Apparatus for processing a wafer-shaped article

Abstract

A processing apparatus for a wafer-shaped object includes a support configured to support the wafer-shaped object during a processing operation; wherein: the support includes a support body and a plurality of clamping pin assemblies adapted and configured relative to the support body to clamp the wafer-shaped object, wherein each of the clamping pin assemblies is rotatable relative to the support body between a clamping configuration in which the clamping pin assemblies clamp the wafer-shaped object, and in a non-clamping configuration in which the clamping pin assemblies do not clamp the wafer-shaped object; each of the clamping pin assemblies protrudes from a corresponding aperture in the support body; and a sealing member is disposed between at least one of the clamping pin assemblies and the corresponding aperture, the sealing member being configured to prevent a processing liquid used in the processing operation from seeping into the aperture.

Description

Technical Field

[0001] This invention relates to a processing apparatus for wafer-shaped objects (e.g., semiconductor wafers), and to a clamping pin assembly used in a processing apparatus for wafer-shaped objects. Prior Technology

[0002] Processing equipment for wafer-shaped objects typically includes pins that laterally support the wafer-shaped object from below or around its edges.

[0003] Examples of such devices are described in commonly owned U.S. Patents 4,903,717, 5,513,668, 6,435,200, 8,608,146 and 9,190,210, the entire contents of which are specifically incorporated herein by reference.

[0004] In a known processing apparatus for a wafer-shaped object, such as that described in U.S. Patent No. 9,190,310, the apparatus includes a chuck for receiving and supporting the wafer-shaped object to be processed.

[0005] The chuck includes a chuck body and a plurality of pin assemblies. Each pin assembly is partially (mostly) disposed within a cavity in the chuck body and includes a body, a first gear located at a first end of the body, and an eccentric longitudinal protrusion located at a second end of the body. At least the eccentric longitudinal protrusion protrudes from the chuck body to contact and support the wafer received by the chuck.

[0006] The pin assembly is configured in a circular series surrounding the area of ​​the wafer-shaped object to be placed on the chuck.

[0007] The second gear system is disposed in the chuck body and meshes with each of the first gears of the pin assembly, so that the rotation of the second gear causes the first gear to rotate synchronously, and thus causes the pin assembly to rotate synchronously.

[0008] The second gear train is coupled to the electric motor via the rotor shaft, so that the second gear can be driven to rotate by the electric motor.

[0009] Rotation of the pin assembly causes the eccentric longitudinal protrusion at the second end of the pin assembly to move closer to or further away from the center of the chuck.

[0010] When the wafer-shaped object is positioned on the chuck, the pin assembly is rotated to move the eccentric longitudinal protrusion closer to the center of the chuck, so that the eccentric longitudinal protrusion contacts the outer edge of the wafer-shaped object, thereby clamping the outer edge of the wafer-shaped object and laterally constraining the wafer-shaped object.

[0011] Generally, processing operations performed on wafer-like objects involve treating the wafer-like objects with one or more processing liquids. For example, wet processing of semiconductor wafers may involve using hydrofluoric acid (HF acid) to etch the surface of the semiconductor wafer.

[0012] The main body of a pin assembly is generally made of a single bulk material, making it relatively inert to the corrosive chemicals used in the handling process. For example, the main body of a pin assembly can be made of plastics, such as polytetrafluoroethylene (PTFE), perfluoroalkoxide (PFA), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polystyrene / polyethylstyrene (PS / PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymers of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), or ethylene chlorotrifluoroethylene (ECTFE).

[0013] However, other components of the chuck body may be made of materials more likely to be damaged by the chemicals used in the processing operation, such as metal.

[0014] A pin assembly with a circumferential groove is provided at a location within a corresponding hole, the groove surrounding the body of the pin assembly. Furthermore, a channel is provided in the chuck body to output a flow of gas from the circumferential groove. Specifically, the gas used in the processing operation (e.g., nitrogen) can permeate between the pin assembly and the hole to reach the location of the circumferential groove. This gas can then be output from the circumferential groove and thus from the hole via the channel in the chuck body.

[0015] The flow of this gas can be used to capture the treatment chemicals that have seeped into the holes, and carry the captured treatment chemicals out of the holes through the channels, so that the treatment chemicals do not seep further into the chuck body through the holes. Summary of the Invention

[0016] The inventors of this case have learned that, in certain circumstances, the above-mentioned known configurations may be insufficient to prevent processing chemicals from seeping into the chuck body.

[0017] For example, when the processing operation involves high temperature or long processing cycle, the inventors have found that the processing chemicals may seep into the holes through the circumferential grooves and the nitrogen flow, and thus further into the chuck body.

[0018] For example, in order to drive the pin assembly to rotate via the first gear, if the chuck body contains the second gear, for example, HF acid treatment chemicals may seep into the location of the second gear along the holes and cause corrosion of the second gear (which is usually made of metal).

[0019] This corrosion may shorten the service life of the equipment and may cause performance or reliability problems, such as the adhesion of pin components.

[0020] The present invention aims to limit the seepage of the processing liquid used in the processing operation into the hole, and the pin assembly is partially disposed in the hole.

[0021] This problem is not unique to semiconductor wafer processing; the same problem can occur when processing the surfaces of other materials (such as glass masters and mother panels used in the manufacture of optical discs and LCD display panels), as well as when cleaning the surfaces of the processing chambers used during the processing of the aforementioned substrates.

