Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device under test tested by the probe card

Abstract

A probe system, probe card, probe head, probes, and electronic device for testing by the probe card are described herein. The probe head includes a plurality of probes, an upper guide plate, and a lower guide plate. The probes pass through the upper and lower guide plates and include a tip, a tail, and a body. The tip includes a contact area for contacting a contact pad on the device under test during testing. The body is located between the tip and tail and extends along a longitudinal axis. The transverse section of the body is perpendicular to the longitudinal axis and has a wide side and a thick side. The wide side represents the width of the body, and the thick side represents the thickness of the body. The length of each probe is greater than the thickness of the body. The body has a multi-layered structure, including a plurality of laminations and at least one slit. The laminations are separated along the wide side, and the at least one slit separates the laminations; the thickness of the body is greater than or equal to the width of the body.

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