Light-emitting device and electronic device

Abstract

This invention provides a portable and easily visible light-emitting device. This invention also provides a light-emitting device that is not easily damaged. One embodiment of this invention provides a light-emitting device in which strip-shaped highly flexible regions and strip-shaped low-flexibility regions are alternately arranged. In the highly flexible regions, a light-emitting panel and a plurality of spacers overlap each other. In the low-flexibility regions, a light-emitting panel and a support overlap each other. When the highly flexible regions are bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers changes according to the bending condition of the light-emitting panel, thereby allowing a neutralizing surface to be formed in or near the light-emitting panel.

Description

Technical Field

[0001] One embodiment of the present invention relates to a light-emitting device. More particularly, one embodiment of the present invention relates to a light-emitting device utilizing organic electroluminescence (hereinafter also referred to as EL).

[0002] Note that one embodiment of the present invention is not limited to the above-described technical fields. Examples of technical fields that can be cited as embodiments of the present invention include semiconductor devices, display devices, light-emitting devices, energy storage devices, memory devices, electronic devices, lighting equipment, input devices (e.g., touch sensors), input / output devices (e.g., touch panels), driving methods thereof, and manufacturing methods thereof. Prior Technology

[0003] In recent years, light-emitting devices or display devices have been expected to be used for various purposes, and there is a diverse range of needs.

[0004] For example, light-emitting devices and display devices used in mobile devices need to be thin, lightweight, and not easily damaged.

[0005] The light-emitting elements (also referred to as "EL elements") have the characteristics of being easy to achieve in thin and lightweight form, being able to respond to input signals at high speed, and being able to be driven by a low DC power supply, and their application in light-emitting devices or display devices is being studied.

[0006] For example, Patent Document 1 discloses a flexible active matrix light-emitting device having a transistor and an organic EL element as switching elements on a thin film substrate.

[0007] [Patent Document 1] Japanese Patent Application Publication No. 2003-174153 Summary of the Invention

[0008] When used in mobile devices, the size of the light-emitting device or display device is reduced to improve portability. On the other hand, the size of the light-emitting area or display area is required to improve visibility.

[0009] One objective of an embodiment of the present invention is to provide a portable light-emitting device, display device, input / output device, electronic device, or lighting device. Another objective of an embodiment of the present invention is to provide a light-emitting device, display device, input / output device, or electronic device with a clear overview. Furthermore, one objective of an embodiment of the present invention is to provide a light-emitting device, display device, input / output device, or electronic device that is both portable and has a clear overview.

[0010] Furthermore, one objective of an embodiment of the present invention is to provide a novel light-emitting device, display device, input / output device, electronic device, or lighting device. Another objective of an embodiment of the present invention is to provide a light-emitting device, display device, input / output device, electronic device, or lighting device that is not easily damaged. Another objective of an embodiment of the present invention is to provide a light-emitting device, display device, input / output device, electronic device, or lighting device with high reliability. Finally, one objective of an embodiment of the present invention is to provide a light-emitting device, display device, input / output device, electronic device, or lighting device with low power consumption.

[0011] Furthermore, one objective of an embodiment of the present invention is to provide a lightweight light-emitting device, etc. Another objective of an embodiment of the present invention is to provide a thin light-emitting device, etc. Another objective of an embodiment of the present invention is to provide a flexible light-emitting device, etc. Another objective of an embodiment of the present invention is to provide a light-emitting device or lighting apparatus having a seamless, large light-emitting area, or a display device, input / output device, or electronic device having a seamless, large display area.

[0012] Note that the description of the above objectives does not preclude the existence of other objectives. One embodiment of the present invention does not need to achieve all of the above objectives. Furthermore, objectives other than those described above can be extracted from the description in the specification, drawings, and claims.

[0013] One embodiment of the present invention is a light-emitting device comprising first to third regions, wherein the first region is located between the second and third regions, and the first region has the highest flexibility among the first to third regions. The first region includes a light-emitting panel and a plurality of spacers, the second region includes a light-emitting panel and a first support, and the third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion of each of the plurality of spacers that overlaps with the light-emitting panel, the second region includes a portion of the first support that overlaps with the light-emitting panel, and the third region includes a portion of the second support that overlaps with the light-emitting panel. Furthermore, when the first region is bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers changes according to the bending condition of the light-emitting panel.

[0014] In another embodiment of the present invention, there is a light-emitting device comprising a first to a third region, wherein the first region is located between the second and the third region, and the first region has the highest flexibility among the first and third regions. The first region includes a light-emitting panel and a plurality of spacers, the second region includes a light-emitting panel and a first support, and the third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion of each of the plurality of spacers that overlaps with the light-emitting panel, the second region includes a portion of the first support that overlaps with the light-emitting panel, and the third region includes a portion of the second support that overlaps with the light-emitting panel. Furthermore, each of the plurality of spacers includes a portion fixed to the light-emitting panel.

[0015] In another embodiment of the present invention, a light-emitting device includes a first to a third region, wherein the first region is located between the second and the third region, and the first region has the highest flexibility among the first and third regions. The first region includes a light-emitting panel, a protective layer, and a plurality of spacers. The second region includes a light-emitting panel, a protective layer, and a first support. The third region includes a light-emitting panel, a protective layer, and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. Among the protective layer, the first support, and the second support, the protective layer has the highest flexibility. The first region includes a portion of each of the plurality of spacers that overlaps with the light-emitting panel through the protective layer. The second region includes a portion of the first support that overlaps with the light-emitting panel through the protective layer. The third region includes a portion of the second support that overlaps with the light-emitting panel through the protective layer. Furthermore, each of the plurality of spacers includes a portion fixed to the protective layer.

[0016] In one embodiment of the present invention, the number of spacers is two or more. For example, one embodiment of the present invention is a light-emitting device including first to third regions, wherein the first region is located between the second and third regions, the first region has the highest flexibility among the first to third regions, the first region includes a light-emitting panel, a first spacer and a second spacer, the second region includes a light-emitting panel and a first support, and the third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion where the first spacer and the light-emitting panel overlap, the second region includes a portion where the second spacer and the light-emitting panel overlap, the second region includes a portion where the first support and the light-emitting panel overlap, and the third region includes a portion where the second support and the light-emitting panel overlap. Furthermore, when the first region is bent, the angle formed by the normals of the opposing surfaces of the first spacer and the second spacer changes according to the bending condition of the light-emitting panel.

[0017] In another embodiment of the present invention, there is a light-emitting device comprising a first to a third region, wherein the first region is located between the second and the third region, and the first region has the highest flexibility among the first and third regions. The first region includes a light-emitting panel, a first spacer, and a second spacer. The second region includes a light-emitting panel and a first support. The third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion where the first spacer and the light-emitting panel overlap. The first region includes a portion where the second spacer and the light-emitting panel overlap. The second region includes a portion where the first support and the light-emitting panel overlap. The third region includes a portion where the second support and the light-emitting panel overlap. The first spacer includes a portion fixed to the light-emitting panel, and the second spacer includes a portion fixed to the light-emitting panel.

[0018] In another embodiment of the present invention, a light-emitting device includes a first to a third region, wherein the first region is located between the second and third regions, and the first region has the highest flexibility among the first to the third regions. The first region includes a light-emitting panel, a protective layer, a first spacer, and a second spacer. The second region includes a light-emitting panel, a protective layer, and a first support. The third region includes a light-emitting panel, a protective layer, and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. Among the protective layer, the first support, and the second support, the protective layer has the highest flexibility. The first region includes a portion where the first spacer and the light-emitting panel overlap through the protective layer. The first region includes a portion where the second spacer and the light-emitting panel overlap through the protective layer. The second region includes a portion where the first support and the light-emitting panel overlap through the protective layer. The third region includes a portion where the second support and the light-emitting panel overlap through the protective layer. The first spacer includes a portion fixed to the protective layer, and the second spacer includes a portion fixed to the protective layer.

[0019] In the above structure, the protective layer preferably includes a portion fixed to the light-emitting panel. Particularly preferably, the protective layer includes a portion fixed to the light-emitting panel in the first region.

[0020] In another embodiment of the present invention, there is a light-emitting device comprising a first to a third region, wherein the first region is located between the second and the third region, and the first region has the highest flexibility among the first and third regions. The first region includes a light-emitting panel and a connecting portion, the second region includes a light-emitting panel and a first support, and the third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion where the connecting portion and the light-emitting panel overlap, the second region includes a portion where the first support and the light-emitting panel overlap, and the third region includes a portion where the second support and the light-emitting panel overlap. The connecting portion includes an elastic body and a plurality of spacers. The elastic body has the function of connecting the first support and the second support. Each of the plurality of spacers includes an opening, through which the elastic body in the opening connects the plurality of spacers to each other.

[0021] In another embodiment of the present invention, there is a light-emitting device comprising a first to a third region, wherein the first region is located between the second and the third region, and the first region has the highest flexibility among the first and third regions. The first region includes a light-emitting panel and a connecting portion, the second region includes a light-emitting panel and a first support, and the third region includes a light-emitting panel and a second support. Among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility. The first region includes a portion in which the connecting portion overlaps with the light-emitting panel, the second region includes a portion in which the first support overlaps with the light-emitting panel, and the third region includes a portion in which the second support overlaps with the light-emitting panel. The connecting portion has the function of connecting the first support and the second support. The connecting portion includes an elastic body, a first spacer, and a second spacer. The first spacer includes an opening, and the second spacer includes an opening. The first spacer and the second spacer are connected to each other through the elastic body in the opening.

[0022] In the above structure, it is preferable that each of the plurality of spacers includes a portion fixed to the light-emitting panel.

[0023] In the above structures, the elastomer is preferably a spring or rubber.

[0024] In all the above structures, when the light-emitting device is in the unfolded state, the length of the elastomer is preferably greater than or equal to its natural length. Note that the natural length refers to the length when no load is applied to the elastomer (such as a spring or rubber) (i.e., the elastomer is not stretched or contracted).

[0025] In the above structures, preferably, a protective layer is included, the first region includes the portion where the connecting part and the light-emitting panel overlap each other through the protective layer, the second region includes the portion where the first support body and the light-emitting panel overlap each other through the protective layer, and the third region includes the portion where the second support body and the light-emitting panel overlap each other through the protective layer.

[0026] In the above structures, in the first region, it is preferable that each of the plurality of spacers includes a portion fixed to the protective layer.

[0027] In the above structures, the protective layer in the first region preferably includes a portion fixed to the light-emitting panel.

[0028] In each of the above structures, the width of the first side of the spacer on one side of the light-emitting panel is wider than the width of the second side of the spacer on the opposite side of the light-emitting panel.

[0029] While examples of light-emitting devices including light-emitting panels have been given in the above description, display devices or input / output devices applying the above structures are also embodiments of the present invention. Furthermore, a display device according to an embodiment of the present invention includes a display panel. An input / output device according to an embodiment of the present invention includes a touch panel.

[0030] Furthermore, one embodiment of the present invention is a module that includes a light-emitting device, a display device, or an input / output device that applies any of the above-described structures, and the module is equipped with connectors such as FPC (Flexible Printed Circuit) or TCP (Tape Carrier Package), or an IC is mounted using COG (Chip On Glass) or similar methods.

[0031] Furthermore, one embodiment of the present invention also includes an electronic device or lighting device using the above-described module. For example, one embodiment of the present invention is an electronic device including at least one of the above-described module, antenna, battery, housing, speaker, microphone, operating switch, or operating button.

[0032] According to one embodiment of the present invention, a portable light-emitting device, display device, input / output device, electronic device, or lighting device can be provided. Furthermore, according to one embodiment of the present invention, a light-emitting device, display device, input / output device, or electronic device with a high degree of visibility can be provided. Additionally, according to one embodiment of the present invention, a light-emitting device, display device, input / output device, or electronic device that is both portable and has a high degree of visibility can be provided.

[0033] Furthermore, according to one embodiment of the present invention, a novel light-emitting device, display device, input / output device, electronic device, or lighting device can be provided. Furthermore, according to one embodiment of the present invention, a light-emitting device, display device, input / output device, electronic device, or lighting device that is not easily damaged can be provided. Furthermore, according to one embodiment of the present invention, a light-emitting device, display device, input / output device, electronic device, or lighting device with high reliability can be provided. Furthermore, according to one embodiment of the present invention, a light-emitting device, display device, input / output device, electronic device, or lighting device with low power consumption can be provided.

[0034] Furthermore, according to one embodiment of the present invention, a lightweight light-emitting device, etc., can be provided. Furthermore, according to one embodiment of the present invention, a thin light-emitting device, etc., can be provided. Furthermore, according to one embodiment of the present invention, a flexible light-emitting device, etc., can be provided. Furthermore, according to one embodiment of the present invention, a light-emitting device or lighting device having a seamless, large light-emitting area, or a display device, input / output device, or electronic device having a seamless, large display area, can be provided.