[0022] Furthermore, this problem is not unique to the specific configuration described above (in which the pin assembly can rotate via the specific configuration of the first and second gears). Rather, the same problem may occur with pin assemblies that can rotate using different rotating mechanisms.

[0023] Therefore, in the most general sense, the present invention relates to a processing apparatus for a wafer-shaped object having a support comprising a plurality of rotatable clamping pin assemblies, wherein the plurality of rotatable clamping pin assemblies protrude from corresponding holes in the support, and wherein a sealing member is disposed between at least one of the clamping pin assemblies and the corresponding hole.

[0024] According to a first embodiment of the present invention, a processing apparatus for a wafer-shaped object is provided. The processing apparatus includes a support configured to support the wafer-shaped object during a processing operation to be performed on it; wherein: The support includes a support body and a plurality of clamping pin assemblies adapted and configured relative to the support body to clamp the wafer-shaped object. Each of the clamping pin assemblies is rotatable relative to the support body between a clamping configuration and a non-clamping configuration. In the clamping configuration, the clamping pin assemblies clamp the wafer-shaped object, while in the non-clamping configuration, the clamping pin assemblies do not clamp the wafer-shaped object. Each of these clamping pin assemblies protrudes from a corresponding hole in the bracket body; and A sealing component is disposed between at least one of the clamping pin assemblies and the corresponding hole, the sealing component being configured to prevent a processing liquid used in the processing operation from seeping into the hole.

[0025] In this invention, the sealing member is disposed between the clamping pin assembly and the orifice, and restricts the seepage of a processing liquid used in the processing operation into the orifice. Therefore, the processing liquid is restricted (e.g., prevented, or substantially prevented) from seeping into the orifice beyond the sealing member.

[0026] Therefore, other components in the support body are protected from contact with the treatment liquid and thus from the effects of undesirable chemical reactions (such as corrosion).

[0027] The first embodiment of the present invention may have any of the following optional features, or any combination thereof (to the extent compatible).

[0028] The wafer-shaped object can be a semiconductor wafer.

[0029] The term "wafer-shaped" can mean that the object has a disk-like shape.

[0030] The processing of the wafer-shaped object may include etching of the wafer-shaped object, such as etching of a semiconductor wafer using HF acid.

[0031] The bracket may include a clamp.

[0032] The chuck can be a rotatable chuck used to rotate the wafer-shaped object supported by the chuck.

[0033] The bracket supporting the wafer-shaped object can mean fixing the wafer-shaped object, clamping the wafer-shaped object, restraining the movement of the wafer-shaped object, limiting the movement of the wafer-shaped object, and / or contacting the wafer-shaped object.

[0034] For example, supporting the wafer-shaped object may include constraints or prevent lateral movement of the wafer-shaped object.

[0035] These clamping pin assemblies can clamp the wafer-shaped object from its sides or edges (i.e., from its peripheral edges) and / or from its underside (i.e., from its main surface). By clamping the wafer-shaped object from its sides or edges, these clamping pin assemblies can restrain or prevent lateral movement of the wafer-shaped object.

[0036] The support can hold the wafer-shaped object in a predetermined orientation during the processing operation. For example, the support can restrict the movement of the wafer-shaped object. Such clamping pin assemblies may alternatively be referred to as clamping pins.

[0037] Such holes in the support body may be referred to as boreholes, pipes, openings, or channels.

[0038] In the most general sense, a clamping pin assembly may refer to any portion (e.g., an extension) that protrudes at least partially from the support body to clamp the wafer-shaped object and is rotatable relative to the support body.

[0039] The support body can have any suitable shape or construction.

[0040] Each of the clamping pin assemblies protruding from a corresponding hole in the bracket body means that at least a portion of the clamping pin assembly is disposed within the hole and at least a portion of the clamping pin assembly is disposed outside the hole, such that the clamping pin assemblies extend beyond the surface of the bracket body.

[0041] The sealing component being positioned between the clamping pin assembly and the hole means that the sealing component is located within the hole and between the outer surface of the clamping pin assembly and the inner surface of the hole.

[0042] Multiple sealing components can be provided, such that each sealing component is disposed between more than one of the clamping pin assemblies and the corresponding hole. For example, a separate sealing component may be disposed between each of the clamping pin assemblies and the corresponding hole. However, it is not necessary to provide a sealing component between each clamping pin assembly and the corresponding hole, although this may be preferred.

[0043] The sealing element is disposed between the clamping pin assembly and the corresponding hole to prevent any part or element of the processing liquid used in the processing operation from seeping into the hole. Generally, the sealing element is an insert that is inserted into the hole.

[0044] The sealing component is typically a separate part from the clamping pin assembly and the hole.

[0045] In practice, the sealing component will fill some or all of the space between the clamping pin assembly and the hole.

[0046] In practice, the sealing component will come into contact with both the clamping pin assembly and the hole.

[0047] Limiting the seepage of the treatment liquid into the hole can mean reducing the amount of seepage or preventing any seepage at all.

[0048] The rotatability of the clamping pin assemblies relative to the bracket body means that each of the clamping pin assemblies can rotate about its respective longitudinal axis.

