Tray for large-size semiconductor integrated circuits

Abstract

The present invention provides a tray 1 for a large-size semiconductor integrated circuit, comprising: one or more recesses 2 for accommodating a large-size semiconductor integrated circuit. A circular recess 10 having a circular profile 8 is formed on the inner bottom surface 4 of each recess. The circular profile 8 is substantially concentric with the center of each recess. The circular recess 10 is formed on the inner bottom surface 4 of a recess 2 to prevent the inner bottom surface 4 from contacting terminals on the bottom surface of a semiconductor integrated circuit to be placed in the recess.

Description

[Technical Field]

[0001] The present invention relates to a tray suitable for a substrate of semiconductor integrated circuits such as ICs, and more particularly, the present invention relates to a tray suitable for a large-size semiconductor integrated circuit (including semiconductor package) having multiple terminals on its own bottom surface. [Previous Technology]

[0002] A semiconductor integrated circuit tray (hereinafter also simply referred to as "tray") is provided with one or more pockets for accommodating a substrate of a semiconductor integrated circuit. Additionally, the tray for the semiconductor integrated circuit is provided with a support step extending horizontally along the pocket of the tray, such that the support step supports a semiconductor integrated circuit and prevents the inner bottom surface of the pocket from contacting the terminals of the semiconductor integrated circuit, wherein the semiconductor integrated circuit placed in the pocket is a grid array type (e.g., PGA type, BGA type, etc.).

[0003] A tray conforming to the JEDEC (Engineering Committee for Electron Devices) standard has horizontal and vertical dimensions ([horizontal dimension] x [vertical dimension]) of [315.0 mm - 322.6 mm (approximately 12.4 inches - 12.7 inches)] x [135.9 mm (approximately 5.35 inches)] and can be operated by conventional automated machinery applicable to JEDEC standard trays.

[0004] However, the substrate of some large-size semiconductor volumetric circuits may be deformed due to manufacturing errors. Or, when a substrate of a semiconductor volumetric circuit is deflected fortuitously, the terminals on the bottom surface of the semiconductor volumetric circuit may come into contact with the inner bottom surface of the groove of the tray.

[0005] Japanese Patent Publication No. 2022-142375 discloses a recess located on the inner bottom surface of a groove in a tray, the recess having a flat surface that is substantially similar to the bottom surface of a semiconductor integrated circuit, and having a depth that is longer than the height of a terminal disposed on the bottom surface of the semiconductor integrated circuit.

[0006] When a large-size semiconductor integrated circuit tray is the same size as the JEDEC standard limit, misalignment occurs; such that the inner bottom surface of the groove on the tray may come into contact with the terminals on the bottom surface of the semiconductor integrated circuit placed in the groove. Furthermore, it is difficult to manipulate large-size semiconductor integrated circuit trays with horizontal and vertical dimensions of 120 x 120 mm (approximately 4.72 x 4.72 inches) or larger in a plan view using conventional automated machinery applicable to JEDEC standard trays. [Summary of the Invention]

[0007] The present invention provides a tray for large-size semiconductor integrated circuits, comprising: one or more recesses for accommodating large-size semiconductor integrated circuits. Each recess has a circular recess with a circular outline formed on its inner bottom surface.

[0008] In a specific instance, the circular profile is substantially concentric with the center of each groove.

[0009] In one specific example, a circular groove has a circular profile, which is formed on the other side of the inner bottom surface of each groove.

[0010] In a specific example, the circular outline on the other side is substantially concentric with the center of each groove.

[0011] In one specific example, the circular groove is formed by a spherical dome having a predetermined radius of curvature.

[0012] In one specific example, the pallet has a protrusion that extends laterally from the longitudinal sidewall of the pallet.

[0013] In a specific example, each protrusion has a generally rectangular shape.

[0014] In a specific example, each protrusion has a generally trapezoidal shape.

[0015] In another specific instance, each protrusion has a generally shaped form.

[0016] In one specific example, the protrusion is positioned at a predetermined distance from the longitudinal side end of the tray.

Implementation Method

[0028] Hereinafter, an embodiment of a tray for large-size semiconductor integrated circuits according to the present invention will be described in detail based on specific examples illustrated in the attached drawings.

[0029] FIG1 is a perspective view of one embodiment of the semiconductor integrated circuit tray of the present invention. The upper surface of the tray 1 is provided with one or more grooves 2, depending on the construction and size of the semiconductor integrated circuit to be placed in the groove 2 of the tray 1. In addition, a groove 2 is provided with a support step 6, which extends horizontally along the inner sidewall of the groove 2 to support the edge of the semiconductor integrated circuit and prevent the inner bottom surface 4 of the groove 2 from contacting the terminals 7 on the bottom surface 4 of the semiconductor integrated circuit.