[0035] Note that the description of the above effects does not preclude the existence of other effects. One embodiment of the present invention does not require achieving all of the above effects. Effects beyond those described above can be derived from the description in the specification, drawings, and claims. Simple Explanation of the Diagram

[0036] In the diagram: Figures 1A to 1C are diagrams illustrating an example of a light-emitting device; Figures 2A to 2C are diagrams illustrating an example of a light-emitting device; Figures 3A to 3C are diagrams illustrating an example of a light-emitting device; Figures 4A and 4B are diagrams illustrating an example of a connecting part and a spacer; Figure 5 is a diagram showing an example of a connecting part; Figures 6A and 6B are diagrams illustrating an example of a light-emitting device; Figures 7A to 7C are diagrams illustrating an example of a light-emitting device; Figures 8A to 8C are diagrams illustrating an example of a light-emitting device; Figures 9A to 9C are diagrams illustrating an example of a light-emitting device; Figures 10A to 10C are diagrams illustrating an example of a light-emitting device; Figures 11A to 11C are diagrams illustrating an example of a light-emitting device; Figures 12A to 12C are diagrams illustrating an example of a light-emitting device; Figures 13A to 13C are diagrams illustrating an example of a light-emitting device; Figures 14A and 14B are diagrams illustrating an example of a light-emitting panel; Figures 15A and 15B are diagrams illustrating an example of a light-emitting panel; Figures 16A to 16D are diagrams illustrating an example of a light-emitting panel; Figures 17A and 17B are diagrams illustrating an example of a light-emitting panel; Figures 18A to 18C are diagrams illustrating an example of a touch panel; Figures 19A and 19B are diagrams illustrating an example of a touch panel; Figures 20A and 20B are diagrams illustrating an example of a touch panel; Figures 21A to 21C are diagrams illustrating an example of a touch panel; Figures 22A to 22C are photographs illustrating the light-emitting device of the embodiment; Figures 23A to 23C are photographs illustrating the light-emitting device of the embodiment. Implementation

[0037] The embodiments will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the following description, and those skilled in the art will readily understand that its methods and details can be varied in many ways without departing from the spirit and scope of the invention. Therefore, the present invention should not be construed as being limited to the contents described in the embodiments shown below.

[0038] Note that in the inventive structures described below, the same element symbols are used in different figures to represent the same parts or parts with the same function, and repeated descriptions are omitted. Furthermore, when representing parts with the same function, the same shading lines are sometimes used without additional element symbols.

[0039] Furthermore, for ease of understanding, the positions, sizes, and extents of the components shown in the drawings may not represent their actual positions, sizes, and extents. Therefore, the disclosed invention is not necessarily limited to the positions, sizes, and extents disclosed in the drawings.

[0040] Furthermore, depending on the situation or state, the "film" and "layer" can be interchanged. For example, a "conductive layer" can be changed into a "conductive film" or an "insulating film" can be changed into an "insulating layer".

[0041] Example 1 In this embodiment, a light-emitting device according to an embodiment of the present invention will be described with reference to FIGS. 1A to 13C.

[0042] While this embodiment illustrates a light-emitting device primarily comprising organic EL elements, one embodiment of the present invention is not limited thereto. One embodiment of the present invention also includes a light-emitting device or display device using other light-emitting or display elements as illustrated in Embodiment 2. Furthermore, one embodiment of the present invention is not limited to light-emitting devices and display devices, but can be applied to various devices such as input / output devices.

[0043] In one embodiment of the light-emitting device of the present invention, strip-shaped highly flexible regions and strip-shaped low-flexibility regions are alternately arranged. By bending the highly flexible regions, the light-emitting device can be folded. The light-emitting device of one embodiment of the present invention has good portability in the folded state and strong visibility in the unfolded state due to its seamless, large light-emitting area.

[0044] In one embodiment of the light-emitting device of the present invention, the highly flexible region can be bent inward or outward. In this embodiment of the light-emitting device, a light-emitting panel can be folded more than once. In this case, the radius of curvature can be, for example, 0.01 mm or more and 150 mm or less.

[0045] Note that in this specification, the case where the light-emitting surface of the light-emitting panel is bent inward is described as "inward bending," and the case where the light-emitting surface of the light-emitting panel is bent outward is described as "outward bending." Furthermore, the light-emitting surface of the light-emitting panel or light-emitting device refers to the surface from which the light emitted by the light-emitting element is extracted.

[0046] When the light-emitting device of one embodiment of the present invention is not in use, it can be folded so that the light-emitting surface of the light-emitting panel is bent inward, thereby preventing damage or dirt to the light-emitting surface.

[0047] When the light-emitting device of one embodiment of the present invention is in use, it can be unfolded to use the entire seamless, large light-emitting area, or it can be folded so that the light-emitting surface of the light-emitting panel bends outward to use a portion of the light-emitting area. Folding the light-emitting device and preventing the portion of the light-emitting area that is not visible to the user from emitting light can reduce the power consumption of the light-emitting device.

[0048] One embodiment of the present invention is a light-emitting device comprising first to third regions. The first region is located between the second and third regions, and the first region has the highest flexibility among the first and third regions. The second region includes an overlapping light-emitting panel and a first support. The third region includes an overlapping light-emitting panel and a second support. Furthermore, among the light-emitting panel, the first support, and the second support, the light-emitting panel has the highest flexibility.

[0049] The first region includes a light-emitting panel and multiple spacers. In the first region, each spacer overlaps with the light-emitting panel.

[0050] In the highly flexible first region, the light-emitting panel and the component (here, the spacer) overlap each other, and therefore, the first region has high mechanical strength and can withstand bending compared to the case where the first region only includes the light-emitting panel.

[0051] On the other hand, sometimes due to overlapping light-emitting panels and components, the neutral surface (the non-stretching surface) is far away from the light-emitting panel. On this neutral surface, no stress or strain occurs due to compressive stress or tensile stress caused by deformation such as bending. The longer the distance between the neutral surface and the light-emitting panel, the more compressive or tensile stress the light-emitting panel is subjected to due to bending, and therefore the light-emitting panel is easily damaged.

[0052] In view of the above, in a light-emitting device according to an embodiment of the present invention, when the first region is bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers changes depending on the bending condition of the light-emitting panel. By adopting this structure, separation of the neutral surface from the light-emitting panel can be prevented. By forming the neutral surface close to the light-emitting panel or forming the neutral surface within the light-emitting panel, the light-emitting panel is less prone to stretching or contraction even when the light-emitting device is bent. Therefore, damage to the light-emitting panel caused by folding can be prevented.

[0053] The following description uses a foldable light-emitting device that includes a high-flexibility region between two low-flexibility regions as an example. This embodiment shows an example where the high-flexibility region and the low-flexibility region are parallel or the low-flexibility regions are parallel to each other, but the regions may not be arranged in parallel.

[0054] <Structure Example A> Figure 1A shows the light-emitting device in its unfolded state. Figure 1B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 1C shows the light-emitting device in its folded state.

[0055] The light-emitting device includes a first region 151, a second region 152, and a third region 153. The first region 151 is located between the second region 152 and the third region 153. Among the three regions, the first region 151 has the highest flexibility.

[0056] The light-emitting device includes a light-emitting panel 101, a support 103(1), a support 103(2), and a plurality of spacers 108.

[0057] The light-emitting panel 101 includes a light-emitting area 111 (also referred to as a light-emitting part, pixel part, or display part, etc.) and a non-light-emitting area 112. The non-light-emitting area 112 is disposed around the light-emitting area 111.

[0058] The light-emitting panel 101 is flexible. Light-emitting panels using organic EL elements are superior because they offer high flexibility and impact resistance, while also achieving a thin and lightweight design.

[0059] Support 103(1) and support 103(2) are separated from each other. The flexibility of both supports is lower than that of the light-emitting panel 101.

[0060] The first region 151 includes a light-emitting panel 101 and a plurality of spacers 108. Each of the plurality of spacers 108 overlaps with the light-emitting panel 101. Each of the plurality of spacers 108 is fixed to the light-emitting panel 101. Adjacent spacers 108 are not fixed to each other. By adopting this structure, when the first region 151 is bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers 108 changes according to the bending condition of the light-emitting panel 101. Therefore, a neutral surface can be formed in or near the light-emitting panel 101.

[0061] Some of the spacers 108 may also be located in areas that do not overlap with the light-emitting panel 101. Alternatively, all of the spacers 108 may overlap with the light-emitting panel 101.

[0062] Although this embodiment shows an example where the spacer 108 is located on the side opposite to the light-emitting surface of the light-emitting panel 101, an embodiment of the invention is not limited thereto. For example, the spacer 108 may also be located on the light-emitting surface side of the light-emitting panel 101. When the spacer 108 is located on the light-emitting surface side of the light-emitting panel 101, the spacer 108 preferably overlaps only with the non-light-emitting area 112. When the spacer 108 overlaps with the light-emitting area 111, it is preferable to use a light-transmitting material for the spacer 108.

[0063] In the second region 152, the light-emitting panel 101 and the support 103(1) overlap each other. The support 103(1) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 and the support 103(1) can also be fixed to each other.

[0064] In the third region 153, the light-emitting panel 101 and the support 103(2) overlap each other. The support 103(2) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 and the support 103(2) can also be fixed to each other.

[0065] When a support is provided only on the side opposite to the light-emitting surface of the light-emitting panel 101, the light-emitting device can be made thinner or lighter, which is preferable.

[0066] <Structure Example B> Figure 2A shows the light-emitting device in its unfolded state. Figure 2B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 2C shows the light-emitting device in its folded state. Note that in the structural examples (including variant examples) shown below, descriptions of structures identical to those shown above are sometimes omitted.

[0067] The light-emitting device includes a light-emitting panel 101, a support 103a (1), a support 103a (2), a support 103b (1), a support 103b (2), and a connecting part 105.

[0068] Support 103a(1) and support 103a(2) are separated from each other. Support 103b(1) and support 103b(2) are separated from each other. The flexibility of all four supports is lower than that of the light-emitting panel 101.

[0069] In the second region 152, a light-emitting panel 101 is disposed between the support 103a(1) and the support 103b(1). The support 103a(1) is located on the side of the light-emitting surface of the light-emitting panel 101. The support 103b(1) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 may also be fixed to at least one of the support 103a(1) and the support 103b(1).

[0070] In the third region 153, a light-emitting panel 101 is disposed between the support 103a (2) and the support 103b (2). The support 103a (2) is located on the side of the light-emitting surface of the light-emitting panel 101. The support 103b (2) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 may also be fixed to at least one of the support 103a (2) and the support 103b (2).

[0071] By including a support body on both the light-emitting side and the side opposite to the light-emitting surface of the light-emitting panel 101, the light-emitting panel 101 can be sandwiched between a pair of supports. This can improve the mechanical strength of the low-flexibility area and make the light-emitting device less prone to damage, which is better.

[0072] The first region 151 includes a light-emitting panel 101 and a connecting portion 105. The light-emitting panel 101 and the connecting portion 105 overlap each other.

[0073] Figures 3A to 3C show side views of the connector 105 in each of the states shown in Figures 2A to 2C, respectively. Figures 4A and 5 show an example of a top view of the connector 105. Figure 4B shows a perspective view of the spacer 108.

[0074] The connecting part 105 includes an elastomer 106 and a plurality of spacers 108.

[0075] Note that in Figures 3A to 3C, 4A and 5, the elastomer 106 is shown with a thin solid line. However, in the actual structure, the elastomer 106 is located in the opening of the spacer 108 and is not exposed to the outside of the spacer 108.

[0076] One end of the elastic body 106 is fixed to the support body 103b (1), and the other end of the elastic body 106 is fixed to the support body 103b (2). That is, the elastic body 106 connects the support body 103b (1) and the support body 103b (2).

[0077] The spacers 108 are provided with openings. The spacers 108 are connected to each other through the elastomer 106. Specifically, the elastomer 106 passes through these openings to connect the multiple spacers 108. There is no particular limitation on the number of openings included in the spacers 108.

[0078] There is no particular restriction on the number of spacers 108.

[0079] The light-emitting device may include only one spacer 108. When the light-emitting device includes one spacer 108, the angle formed by the normals of the opposing surfaces of the spacer 108 and the support body can be changed according to the curvature of the light-emitting panel. By adopting this structure, separation between the neutral surface and the light-emitting panel can be prevented.

[0080] The light-emitting device preferably includes two or more spacers 108.

[0081] Figure 4A shows an example of ten spacers 108 arranged in one direction. Figure 5 shows an example of two columns having ten spacers 108 arranged in one direction, and the connecting portion 105 including a total of twenty spacers 108.

[0082] The more spacers 108 arranged in a column, the smoother the light-emitting device can bend, which is preferable. Furthermore, the narrower the width (length in the shorter side direction) of the spacers 108, the smoother the light-emitting device can bend, which is also preferable. By arranging more narrow spacers 108, a light-emitting device with strong bending resistance can be achieved.