[0049] The clamping pin assemblies can rotate independently relative to the bracket body. Alternatively, the clamping pin assemblies can rotate synchronously relative to the bracket body.

[0050] The bracket body may include a rotation mechanism for driving rotation of the clamping pin assemblies relative to the bracket body.

[0051] The sealing component may surround (or be around) the clamping pin assembly. Therefore, the sealing component can effectively limit the infiltration of the processing liquid.

[0052] Generally, one body of the clamping pin assembly has a circular cross-section.

[0053] The sealing component can be ring-shaped or have an annular shape.

[0054] The sealing component can be an O-ring.

[0055] The sealing element may be placed in a groove or otherwise constrained to limit its movement along the hole.

[0056] For example, the clamping pin assembly may have a circumferential groove around its outer surface, and the sealing member may be disposed within the circumferential groove.

[0057] Alternatively, or furthermore, a circumferential groove may be provided within the inner surface of the hole, and the sealing component may be placed within the circumferential groove.

[0058] Preferably, the sealing component comprises a material that is chemically inert to the processing chemicals used in the processing operation. For example, the sealing component may comprise a perfluoroelastomer polymer. Such a material is substantially chemically inert to HF acids. However, other materials may be used alternatively.

[0059] Preferably, the sealing component comprises a resiliently deformable material, so that the sealing component provides a good seal between the clamping pin assembly and the hole.

[0060] Preferably, the sealing component comprises an elastic material.

[0061] For example, the sealing component may contain a specific material, CHEMRAZ® 551, or a similar material.

[0062] The sealing component can be configured to rotate relative to the hole together with the clamping pin assembly. Therefore, the sealing component may not rotate relative to the clamping pin assembly.

[0063] The sealing component may include an outer layer that reduces the adhesion between the sealing component and the hole, or reduces the adhesion between the sealing component and the clamping pin assembly.

[0064] In other words, the sealing component may include an inner core formed of a first material and an outer layer formed of a second material, wherein the second material provides reduced adhesion between the sealing component and the hole or between the sealing component and the clamping pin assembly, compared to the adhesion provided by the first material.

[0065] In other words, the sealing component may include an inner sealing body and an outer layer that reduces the adhesion between the sealing component and the hole, or reduces the adhesion between the sealing component and the clamping pin assembly.

[0066] The material of the outer layer (the second material) may be a harder material than the material of the inner sealing body (the first material).

[0067] The outer layer can be made of a more wear-resistant material than the inner sealing body.

[0068] The outer layer may contain a fluoropolymer-based material that is different from the material of the inner sealing body.

[0069] The outer layer may contain a PTFE-based material.

[0070] The outer layer may be a coating layer, which is applied to the inner sealing body.

[0071] The outer layer can be made of ENDURO™ LF10 coating or similar materials.

[0072] One body of the clamping pin assembly may be made of plastic, such as polytetrafluoroethylene (PTFE), perfluoroalkoxide (PFA), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polystyrene / polyethylstyrene (PS / PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymer of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), or ethylene chlorotrifluoroethylene (ECTFE).

[0073] Each of the clamping pin assemblies may have a first gear located inside the bracket body, and the bracket body may include a drive mechanism for driving the rotation of the first gear to rotate the clamping pin assembly.

[0074] The first gear may be located at the first end of the clamping pin assembly.

[0075] The first gear may be integral with one of the main bodies of the clamping pin assembly and may be made of the same material as the main body of the clamping pin assembly.

[0076] The drive mechanism may include an electric motor coupled to the first gears to drive the rotation of the first gears individually or synchronously.

[0077] The drive mechanism may include components that can be negatively affected by the treatment chemicals, such as metal components that can be corroded by the treatment chemicals.

[0078] The drive mechanism may include a second gear meshing with each of the first gears, such that rotation of the second gear causes synchronous rotation of each of the first gears.

[0079] The second gear can be made of metal.

[0080] Each of the clamping pin assemblies may include a circumferential groove, and the support body may include a corresponding conduit for outputting a flow of gas from the circumferential groove.

[0081] The gas is a gas used during the processing operation.

[0082] The gas can be nitrogen.

[0083] In the case where the clamping pin assembly includes a first circumferential groove for accommodating the sealing member, the circumferential groove from which the gas flow exits is a second circumferential groove, which is separate from the first circumferential groove.

[0084] The second circumferential groove is configured to be farther from the first end of the clamping pin assembly than the first circumferential groove.

[0085] Therefore, the combination of the circumferential groove from which the gas flow exits and the sealing member that restricts the infiltration of the processing liquid can effectively prevent the processing liquid from seeping into the hole. However, it is not always necessary to provide the second circumferential groove.

[0086] Each of these clamping pin assemblies may include: an entity; The first gear; and A clamping portion located at the second end of the main body is used to clamp the wafer-shaped object.

[0087] The clamping portion may include a longitudinal protrusion originating from a second end of the body, the longitudinal protrusion being spaced apart from one of the longitudinal axes of the clamping pin assembly.

[0088] In other words, the longitudinal protrusion can be an eccentric protrusion.

[0089] The second end of the body is the end that protrudes from the hole.

[0090] The first gear can be located at the first end of the body.