[0030] As shown in Figure 1, a circular groove 10 with a circular outline 8 is formed on the bottom surface of each of the two grooves 2 on the upper surface of the tray 1.

[0031] Figure 2(a) is a cross-sectional view taken along line AA in Figure 1.

[0032] Figure 2(b) illustrates a tray 1, which is used to exaggerate the definition of a circular groove 10, although a truly circular groove 10 is slightly too round to be seen with the naked eye. As illustrated in Figure 2(b), the circular groove 10 may be formed on the inner bottom surface 4 of a groove 2 of the tray 1.

[0033] Figure 2(c) is a perspective view showing that the circular groove 10 is composed of a curved spherical dome (a spherical segment taken along the inner bottom surface 4). Figure 2(c) exaggerates the tray 1 to clearly show the circular surface of the spherical dome. As shown, the circular groove 10 formed on the inner bottom surface 4 of the groove 2 prevents the inner bottom surface 4 from contacting the terminals (especially the terminals around the center of the substrate) on the bottom surface of a semiconductor integrated circuit to be placed in the groove 2. The dotted lines spanning Figures 2(a)-(c) indicate corresponding points.

[0034] Figure 3 illustrates an embodiment of a tray 1. Figure 3(a) is a cross-sectional view taken along line AA in Figure 1. Figure 3(b) illustrates a circular groove 10 formed on the inner bottom surface 4 of the groove 2 of the tray 1. Figure 3(b) further illustrates the circular outline 8 of the circular groove 10 in the groove 2, wherein the circular outline 8 is substantially concentric with the center of the groove 2 (i.e., the two diagonals leading to opposite corners of the circular outline 2 intersect at the center of the circular outline). Figure 3(b) further illustrates the circular groove 10 of the circular outline 8. In one specific example, a circular outline 8 has the radius shown in the figure; meanwhile, in another embodiment, a circular outline 8 may have a different radius. In some specific instances, the circular groove 10 is composed of a spherical dome (a spherical segment taken along the inner bottom surface 4) with a predetermined radius of curvature in the range of 1,000 mm to 5,000 mm (approximately 39.37 inches to approximately 196.9 inches). For example, the predetermined radius of curvature is 3,000 mm (approximately 118.1 inches).

[0035] Figure 4 illustrates another embodiment of the tray 1. Figure 4(a) is a cross-sectional view taken along line AA in Figure 1. As illustrated in Figure 4(b), a circular groove 10 is formed on the reverse side of the inner bottom surface of a groove 2 in the tray 1. Figure 4(b) further illustrates the circular profile 8 of the circular groove 10, wherein the circular profile 8 is substantially concentric with the center of the groove 2. In some specific instances, the circular groove 10 is composed of a spherical dome (a spherical segment taken along the lower side of the tray 1) having a predetermined radius of curvature.

[0036] Figure 5 illustrates another embodiment of the tray 1. Figure 5(a) is a cross-sectional view taken along line AA in Figure 1. In this embodiment, a circular groove 10 is formed on the upper and lower surfaces of the tray 1 as illustrated in Figures 5(b)-(c). Figure 5(b) shows a circular groove 10 formed on the inner bottom surface of a groove 2 of the tray 1. Figure 5(c) shows a circular groove 10 formed on the other side of the inner bottom surface 4 of the groove 2. Figures 5(b)-(c) further show the circular outline 8 of the circular groove 10, which is substantially concentric with the center of the groove 2. With such a structure, the tray 1 can resist forces in the bending direction even when it is very thin, and when large-size semiconductor integrated circuits are packaged in the tray 1, substrate deformation (warping, deflection, etc.) is avoided.

[0037] Figure 6 illustrates a first specific embodiment of the invention. Figure 6(a) is a cross-sectional view taken along line AA in Figure 1. Figure 6(b) is a cross-sectional view that exaggerates the formation of an arched circular groove 10 on the bottom surface 4 within the groove 2 of the tray 1. This circular groove 10 formed on the inner bottom surface 4 of the groove 2 prevents the inner bottom surface 4 from contacting the terminals (particularly the terminals around the center of the substrate) on the bottom surface of the semiconductor integrated circuit to be placed in the groove 2.

[0038] Figure 7 illustrates a second specific embodiment of the invention. Figure 7(a) is a cross-sectional view taken along line AA in Figure 1. Figure 7(b) is a cross-sectional view 12, which exaggerates an arched circular groove 10 on one side of the inner bottom surface 4 of the tray 1. Although the tray 1 is very thin, it is rigid and not easily broken because the weight of the semiconductor integrated circuit substrate will be received by the bridging structure of the circular groove 10 on the underside of the tray 1.

