Installation devices, installation methods, and computer programs

Abstract

The present invention aims to provide a mounting device, etc., which can accurately and quickly align a mounting body such as a semiconductor wafer with a substrate or other object, and place the mounting body on the target position on the object with high precision and in a short time for installation. A mounting device includes: a mounting tool for acquiring and holding the mounting body; a first imaging unit and a second imaging unit having a field of view overlooking a stage from one side of the mounting tool, wherein each optical system and imaging element is configured to satisfy the Sham condition so that a plane corresponding to the stage surface of the stage becomes the focal plane, and to capture images of a mark on the object to be mounted and a mark on the mounting body determined within the field of view; a calculation unit for calculating the relative position between the mark on the object to be mounted and the mark on the mounting body based on a first image output from the first imaging unit and a second image output from the second imaging unit; and a mounting control unit for correcting the position of the mounting body based on the calculation result of the calculation unit to place the mounting body on the object to be mounted.

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