[0083] In the structure shown in Figure 5, the spacers 108 are arranged in two columns with a gap between them. On the other hand, in the structure shown in Figure 4A, the spacers 108 are arranged in one column, so there is no gap between them. Therefore, when the light-emitting device is folded, the curved portion of the light-emitting panel is not easily exposed, thereby preventing damage to the light-emitting panel or the components included in the light-emitting panel.

[0084] Each of the plurality of spacers 108 overlaps with the light-emitting panel 101. Although the plurality of spacers 108 are interconnected through the elastomer 106 in the opening, the spacers 108 are not fixed to each other. By adopting this structure, when the first region 151 is bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers 108 changes according to the bending condition of the light-emitting panel 101. Thus, a neutral surface can be formed in or near the light-emitting panel 101.

[0085] The upper right corner of Figure 3C shows an enlarged view of two adjacent spacers 108. In Figure 3C, the angle θ formed by the normals of the opposing surfaces of the two adjacent spacers 108 is an acute angle. As the light-emitting device is unfolded from the state shown in Figure 3C, the angle θ decreases. Then, when the angle θ is 0° in the state shown in Figure 3A, that is, when the opposing surfaces of the two adjacent spacers 108 are in contact, the light-emitting device cannot bend further. In other words, the first region 151 at this time can also be said to be a part that cannot bend outwards.

[0086] Note that although an example is shown here where the spacer 108 is located on the side opposite to the light-emitting surface of the light-emitting panel 101, and the first region 151 is a region that can be bent inward but not outward, the invention is not limited thereto. When the spacer 108 is located on the side of the light-emitting surface of the light-emitting panel 101, the first region 151 is a region that can be bent outward but not inward.

[0087] The light-emitting device shown in Figure 3C can also be bent with a smaller radius of curvature than that shown in Figure 3C. However, if the light-emitting panel 101 is bent with an extremely small radius of curvature, the light-emitting panel 101 may be damaged. Therefore, it is preferable to adjust the thickness of the support 103a(1) and the support 103a(2) or to provide a fixing tool for fixing the two supports to each other, so that there is a certain or greater gap between the support 103b(1) and the support 103b(2). This can prevent the light-emitting panel 101 from being bent with an extremely small radius of curvature.

[0088] The range within the first region 151 that allows the light-emitting device to bend can be controlled by adjusting the shape or number of the spacers 108.

[0089] For example, there is no restriction on the cross-sectional shape of the spacer 108 along the direction perpendicular to its long side, and the cross-sectional shape can also be a polygon (including a polygon with rounded corners) or a circle, such as a triangle, a quadrilateral, a pentagon, a hexagon, etc.

[0090] For example, as shown in example B of this structure, the cross-sectional shape of the spacer 108 along the direction perpendicular to its long side is a shape such as a square, rectangle, parallelogram, etc., where the two opposite sides of the spacer 108 (the two opposite sides of each adjacent spacer 108) are parallel. In this case, the highly flexible region becomes capable of bending outwards only.

[0091] Alternatively, for example, as described in structural example D below, the cross-sectional shape of the spacer 108 along its long side can be a shape in which the two opposite sides of the spacer 108 are not parallel, such as a trapezoid. In this case, the highly flexible region can be both able to bend inwards and outwards.

[0092] Preferably, each of the plurality of spacers 108 is fixed to the light-emitting panel 101. This prevents the spacers 108 from moving along their long sides.

[0093] For example, a spring or rubber can be used as the elastic body 106. When the light-emitting device is in its unfolded state, the length of the elastic body 106 is preferably longer than its natural length. This makes it easier to maintain the unfolded state of the light-emitting device. On the other hand, when it is desired that the light-emitting device be easily kept in a bent state, the length of the elastic body 106 in the unfolded state can be shorter than its natural length.

[0094] <Example 1 of the variation> Figures 6A and 6B show top views of the light-emitting device in its unfolded state.

[0095] The light-emitting device shown in Figure 6A is an example of a device that allows a user who sees the light-emitting surface of the device to see both the light-emitting area 111 and the non-light-emitting area 112.

[0096] The light-emitting device shown in Figure 6B is an example where the user who sees the light-emitting surface of the light-emitting device can only see the light-emitting area 111, and cannot see the non-light-emitting area 112.

[0097] Although the light-emitting device shown in Figure 6A is a variation of structural example B, it can also be applied to structural example A. Similarly, although the light-emitting device shown in Figure 6B is a variation of structural example A, it can also be applied to structural example B.

[0098] The light-emitting device shown in Figures 6A and 6B includes a light-shielding layer 109. The light-shielding layer 109 overlaps with the connecting portion 105 or the spacer 108. By providing the light-shielding layer 109 to overlap the connecting portion 105 or the spacer 108, the connecting portion 105 or the spacer 108 can be prevented from being seen by a user who is looking at the light-emitting surface of the light-emitting device.

[0099] Alternatively, the light-shielding layer 109 may overlap with the non-light-emitting area 112 of the light-emitting panel. By overlapping the light-shielding layer 109 with the non-light-emitting area 112, external light can be prevented from illuminating the non-light-emitting area 112. As a result, light degradation of transistors and the like included in the drive circuit in the non-light-emitting area 112 can be suppressed.

[0100] As the light-shielding layer 109, a flexible material capable of blocking light is used. For example, resin, plastic, metal, alloy, rubber, and paper can be used. Films or tapes using these materials can also be used. In addition, an adhesive layer can be provided between the light-shielding layer 109 and the connecting portion 105.

[0101] <Example 2> Figure 7A shows a top view of the light-emitting device in its unfolded state. Figure 7B shows a side view of the light-emitting device in its folded state.

[0102] The light-emitting device shown in Figures 7A and 7B includes only one spacer 108. The spacer 108 includes multiple slits. The multiple protrusions separated by the slits have the same function as the multiple spacers in the above structural example. That is, when the first region 151 is bent, the angle formed by the normals of the opposing surfaces of two adjacent protrusions changes depending on the bending condition of the light-emitting panel 101. Thus, a neutralizing surface can be formed in or near the light-emitting panel 101. The deeper the slit, the easier it is to form a neutralizing surface in or near the light-emitting panel 101. Alternatively, two or more spacers 108 with slits may be included.

[0103] Furthermore, the light-emitting device shown in Figures 7A and 7B includes a fixing tool 107. By including the fixing tool 107, the light-emitting panel 101 is prevented from bending with a very small radius of curvature when the light-emitting device is folded, thereby preventing damage to the light-emitting device. The fixing tool 107 can be a magnetic or mechanical fixing tool. The fixing tool 107 can hold the light-emitting device in a folded state.

[0104] <Example 3> Figure 7C shows a side view of the light-emitting device in its unfolded state. The light-emitting device shown in Figure 7C is a modified example of the light-emitting devices shown in Figures 3A to 3C.

[0105] A protective layer 113a may also be included on the light-emitting surface of the light-emitting panel 101. When the protective layer 113a allows visible light to pass through, it may be overlapped with the light-emitting region 111. When the protective layer 113a does not allow visible light to pass through, it includes an opening in the portion overlapping with the light-emitting region 111. The protective layer 113a may also serve as the aforementioned light-shielding layer 109.

[0106] A protective layer 113b is included between the light-emitting panel 101 and the connecting portion 105. The protective layer 113b is fixed to the connecting portion 105. For example, multiple spacers 108 can each be fixed to the protective layer 113b. This prevents the spacers 108 from moving in the direction of their long sides.

[0107] Furthermore, the protective layer 113b is preferably fixed to the light-emitting panel 101. In particular, in the area where the light-emitting panel 101, the protective layer 113b, and the connecting portion 105 overlap, the protective layer 113b is preferably fixed to the light-emitting panel 101. This further improves the mechanical strength of the highly flexible first region 151.

[0108] The thinner the protective layer 113b, the less likely the neutral surface is to separate from the light-emitting panel 101, thus suppressing damage to the light-emitting panel 101, which is preferable. Since the protective layer 113b is located on the side opposite to the light-emitting surface of the light-emitting panel 101, it does not need to be translucent. Furthermore, the thicker the protective layer 113b, the higher the mechanical strength of the light-emitting device, thereby effectively protecting the light-emitting panel 101. The thickness of the protective layer 113b can be, for example, more than 0.01 times and less than 10 times the thickness of the light-emitting panel 101, preferably more than 0.05 times and less than 5 times, and more preferably more than 0.05 times and less than 3 times.

[0109] Additionally, a protective layer 113b can be disposed overlapping both the light-emitting region 111 and the non-light-emitting region 112. The larger the area of ​​overlap between the protective layer 113b and the light-emitting panel 101, the better the light-emitting panel 101 is protected, thereby improving the reliability of the light-emitting device. For example, at least one (preferably all) of the support 103a(1), support 103a(2), support 103b(1), and support 103b(2) can be overlapped with the protective layer 113b.

[0110] The protective layer preferably has higher flexibility than the support. Furthermore, the protective layer preferably has a thinner thickness than the support.

[0111] By providing at least one of the protective layers 113a and 113b, the high-flexibility region can have high mechanical strength, thereby making the light-emitting device less susceptible to damage. Therefore, the light-emitting device is less likely to be damaged by deformation caused by external forces, not only in the low-flexibility region but also in the high-flexibility region.

[0112] When only one of the protective layers 113a and 113b is included, the light-emitting device can be made thinner or lighter.

[0113] When both protective layers 113a and 113b are provided, a light-emitting panel can be sandwiched between the pair of protective layers, thereby improving the mechanical strength of the light-emitting device and making the light-emitting device less prone to damage.

[0114] <Examples of materials used in light-emitting devices> There are no particular restrictions on the materials used for spacers, protective layers, and supports; for example, they can all be formed from plastics, metals, alloys, rubber, etc. Using plastics and rubber, lightweight and durable spacers, protective layers, or supports can be obtained, making them preferable. For example, silicone rubber can be used for the protective layer, while stainless steel or aluminum can be used for the spacers and supports.

[0115] Furthermore, materials with high toughness are preferably used as spacers, protective layers, and supports. This allows for the creation of light-emitting devices with high impact resistance that are less prone to damage. For example, using organic resins, thin metal materials, or thin alloy materials for the spacers, protective layers, and supports can result in lightweight light-emitting devices that are less susceptible to damage. Additionally, for the same reason, it is preferable to use materials with high toughness for the substrate constituting the light-emitting panel.

[0116] If the spacers, protective layers, and supports located on the luminescent side do not overlap with the luminescent area of ​​the luminescent panel, they do not need to be translucent. When the spacers, protective layers, and supports located on the luminescent side overlap with at least a portion of the luminescent area, they are preferably made of materials that allow light emission from the luminescent panel to pass through. There are no restrictions on the translucentness of the spacers, protective layers, and supports located on the opposite side of the luminescent side.

[0117] When bonding any two of the spacers, protective layers, supports, and light-emitting panels together, various adhesives can be used, such as two-component resins that cure at room temperature, photocurable resins, thermosetting resins, etc. Alternatively, film-type adhesives can also be used. Furthermore, the various components of the light-emitting device can be fixed using screws that pass through any two or more of the spacers, protective layers, supports, and light-emitting panels, pins that clamp any two or more of the spacers, protective layers, supports, and light-emitting panels, clips, etc.

[0118] One embodiment of the present invention provides a light-emitting device that can divide a light-emitting panel (a light-emitting area) into two or more areas by means of a bent portion. For example, the area hidden by the fold can be used as a non-light-emitting area, while only the exposed area can be used as a light-emitting area. This reduces power consumption in areas not used by the user.

[0119] One embodiment of the light-emitting device of the present invention may include a sensor for determining whether each highly flexible region is bent. This sensor may be configured, for example, as a switch such as a magnetic switch or a pressure sensor such as a MEMS pressure sensor.

[0120] Next, a light-emitting device comprising two highly flexible regions and three low-flexibility regions, capable of being folded into three folds, will be described below as an example. Although this embodiment shows an example where one of the two highly flexible regions is bent inwards and the other outwards, one embodiment of the invention is not limited to this. That is, when folding a light-emitting device comprising multiple highly flexible regions, it is not necessary to alternately bend inwards and outwards. Multiple highly flexible regions may also be bent inwards or outwards simultaneously. Alternatively, multiple highly flexible regions may be bent inwards or outwards repeatedly.

[0121] <Structure Example C> Figure 8A shows the light-emitting device in its unfolded state. Figure 8B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 8C shows the light-emitting device in its folded state.

[0122] The light-emitting device includes a first region 161, a second region 162, a third region 163, a fourth region 164, and a fifth region 165. The first region 161 is located between the second region 162 and the third region 163. The flexibility of the first region 161 is the highest among the first to third regions. The fourth region 164 is located between the third region 163 and the fifth region 165. The flexibility of the fourth region 164 is the highest among the third to fifth regions.

[0123] The light-emitting device includes a light-emitting panel 101, a support 103(1), a support 103(2), a support 103(3), a connecting part 105a, and a connecting part 105b.