[0091] The surface of the second end of the body, excluding the longitudinal protrusion, may be a support surface for contacting the bottom side of the wafer-shaped object in order to support the wafer-shaped object from below.

[0092] The supporting surface can be substantially flat.

[0093] Each of the clamping pin assemblies may include a reinforcing member disposed within a recess formed in the clamping pin assembly.

[0094] For example, the recess may extend from the first end of the clamping pin assembly to the second end of the clamping pin assembly, or to a position between the first end and the second end.

[0095] In practice, the reinforcing component is an insert that is inserted into the recess.

[0096] The reinforcing component may have greater strength than the material of the body of the clamping pin assembly.

[0097] The reinforcing component may have a greater tensile strength than the material of the body of the clamping pin assembly.

[0098] The reinforcing component may have a higher Young's modulus than the material of the body of the clamping pin assembly.

[0099] The inclusion of a reinforcing member can be advantageous because cutting one or more circumferential grooves into the clamping pin assembly may reduce the strength or Young's modulus of the clamping pin assembly. This can be offset by including the reinforcing member.

[0100] The reinforcing member is advantageously present in the clamping pin assembly and located at a longitudinal position on the clamping pin assembly, where a circumferential groove is provided. For example, when the sealing member is positioned within a circumferential groove on the clamping pin assembly, the reinforcing member is advantageously present at this longitudinal position on the clamping pin assembly, where the circumferential groove for the sealing member is provided. This is advantageous because the strength or Young's modulus of the clamping pin assembly may be minimum at the location where the circumferential groove is formed.

[0101] For example, the reinforcing component can be made of metallic material.

[0102] The support can be a chuck surrounded by a processing chamber used for processing semiconductor wafers. For example, the processing chamber can be used for wet processing of a single semiconductor wafer.

[0103] The device may further include a nozzle for dispensing a processing liquid onto the surface of the wafer supported by the support. Generally, the processing liquid is dispensed onto the surface of the wafer opposite to the surface of the wafer facing the support.

[0104] The device may further include a heater for heating the surface of the wafer-shaped object. Generally, the heater is configured to heat the surface of the wafer-shaped object facing the support.

[0105] The clamping pin assemblies can be configured in a circular series surrounding an area where a wafer-shaped object is to be disposed on the support, and the clamping pin assemblies can be configured such that the edges contact the wafer-shaped object, thereby restricting its lateral movement away from a predetermined position.

[0106] According to a second embodiment of the present invention, a clamping pin assembly is provided for a wafer-shaped object processing apparatus, the clamping pin assembly comprising: an entity; A gear; A first circumferential groove, surrounding the body, for mounting a sealing member around the body; and A second circumferential groove surrounds the body.

[0107] The clamping pin assembly may be configured for or adapted to the device according to the first embodiment of the invention, and may optionally have any of the features of the clamping pin assembly in the first embodiment of the invention described above.

[0108] The gear can be formed at the first end of the body.

[0109] The second circumferential groove may be farther from the first end of the body than the first circumferential groove.

[0110] According to a third embodiment of the present invention, a clamping pin assembly is provided for a wafer-shaped object processing apparatus, the clamping pin assembly comprising: an entity; A gear; A first circumferential groove surrounds the body; and A sealing component is placed in the first circumferential groove.

[0111] The gear can be formed at the first end of the body.

[0112] The clamping pin assembly may be configured for or adapted to the device according to the first embodiment of the invention, and may optionally have any of the features of the clamping pin assembly in the first embodiment of the invention described above.

[0113] The second embodiment of the present invention and / or the third embodiment of the present invention may have any of the following optional features, or any combination thereof (to the extent compatible).

[0114] The clamping pin assembly may further include a reinforcing member disposed within a recess formed in the body.

[0115] The reinforcing component may extend from the first end of the body to a location located in or beyond the first circumferential groove.

[0116] The clamping pin assembly may include a protrusion that extends longitudinally from a second end of the body, the protrusion being spaced apart from one of the longitudinal axes of the clamping pin assembly. Simple Explanation of the Diagram

[0117] Embodiments of the invention will now be described by way of example only, with reference to the accompanying drawings, in which: According to one embodiment of the present invention, FIG1 is a cross-sectional view of a chuck for a semiconductor wafer processing apparatus; Figure 2 is a three-dimensional view of the clamp in Figure 1; According to one embodiment of the present invention, FIG3A is a cross-sectional view of the pin assembly for the chucks of FIG1 and 2; Figure 3B is a top view of the pin assembly in Figure 3A; and Figure 3C is a perspective view of the pin assembly of Figure 3A. Implementation

[0118] According to one embodiment of the present invention, FIG1 is a partial cross-sectional view of a chuck 1 for a semiconductor wafer processing device.

[0119] In use, the chuck 1 can be used to surround or partially surround a processing chamber for single-wafer wet processing of semiconductor wafers. The processing chamber can have any suitable construction.

[0120] As shown in Figure 1, the chuck 1 includes a chuck body 3, which includes a generally cup-shaped base 5, a spindle receiving portion 7 surrounded by the cup-shaped base 5, and an upper portion 9.

[0121] When the mandrel is inserted into the recess 11 formed in the mandrel receiving portion 7, the chuck 1 is mounted on the mandrel. The recess 11 is shaped to operably engage with the mandrel by having a shape corresponding to the shape of the mandrel. In this embodiment, the recess 11 has a truncated conical shape, which corresponds to a complementary truncated conical mandrel.

