Light-emitting packaged components
TWI940190BActive Publication Date: 2026-09-21BEST EPITAXY MFG CO LTD
Patent Information
- Application Number
- TW114126231
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-07-10
- Publication Date
- 2026-09-21
- Estimated Expiration
- 2045-07-09
Smart Images
Figure TWG2TB001912307_001 
Figure TWG2TB001912307_002 
Figure TWG2TB001912307_003
Abstract
A light-emitting packaging element includes a carrier substrate and a plurality of light-emitting diode (LED) chips. The carrier substrate has a plurality of through holes and a plurality of electrical connection units. Each electrical connection unit corresponds to two adjacent through holes and has a first electrical connection piece and a second electrical connection piece spaced apart. Each LED chip has a light-emitting unit and an electrode unit. The light-emitting unit has a semi-polar or non-polar N-type gallium nitride epitaxial layer and is connected to the first electrical connection piece and the second electrical connection piece of the corresponding electrical connection unit by flip-chip bonding. The carrier substrate simultaneously redefines the electrical connection lines of the LED chips, making subsequent applications easier.
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Citation Information
Patent Citations
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