[0124] The light-emitting panel 101 includes a light-emitting area 111 and a non-light-emitting area 112. The non-light-emitting area 112 is arranged around the light-emitting area 111.

[0125] Support 103(1) and support 103(2) are separated from each other. Support 103(2) and support 103(3) are separated from each other. The flexibility of the three supports is lower than that of the light-emitting panel 101.

[0126] The first region 161 includes a light-emitting panel 101 and a connecting portion 105a. The light-emitting panel 101 and the connecting portion 105a overlap each other.

[0127] The fourth region 164 includes a light-emitting panel 101 and a connecting portion 105b. The light-emitting panel 101 and the connecting portion 105b overlap each other.

[0128] The first region 161 is the part that allows the light-emitting panel 101 to bend outward. The details of the connecting part 105a are described in structural example D.

[0129] The fourth region 164 is the part that allows the light-emitting panel 101 to bend inward. For details of the connecting part 105b, please refer to the description of the connecting part 105 in structural example B.

[0130] The second region 162 includes an overlapping light-emitting panel 101 and a support 103(1). The support 103(1) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 and the support 103(1) can also be fixed to each other.

[0131] The third region 163 includes an overlapping light-emitting panel 101 and a support 103(2). The support 103(2) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 and the support 103(2) can also be fixed to each other.

[0132] The fifth region 165 includes an overlapping light-emitting panel 101 and a support 103(3). The support 103(3) is located on the side opposite to the light-emitting surface of the light-emitting panel 101. The light-emitting panel 101 and the support 103(3) can also be fixed to each other.

[0133] When the support is preferably included only on the side opposite to the light-emitting surface of the light-emitting panel 101, the light-emitting device can be made thinner or lighter.

[0134] <Structure Example D> Figure 9A shows the light-emitting device in its unfolded state. Figure 9B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 9C shows the light-emitting device in its folded state.

[0135] The light-emitting device includes a light-emitting panel 101, a support 103a (1), a support 103a (2), a support 103a (3), a support 103b (1), a support 103b (2), a support 103b (3), a connecting part 105a, and a connecting part 105b.

[0136] Support 103a(1) and support 103a(2) are separated from each other. Support 103a(2) and support 103a(3) are separated from each other. Support 103b(1) and support 103b(2) are separated from each other. Support 103b(2) and support 103b(3) are separated from each other. The flexibility of all six supports is lower than that of the light-emitting panel 101.

[0137] The first region 161 includes a light-emitting panel 101 and a connecting portion 105a. The light-emitting panel 101 and the connecting portion 105a overlap each other.

[0138] The fourth region 164 includes a light-emitting panel 101 and a connecting portion 105b. The light-emitting panel 101 and the connecting portion 105b overlap each other.

[0139] The second region 162 includes a light-emitting panel 101 between supports 103a (1) and 103b (1). Support 103a (1) is located on the light-emitting side of the light-emitting panel 101. Support 103b (1) is located on the side opposite to the light-emitting side of the light-emitting panel 101. The light-emitting panel 101 may also be fixed to at least one of supports 103a (1) and 103b (1).

[0140] The third region 163 includes a light-emitting panel 101 between supports 103a (2) and 103b (2). Support 103a (2) is located on the light-emitting side of the light-emitting panel 101. Support 103b (2) is located on the side opposite to the light-emitting side of the light-emitting panel 101. The light-emitting panel 101 may also be fixed to at least one of supports 103a (2) and 103b (2).

[0141] The fifth region 165 includes a light-emitting panel 101 between the support 103a (3) and the support 103b (3). The support 103a (3) is located on the light-emitting side of the light-emitting panel 101. The support 103b (3) is located on the side opposite to the light-emitting side of the light-emitting panel 101. The light-emitting panel 101 may also be fixed to at least one of the support 103a (3) and the support 103b (3).

[0142] When both the light-emitting side and the side opposite to the light-emitting surface of the light-emitting panel 101 are preferably supported, the light-emitting panel 101 can be sandwiched between a pair of supports, thereby improving the mechanical strength of the low-flexibility area and making the light-emitting device less prone to damage.

[0143] Figures 10A to 10C show side views of the connecting portion 105a in each of the states shown in Figures 9A to 9C.

[0144] The connecting portion 105a includes an elastic body 106 and a plurality of spacers 108. Structural example D shows an example where the cross-sectional shape of the spacers 108 along the direction perpendicular to their long sides is trapezoidal. Thus, in the first region 161, the highly flexible region can bend both inwards and outwards.

[0145] Note that although the elastomer 106 is shown in thin solid lines in Figures 10A to 10C, the elastomer 106 is actually located in the opening provided in the spacer 108 and is not exposed to the outside of the spacer 108.

[0146] One end of the elastic body 106 is fixed to the support body 103b (1), and the other end of the elastic body 106 is fixed to the support body 103b (2). That is, the elastic body 106 connects the support body 103b (1) and the support body 103b (2).

[0147] The spacer 108 includes an opening. An elastomer 106 passes through the opening to connect multiple spacers 108.

[0148] Each of the plurality of spacers 108 overlaps with the light-emitting panel 101. Although the plurality of spacers 108 are connected to each other by an elastic body 106 passing through the opening, the spacers 108 are not fixed to each other. By adopting this structure, when the first region 161 is bent, the angle formed by the normals of the opposing surfaces of two adjacent spacers 108 changes according to the bending condition of the light-emitting panel 101. Thus, a neutral surface can be formed in or near the light-emitting panel 101.

[0149] The lower left of Figure 10A shows an enlarged view of two adjacent spacers 108. In Figure 10A, the angle θ formed by the normals of the opposing surfaces of the two adjacent spacers 108 is an acute angle. As the light-emitting device is bent from the state shown in Figure 10A, the angle θ decreases. Then, in the state shown in Figure 10C, when the angle θ is 0°, the light-emitting device cannot be bent further. That is, the shape and number of spacers 108 can prevent the light-emitting panel 101 from bending with a very small radius of curvature when the light-emitting device is folded in the first region 161.

[0150] Furthermore, since the angle θ can be greater than the state in Figure 10A, the light-emitting device can also be bent inward in the first region 161.

[0151] Preferably, the width or area of ​​one side of the light-emitting panel 101 of the spacer 108 is greater than the width or area of ​​the opposite side. Therefore, in the light-emitting device, the light-emitting panel 101 can be bent outwards. For example, as shown in FIG10A, the side surface of the spacer 108 is trapezoidal. Additionally, the corners of the spacer 108 may also have curvature.

[0152] The spacers 108 are preferably fixed to the light-emitting panel 101. This prevents the spacers 108 from moving along their long sides.

[0153] <Structural Example E> Figure 11A shows the light-emitting device in its unfolded state. Figure 11B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 11C shows the light-emitting device in its folded state. Figure 12A shows a side view of the light-emitting device in Figure 11C. Figure 12B shows a top view of the light-emitting device in Figure 11A.

[0154] As shown in Figures 11A and 12B, the support 103a(1) may also overlap with the connecting portion 105a or the spacer 108. In this case, it is preferable to use a material that blocks visible light to form the support 103a(1). This prevents the user who is looking at the light-emitting surface of the light-emitting device from seeing the connecting portion 105a or the spacer 108. Alternatively, as shown in Modified Example 1, a light-shielding layer may also be provided.

[0155] As shown in Figures 11A and 12B, when the support 103a(1) and support 103a(2) are in contact with each other while the light-emitting device is in the unfolded state, the light-emitting device cannot bend inward in the first region 161. Thus, when it is desired to restrict the bending direction of highly flexible regions in the light-emitting device, the structure of the support can also be used for control.

[0156] Furthermore, as shown in Figure 12A, when the light-emitting device is folded, the pair of low-flexibility regions on the outer side of the overlapping low-flexibility regions are preferably parallel to the plane supporting the light-emitting device, while the other low-flexibility regions on the inner side are preferably not parallel to the plane. This allows for the thinning of the light-emitting device.

[0157] <Example 4> Figure 12C shows a side view of the light-emitting device in a folded state. The light-emitting device shown in Figure 12C is a variation of the light-emitting device shown in Figure 12A.

[0158] As shown in Figure 12C, in a structure in which the support body 103b (2) and support body 103b (3) can maintain a certain degree of interval by adjusting the thickness of the support body 103a (2) and support body 103a (3), it is possible to prevent the light-emitting panel 101 from bending with a very small radius of curvature.

[0159] While structural examples A and B illustrate light-emitting devices that can be bent inwards into a folded shape, one embodiment of the present invention is not limited thereto. As shown in structural example F below, a light-emitting device that can be bent outwards into a folded shape is also an embodiment of the present invention.

[0160] <Structure Example F> Figure 13A shows a top view of the light-emitting device in its unfolded state. Figure 13B shows a side view of the light-emitting device in its folded state.

[0161] The light-emitting device includes a first region 171, a second region 172, and a third region 173. The first region 171 is located between the second region 172 and the third region 173. The flexibility of the first region 171 is the highest among the three regions.

[0162] The light-emitting device includes a light-emitting panel 101, a support 103a (1), a support 103a (2), a support 103b (1), a support 103b (2), and a connecting part 105.

[0163] Support 103a(1) and support 103a(2) are separated from each other. Support 103b(1) and support 103b(2) are separated from each other. The flexibility of all four supports is lower than that of the light-emitting panel 101.

[0164] The first region 171 includes a light-emitting panel 101 and a connecting portion 105. The light-emitting panel 101 and the connecting portion 105 overlap each other.

[0165] The first region 171 is a portion in which the light-emitting panel 101 can be bent outward. For details, please refer to the connecting portion 105a in structural example D. The light-emitting panel 101 can also be bent inward within the first region 171.

[0166] The second region 172 includes a light-emitting panel 101 between the support 103a (1) and the support 103b (1). The third region 173 includes a light-emitting panel 101 between the support 103a (2) and the support 103b (2).

[0167] <Example 5> Figure 13C shows a side view of the light-emitting device in a folded state. The light-emitting device shown in Figure 13C is a variation of the light-emitting device shown in Figure 13B.

[0168] The light-emitting device shown in Figure 13C includes only one spacer 108. The spacer 108 includes multiple slits. The multiple protrusions separated by the slits have the same function as the multiple spacers in the above structural example. That is, when the first region 171 is bent, the angle formed by the normals of the opposing surfaces of two adjacent protrusions changes depending on the bending condition of the light-emitting panel 101. Thus, a neutralizing surface can be formed in or near the light-emitting panel 101. The deeper the slit, the easier it is to form a neutralizing surface in or near the light-emitting panel 101. Alternatively, two or more spacers 108 with slits may be included.

[0169] As described above, in this embodiment, by overlapping the light-emitting panel and the component to form a highly flexible region of the light-emitting device, the mechanical strength of this region can be improved. Furthermore, even with the component, a neutral surface can be formed in or near the light-emitting panel. Therefore, even if the light-emitting device is bent, the light-emitting panel is less prone to stretching or contraction, thus preventing damage to the light-emitting panel.

[0170] This embodiment can be appropriately combined with other embodiments.

[0171] Example 2 In this embodiment, the light-emitting panel will be described with reference to the drawings.

[0172] Although this embodiment illustrates a light-emitting panel that primarily uses organic EL elements, one embodiment of the invention is not limited thereto.

[0173] When the light-emitting panel illustrated in this embodiment is bent, the minimum radius of curvature of the bent portion of the light-emitting panel can be set to 1 mm or more and 150 mm or less, 1 mm or more and 100 mm or less, 1 mm or more and 50 mm or less, 1 mm or more and 10 mm or less, or 2 mm or more and 5 mm or less. In the light-emitting panel of this embodiment, the element will not be damaged even when bent with a small radius of curvature (for example, 2 mm or more and 5 mm or less), thus the light-emitting device has high reliability. By bending the light-emitting panel with a small radius of curvature, the light-emitting device of one embodiment of the present invention can be made thinner. There is no limitation on the direction in which the light-emitting panel of this embodiment is bent. In addition, there can be one or more bent portions.

[0174] <Specific Example 1> Figure 14A shows a plan view of the light-emitting panel, while Figure 14B shows an example of a cross-sectional view along the dashed line D1-D2 in Figure 14A. Specific example 1 shows a top-emitting panel that uses a color filter method. In this embodiment, the light-emitting panel can, for example, use sub-pixels of three colors (R (red), G (green), and B (blue)) to represent a color structure, sub-pixels of four colors (R (red), G (green), B (blue), and W (white)) to represent a color structure, or sub-pixels of four colors (R (red), G (green), B (blue), and Y (yellow)) to represent a color structure. There are no particular limitations on the color elements; colors other than R, G, B, W, and Y can also be used, such as cyan or magenta.

[0175] The light-emitting panel shown in Figure 14A includes a light-emitting part 804, a driving circuit part 806, and an FPC 808.

