Resin formulation, thermoset, and method of manufacturing the same

Abstract

This invention relates to a resin formulation, a thermosetting resin, and a method for manufacturing the same. The resin formulation comprises an epoxy resin, a thermosetting polyimide resin, a modified polyetherimide, and an amine curing agent. The modified polyetherimide has nucleophilic functional groups that can modify the thermosetting polyimide resin, resulting in a thermosetting resin with a specific phase separation system and thus good fracture toughness, heat resistance, and modulus.

Claims

1. A resin formulation comprising: an epoxy resin; a thermosetting polyimide resin, wherein the thermosetting polyimide resin comprises bismaleimide (BMI), and based on 100 mol% of the epoxy resin, an amount of the thermosetting polyimide resin used is 60 mol% to 90 mol%; a modified polyetherimide comprising nucleophilic functional groups, wherein the nucleophilic functional groups comprise hydroxyl, thiol, carboxyl, and / or amino groups, and based on 100 parts of the epoxy resin, an amount of the modified polyetherimide used is 5 parts to 30 parts; and an amine curing agent, wherein the ratio of the amino groups of the amine curing agent to the epoxy groups of the epoxy resin is 40 mol% to 90 mol.

2. The resin formulation as described in claim 1 further comprises a curing accelerator, wherein, based on 100 parts of the epoxy resin, the amount of the curing accelerator used is from 0.5 parts to 2.0 parts.

3. The resin formulation as described in claim 1, wherein the molecular weight of the modified polyether amide is from 5000 g / mol to 30000 g / mol.

4. A thermosetting resin comprising: an epoxy-rich phase comprising an epoxy resin and a thermosetting polyimide resin; and a plurality of island-shaped structures uniformly dispersed in the epoxy-rich phase, wherein each of the island-shaped structures comprises: a core comprising a modified polyether polyimide; and a thermosetting polyimide resin-rich portion covering the core, wherein the thermosetting polyimide resin-rich portion comprises a thermosetting polyimide resin, and the thermosetting polyimide resin comprises bismaleimide (BMI), and wherein the stress intensity factor of the thermosetting resin is from 0.50 MPa∙m½ to 3.00 MPa∙m½.

5. The thermosetting resin as claimed in claim 4, wherein the average particle size of the island-type resins is from 100 nm to 30 μm.

6. A method for manufacturing a thermosetting resin, comprising: performing an addition step on a thermosetting polyimide resin and a modified polyether propyleneimide at a temperature of 90°C to 130°C to obtain a first mixture; The first mixture and epoxy resin are mixed at 90°C to 130°C to obtain a second mixture; and the second mixture is cured using an amine curing agent to obtain the thermosetting resin, wherein, based on 100 mol% of the epoxy resin, the amount of the thermosetting polyetherimide resin used is 60 mol% to 90 mol%, the modified polyetherimide contains nucleophilic functional groups, the nucleophilic functional groups including hydroxyl, thiol, carboxyl and / or amine groups, based on 100 mol% of the epoxy resin used, the amount of the modified polyetherimide used is 5 mol% to 30 mol%, and the ratio of the amine group of the amine curing agent to the epoxy group of the epoxy resin is 40 mol% to 90 mol%.

7. The method for manufacturing the thermosetting resin as described in claim 6 further includes, prior to the addition step, subjecting the thermosetting polyimide resin to a heating step at 150°C to 170°C for 10 to 50 minutes.

8. The method for manufacturing a thermosetting resin as described in claim 6 further includes lowering the temperature of the second mixture to 70°C to 90°C before performing the curing step.

9. A method for manufacturing a thermosetting resin as claimed in claim 6, wherein the curing step comprises a first curing treatment, a second curing treatment and a third curing treatment, wherein the first curing treatment is performed at 130°C to 150°C for 1 hour to 3 hours, the second curing treatment is performed at 160°C to 195°C for 6 hours to 9 hours, and the third curing treatment is performed at 200°C to 230°C for 6 hours to 9 hours.

10. A method for manufacturing a thermosetting resin as claimed in claim 6, wherein the addition step and the mixing step each include a stirring process, and the stirring process is performed at a speed of 300 revolutions per minute (rpm) to 500 rpm.

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