[0122] Of course, in other embodiments, the chuck may be constructed differently than those described above. For example, the chuck may replace the terrain as a single piece, or be formed from fewer or more components than those illustrated in Figure 1.

[0123] Therefore, by using a mandrel, the chuck 1 can rotate relative to the processing chamber. Therefore, the chuck 1 can be referred to as a 'rotary chuck'.

[0124] For example, screws can be used to fix the upper part 9 to the base 5.

[0125] The upper part 9 has an upper surface 13 for supporting the semiconductor wafer. In particular, the upper surface 13 is used to contact the lower surface of the semiconductor wafer so as to support the semiconductor wafer from below.

[0126] As shown in Figure 1, the upper part 9 of the chuck body 3 surrounds the gas distribution chamber 15. The gas distribution chamber 15 is adjacent to the top end of the recess 11 in the mandrel receiving part 7 so that when a properly shaped mandrel is received in the recess 11, the top end of the mandrel extends into the gas distribution chamber 15 in the upper part 9.

[0127] The mandrel is preferably hollow and includes a plurality of radial guide perforations at its distal end. Thus, pressurized gas (e.g., nitrogen) delivered through the hollow mandrel can be guided into the gas distribution chamber 15 through these perforations.

[0128] The upper portion 9 of the chuck body 3 further includes a plurality of annularly arranged holes 17 extending from the gas distribution chamber 15 to the upper surface 13 of the upper portion 9. Therefore, gas can be supplied through the hollow mandrel, the gas distribution chamber 15, and the holes 17, allowing the wafer (if present) to float on the gas cushion during processing. This gas can also be used to help hold the wafer in place within the chuck 1, which operates according to the Bernoulli principle.

[0129] However, supplying gas to the upper surface 13 is not necessary and can therefore be omitted in other embodiments. For example, the chuck does not necessarily include the gas distribution chamber 15 and the orifice 17, and in other embodiments, the gas distribution chamber 15 and the orifice 17 can be omitted.

[0130] As shown in Figures 1 and 2, the chuck 1 further includes a plurality of pin assemblies 19. As shown in Figure 2, the plurality of pin assemblies 19 are arranged in a circular series surrounding the area on the upper surface 13 of the upper part 9 where the wafer-shaped object is to be disposed.

[0131] As shown in Figure 1, each pin assembly 19 is partially (mostly) disposed within a corresponding hole 21 in the upper part 9 of the chuck body 3. Specifically, each pin assembly 19 is accommodated within a corresponding hole 21 in the upper part 9 of the chuck body 3, and a portion of the pin assembly 19 protrudes from the hole 21 and extends beyond the upper surface 13 of the upper part 9.

[0132] In this embodiment, the hole 21 is a cylindrical hole drilled into the upper part 9 of the chuck body 3.

[0133] The construction of the pin assembly 19 in one embodiment of the present invention is illustrated in Figures 3A to 3C.

[0134] As shown in Figure 3A, each pin assembly 19 includes a main body 22, a gear 23, and a longitudinal protrusion 25. The main body is substantially cylindrical in shape. The gear is disposed at the first end of the main body 22, and the longitudinal protrusion is disposed at the second end of the main body 22.

[0135] The gear 23 includes a plurality of teeth 27 that extend radially outward from the first end of the body portion 22.

[0136] In this embodiment, the gear 23 is integrally formed with the main body 22. In other words, the gear 23 is made of the same material as the main body 22 and is formed as a single piece with the main body 22. However, in other embodiments, the gear 23 may be formed separately from the main body 22 and then attached to the main body 22, and may be formed of a different material than the main body 22.

[0137] The longitudinal protrusion 25 is integrally formed with the main body 22. In other words, the longitudinal protrusion 25 is formed as a single piece with the main body 22 from the same material. However, in other embodiments, the longitudinal protrusion 25 may be formed separately from the main body 22 and then attached to the main body 22, and may be formed from a different material than the main body 22.

[0138] The main body 22 of the pin assembly 19 (and optionally the longitudinal protrusion and / or gear) may be made of plastic, such as polytetrafluoroethylene (PTFE), perfluoroalkoxide (PFA), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polystyrene / polyethylstyrene (PS / PES), ethylene tetrafluoroethylene (ETFE), polyvinylidene fluoride (PVDF), homopolymers of chlorotrifluoroethylene (PCTFE), fluorinated ethylene propylene (FEP), or ethylene chlorotrifluoroethylene (ECTFE).

[0139] In this embodiment, the longitudinal protrusion 25 is cylindrical in shape. However, this is not necessary.

[0140] The longitudinal protrusion 25 extends longitudinally from the top surface 29 of the body 22. Apart from the longitudinal protrusion 25, the top surface 29 is substantially flat.

[0141] The longitudinal protrusion 25 is narrower than the main body 22 (having a smaller diameter) and is eccentrically positioned relative to the main body 22. Therefore, the longitudinal protrusion 25 is spaced apart from the longitudinal axis of the main body 22. In other words, the longitudinal protrusion 25 is an eccentric protrusion.

