Chip heating socket

Abstract

This invention provides a wafer heating device, including a base and a temperature control device. The base has a wafer placement area for placing wafers, and the temperature control device includes a heating element capable of aligning with the wafer placement area and an operating member for pressing down the heating element to approach the wafer. One of the base or the temperature control device is provided with a sliding groove, and the other is provided with a guide rail adapted to the sliding groove. The temperature control device is aligned with the base via the guide rail and the sliding groove to preheat the wafer for subsequent temperature testing. Compared with the prior art, this application simplifies the heating process by setting a mating sliding mechanism.

Description

Technical Field

[0001] The invention relates to a wafer heating device. Prior Art

[0002] For related technology, please refer to patent number TWI387752B, which discloses a wafer heating device comprising a base with a wafer placement area and a temperature control device mounted above the base. The temperature control device and the base are connected by a snap-fit ​​mechanism. When wafer testing requires wafer replacement, the snap-fit ​​mechanism must be opened, the temperature control device separated from the base, and then reattached to the base after the wafer is replaced, making this an inconvenient operation.

[0003] Therefore, it is necessary to provide a wafer heating device to overcome the above-mentioned defects. Summary of the Invention

[0004] The present invention is achieved through the following technical solutions: a wafer heating device, comprising a base and a temperature control device, wherein the base has a wafer placement area for placing a wafer, the temperature control device comprises a heating element aligned with the wafer placement area and an operating member for pressing the heating element down to approach the wafer, one of the base and the temperature control device is provided with a slide groove, and the other is provided with a guide rail adapted to the slide groove, the temperature control device slides into the base to heat the wafer.

[0005] Compared with the prior art, the present invention has the following beneficial effects: by using matching slide grooves and guide rails between the temperature control device and the base, the temperature control device can be quickly and conveniently aligned and staggered relative to the base to replace the wafer. Simple diagram description

[0006] Figure 1 is a perspective view of a wafer heating device of the present invention, wherein the temperature control device is not aligned with the base;

[0007] Figure 2 is a perspective view of the base and the wafer in Figure 1;

[0008] Figure 3 is a perspective view of the temperature control device in Figure 1 from another angle;

[0009] Figure 4 is an exploded perspective view of the temperature control device in Figure 3;

[0010] Figure 5 is an exploded perspective view of another angle of Figure 4;

[0011] Figure 6 is a partial exploded view of the temperature control device in Figure 3;

[0012] Figure 7 is a perspective view of the heating element and the heat sink;

[0013] Figure 8 is a perspective view of the right side of Figure 1, showing the relationship between the operating member and the roller;

[0014] Figure 9 is a partial enlarged view of Figure 8; and

[0015] FIG10 is a perspective view of the operating member in FIG8 in a pressed-down state. Implementation Method

[0016] Referring to Figure 1 , the present invention discloses a wafer heating device 100 that heats a wafer 30, causing it to experience a temperature increase, and then powers it on to test its continued operation. The heating device 100 comprises a base 10 and a temperature control device 20. The wafer 30 to be tested is placed on the base 10. The temperature control device 20 slides onto the base 10 and begins heating the wafer 30, thereby increasing its temperature. The sliding movement of the temperature control device 20 allows for quick and convenient alignment and deflection relative to the base 10, allowing for wafer 30 replacement. A detailed structural description is provided below.

[0017] As shown in Figure 2, the base 10 has a wafer placement area 11 for placing a wafer 30 approximately in the center, with slide grooves 12 at each end. In this embodiment, a mounting rib 13 is provided at each end of the base 10. The mounting rib 13 extends in the front-to-back direction, and the slide groove 12 extends through the front and back ends of the mounting rib 13. A set of electrical connectors 14 is also installed between the mounting rib 13 and the wafer placement area 11.

[0018] As shown in Figures 3 to 6, the temperature control device 20 includes a heating assembly 21 that can be aligned with the wafer placement area 11 and an operating member 22 for pressing the heating assembly 21 downward to bring it closer to the wafer 30. The temperature control device 20 is equipped with a guide rail 23 that adapts to the slide 12. The interaction between the slide 12 and the guide rail 23 allows the temperature control device 20 to align with the base 10, thereby aligning the heating assembly 21 with the wafer placement area 11 for heating. During testing, the temperature control device 20 is slid through the slide 12 and the guide rail 23 to the top of the wafer 30 for alignment. After alignment is achieved, the operating member 22 is pressed downward to bring the heating assembly 21 into contact with the wafer 30, and heating is then performed. In other embodiments, the mounting ribs can be equipped with mounting rails according to different requirements. Specifically, the rails span across the mounting ribs, and the slide is provided on the temperature control device. In other words, one of the base and the temperature control device has a slide, while the other has a guide rail that adapts to the slide.