[0176] The light-emitting panel shown in Figure 14B includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (multiple transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, multiple light-emitting elements, and an insulating layer 821), a third adhesive layer 822, a second functional layer (a color layer 845 and a light-shielding layer 847), a second insulating layer 715, a second adhesive layer 713, and a second flexible substrate 711. The third adhesive layer 822, the second insulating layer 715, the second adhesive layer 713, and the second flexible substrate 711 allow visible light to pass through. The light-emitting elements or transistors included in the light-emitting portion 804 and the driving circuit portion 806 are sealed by the first flexible substrate 701, the second flexible substrate 711, and the third adhesive layer 822.

[0177] In the light-emitting portion 804, a transistor 820 and a light-emitting element 830 are disposed on a first flexible substrate 701, separated by a first adhesive layer 703 and a first insulating layer 705. The light-emitting element 830 includes a lower electrode 831 on the insulating layer 817, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered by the insulating layer 821. Preferably, the lower electrode 831 reflects visible light. The upper electrode 835 allows visible light to pass through.

[0178] Additionally, the light-emitting portion 804 includes a color layer 845 overlapping with the light-emitting element 830 and a light-shielding layer 847 overlapping with the insulating layer 821. A third adhesive layer 822 is filled in the gap between the light-emitting element 830 and the color layer 845.

[0179] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor constituting the transistor. In addition, in order to reduce the surface unevenness caused by the transistor, the insulating layer 817 is preferably an insulating layer with planarization function.

[0180] In the drive circuit section 806, a plurality of transistors are disposed on the first flexible substrate 701, separated by a first adhesive layer 703 and a first insulating layer 705. Figure 14B shows one of the transistors in the drive circuit section 806.

[0181] The first insulating layer 705 is bonded to the first flexible substrate 701 using a first adhesive layer 703. Furthermore, the second insulating layer 715 is bonded to the second flexible substrate 711 using a second adhesive layer 713. When the first insulating layer 705 or the second insulating layer 715 is made of a highly moisture-resistant film, the reliability of the light-emitting panel is improved because it can prevent impurities such as water from entering the light-emitting element 830 or the transistor 820.

[0182] The conductive layer 857 is electrically connected to an external input terminal that transmits signals or potentials from the outside to the drive circuit section 806. Here, an example is shown where an FPC 808 is provided as an external input terminal. To prevent an increase in the number of processes, the conductive layer 857 is preferably manufactured using the same material and process as the electrodes or wiring used in the light-emitting section or drive circuit section. Here, an example is shown where the conductive layer 857 is manufactured using the same material and process as the electrodes constituting the transistor 820.

[0183] In the light-emitting panel shown in Figure 14B, the FPC 808 is located on the second flexible substrate 711. The connector 825 is connected to the conductive layer 857 through openings provided in the second flexible substrate 711, the second adhesive layer 713, the second insulating layer 715, the third adhesive layer 822, the insulating layer 817, and the insulating layer 815. Additionally, the connector 825 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are electrically connected to each other via the connector 825. When the conductive layer 857 overlaps with the second flexible substrate 711, by forming an opening in the second flexible substrate 711 (or using a substrate with an opening), the conductive layer 857, the connector 825, and the FPC 808 can be electrically connected to each other.

[0184] Figures 14A and 14B show examples of variations of the light-emitting panel. Figure 15A shows a plan view of the light-emitting panel, while Figure 15B shows an example of a cross-sectional view along the dashed lines D3-D4 in Figure 15A. Figure 16A shows an example of a cross-sectional view along the dashed lines D5-D6 in Figure 15A.

[0185] The light-emitting panels shown in Figures 15A and 15B are examples of cases where the dimensions of the first flexible substrate 701 and the second flexible substrate 711 are different. The FPC 808 is located on the second insulating layer 715 and does not overlap the second flexible substrate 711. The connector 825 is connected to the conductive layer 857 through openings provided in the second insulating layer 715, the third adhesive layer 822, the insulating layer 817, and the insulating layer 815. Because it is not necessary to provide openings in the second flexible substrate 711, there are no restrictions on the material of the second flexible substrate 711.

[0186] Furthermore, it is preferable that the insulating layer formed using an organic resin with low gas barrier or moisture resistance does not protrude to the end of the light-emitting device. By adopting this structure, impurities can be prevented from entering from the side of the light-emitting device. For example, as shown in Figures 15B and 16A, the insulating layer 817 may not be provided at the end of the light-emitting device.

[0187] Furthermore, Figure 16B shows a modified example of the light-emitting part 804.

[0188] The light-emitting panel shown in Figure 16B includes an insulating layer 817a and an insulating layer 817b, and a conductive layer 856 is disposed on the insulating layer 817a. The source electrode or drain electrode of the transistor 820 is electrically connected to the lower electrode of the light-emitting element 830 through the conductive layer 856.

[0189] The light-emitting panel shown in Figure 16B includes spacers 823 on the insulating layer 821. By providing spacers 823, the distance between the first flexible substrate 701 and the second flexible substrate 711 can be adjusted.

[0190] The light-emitting panel shown in Figure 16B includes a protective layer 849 covering a color layer 845 and a light-shielding layer 847. An adhesive layer 822 fills the gap between the light-emitting element 830 and the protective layer 849.

[0191] In addition, Figure 16C shows a modified example of the light-emitting element 830.

[0192] Additionally, as shown in FIG16C, the light-emitting element 830 may also include an optical adjustment layer 832 between the lower electrode 831 and the EL layer 833. Preferably, a light-transmitting conductive material is used as the optical adjustment layer 832. Due to the combination of the color filter (color layer) and the microcavity structure (optical adjustment layer), light with high color purity can be extracted from the light-emitting panel of one embodiment of the present invention. The thickness of the optical adjustment layer can be varied according to the color of each sub-pixel.

[0193] <Specific Example 2> The light-emitting panel shown in Figure 16D includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830 and insulating layer 821), a second adhesive layer 713 and a second flexible substrate 711.

[0194] The conductive layers 857a and 857b are external connection electrodes of the light-emitting panel and can be electrically connected to FPCs, etc.

[0195] The light-emitting element 830 includes a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the lower electrode 831 is covered by an insulating layer 821. The light-emitting element 830 can adopt a bottom-emitting structure, a top-emitting structure, or a dual-emitting structure. The electrodes, substrate, insulating layer, etc. on the light-extracting side allow visible light to pass through. The conductive layer 814 is electrically connected to the lower electrode 831.

[0196] The light extraction structure in the substrate on the light extraction side can include a hemispherical lens, a microlens array, a thin film with an uneven structure, or a light diffusion film. For example, by using an adhesive having the same refractive index as the substrate, the lens, or the thin film to bond the lens or the thin film to the resin substrate, a substrate with a light extraction structure can be formed.

[0197] Although the conductive layer 814 is not necessarily required, it is preferable to provide the conductive layer 814 because it can suppress the voltage drop caused by the resistance of the lower electrode 831. Alternatively, for the same purpose, a conductive layer electrically connected to the upper electrode 835 may be provided on the insulating layer 821, the EL layer 833, or the upper electrode 835.

[0198] The conductive layer 814 can be formed in a single layer or in a stack using materials selected from copper, titanium, tantalum, tungsten, molybdenum, chromium, neodymium, scandium, nickel, and aluminum, or alloys with these materials as the main components. The thickness of the conductive layer 814 can be set to, for example, 0.1 μm or more and 3 μm or less, preferably 0.1 μm or more and 0.5 μm or less.

[0199] <Specific Example 3> Figure 15A shows a plan view of the light-emitting panel, while Figure 17A shows an example of a cross-sectional view along the dashed line D3-D4 in Figure 15A. Specific example 3 shows a bottom-emitting panel that uses a color filter method.

[0200] The light-emitting panel shown in Figure 17A includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (multiple transistors, a conductive layer 857, an insulating layer 815, a color layer 845, insulating layers 817a and 817b, a conductive layer 856, multiple light-emitting elements, and an insulating layer 821), a second adhesive layer 713, and a second flexible substrate 711. The first flexible substrate 701, the first adhesive layer 703, the first insulating layer 705, the insulating layer 815, the insulating layer 817a, and the insulating layer 817b allow visible light to pass through.

[0201] In the light-emitting portion 804, transistors 820 and 824, and a light-emitting element 830 are disposed on the first flexible substrate 701, separated by a first adhesive layer 703 and a first insulating layer 705. The light-emitting element 830 includes a lower electrode 831 on the insulating layer 817b, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered by the insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 allows visible light to pass through. There are no particular restrictions on the position of the color layer 845 overlapping the light-emitting element 830; for example, the color layer 845 can be disposed between insulating layers 817a and 817b, or between insulating layers 815 and 817a, etc.

[0202] In the drive circuit section 806, a plurality of transistors are disposed on the first flexible substrate 701, separated by a first adhesive layer 703 and a first insulating layer 705. FIG17A shows two transistors among the transistors included in the drive circuit section 806.

[0203] The first insulating layer 705 is bonded to the first flexible substrate 701 using the first adhesive layer 703. When a highly moisture-resistant film is used as the first insulating layer 705, it can prevent impurities such as water from entering the light-emitting element 830, transistor 820 and transistor 824, thereby improving the reliability of the light-emitting panel, which is preferable.

[0204] The conductive layer 857 is electrically connected to an external input terminal that transmits signals or potentials from the outside to the drive circuit section 806. Here, an example is shown where an FPC 808 is provided as an external input terminal. Also, an example is shown where the conductive layer 857 is manufactured using the same material and process as the conductive layer 856.

[0205] <Specific Example 4> Figure 15A shows a plan view of the light-emitting panel, while Figure 17B shows an example of a cross-sectional view along the dashed line D3-D4 in Figure 15A. Specific example 4 shows a top-emitting panel that employs a separately colored method.

[0206] The light-emitting panel shown in Figure 17B includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a first functional layer (multiple transistors, a conductive layer 857, an insulating layer 815, an insulating layer 817, multiple light-emitting elements, an insulating layer 821, and spacers 823), a second adhesive layer 713, and a second flexible substrate 711. The second adhesive layer 713 and the second flexible substrate 711 allow visible light to pass through.

[0207] In the light-emitting panel shown in Figure 17B, connector 825 is located on insulating layer 815. Connector 825 is connected to conductive layer 857 through an opening provided in insulating layer 815. In addition, connector 825 is also connected to FPC 808. Conductive layer 857 and FPC 808 are electrically connected to each other through connector 825.

[0208] <Examples of materials> Next, the materials that can be used in the light-emitting panel will be described. Note that sometimes the components already described in the previous part of this specification are omitted.

[0209] Materials such as glass, quartz, organic resin, metal, and alloy can be used as substrates. The substrate on the side that extracts the light emitted by the light-emitting element uses a material that transmits that light.

[0210] In particular, a flexible substrate is preferred. For example, an organic resin or a glass, metal, or alloy thin enough to be flexible can be used. For example, the thickness of the flexible substrate is preferably 1 μm or more and 200 μm or less, more preferably 1 μm or more and 100 μm or less, further preferably 1 μm or more and 50 μm or less, and particularly preferably 1 μm or more and 25 μm or less.

[0211] Since organic resin has a lower specific gravity than glass, using organic resin as a flexible substrate is preferable to using glass as a flexible substrate because it allows for a lighter light-emitting device.

[0212] The substrate is preferably made of a highly resilient material. This allows for the creation of a light-emitting device that is highly impact-resistant and less prone to damage. For example, by using an organic resin substrate, a thin metal substrate, or an alloy substrate, a lightweight and less easily damaged light-emitting device can be achieved compared to using a glass substrate.

[0213] Because metallic and alloy materials have high thermal conductivity and easily conduct heat to the entire substrate, they can suppress local temperature rise in the light-emitting panel, making them preferable. The thickness of the substrate using metallic or alloy materials is preferably 10 μm or more and 200 μm or less, more preferably 20 μm or more and 50 μm or less.

[0214] There are no particular restrictions on the materials used to form the metal or alloy substrate. For example, alloys of metals such as aluminum, copper, nickel, aluminum alloys, or stainless steel are preferred.

[0215] Furthermore, when a material with high thermal emissivity is used as the substrate, the surface temperature rise of the light-emitting panel can be suppressed, thereby preventing damage to the light-emitting panel and a decrease in reliability. For example, the substrate can also be a laminated structure of a metal substrate and a layer with high thermal emissivity (e.g., metal oxide or ceramic materials can be used).

[0216] Materials that are flexible and transparent include, for example, polyester resins such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyether ether (PES) resin, polyamide resin (nylon, aromatic polyamide, etc.), polycyclic olefin resin, polystyrene resin, polyamide-amide resin, polyvinyl chloride resin, and polytetrafluoroethylene (PTFE) resin. Materials with a low coefficient of linear expansion are particularly preferred, such as polyamide-amide resin, polyimide resin, polyamide resin, and PET. Alternatively, a substrate (also called a prepreg) in which resin is impregnated into a fiber body or an organic resin with inorganic fillers can be used to reduce the coefficient of linear expansion.

