 m / s.

23. The gas treatment method as claimed in claim 14, wherein step S3000 comprises spraying the solvent onto the surface of the photocatalyst in a shower-like manner.

24. The gas treatment method as claimed in claim 14, wherein step S3000 comprises flowing the solvent over the surface of the photocatalyst in a repetitive rinsing manner.

25. The gas processing method as claimed in claim 14, wherein the gaseous organic compound comprises one or more selected from isopropanol, acetone, and toluene.

26. The gas processing method as claimed in claim 14, wherein the gaseous organic compound does not contain one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

27. A method for treating a gaseous organic compound, comprising: (A1000) providing a gaseous organic compound; (A2000) subjecting the gaseous organic compound to a photocatalyst to generate an organic compound product; (A3000) providing a solvent; (A3200) passing the gaseous organic compound through the solvent to form at least a portion of the gaseous organic compound into a liquid organic compound; (A3400) subjecting the liquid organic compound to the photocatalyst to generate the organic compound product; (A4000) contacting the solvent with the surface of the photocatalyst to dissolve the organic compound product in the solvent, wherein the solubility of the organic compound product in the solvent is higher than the solubility of the gaseous organic compound in the solvent, or the volatility of the organic compound product in the solvent is lower than the volatility of the gaseous organic compound in the solvent; and (A5000) separating the solvent containing the organic compound product from the photocatalyst.

28. The gaseous organic compound treatment method as claimed in claim 27, wherein step A2000 includes continuously providing ultraviolet light to the photocatalyst to cause the gaseous organic compound to react and generate the organic compound product.

29. The method for processing a gaseous organic compound as claimed in claim 27, wherein step A2000 comprises subjecting the gaseous organic compound to multiple reactions by the photocatalyst to generate the organic compound product.

30. The gas treatment method as claimed in claim 27, wherein step A3400 comprises subjecting the liquid-phase organic compound to multiple reactions via the photocatalyst to generate the organic compound product.

31. The method for processing a gaseous organic compound as claimed in claim 27, wherein step A1000 comprises providing the gaseous organic compound together with the solvent.

32. The gas-phase organic compound processing method as claimed in claim 27, wherein step A3000 includes supplying the solvent in batches.

33. The gas-phase organic compound processing method as claimed in claim 27, wherein step A3000 includes supplying the solvent in a continuous manner.

34. The gas-phase organic compound treatment method as claimed in claim 33, wherein the solvent flows through the surface of the photocatalyst at a rate of 75.6 L / min‧m2 or higher.

35. The method for processing a gaseous organic compound as claimed in claim 27, wherein the flow rate of the gaseous organic compound across the surface of the photocatalyst is less than 0.7 m / s.

36. The gas-phase organic compound treatment method as claimed in claim 27, wherein step A3000 comprises spraying the solvent onto the surface of the photocatalyst in a shower-like manner.

37. The gas-phase organic compound treatment method as claimed in claim 27, wherein step A3000 comprises flowing the solvent over the surface of the photocatalyst in a repetitive rinsing manner.

38. The method for processing a gaseous organic compound as claimed in claim 27, wherein the gaseous organic compound comprises one or more selected from isopropanol, acetone, and toluene.

39. The method for processing a gaseous organic compound as claimed in claim 27, wherein the gaseous organic compound does not contain one or more selected from polyhalogenated compounds, benzene ring compounds, polycyclic aromatic hydrocarbons, and long-chain alkane compounds.

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