[0142] As shown in Figure 3A, the recess 31 is formed in the bottom surface of the main body 22. For example, the recess 31 may be a drill hole drilled into the bottom surface of the main body 22, or it may be formed in the bottom surface of the main body 22.

[0143] The insert 33 is disposed within the recess 31. For example, the insert 33 can be inserted into the recess 31 from the bottom surface of the body 22.

[0144] The insert 33 has higher strength and / or Young's modulus than the main body 22. Therefore, the insert 33 serves as a reinforcing component that increases the strength and / or rigidity of the main body 22.

[0145] Insert 33 may be made of metal, such as titanium.

[0146] As shown in Figures 1 and 2, each of the plurality of pin assemblies 19 is accommodated in a corresponding hole 21 in the upper part 9 of the chuck body 3, such that the top surface 29 of the body 22 of the pin assembly 19 is flush or substantially flush with the surrounding surface of the upper part 9, such that only the longitudinal protrusion 25 protrudes from the hole 21 and is higher than the upper surface 13 of the upper part 9.

[0147] Therefore, the top surface 29 of the main body of the pin assembly 19 can contact the bottom side of the semiconductor wafer housed on the upper surface 13 of the upper part 9.

[0148] As shown in Figure 1, the chuck body 3 includes a rotating mechanism for driving the rotation of the gear 23 of the pin assembly 19, so that the pin assembly 19 rotates.

[0149] In particular, the chuck body 3 includes a second gear 35, which is rotatably mounted in the chuck body 3 via a bearing 37. Therefore, the second gear 35 can rotate relative to the chuck body 3 within the chuck body 3.

[0150] The second gear 35 includes a gear rim 39, which is coupled (engaged) with the gear 23 of each pin assembly 19. Therefore, rotation of the second gear 35 causes simultaneous rotation of the gear 23 of each pin assembly 19, and thus causes simultaneous rotation of each pin assembly 19.

[0151] A drive device, such as an electric motor, is coupled to the second gear 35 to drive the rotation of the second gear 35.

[0152] As can be understood from Figure 1, for example, depending on the rotational position of the longitudinal protrusion 25, the rotation of the pin assembly 19 will cause the longitudinal protrusion 25 to move closer to or further away from the center of the upper surface 13 of the upper part 9 of the chuck body 3.

[0153] The pin assembly 19 is configured such that its longitudinal protrusions 25 move synchronously when the pin assembly 19 is rotated by the second gear 35. In other words, when the pin assembly 19 rotates, the distance from each longitudinal protrusion 25 to the center of the upper surface 13 is the same for all pin assemblies 19.

[0154] Between the clamping configuration and the non-clamping configuration, the pin assembly 19 can rotate relative to the chuck body 3. In the clamping configuration, the pin assembly 19 can clamp the semiconductor wafer disposed on the upper surface 13, while in the non-clamping configuration, the pin assembly 19 does not clamp the semiconductor wafer.

[0155] In particular, in the clamping configuration, the pin assembly 19 is rotated such that the longitudinal protrusion 25 contacts the outer edge of the semiconductor wafer and applies pressure to the semiconductor wafer. The circular configuration of the pin assembly 19 means that the longitudinal protrusion 25 thus clamps and secures the semiconductor wafer to prevent lateral movement of the semiconductor wafer. In the non-clamping configuration, the pin assembly 19 is rotated such that the longitudinal protrusion 25 does not contact the outer edge of the semiconductor wafer, so that the semiconductor wafer is not laterally restricted.

[0156] The device typically includes nozzles for dispensing a processing liquid onto the surface of a semiconductor wafer. Generally, the processing liquid is dispensed onto the surface of the semiconductor wafer opposite to the surface facing the chuck body 3. For example, the processing liquid could be HF acid used to etch the surface of the semiconductor wafer.

[0157] As the chuck 1 is rotated during the processing operation, the processing liquid dispensed onto the surface of the semiconductor wafer will move radially outward toward the edge of the semiconductor wafer and across the surface of the semiconductor wafer. Some of the processing liquid will thus come into contact with the pin assembly 19 configured around the periphery of the semiconductor wafer.

[0158] Because the fit between the pin assembly 19 and the hole 21 is not an interference fit, allowing the pin assembly 19 to rotate relative to the hole 21, some processing fluid will seep into the hole 21 and between the outer surface of the pin assembly 19 and the inner surface of the hole 21.

[0159] The second gear 35 is made of metal, which may corrode if it comes into contact with the processing liquid (e.g., HF). Therefore, it is desirable to prevent the processing liquid from reaching the second gear 35.

[0160] To achieve this goal, as shown in Figure 3A, the first circumferential groove 41 is provided around the body 22 of the pin assembly 19.

[0161] The O-ring 43 is placed in the first circumferential groove 41 surrounding the main body 22.

[0162] The width or thickness of the O-ring 43 is greater than the depth of the first circumferential groove 41, such that a portion of the O-ring 43 extends radially outward from the first circumferential groove 41 beyond the outer surface of the body 22 adjacent to the first circumferential groove 41.

[0163] The O-ring 43 in this embodiment comprises a perfluoroelastomer material coated with a PTFE-based coating. More specifically, the O-ring 43 in this embodiment comprises an O-ring formed of CHEMRAZ® 551 coated with an ENDURO™ LF10 coating.