[0217] The flexible substrate can be a laminated structure, wherein layers using the aforementioned materials are stacked together with a hard coating (e.g., a silicon nitride layer, etc.) that protects the surface of the device from damage or other damage, or layers of materials that can disperse pressure (e.g., an aromatic polyamide resin layer, etc.).

[0218] Flexible substrates with multiple layers can also be used as flexible substrates. In particular, by employing a structure with a glass layer, the barrier properties against water or oxygen can be improved, thus providing a highly reliable light-emitting panel.

[0219] For example, a flexible substrate can be used in which a glass layer, an adhesive layer, and an organic resin layer are stacked from the side closest to the light-emitting element. The thickness of the glass layer is set to be 20 μm or more and 200 μm or less, preferably 25 μm or more and 100 μm or less. This thickness of glass layer can simultaneously achieve high water or oxygen barrier properties and high flexibility. Furthermore, the thickness of the organic resin layer is 10 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing this organic resin layer on the outside of the glass layer, cracks or fissures in the glass layer can be prevented, improving the mechanical strength of the glass. By applying this composite material of glass and organic resin to the substrate, a highly reliable flexible light-emitting panel can be manufactured.

[0220] As the adhesive layer, various curing adhesives can be used, including UV-curing adhesives, reactive curing adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, and EVA (ethylene vinyl acetate) resins. Materials with low moisture permeability, such as epoxy resins, are particularly preferred. Two-component mixed resins can also be used. Furthermore, adhesive sheets can also be used.

[0221] In addition, a desiccant can also be included in the resin. For example, a substance that adsorbs moisture through chemical adsorption, such as an oxide of an alkaline earth metal (calcium oxide or barium oxide, etc.), can be used. Alternatively, a substance that adsorbs moisture through physical adsorption, such as zeolite or silicone, can be used. When a desiccant is included in the resin, it can prevent impurities such as moisture from penetrating the functional components, thereby improving the reliability of the light-emitting panel, which is therefore preferable.

[0222] Furthermore, by mixing fillers or light-scattering components with high refractive indices into the aforementioned resins, the light extraction efficiency of the light-emitting elements can be improved. For example, titanium dioxide, barium oxide, zeolite, zirconium, etc., can be used.

[0223] The first insulating layer 705 and the second insulating layer 715 are preferably insulating films with high moisture resistance. The first insulating layer 705 or the second insulating layer 715 may also have the function of preventing impurities from diffusing into the light-emitting element.

[0224] Examples of insulating films with high moisture resistance include silicon nitride films, silicon oxynitride films, and other films containing nitrogen and silicon, as well as aluminum nitride films and other films containing nitrogen and aluminum. Additionally, silicon oxide films, silicon oxynitride films, and aluminum oxide films can also be used.

[0225] For example, the water vapor transmission rate of the moisture-proof insulating film is set to below 1×10-5 [g / (m2.day)], preferably below 1×10-6 [g / (m2.day)], more preferably below 1×10-7 [g / (m2.day)], and even more preferably below 1×10-8 [g / (m2.day)].

[0226] In the light-emitting panel, at least one of the first insulating layer 705 and the second insulating layer 715 needs to transmit light emitted by the light-emitting element. Preferably, the average light transmittance of one of the first insulating layer 705 and the second insulating layer 715, with wavelengths above 400 nm and below 800 nm, is higher than that of the other insulating layer.

[0227] There are no particular restrictions on the structure of the transistors in the light-emitting panel. For example, interleaved or anti-interleaved transistors can be used. Furthermore, top-gate or bottom-gate transistor structures can also be used. There are no particular restrictions on the semiconductor materials used for the transistors; examples include silicon, germanium, and organic semiconductors. Alternatively, oxide semiconductors containing at least one of indium, gallium, and zinc, such as In-Ga-Zn metal oxides, can also be used.

[0228] There are no particular restrictions on the crystallinity of the semiconductor material used for the transistor; either amorphous semiconductors or crystalline semiconductors (microcrystalline semiconductors, polycrystalline semiconductors, single-crystal semiconductors, or semiconductors with a portion of crystalline regions) can be used. When using crystalline semiconductors, the degradation of transistor characteristics can be suppressed, making them preferable.

[0229] To stabilize the characteristics of the transistor, a base film is preferably provided. The base film can be an inorganic insulating film such as silicon oxide, silicon nitride, silicon oxynitride, or silicon oxynitride, formed as a single layer or in layers. The base film can be formed by sputtering, CVD (Chemical Vapor Deposition) methods (e.g., plasma CVD, thermal CVD, MOCVD (Metal Organic Chemical Vapor Deposition), etc.), ALD (Atomic Layer Deposition), coating, printing, etc. Alternatively, a base film may be omitted if not required. In the above structural examples, the first insulating layer 705 can also serve as the base film of the transistor.

[0230] As a light-emitting element, a self-emissive element can be used, and within this scope, elements whose brightness is controlled by current or voltage can be used. For example, light-emitting diodes (LEDs), organic EL elements, and inorganic EL elements can be used.

[0231] The light-emitting element can employ a top-emitting structure, a bottom-emitting structure, or a dual-emitting structure. The electrode on the light-extracting side uses a conductive film that allows visible light to pass through. Alternatively, the electrode on the non-light-extracting side preferably uses a conductive film that reflects visible light.

[0232] As a conductive film that allows visible light to pass through, indium oxide, indium tin oxide (ITO), indium zinc oxide, zinc oxide (ZnO), and zinc oxide with gallium addition can be used, for example. Alternatively, it can be formed by making thin, transparent films from metals such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium, alloys containing these metals, or nitrides of these metals (e.g., titanium nitride). Furthermore, laminated films of the above materials can be used as the conductive layer. For example, using a laminated film of silver and magnesium alloys with ITO can improve conductivity, making it preferable. Graphene can also be used.

[0233] As a conductive film that reflects visible light, materials such as aluminum, gold, platinum, silver, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, or palladium, or alloys containing these materials, can be used. Additionally, lanthanum, neodymium, or germanium can be added to the aforementioned materials or alloys. Furthermore, the conductive film reflecting visible light can be formed using aluminum alloys (aluminum alloys), such as aluminum-titanium alloys, aluminum-nickel alloys, aluminum-neodymium alloys, and aluminum, nickel, and lanthanum alloys (Al-Ni-La), as well as silver alloys (Ag-Pd-Cu, also referred to as APC), silver-magnesium alloys, and other silver-containing alloys. Alloys containing silver and copper have high heat resistance and are therefore preferred. Furthermore, by laminating a metal film or metal oxide film in contact with the aluminum alloy film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and the metal oxide film include titanium and titanium oxide. Additionally, a conductive film that allows visible light to pass through can be laminated with a film made of a metallic material. For example, laminated films of silver and ITO, or laminated films of silver and magnesium alloys and ITO can be used.

[0234] Each electrode can be formed using vapor deposition or sputtering. Alternatively, it can be formed using inkjet printing, screen printing, or plating.

[0235] When a voltage higher than the critical voltage of the light-emitting element is applied between the lower electrode 831 and the upper electrode 835, holes are injected into the EL layer 833 from the anode side, while electrons are injected into the EL layer 833 from the cathode side. The injected electrons and holes recombine in the EL layer 833, thereby causing the light-emitting material contained in the EL layer 833 to emit light.

[0236] The EL layer 833 includes at least a light-emitting layer. In addition to the light-emitting layer, the EL layer 833 may also include one or more layers, such as materials with high hole injection capacity, materials with high hole transport capacity, hole blocking materials, materials with high electron transport capacity, materials with high electron injection capacity, or bipolar materials (materials with both high electron transport capacity and high hole transport capacity).

[0237] The EL layer 833 can be made of low-molecular-weight compounds, high-molecular-weight compounds, or inorganic compounds. The layers constituting the EL layer 833 can be formed by methods such as vapor deposition (including vacuum vapor deposition), transfer printing, printing, inkjet printing, and coating.

[0238] The light-emitting element 830 may also contain two or more light-emitting materials. Thus, for example, a light-emitting element capable of emitting white light can be achieved. For example, by selecting light-emitting materials in a manner that makes the emission of each of the two or more light-emitting materials complementary colors, white light emission can be obtained. For example, light-emitting materials that emit light in the form of R (red), G (green), B (blue), Y (yellow), or O (orange), or light-emitting materials that emit light containing spectral components of two or more of R, G, and B, can be used. For example, light-emitting materials that emit blue light and light-emitting materials that emit yellow light can also be used. In this case, the emission spectrum of the light-emitting material that emits yellow light preferably includes spectral components of green and red. Furthermore, the emission spectrum of the light-emitting element 830 preferably has two or more peaks in the visible region (e.g., 350 nm or more and 750 nm or 400 nm or more and 800 nm or less).

[0239] The EL layer 833 can also have multiple light-emitting layers. In the EL layer 833, multiple light-emitting layers can be stacked in contact with each other, or they can be stacked with a separation layer in between. For example, a separation layer can also be provided between the fluorescent light-emitting layer and the phosphorescent light-emitting layer.

[0240] A separation layer is provided to prevent, for example, energy transfer (especially triplet energy transfer) from the excited state of the phosphorescent material generated in the phosphorescent layer to the fluorescent material in the fluorescent layer due to the Dexter mechanism. The separation layer can have a thickness of about a few nanometers (nm). Specifically, the thickness of the separation layer is 0.1 nm or more and 20 nm or less, or 1 nm or more and 10 nm or less, or 1 nm or more and 5 nm or less. The separation layer contains a single material (preferably a bipolar material) or multiple materials (preferably a hole-transporting material and an electron-transporting material).

[0241] The separation layer can also be formed using the material contained in the light-emitting layer that contacts the separation layer. This simplifies the fabrication of the light-emitting element and reduces the driving voltage. For example, when the phosphorescent light-emitting layer is composed of a host material, an auxiliary material, and a phosphorescent material (guest material), the separation layer can also be formed using the host material and the auxiliary material. In other words, the separation layer has regions that do not contain phosphorescent material, and the phosphorescent light-emitting layer has regions that contain phosphorescent material. Thus, the separation layer and the phosphorescent light-emitting layer can be deposited and formed separately depending on the presence or absence of phosphorescent material. Furthermore, by adopting this structure, the separation layer and the phosphorescent light-emitting layer can be formed in the same processing chamber. This reduces manufacturing costs.

[0242] In addition, the light-emitting element 830 can be a single unit including an EL layer, or it can be a series element including multiple EL layers stacked with charge separated by layers.

[0243] The light-emitting element is preferably disposed between a pair of highly moisture-resistant insulating films. This prevents impurities such as water from penetrating the light-emitting element, thereby suppressing a decrease in the reliability of the light-emitting panel. Specifically, as described above, when highly moisture-resistant insulating films are used as the first insulating layer 705 and the second insulating layer 715, the light-emitting element is located between a pair of highly moisture-resistant insulating films, thus suppressing a decrease in the reliability of the light-emitting panel.

[0244] As the insulating layer 815, inorganic insulating films such as silicon oxide films, silicon oxynitride films, and aluminum oxide films can be used, for example. Furthermore, as the insulating layers 817, 817a, and 817b, organic materials such as polyimide, acrylic resin, polyimide, polyimide-polyimide, and benzocyclobutene resins can be used, and low-dielectric-constant materials (low-k materials) can also be used. In addition, multiple insulating films can be stacked to form each insulating layer.

[0245] The insulating layer 821 is formed using organic or inorganic insulating materials. For example, polyimide resin, polyamide resin, acrylic resin, silicone resin, epoxy resin, or phenolic resin can be used as the resin. In particular, it is preferable to use a photosensitive resin material to form an opening on the lower electrode 831, and to form the sidewall of the opening as an inclined surface with a continuous curvature.

[0246] Although there are no particular restrictions on the method of forming the insulating layer 821, it can be achieved by photolithography, sputtering, vapor deposition, droplet jetting (inkjet printing, etc.), printing (screen printing, offset printing, etc.).

[0247] The spacer 823 can be formed using inorganic insulating materials, organic insulating materials, or metallic materials. For example, various materials suitable for the aforementioned insulating layer can be used as inorganic and organic insulating materials. Furthermore, titanium, aluminum, etc., can be used as metallic materials. By electrically connecting the spacer 823 containing conductive material to the upper electrode 835, the potential drop caused by the resistance of the upper electrode 835 can be suppressed. Additionally, the spacer 823 can be in the shape of a positive cone or an inverse cone.

[0248] The conductive layer for a light-emitting panel, used as an electrode, wiring, or auxiliary electrode for a transistor or light-emitting element, can be formed in single or multilayer forms using metallic materials such as molybdenum, titanium, chromium, tantalum, tungsten, aluminum, copper, neodymium, and scandium, or alloys containing these elements. Alternatively, the conductive layer can be formed using conductive metal oxides. Examples of conductive metal oxides include indium oxide (In₂O₃, etc.), tin oxide (SnO₂, etc.), ZnO, ITO, indium zinc oxide (In₂O₃-ZnO, etc.), or materials containing silicon oxide within these metal oxide materials.

