Wafer box cover opening mechanism

TWI940155BActive Publication Date: 2026-09-21NIVEK INTERNATIONAL CO LTD
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Patent Information

Application Number
TW114122442
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-06-16
Publication Date
2026-09-21
Estimated Expiration
2045-06-15

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    Figure TWG2TB001912272_003
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Abstract

This invention provides a cap-opening mechanism, comprising a housing, a plurality of suction devices, a plurality of unlocking devices, and a plurality of fixing devices. The housing has a panel, a base plate, and a receiving space located between the base plate and the panel. The panel has a plurality of holes, and the base plate has a plurality of through holes. The suction devices are disposed in the receiving space and have a suction cup located within one of the holes. The unlocking devices are disposed in the receiving space and have an unlocking head located within one of the holes. The fixing devices pass through the through holes and fix the base plate to an inner surface of a wafer transport carrier. By means of the above-described mechanism, the plurality of fixing devices can be disassembled to replace the cap-opening mechanism with another, achieving the purpose of quickly changing the cap-opening mechanism.
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Claims

1. A cover-opening mechanism, comprising: a housing including a base plate and a panel, wherein a side wall extends from both sides of the base plate and the panel to form an accommodating space, connecting the base plate and the panel; the panel having a plurality of holes; the base plate having a plurality of through holes; and a plurality of adsorption devices and a plurality of unlocking devices respectively mounted on the base plate, wherein the adsorption devices and unlocking devices are both located within the accommodating space and extend into the holes on the panel; and a plurality of fixing devices, the fixing devices fixing the base plate to an inner surface of a wafer transport carrier through the through holes in the base plate; wherein... The housing can be removed from an inner surface of the wafer carrier using this fixing device.

2. The opening mechanism as described in claim 1, wherein, The adsorption device has a suction cup at one end, which extends from the accommodating space into the hole; the unlocking device has an unlocking head at one end, which extends from the accommodating space into the hole.

3. The opening mechanism as described in claim 1, wherein, The opening mechanism also includes a calibration plate, which is fixed between the base plate and the inner surface, and the calibration plate keeps the opening mechanism in a horizontal state.

4. The opening mechanism as described in claim 3, wherein, The opening mechanism also includes a plurality of locking devices, and the calibration plate includes a plurality of locking holes through which the locking devices pass to fix the calibration plate to the inner surface.

5. The opening mechanism as described in claim 3, wherein, The calibration plate also includes a groove that is horizontal, and one side of the base plate is pressed against the groove so that the opening mechanism is kept horizontal.

6. The lid-opening mechanism as described in claim 2, wherein, A plurality of the suction cups are located on the panel in an arrangement that corresponds to the arrangement of the adsorption surfaces on a wafer carrier.

7. The opening mechanism as described in claim 2, wherein, A plurality of the unlocking heads are located on the panel in another arrangement, which corresponds to the arrangement of latches on a wafer carrier.

8. The lid-opening mechanism as described in claim 2, wherein, The unlocking head is shaped like a flathead or a crosshead, and it can be rotated clockwise or counterclockwise around its own center to unlock.

9. The lid-opening mechanism as described in claim 2, wherein, The opening mechanism further includes a plurality of detection devices disposed in the receiving space, with one detection end of the detection device located in the hole, and the detection device detecting the distance between the panel and a wafer carrier.

10. The opening mechanism as described in claim 9, wherein, A plurality of the holes are evenly distributed on both sides of the panel, and each side has the suction cup, the unlocking head and the detection end.

11. The opening mechanism as described in claim 3, wherein, The fixing device includes a fixing screw and an adjusting screw. The adjusting screw has a through hole and an external thread. The adjusting screw passes through the through hole with the external thread and abuts against the calibration plate. The fixing screw enters the through hole and locks the adjusting screw to the calibration plate. Rotating the adjusting screw can finely adjust the distance between the panel and the calibration plate.

12. The opening mechanism as described in claim 4, wherein, The locking device includes a fixing screw and an adjusting screw. The adjusting screw has a through hole and an external thread. The adjusting screw is rotated through the locking hole with the external thread and abuts against the inner surface. The fixing screw is inserted into the through hole to lock the adjusting screw to the inner surface. Finally, the adjusting screw is rotated so that the distance between the calibration plate and the inner surface can be finely adjusted by the external thread.

Citation Information

Patent Citations

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    CN113097112A

  • Door opening apparatus, transmission chamber and semiconductor processing device

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  • A wafer box transporting device and wafer box transporting device equipment

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  • Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer box

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