[0039] Figure 8 illustrates a third specific embodiment of the invention. Figure 8(a) is a cross-sectional view 12 taken along line AA in Figure 1. Figure 8(b) is a cross-sectional view 12 illustrating an arched circular groove 10 on the inner bottom surface 4 of the groove 2 of the tray 1. Figure 8(c) is a cross-sectional view 12 illustrating an arched circular groove 10 on the other side of the inner bottom surface 4 of the tray 2. Figures 8(b)-(c) exaggerate the tray 1 so that the bridging structure (arched structure) can be clearly seen.

[0040] The tray 1 illustrated in Figure 9-11 has a protrusion 14. This protrusion 14 allows the recess 2 of the tray 1 to accommodate a semiconductor integrated circuit having a horizontal and vertical dimension of 120 x 120 mm (approximately 4.72 x 4.72 in.) or larger in a plan view. The shape and dimensions of the protrusion 14 can be designed according to the size, weight, etc. of the semiconductor integrated circuit to be placed in the recess 2 of the tray 1. The protrusion 14 can extend laterally from the longitudinal sidewall 16 of the tray 1.

[0041] Figure 9 illustrates the protrusions 14 in a first specific example, each having a generally rectangular shape. Figure 9 further illustrates positions 18 of the protrusions 14 extending laterally beyond the longitudinal sidewalls 16 of the pallet 1, forming a cross-shaped pattern as shown. These positions 18 are a predetermined distance away from the longitudinal sides (i.e., corners) of the pallet 1. Positions 18 should be 20 to 70 mm (approximately 0.79 to 2.76 inches) away from the longitudinal side ends, which will allow conventional automated machinery suitable for JEDEC standard pallets to operate the pallet 1 with these protrusions 14; however, technically, the pallet 1 with these protrusions 14 does not conform to the JEDEC standard.

[0042] Figure 10 illustrates the protrusions 14 in the second specific example, each of which has a generally trapezoidal shape.

[0043] Figure 11 shows the protrusion 14 in the third example, each protrusion 14 having a generally composed of

[0044] Figure 11 illustrates the protrusions 14 in the third specific example, each of which has a generally arcuate shape, that is, an outline outlined by an arc (with a central angle of less than 180 degrees) and a subtense connecting the two ends of the arc. [Simplified Explanation of the Diagram]

[0017] Figure 1 is a plan view illustrating an embodiment of a tray for large-size semiconductor integrated circuits according to the present invention.

[0018] Figure 2 is a planar enlarged view of the groove of the tray for the semiconductor integrated circuit in Figure 1.

[0019] Figure 3 illustrates a tray with a circular groove, which is formed on the inner bottom surface of a groove in the tray.

[0020] Figure 4 illustrates a tray with a circular groove, which is formed on the other side of the inner bottom surface of a groove in the tray.

[0021] Figure 5 illustrates a tray with a circular groove formed on the inner bottom surface and on the other side of the inner bottom surface of a groove on the tray.

[0022] Figure 6 is a cross-sectional view illustrating an arched circular groove formed on the inner bottom surface of a groove in the tray.

[0023] Figure 7 is a cross-sectional view illustrating an arched circular groove formed on the other side of the inner bottom surface of a groove in the tray.

[0024] Figure 8 is a cross-sectional view illustrating an arched circular groove formed on the inner bottom surface and on the other side of the inner bottom surface of a groove in the tray.

[0025] Figure 9 illustrates a tray having a protrusion having a rectangular shape.

[0026] Figure 10 illustrates a tray having a protrusion having a trapezoidal shape.

[0027] Figure 11 illustrates a tray having a protrusion with an arcuate shape.

Claims

1. A tray for large-size semiconductor integrated circuits, comprising: One or more recesses for accommodating large-size semiconductor integrated circuits; Not only on the inner bottom surface of each groove, but also on the other side of the inner bottom surface of each groove, a circular groove with a circular outline is formed; and the circular outline is substantially concentric with the center of each groove.

2. A tray for large-size semiconductor integrated circuits as described in claim 1, wherein the dimensions of the recess in the tray are such that it accommodates a semiconductor integrated circuit having a horizontal and vertical dimension of 120 x 120 mm or greater in a plan view.

3. The tray for large-size semiconductor integrated circuits as described in claim 1 or 2, wherein the circular recess is composed of a spherical dome having a predetermined radius of curvature.

4. A tray for large-size semiconductor integrated circuits as described in claim 1 or 2, wherein the tray has a protrusion that extends laterally from the longitudinal sidewall of the tray.

5. The tray for large-size semiconductor integrated circuits as described in claim 4, wherein each of the protrusions has a generally rectangular shape.

6. The tray for large-size semiconductor integrated circuits as described in claim 4, wherein each of the protrusions has a generally trapezoidal shape.

7. The tray for large-size semiconductor integrated circuits as described in claim 4, wherein each of the protrusions has a generally arc-shaped form.

8. The tray for large-size semiconductor integrated circuits as described in claim 4, wherein the protrusion is located at a predetermined distance from the longitudinal side end of the tray.

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