Dicing frame

TWI940331BActive Publication Date: 2026-09-21SHIN ETSU POLYMER CO LTD
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Patent Information

Application Number
TW114137739
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2025-03-06
Filing Date
2025-09-30
Publication Date
2026-09-21
Estimated Expiration
2045-09-29

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Abstract

The present invention provides a dicing frame that can handle semiconductor wafers and glass substrates of different shapes using the same frame. The dicing frame (1) has an opening (30) with an annular shape and extending through in the thickness direction. The dicing frame (1) is used to hold the substrate and cut the substrate by using dicing tape that blocks the opening (30). The opening (30) has an opening shape that can surround any of the first substrate (circular in top view) and the second substrate (15) (rectangular in top view), and is non-circular and non-rectangular in top view.
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Citation Information

Patent Citations

  • Method of processing plate-like object which does not deteriorate the production efficiency even when dividing while protecting the surface of a plate-like object such as a wafer or a CSP substrate

    TW202018798A

  • Apparatus for joining adhesive tape

    TW202420493A