[0249] A color layer is a colored layer that allows light of a specific wavelength range to pass through. For example, color filters that allow light of the red, green, blue, and yellow wavelength ranges to pass through can be used. Each color layer is formed at the desired location using various materials and employing methods such as printing, inkjet printing, or etching using photolithography. Alternatively, a transparent resin can be disposed in the white sub-pixel, overlapping the light-emitting element.

[0250] A light-shielding layer is disposed between adjacent color layers. The light-shielding layer blocks the light emitted by adjacent light-emitting elements, thereby suppressing color mixing between adjacent light-emitting elements. Here, by distributing the color layers with their ends overlapping the light-shielding layer, light leakage can be suppressed. The light-shielding layer can be made of a material that blocks the light emitted by the light-emitting elements; for example, a black matrix can be formed using a resin material containing metallic materials and pigments or dyes. Furthermore, it is preferable to place the light-shielding layer in an area outside the light-emitting parts, such as the drive circuit section, to suppress unintentional light leakage caused by light guiding, etc.

[0251] In addition, a protective layer covering the color layer and the light-shielding layer can be provided. By providing a protective layer, impurities contained in the color layer can be prevented from diffusing to the light-emitting element. The protective layer is made of a material that transmits light emitted by the light-emitting element. For example, inorganic insulating films such as silicon nitride film and silicon oxide film, or organic insulating films such as acrylic resin film and polyimide film can be used. A laminated structure of organic and inorganic insulating films can also be used.

[0252] Furthermore, when the adhesive layer material is applied to the upper surface of the color layer and the light-shielding layer, the material used as the protective layer is preferably a material with high wettability relative to the adhesive layer material. For example, as the protective layer, it is preferable to use an oxide conductive film such as an ITO film or a metal film such as an Ag film that is thin enough to be transparent.

[0253] By using a material with high wettability relative to the adhesive layer material as the protective layer, the adhesive layer material can be evenly coated. This prevents air bubbles from being incorporated when bonding a pair of substrates, thereby preventing display defects.

[0254] As connectors, various anisotropic conductive films (ACF) or anisotropic conductive pastes (ACP) can be used.

[0255] As described above, one embodiment of the present invention can be applied to light-emitting panels, display panels, touch panels, etc.

[0256] Examples of display elements include organic EL elements, inorganic EL elements, light-emitting elements such as LEDs, liquid crystal elements, electrophoretic elements, and display elements using MEMS (microelectromechanical systems).

[0257] Furthermore, the light-emitting panel of one embodiment of the present invention can be used as both a display device and a lighting device. For example, it can also be used as a light source such as a backlight or a front light source, that is, a lighting device for a display panel.

[0258] This embodiment can be appropriately combined with any other embodiment.

[0259] Example 3 In this embodiment, a touch panel is illustrated using diagrams. Furthermore, for the same constituent elements of the touch panel as those of the light-emitting panel described in Embodiment 2, please refer to the above description. Although this embodiment illustrates a touch panel using a light-emitting element, it is not limited to this. For example, a touch panel using other elements (display elements, etc.) shown in Embodiment 2 is also an embodiment of the present invention.

[0260] <Structure Example 1> Figure 18A is a top view of the touch panel. Figure 18B is a cross-sectional view along the dotted lines AB and CD in Figure 18A. Figure 18C is a cross-sectional view along the dotted line EF in Figure 18A.

[0261] The touch panel 390 shown in Figure 18A includes a display unit 301 (which also serves as an input unit), a scan line driving circuit 303g (1), an imaging pixel driving circuit 303g (2), an image signal line driving circuit 303s (1), and an imaging signal line driving circuit 303s (2).

[0262] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308.

[0263] Pixel 302 comprises multiple sub-pixels. Each sub-pixel includes a light-emitting element and pixel circuitry.

[0264] The pixel circuit supplies power to drive the light-emitting element. The pixel circuit is electrically connected to wiring that supplies selection signals. Furthermore, the pixel circuit is electrically connected to wiring that supplies image signals.

[0265] The scan line drive circuit 303g(1) can supply a selection signal to the pixel 302.

[0266] The image signal line driving circuit 303s(1) can supply image signals to the pixel 302.

[0267] A touch sensor can be constructed using the imaging pixel 308. Specifically, the imaging pixel 308 can detect fingers, etc., touching the display unit 301.

[0268] Imaging pixel 308 includes photoelectric conversion elements and imaging pixel circuitry.

[0269] The imaging pixel circuit drives the photoelectric conversion element. The imaging pixel circuit is electrically connected to wiring that supplies control signals. Furthermore, the imaging pixel circuit is electrically connected to wiring that supplies power potential.

[0270] Examples of control signals include signals that select the imaging pixel circuit for reading the recorded imaging signal, signals that initialize the imaging pixel circuit, and signals that determine the time for the imaging pixel circuit to detect light.

[0271] The imaging pixel driving circuit 303g(2) can supply control signals to the imaging pixel 308.

[0272] The imaging signal line driving circuit 303s(2) can read out the imaging signal.

[0273] As shown in Figures 18B and 18C, the touch panel 390 includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a second flexible substrate 711, a second adhesive layer 713, and a second insulating layer 715. Furthermore, the first flexible substrate 701 and the second flexible substrate 711 are bonded together by a third adhesive layer 360.

[0274] The first flexible substrate 701 and the first insulating layer 705 are bonded together by the first adhesive layer 703. Furthermore, the second flexible substrate 711 and the second insulating layer 715 are bonded together by the second adhesive layer 713. For the materials used for the substrate, adhesive layer, and insulating layer, please refer to Example 2.

[0275] Each pixel 302 includes sub-pixels 302R, 302G, and 302B (Fig. 18C).

[0276] For example, subpixel 302R includes a light-emitting element 350R and pixel circuitry. The pixel circuitry includes a transistor 302t capable of supplying power to the light-emitting element 350R. Subpixel 302R also includes the light-emitting element 350R and optical elements (e.g., a color layer 367R that allows red light to pass through).

[0277] The light-emitting element 350R includes a lower electrode 351R, an EL layer 353, and an upper electrode 352 stacked in sequence (Figure 18C).

[0278] The EL layer 353 includes a first EL layer 353a, an intermediate layer 354 and a second EL layer 353b stacked in sequence.

[0279] In addition, a microcavity structure can be provided in the light-emitting element 350R to efficiently extract light of a specific wavelength. Specifically, an EL layer can also be provided between a film that reflects visible light and a semi-reflective, semi-transparent film designed for efficient extraction of specific light.

[0280] Sub-pixel 302R includes a third adhesive layer 360 that contacts the light-emitting element 350R and the color layer 367R. The color layer 367R is located at a position overlapping with the light-emitting element 350R. Thus, a portion of the light emitted by the light-emitting element 350R passes through the third adhesive layer 360 and the color layer 367R, and is emitted to the outside of the sub-pixel 302R as shown by the arrow in FIG18B or FIG18C.

[0281] The touch panel 390 includes a light-shielding layer 367BM. The light-shielding layer 367BM is provided in such a way that it surrounds a color layer (e.g., color layer 367R).

[0282] The touch panel 390 has an anti-reflection layer 367p disposed at a position overlapping with the display unit 301. For example, a circular polarizing plate can be used as the anti-reflection layer 367p.

[0283] The touch panel 390 includes an insulating layer 321. The insulating layer 321 covers transistors 302t and the like. Furthermore, the insulating layer 321 can be used as a layer to planarize the surface roughness of pixel circuits or imaging pixel circuits. Additionally, an insulating layer capable of suppressing the diffusion of impurities into transistors 302t and the like can be used in the insulating layer 321.

[0284] The touch panel 390 includes a partition wall 328 that overlaps with the end of the lower electrode 351R. In addition, a spacer 329 is provided on the partition wall 328 for controlling the spacing between the first flexible substrate 701 and the second flexible substrate 711.

[0285] The image signal line driving circuit 303s(1) includes a transistor 303t and a capacitor 303c. Furthermore, the driving circuit can be formed on the same substrate as the pixel circuit using the same process. As shown in FIG18B, a second gate 304 can be provided on the insulating layer 321 of the transistor 303t. The second gate 304 can be electrically connected to the gate of the transistor 303t, and different potentials can be applied to these gates. Additionally, if necessary, a second gate 304 can be provided in transistors 308t and 302t, etc.

[0286] Imaging pixel 308 includes photoelectric conversion element 308p and imaging pixel circuitry. The imaging pixel circuitry can detect light incident on photoelectric conversion element 308p. The imaging pixel circuitry includes transistor 308t. For example, a PIN photodiode can be used for photoelectric conversion element 308p.

[0287] The touch panel 390 includes wiring 311 capable of supplying signals, and the wiring 311 is provided with terminals 319. An FPC 309 capable of supplying signals such as image signals and synchronization signals is electrically connected to the terminals 319. The FPC 309 may also be mounted with a printed circuit board (PWB).

[0288] Alternatively, transistors such as 302t, 303t, and 308t can be formed using the same process. Or, these transistors can be formed using different processes.

[0289] <Structure Example 2> Figures 19A and 19B are perspective views of the touch panel 505. Note that the main components are shown for ease of understanding. Figures 20A and 20B are cross-sectional views along the dashed line X1-X2 in Figure 19A.

[0290] As shown in Figures 19A and 19B, the touch panel 505 includes a display unit 501, a scan line driving circuit 303g (1), and a touch sensor 595, etc. In addition, the touch panel 505 includes a first flexible substrate 701, a second flexible substrate 711, and a flexible substrate 590.

[0291] The touch panel 505 includes a plurality of pixels and a plurality of wirings 311. The plurality of wirings 311 are capable of supplying signals to the pixels. The plurality of wirings 311 are disposed on the outer periphery of the first flexible substrate 701, and a portion of the plurality of wirings 311 constitutes a terminal 319. The terminal 319 is electrically connected to the FPC 509(1).

[0292] The touch panel 505 includes a touch sensor 595 and a plurality of wirings 598. The plurality of wirings 598 are electrically connected to the touch sensor 595. The plurality of wirings 598 are disposed on the outer periphery of the flexible substrate 590, and a portion of the plurality of wirings 598 constitutes a terminal. Furthermore, the terminal is electrically connected to the FPC 509(2). Note that, for ease of understanding, the electrodes or wirings of the touch sensor 595 disposed on the back side of the substrate 590 (the side opposite to the first flexible substrate 701) are shown in solid lines in FIG19B.

[0293] As the touch sensor 595, a capacitive touch sensor can be used, for example. Types of capacitive touch sensors include surface-type capacitive touch sensors and projection-type capacitive touch sensors. Here, a projection-type capacitive touch sensor is shown.

[0294] As projection-type electrostatic capacitive sensors, there are self-capacitance type and mutual capacitance type. The mutual capacitance type is preferred because it allows for simultaneous multi-point detection.

[0295] In addition, various sensors that can detect the proximity or contact of objects such as fingers can be applied to the touch sensor 595.

[0296] The projection-type electrostatic capacitive touch sensor 595 includes electrodes 591 and 592. Electrode 591 is electrically connected to any one of the plurality of wirings 598, and electrode 592 is electrically connected to the other one of the plurality of wirings 598.

[0297] As shown in Figures 19A and 19B, electrode 592 has a shape in which multiple quadrilaterals are repeatedly arranged in one direction and connected to each other at the corners.

[0298] Electrode 591 is quadrilateral and is repeatedly arranged in directions intersecting the extension direction of electrode 592. Multiple electrodes 591 are not necessarily arranged orthogonally to a single electrode 592, but can also be arranged with an angle of less than 90° between them.

[0299] Wiring 594 is arranged to intersect with electrode 592. Wiring 594 electrically connects two electrodes 591 sandwiching electrode 592. Preferably, the area of ​​the intersection between electrode 592 and wiring 594 is minimized. This reduces the area of ​​the region where electrodes are not located, thus reducing unevenness in light transmittance. Consequently, unevenness in the brightness of light transmitted through touch sensor 595 is reduced.

[0300] Note that the shapes of electrodes 591 and 592 are not limited to these, and can have various shapes.

[0301] As shown in Figure 20A, the touch panel 505 includes a first flexible substrate 701, a first adhesive layer 703, a first insulating layer 705, a second flexible substrate 711, a second adhesive layer 713, and a second insulating layer 715. Furthermore, the first flexible substrate 701 and the second flexible substrate 711 are bonded together by a third adhesive layer 360.

[0302] The adhesive layer 597 bonds the flexible substrate 590 and the second flexible substrate 711 together in such a way that the touch sensor 595 overlaps with the display unit 501. The adhesive layer 597 is light-transmitting.

[0303] Electrodes 591 and 592 are formed using a light-transmitting conductive material. As a light-transmitting conductive material, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide with added gallium can be used. Alternatively, a film containing graphene can be used. The graphene-containing film can be formed, for example, by reducing graphene oxide, which is formed in a film-like state. Examples of reduction methods include heating methods.

