Ultra-thin glass substrate processing method, ultra-thin glass substrate processing device and temporary ultra-thin glass carrier assembly

Abstract

This invention provides a method for processing an ultrathin glass substrate, an apparatus for processing an ultrathin glass substrate, and an ultrathin glass temporary support assembly. The apparatus for processing the ultrathin glass substrate includes a substrate support module, an adhesive supply module, a glass bonding module, an adhesive curing module, and a glass processing module. The substrate support module is configured to support a temporary support substrate. The adhesive supply module is configured to provide a reversible adhesive layer onto the temporary support substrate. The glass bonding module is configured to attach an ultrathin glass substrate with a thickness of less than 100 µm to the reversible adhesive layer. The adhesive curing module is configured to cure the reversible adhesive layer, thereby integrating the ultrathin glass substrate, the reversible adhesive layer, and the temporary support substrate into an ultrathin glass temporary support assembly. The glass processing module is configured to process the ultrathin glass substrate to obtain a processed ultrathin glass substrate.

Claims

1. A method for processing an ultrathin glass substrate, comprising: An ultrathin glass substrate is provided, wherein the thickness of the ultrathin glass substrate is less than 100 µm; A reversible adhesive layer is provided on a temporary carrier substrate; The ultrathin glass substrate and the temporary support substrate carrying the reversible adhesive layer are aligned to adjust their relative positions; the ultrathin glass substrate and the temporary support substrate carrying the reversible adhesive layer are bonded together to attach the ultrathin glass substrate to the temporary support substrate carrying the reversible adhesive layer, thereby forming an ultrathin glass temporary support assembly comprising at least the ultrathin glass substrate, the reversible adhesive layer, and the temporary support substrate, with one upper surface of the ultrathin glass substrate completely exposed; the reversible adhesive layer of the ultrathin glass temporary support assembly is cured to fix the ultrathin glass substrate to the temporary support substrate; and the ultrathin glass substrate of the ultrathin glass temporary support assembly is processed to obtain a processed ultrathin glass substrate; When the ultrathin glass substrate is drilled to form at least one through hole, the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

2. The method for processing an ultrathin glass substrate as described in claim 1, wherein, The thickness of the ultrathin glass substrate is between 30 µm and 100 µm, and the ultrathin glass substrate is configured as an initial ultrathin glass substrate before processing; wherein, the temporary support substrate is configured as a metal substrate, a ceramic substrate, or a polymer substrate, and the thickness of the temporary support substrate is greater than the thickness of the ultrathin glass substrate; wherein, prior to the step of providing the reversible adhesive layer on the temporary support substrate, the processing method of the ultrathin glass substrate further includes: supporting the temporary support substrate through a substrate support module; and performing a surface treatment process on the temporary support substrate through a surface treatment module; wherein, the surface treatment process includes a cleaning and drying process for removing oil or particles, a surface roughening process for improving adhesive adhesion, or a plasma pretreatment process for improving adhesive adhesion; wherein, the step of providing the reversible adhesive layer on the temporary support substrate further includes: applying or attaching the reversible adhesive layer to the temporary support substrate through an adhesive providing module. The reversible adhesive layer is configured as a UV-removable adhesive layer, a heat-release adhesive layer, or a chemically solvent-soluble adhesive layer. The step of bonding the ultrathin glass substrate and the temporary support substrate carrying the reversible adhesive layer further includes: attaching the ultrathin glass substrate to the reversible adhesive layer through a glass bonding module. The step of bonding the ultrathin glass substrate and the temporary support substrate carrying the reversible adhesive layer further includes: gently pressing the ultrathin glass substrate in a vacuum or cleanroom environment to remove air bubbles formed between the ultrathin glass substrate and the reversible adhesive layer. The step of curing the reversible adhesive layer of the ultrathin glass temporary support component further includes: curing the reversible adhesive layer through an adhesive curing module, thereby fixing the ultrathin glass substrate onto the temporary support substrate; and wherein the adhesive curing module is configured to provide a predetermined adhesive curing light source or a predetermined adhesive curing heat source to the reversible adhesive layer, thereby curing the reversible adhesive layer between the temporary support substrate and the ultrathin glass substrate.

3. The method for processing an ultrathin glass substrate as described in claim 1, wherein, After the step of curing the reversible adhesive layer of the ultrathin glass temporary support component, the processing method of the ultrathin glass substrate further includes: performing a high-temperature resistance test, an acid corrosion resistance test, or an alkali corrosion resistance test on the ultrathin glass temporary support component; wherein, after the step of processing the ultrathin glass substrate of the ultrathin glass temporary support component, the processing method of the ultrathin glass substrate further includes: transferring the processed ultrathin glass substrate; and wherein, the step of transferring the processed ultrathin glass substrate further includes: stacking the processed ultrathin glass substrate on another processed ultrathin glass substrate through a substrate transfer module.