[0164] More generally, the suitable O-ring 43 comprises an elastomeric material coated with a material that provides a lower adhesive force to the inner surface of the hole 21 compared to the adhesive force provided by the elastomeric material. Therefore, the elastomeric material provides a suitable seal between the pin assembly 19 and the hole 21, while the coating minimizes friction between the O-ring 43 and the hole 21, allowing the pin assembly 19 to rotate controllably within the hole 21 without adhesion.

[0165] The O-ring 43 is fitted around the body 22 within the first circumferential groove 41 so that the O-ring 43 clamps the body 22. Therefore, the O-ring 43 rotates together with the body 22.

[0166] As illustrated in Figure 1, when the pin assembly 19 is disposed in the corresponding hole 21, the O-ring 43 contacts the inner surface of the hole 21 and is pressed against the inner surface of the hole 21.

[0167] Therefore, the O-ring 43 provides a seal between the pin assembly 19 and the hole 21, extending completely around the pin assembly 19, thereby preventing the processing fluid from penetrating into the hole 21 beyond the position of the O-ring 43. Thus, the processing fluid is prevented from reaching the second gear 35.

[0168] As described above, the elastomeric material in the O-ring 43 ensures a good seal between the inner surfaces of the O-ring 43, the body 22, and the hole 21, thus preventing or substantially preventing the processing liquid from seeping into the hole 21 and beyond the position of the O-ring 43.

[0169] However, the O-ring 43, made of a purely elastic material, can provide high adhesion between the O-ring 43 and the inner surface of the hole 21, making it difficult to controllably rotate the pin assembly 19. Therefore, the O-ring 43 preferably comprises a coating material that minimizes friction between the O-ring 43 and the hole 21, allowing the pin assembly 19 to rotate controllably within the hole 21 without adhesion.

[0170] The presence of the first circumferential groove 41 may reduce the strength and / or Young's modulus of the body 22 of the pin assembly 19. Therefore, as shown in FIG3A, it is advantageous for the insert 33 to extend at least to the location of the first circumferential groove 41, and preferably to extend beyond the location of the first circumferential groove 41. The insert 33 can thus strengthen the body 22 at the location where the body 22 is weakened by the first circumferential groove 41.

[0171] As shown in Figures 3A and 3C, a second circumferential groove 45 is also provided around the body 22 of the pin assembly 19. The second circumferential groove 45 is farther from the first end of the body 22 than the first circumferential groove 41. In other words, the second circumferential groove 45 is closer to the longitudinal protrusion 25 than the first circumferential groove 41.

[0172] As shown in Figure 1, the upper part 9 of the chuck body 3 includes a channel 47, which is configured such that when the pin assembly 19 is disposed in the hole 21, the channel 47 is in communication (fluid communication, i.e. gas communication) with the second circumferential groove 45 of the pin assembly 19.

[0173] More specifically, channel 47 extends from hole 21 to the outside of chuck body 3.

[0174] As described above, gas is supplied from the gas distribution chamber 15 and the plurality of holes 17 to the space located below the semiconductor wafer. Therefore, the gas pressure above the upper part 9 of the chuck body 3 can be greater than the gas pressure around the sides of the chuck body 3. This pressure difference can cause the flow of gas from above the upper part 9 of the chuck body 3, into the hole 21, to the second circumferential groove 45 of the pin assembly 19, and to the outside of the chuck body 3 through the channel 47.

[0175] Some of the processing fluid that seeps into the hole 21 can be collected in the second circumferential groove 45, and then carried away from the hole 21 by the flow of gas and through the channel 47.

[0176] Therefore, the infiltration of the processing liquid into the hole 21 can also be restricted by the gas flow through the second circumferential groove 45 of the pin assembly 19.

[0177] In an alternative embodiment, the O-ring 43 may instead be disposed within a circumferential groove formed on the inner surface of the hole and may not rotate relative to the hole. Therefore, the pin assembly 19 may rotate relative to the O-ring 43 within the hole.

[0178] The features disclosed in the foregoing description, or in the following claims, or in the accompanying drawings, expressed in their particular form or in a manner for performing the disclosed function or for obtaining the disclosed result, may, as appropriate, be used alone or in any combination of such features to implement the invention in its various forms.

[0179] Although the present invention has been described in conjunction with the above exemplary embodiments, many equivalent modifications and variations will become apparent to those skilled in the art when this disclosure is made. Accordingly, the above exemplary embodiments of the present invention are considered illustrative rather than restrictive. Various changes may be made to the embodiments without departing from the spirit and scope of the invention.

[0180] To avoid any doubt, any theoretical explanations provided herein are offered for the purpose of improving the reader's understanding. The inventor of this case does not wish to be bound by any of these theoretical explanations.

[0181] Any section headings used herein are for organizational purposes only and are not intended to limit the subject matter of the application.

[0182] Throughout this specification (including the following requests), unless the context otherwise requires, the terms “comprising” and “including”, and variations thereof (e.g., “containing,” “containing,” and “including”), will be understood to imply coverage of the whole or steps, or the whole or groups of steps, but not to exclude any other whole or steps, or the whole or groups of steps.