[0304] Note that materials used for conductive films such as electrodes 591, 592, and wiring 594—that is, materials constituting the wiring or electrodes of the touch panel—can include, for example, transparent conductive films containing indium oxide, tin oxide, zinc oxide, etc. (e.g., ITO). Furthermore, materials used for wiring or electrodes constituting the touch panel preferably have low resistance values. Examples include silver, copper, aluminum, carbon nanotubes, graphene, and metal halides (silver halides, etc.). Metal nanowires composed of multiple extremely fine (e.g., several nanometers in diameter) conductors can also be used. Alternatively, metal meshes in which the conductors are formed into a mesh can be used. Examples include Ag nanowires, Cu nanowires, Al nanowires, Ag meshes, Cu meshes, and Al meshes. For example, when Ag nanowires are used as wiring or electrodes constituting the touch panel, visible light transmittance of 89% or more and sheet resistance of 40 Ω / square or more and 100 Ω / square or less can be achieved. Furthermore, since materials such as metal nanowires, metal meshes, carbon nanotubes, and graphene, which are examples of materials that can be used to form the wiring or electrodes of the aforementioned touch panel, have high transmittance to visible light, they can also be used as electrodes for display elements (e.g., pixel electrodes or common electrodes).

[0305] After the transparent conductive material is formed on the flexible substrate 590 by sputtering, the unwanted parts can be removed by various patterning techniques such as photolithography to form electrodes 591 and 592.

[0306] Electrodes 591 and 592 are covered by an insulating layer 593. Furthermore, openings leading to electrodes 591 are provided in the insulating layer 593, and wiring 594 electrically connects adjacent electrodes 591. Because the aperture ratio of the touch panel can be increased, a light-transmitting conductive material is suitable for use in wiring 594. Additionally, because resistance can be reduced, a material with higher conductivity than electrodes 591 and 592 is suitable for use in wiring 594.

[0307] In addition, by providing an insulating layer covering the insulating layer 593 and the wiring 594, the touch sensor 595 can be protected.

[0308] In addition, the connection layer 599 electrically connects the wiring 598 to the FPC 509(2).

[0309] Display unit 501 includes a plurality of pixels arranged in a matrix. Since each pixel has the same structure as in structural example 1, description is omitted.

[0310] Alternatively, as shown in FIG20B, a touch panel can be constructed using two substrates, a first flexible substrate 701 and a second flexible substrate 711, without using the flexible substrate 590. The second flexible substrate 711 and the second insulating layer 715 are bonded together by a second adhesive layer 713, and a touch sensor 595 is disposed in contact with the second insulating layer 715. A color layer 367R and a light-shielding layer 367BM are disposed in contact with the insulating layer 589 covering the touch sensor 595. Alternatively, the color layer 367R and the light-shielding layer 367BM can be disposed in contact with the wiring 594 instead of necessarily disposing of the insulating layer 589.

[0311] <Structure Example 3> Figures 21A to 21C are cross-sectional views of the touch panel 505B. The touch panel 505B described in this embodiment differs from the touch panel 505 in structural example 2 in that the supplied image data is displayed on the side where the transistor is located; and the touch sensor is located on the side of the first flexible substrate 701 of the display section. Here, only the different structures will be described in detail; for parts where the same structure can be used, the above description will be used.

[0312] The color layer 367R is located at a position overlapping with the light-emitting element 350R. Furthermore, the light-emitting element 350R shown in FIG21A emits light toward the side where the transistor 302t is disposed. Thus, a portion of the light emitted by the light-emitting element 350R passes through the color layer 367R and is emitted to the outside of the touch panel 505B in the direction of the arrow in FIG21A.

[0313] The touch panel 505B includes a light-shielding layer 367BM in the direction of light emission. The light-shielding layer 367BM is provided in such a way that it surrounds a color layer (e.g., color layer 367R).

[0314] The touch sensor 595 is disposed on the side of the first flexible substrate 701, rather than on the side of the second flexible substrate 711 (see Figure 21A).

[0315] The adhesive layer 597 is used to bond the flexible substrate 590 to the first flexible substrate 701 in such a way that the touch sensor 595 overlaps with the display unit. The adhesive layer 597 is transparent.

[0316] In addition, Figures 21A and 21B show the structure when a bottom-gate transistor is applied to the display section 501.

[0317] For example, a semiconductor layer containing oxide semiconductors, amorphous silicon, etc., can be applied to transistors 302t and 303t shown in FIG21A.

[0318] For example, a semiconductor layer containing polysilicon or the like can be applied to transistors 302t and 303t shown in FIG21B.

[0319] Additionally, Figure 21C shows the structure when a top-gate transistor is applied.

[0320] For example, a semiconductor layer containing polycrystalline silicon or a single-crystal silicon film transferred from a single-crystal silicon substrate can be applied to transistors 302t and 303t shown in FIG21C.

[0321] This embodiment can be implemented in appropriate combination with other embodiments. Example

[0322] This example demonstrates the manufacture of a light-emitting device according to an embodiment of the present invention.

[0323] In this example, a light-emitting device is manufactured that corresponds to structural example B (see Figure 2A, etc.) and structural example D (see Figure 9A, etc.).

[0324] The light-emitting panel manufactured in this example is manufactured by the following steps: a release layer (tungsten film) is formed on a pair of forming substrates (glass substrates), a release layer (one including a transistor, a light-emitting element, etc., and the other including a color filter, etc.) is formed on each release layer, and then each forming substrate is peeled off from the release layer and a flexible substrate is attached to the release layer using an adhesive.

[0325] As a transistor, CAAC-OS (C-axis Aligned Crystalline Oxide Semiconductor) transistors are used. Unlike amorphous semiconductors, CAAC-OS has a low defect energy level density, thus improving the reliability of the transistor. Furthermore, because CAAC-OS has unobservable grain boundaries, stable and uniform films can be formed over large areas, and it is less prone to cracking due to stress generated when bending flexible light-emitting devices.

[0326] CAAC-OS is a crystalline oxide semiconductor with its c-axis aligned approximately perpendicular to the film surface. It has also been confirmed that oxide semiconductors, in addition to single-crystal structures, possess various crystalline structures, such as nano-crystal (nc: nanocrystal) structures, which are aggregates of nanocrystals at the nanoscale. The crystallinity of CAAC-OS is lower than that of the single-crystal structure but higher than that of the nc structure.

[0327] In this example, a channel-etching transistor using In-Ga-Zn oxides is applied. This transistor is fabricated on a glass substrate at a process temperature below 500°C.

[0328] When components such as transistors are manufactured directly on organic resins such as plastic substrates, the process temperature of the components needs to be set below the heat resistance temperature of the organic resin. In this embodiment, because the substrate for forming is a glass substrate, and the release layer, which serves as an inorganic film, has high heat resistance, the transistor can be manufactured at the same temperature as when forming a transistor on a glass substrate, thereby easily ensuring the performance and reliability of the transistor.

[0329] The light-emitting element is a tandem (stacked) type organic EL element that emits white light. The light-emitting element has a top-emitting structure, and the light from the light-emitting element is extracted to the outside of the light-emitting panel through a color filter.

[0330] Two types of luminous panels were manufactured.

[0331] Figures 22A to 22C show the light-emitting device corresponding to structural example B. Figure 22A shows the light-emitting device in its unfolded state. Figure 22B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 22C shows the light-emitting device in its folded state.

[0332] The light-emitting device shown in Figures 22A to 22C includes a magnetic fixing tool used as a fixing tool 107. Furthermore, the connecting portion 105 includes an elastomer and multiple spacers. Because a light-shielding layer 109 overlapping with the connecting portion 105 is provided, the connecting portion 105 is not visible to users who are viewing the light-emitting surface of the light-emitting device.

[0333] In the light-emitting device shown in Figures 22A to 22C, the light-emitting panel includes a light-emitting portion (also called a light-emitting area or pixel portion) with a diagonal size of 5.9 inches; a pixel count of 720 × 1280; a pixel size of 102 μm × 102 μm; a resolution of 249 ppi; and an aperture ratio of 45.2%. It incorporates a built-in scan driver and utilizes an external source driver via a COF (Chip On Film) package. The frame frequency is 60 Hz. Furthermore, the light-emitting panel weighs approximately 3 g and is less than 100 μm thick.

[0334] Figures 23A to 23C show the light-emitting device corresponding to structural example D. Figure 23A shows the light-emitting device in its unfolded state. Figure 23B shows the light-emitting device in an intermediate state, transitioning from an unfolded state to a folded state or from a folded state to an unfolded state. Figure 23C shows the light-emitting device in its folded state.

[0335] In the light-emitting device shown in Figures 23A to 23C, the light-emitting panel has a diagonal size of 8.7 inches; a pixel count of 1080 × 1920; a pixel size of 100 μm × 100 μm; a resolution of 254 ppi; and an aperture ratio of 46.0%. It incorporates a scan driver and utilizes an external COF source driver. The frame frequency is 60 Hz. The light-emitting panel incorporates a capacitive touch sensor. Furthermore, the light-emitting panel weighs approximately 6 g and is less than 100 μm thick.

[0336] As described above, by applying one embodiment of the present invention, a light-emitting device can be manufactured that is highly portable in its folded state and has a large, seamless light-emitting area with excellent visibility in its unfolded state. Furthermore, a light-emitting device that prevents damage to the light-emitting panel caused by folding can also be manufactured.

[0337] 101: Illuminated Panel 103: Support 103a: Support 103b: Support 105: Connecting part 105a: Connecting part 105b: Connecting part 106: Elastomer 107: Fixing tools 108: Spacers 109: Light-shielding layer 111: Emitting area 112: Non-luminous area 113a: Protective layer 113b: Protective layer 151: Area 1 152: Second Area 153: Third Region 161: Area 1 162: Second Region 163: Third Region 164: Fourth Region 165: Fifth District 171: Area 1 172: Second Area 173: Third Area 301: Display Section 302: pixels 302B: Subpixel 302G: Subpixel 302R: Subpixel 302t: Transistor 303c: Capacitor 303g(1): Scan line drive circuit 303g(2): Imaging pixel driving circuit 303s(1): Image signal line driving circuit 303s(2): Imaging signal line driving circuit 303t: Transistor 304: Gate 308: Imaging pixels 308p: Photoelectric conversion element 308t: Transistor 309:FPC 311: Wiring 319:Terminal 321: Insulation layer 328: Partition wall 329: Spacers 350R: Light-emitting element 351R: Lower electrode 352: Upper electrode 353: EL layer 353a: EL layer 353b: EL layer 354: Intermediate layer 360: Adhesive layer 367BM: Light-shielding layer 367p: Anti-reflection layer 367R: Color Layer 390: Touch panel 501: Display Section 505: Touch panel 505B: Touch panel 509:FPC 589: Insulation layer 590:Flexible substrate 591: Electrode 592: Electrode 593: Insulation layer 594: Wiring 595: Touch Sensor 597: Adhesive layer 598: Wiring 599: Connection Layer 701:Flexible substrate 703: Adhesive layer 705: Insulation layer 711:Flexible substrate 713: Adhesive layer 715: Insulation layer 804: Light-emitting part 806: Drive Circuit Section 808:FPC 814: Conductive layer 815: Insulation layer 817: Insulation layer 817a: Insulation layer 817b: Insulation layer 820: Transistor 821: Insulation layer 822: Adhesive layer 823: Spacer 824: Transistor 825: Connector 830: Light-emitting element 831: Lower electrode 832: Optical Adjustment Layer 833: EL layer 835: Upper electrode 845: Color Layer 847: Light-shielding layer 849: Protective layer 856: Conductive layer 857: Conductive layer 857a: Conductive layer 857b: Conductive layer

Claims

1. A semiconductor device comprising: a first flexible substrate; a first insulating layer above the first flexible substrate; a top-gate thin-film transistor above the first insulating layer; a second insulating layer above the top-gate thin-film transistor; a lower electrode above the second insulating layer and electrically connected to the top-gate thin-film transistor; a third insulating layer above a portion of the lower electrode; an electroluminescent layer above the lower electrode; an upper electrode above the electroluminescent layer and the third insulating layer; a first adhesive layer above the upper electrode; and a second flexible substrate above the first adhesive layer. The second adhesive layer above the second flexible substrate; the first conductive layer above the second adhesive layer; The fourth insulating layer above the first conductive layer; the second conductive layer above the fourth insulating layer; the resin layer above the second conductive layer; the circular polarizer above the resin layer; and the third adhesive layer, comprising resin and located between the first flexible substrate and the first insulating layer.

2. The semiconductor device according to claim 1, wherein the resin layer is a third flexible substrate.

3. The semiconductor device according to claim 1, further comprising a color layer and a light-shielding layer between the upper electrode and the second flexible substrate.

4. The semiconductor device according to claim 1, wherein the first conductive layer intersects with the second conductive layer.

Images