4. The method for processing an ultrathin glass substrate as described in claim 1, wherein, After processing the ultrathin glass substrate of the ultrathin glass temporary support assembly, the processing method of the ultrathin glass substrate further includes: separating the processed ultrathin glass substrate; wherein, the step of separating the processed ultrathin glass substrate further includes: allowing the processed ultrathin glass substrate to separate from the reversible adhesive layer through a glass debonding module; wherein, the glass debonding module is configured to provide a predetermined debonding light source or a predetermined debonding heat source to the reversible adhesive layer, thereby reducing the adhesion between the processed ultrathin glass substrate and the reversible adhesive layer; wherein, after separating the processed ultrathin glass substrate, the processing method of the ultrathin glass substrate further includes: cleaning the processed ultrathin glass substrate; wherein, the step of cleaning the processed ultrathin glass substrate further includes: cleaning the processed ultrathin glass substrate and the temporary support substrate through a glass cleaning module. The glass cleaning module is configured to provide a predetermined cleaning agent to the processed ultrathin glass substrate to remove foreign matter adhering to the processed ultrathin glass substrate. Following the cleaning step, the processing method further includes: recycling the temporary support substrate for reuse. Following the recycling step, the processing method further includes: inspecting the processed ultrathin glass substrate. The inspection step further includes: inspecting a predetermined appearance of the processed ultrathin glass substrate using an appearance inspection module; and inspecting a predetermined function of the processed ultrathin glass substrate using a functional testing module. The predetermined appearance of the processed ultrathin glass substrate includes surface flatness, surface bubbles, surface cracks, structural warping, or residual foreign matter. The predetermined function of the processed ultrathin glass substrate is an electrical function or an optical function.

5. A processing apparatus for ultrathin glass substrates, comprising: One signal control module; A substrate support module electrically connected to the signal control module, the substrate support module being configured to support a temporary support substrate; an adhesive supply module electrically connected to the signal control module, the adhesive supply module being configured to provide a reversible adhesive layer on the temporary support substrate; and a glass bonding module electrically connected to the signal control module, the glass bonding module being configured to attach an ultrathin glass substrate to the reversible adhesive layer. An adhesive curing module electrically connected to the signal control module is configured to cure the reversible adhesive layer to fix the ultrathin glass substrate onto the temporary support substrate; and a glass processing module electrically connected to the signal control module is configured to process the ultrathin glass substrate to obtain a processed ultrathin glass substrate; wherein the ultrathin glass substrate, the reversible adhesive layer, and the temporary support substrate are integrated into an ultrathin glass temporary support assembly, and an upper surface of the ultrathin glass substrate is completely exposed; and wherein the thickness of the ultrathin glass substrate is less than 100 µm.

6. The processing equipment for ultrathin glass substrates as described in claim 5, wherein, The adhesive material supply module is configured to apply or attach the reversible adhesive layer to the temporary support substrate, and the reversible adhesive layer is configured as a UV-release adhesive layer, a heat-release adhesive layer, or a chemical solvent-soluble adhesive layer; wherein, the adhesive material curing module is configured to provide a predetermined curing light source or a predetermined curing heat source to the reversible adhesive layer, thereby curing the reversible adhesive layer between the temporary support substrate and the ultra-thin glass substrate; wherein, the glass processing module is configured to thin, drill, or cut the ultra-thin glass substrate; wherein, the glass processing module is configured to perform semiconductor processing, printed circuit board processing, or liquid crystal display processing on the ultra-thin glass substrate; and wherein, when the ultra-thin glass substrate is drilled through the glass processing module to form at least one through hole, the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

7. The processing equipment for ultrathin glass substrates as described in claim 5, further comprising: A surface treatment module electrically connected to the signal control module, the surface treatment module being configured to perform a surface treatment process on the temporary support substrate; A glass debonding module electrically connected to the signal control module, the glass debonding module being configured to allow the processed ultrathin glass substrate to separate from the reversible adhesive layer; a glass cleaning module electrically connected to the signal control module, the glass cleaning module being configured to clean the processed ultrathin glass substrate and the temporary support substrate; and an appearance inspection module electrically connected to the signal control module, the appearance inspection module being configured to inspect a predetermined appearance of the processed ultrathin glass substrate. A function detection module is electrically connected to the signal control module and is configured to detect a predetermined function of the processed ultrathin glass substrate. And a substrate transfer module electrically connected to the signal control module, the substrate transfer module being configured to stack the processed ultrathin glass substrate on another processed ultrathin glass substrate.

8. The processing equipment for ultrathin glass substrates as described in claim 7, wherein, The surface treatment process includes a cleaning and drying process for removing oil or particles, a surface roughening process for improving adhesive adhesion, or a plasma pretreatment process for improving adhesive adhesion; wherein the glass debonding module is configured to provide a predetermined debonding light source or a predetermined debonding heat source to the reversible adhesive layer, thereby reducing the adhesion between the processed ultrathin glass substrate and the reversible adhesive layer; wherein the glass cleaning module is configured to provide a predetermined cleaning agent to the processed ultrathin glass substrate, thereby removing foreign matter adhering to the processed ultrathin glass substrate; wherein the predetermined appearance of the processed ultrathin glass substrate is surface flatness, surface bubbles, surface cracks, structural warping, or residual foreign matter; and wherein the predetermined function of the processed ultrathin glass substrate is an electrical function or an optical function.

9. An ultrathin glass temporary support component, comprising: A temporary substrate; A reversible adhesive layer is disposed on the temporary support substrate; And an ultrathin glass substrate, the ultrathin glass substrate being disposed on the reversible adhesive layer, and an upper surface of the ultrathin glass substrate being completely exposed; wherein the thickness of the ultrathin glass substrate is less than 100 µm; wherein, when the ultrathin glass substrate is drilled to form at least one through hole, the at least one through hole extends to the reversible adhesive layer and the temporary support substrate.

10. The ultrathin glass temporary support assembly as described in claim 9, wherein, The temporary support substrate is configured as a metal substrate, a ceramic substrate, or a polymer substrate, and the thickness of the temporary support substrate is greater than the thickness of the ultrathin glass substrate; wherein the ultrathin glass substrate is disposed on the reversible adhesive layer through the cooperation of a glass bonding module and an adhesive curing module; wherein the thickness of the ultrathin glass substrate is between 30 µm and 100 µm.

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