[0183] It should be noted that, as used in the specification and the accompanying claims, the singular forms “a,” “one,” and “the” include plural indicators unless the context otherwise specifies. Here, a range can be expressed as “about” a specific value and / or to “about” another specific value. When expressing such a range, another embodiment includes from a specific value and / or to other specific values. Similarly, when a numerical value is expressed as an approximation by using the antecedent “about,” it will be understood that the specific value forms another embodiment. The term “about” in relation to numerical values ​​is optional and means, for example, + / - 10%.

[0184] 1: Clamp 3: Chuck body 5: Base 7: Mandrel housing 9: Upper part 11: concave part 13: Upper surface 15: Gas distribution chamber 17: Hole 19: Pin Components 21: Hole 22: Main Body (Main Body Section) 23: Gear 25: Longitudinal protrusion 27: Gear teeth 29: Top surface 31: concave part 33: Insert 35: Second Gear 37: Bearing 39: Gear edge 41: First week towards the trench 43: O-ring 45: Second week towards the trench 47: Channel

Claims

1. A processing apparatus for a wafer-shaped object, the processing apparatus comprising a support configured to support the wafer-shaped object during a processing operation to be performed on the wafer-shaped object; wherein: The support includes a support body and a plurality of clamping pin assemblies adapted and configured relative to the support body to clamp the wafer-shaped object. Each of the clamping pin assemblies is rotatable relative to the support body between a clamping configuration and a non-clamping configuration, in which the clamping pin assemblies clamp the wafer-shaped object, and in the non-clamping configuration, the clamping pin assemblies do not clamp the wafer-shaped object. Each of the clamping pin assemblies protrudes from a corresponding aperture in the support body. A sealing member is disposed between at least one of the clamping pin assemblies and the corresponding aperture. The sealing member is configured to restrict the infiltration of a processing liquid used in the processing operation into the aperture. The sealing member includes an inner core and an outer layer, the outer layer reducing the adhesion between the sealing member and the aperture, or the adhesion between the sealing member and the clamping pin assembly.

2. The processing apparatus for a wafer-shaped object as described in claim 1, wherein the sealing member surrounds the clamping pin assembly.

3. The processing apparatus for a wafer-shaped object as described in claim 2, wherein the sealing component includes an O-ring.

4. A processing apparatus for a wafer-shaped object as described in claim 2 or 3, wherein the clamping pin assembly and / or the surrounding hole has a circumferential groove, and the sealing member is disposed in the circumferential groove.

5. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein the sealing component comprises a perfluoroelastomer polymer.

6. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein the sealing member is configured to rotate with the clamping pin assembly relative to the hole.

7. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein the outer layer is a fluoropolymer-based outer layer, the outer layer being a material different from that of the inner core.

8. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein each of the clamping pin assemblies has a first gear located inside the support body, and the support body includes a drive mechanism for driving rotation of the first gear to rotate the clamping pin assembly.

9. The wafer-shaped object processing apparatus as claimed in claim 8, wherein the drive mechanism includes a second gear meshing with each of the first gears such that rotation of the second gear causes synchronous rotation of each of the first gears.

10. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein each of the clamping pin assemblies includes a circumferential groove, and wherein the support body includes a corresponding conduit for outputting a flow of gas from the circumferential groove.

11. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein each of the clamping pin assemblies comprises: a body; a first gear; and a clamping portion located at a second end of one of the bodies for clamping the wafer-shaped object.

12. The wafer-shaped object processing apparatus as claimed in claim 11, wherein the clamping portion includes a longitudinal protrusion originating from a second end of one of the bodies, the longitudinal protrusion being spaced apart from a longitudinal axis of one of the clamping pin assemblies.

13. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein each of the clamping pin assemblies includes a reinforcing member disposed within a recess formed in the clamping pin assembly.

14. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein the support is a chuck surrounded by a processing chamber for processing semiconductor wafers.

15. A processing apparatus for a wafer-shaped object as described in any one of claims 1 to 3, wherein the clamping pin assemblies are configured in a circular series surrounding an area on which one of the wafer-shaped objects is to be disposed on the support, and the clamping pin assemblies are configured such that the edges contact the wafer-shaped object, thereby restricting its lateral movement away from a predetermined position.

16. A clamping pin assembly for a wafer-shaped object processing apparatus, the clamping pin assembly comprising: a body; a gear; a first circumferential groove formed in the body and extending around the body for disposing a sealing member around the body; and a second circumferential groove formed in the body and extending around the body.

17. A clamping pin assembly for a wafer-shaped object processing apparatus, the clamping pin assembly comprising: a body; a gear; a first circumferential groove surrounding the body; and a sealing member disposed within the first circumferential groove, wherein the sealing member comprises an inner core and an outer layer, the outer layer reducing the adhesive force between the sealing member and a hole, or the adhesive force between the sealing member and the clamping pin assembly, when the clamping pin assembly is received in a hole.

18. The clamping pin assembly as claimed in claim 16 or claim 17, wherein the clamping pin assembly further includes a reinforcing member disposed within a recess formed in the body.

19. The clamping pin assembly as claimed in claim 18, wherein the reinforcing member extends from a first end of the body to a location located in or beyond the first circumferential groove.

20. The clamping pin assembly as claimed in claim 16 or claim 17, wherein the clamping pin assembly includes a protrusion projecting longitudinally from a second end of the body, the protrusion being spaced apart from a longitudinal axis of the clamping pin assembly.

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