Semiconductor devices and methods of manufacturing semiconductor devices

TWI940496BActive Publication Date: 2026-10-01AMKOR TECH SINGAPORE HLDG PTE LTD
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Patent Information

Application Number
TW110114900
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2020-05-19
Filing Date
2021-04-26
Publication Date
2026-10-01
Estimated Expiration
2041-04-25

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Abstract

In one embodiment, a semiconductor device includes: a main substrate including a first side and a main conductive structure; and a first component module above the first side of the main substrate. The first component module includes a first electronic component and a first module encapsulation contacting a side of the first electronic component. The semiconductor device further includes a second component module above the first side of the main substrate. The second component module includes a second electronic component and a second module encapsulation contacting a side of the second electronic component. The semiconductor device further includes a main encapsulation above the first side of the main substrate and between the first component module and the second component module. Other embodiments and related methods are also disclosed herein.
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Citation Information

Patent Citations

  • 3D chip package with shielded structures

    US20130105950A1

  • Semiconductor package structure and method for manufacturing the same

    US20190244907A1