[0019] Referring to Figures 4 to 6 , the temperature control device 20 includes a pair of support members 24 and a mounting plate 25. A guide rail 23 is provided on the bottom surface of each support member 24. The operating member 22 is pivotally mounted between the two support members 24, forming a space between the two support members for accommodating the mounting plate 25. The operating member 22 includes a horizontal bar 221 and two vertical bars 222, with the ends of the vertical bars 222 mounted on the support members 24. The ends of the operating member 22 are received in wire grooves 241 provided in the support members 24 and secured by a rotating shaft 223. When an external force is applied to the horizontal bar 221, the vertical bars 222 can rotate about the rotating shaft 223. The operating member 22 is a metal plate structure with an eccentric wheel 224 at its end.

[0020] The heating element 21 is fixed to the mounting plate 25. In this embodiment, a heat sink 26 is also fixed above the mounting plate 25. In the specific embodiment, as shown in Figure 7, the heating element 21 is first fixed below the heat sink 26 and then fixed to the mounting plate 25. In this way, the heating element 21 is exposed in the middle of the mounting plate 25.

[0021] The mounting plate 25 has grooves 251 at both ends. Rollers 281 are mounted and rotatable within these grooves. Rollers 281 can also be replaced with linear sliding elements, such as rollers, to maintain linear sliding motion. After the heating element 21 and heat sink 26 are secured to the mounting plate 25, it is placed in the space between the two supports 24. Multiple elastic members 27 are positioned between the mounting plate 25 and the supports 24, allowing the mounting plate 25 to move up and down relative to the supports 24. In this embodiment, the elastic members 27 are four springs. In this embodiment, rollers 282 are positioned at each end of the mounting plate 25 to assist the elastic members 27 in driving the mounting plate 25 up and down relative to the supports 24. The multiple locations of the rollers 282 reduce linear interference, making multiple steps, such as opening and closing the wafer heating device 100 and measuring wafers 30 of varying thicknesses, smoother and easier to operate.

[0022] As shown in Figures 8 to 10 , the eccentric wheel 224 of the operating member 22 has different radii. When not pressed down (as shown in Figure 8 ), the smaller radius portion of the eccentric wheel 224 abuts against the roller 281. The mounting plate 25, supported upward by the elastic member 27, does not press down on the heating element. When the operating member 22 is pressed down (as shown in Figure 10 ), the eccentric wheel 224 rotates, causing the larger radius portion of the eccentric wheel 224 to press against the roller 281. Because the eccentric wheel 224 is fixed to the support member 24 by the roller 281 and cannot move up or down, the downward pressure of the eccentric wheel 224 causes the mounting plate 25 to move downward. This downward movement of the mounting plate 25 simultaneously drives the heating element 21 downward, pressing against the wafer 30. This downward pressure of the eccentric wheel 224 on the roller 281 drives the temperature control device 20 downward, causing the heating element 21 to abut against the wafer 30. Because the eccentric wheel 224 of the operating member 22 always abuts against the roller 281 during the downward pressing process, the operation of the operating member 22 is smoother and more convenient. Referring to Figures 9 and 10, the eccentric wheel 224 is provided with a straight segment 2211. During downward pressing, the straight segment 2211 presses against the roller 28, fixing the position of the eccentric wheel 224 relative to the roller 281, keeping the heating assembly 21 in close contact with the wafer 31 and preventing the temperature control device 20 from being ejected due to the rounded corners of the eccentric wheel.

[0023] The mounting plate 25 is provided with another set of electrical connectors 14a on either side of the heating element 21. When the temperature control device 20 is aligned with the base 10, the operating member 22 is rotated. At this time, the mounting plate 25 drives the connector 14a located thereon to move downward and electrically connect with the other electrical connector 14b. At this time, the heating element 21 is electrically conductive and begins to heat.

[0024] Because the thickness and size of wafers 30 produced by different manufacturers vary, the opening and closing size of the wafer heating device 100 needs to be adjusted according to the different wafers 30 during testing. To facilitate adjustment of the opening and closing size, as shown in Figures 2 and 3, the slide 12 is provided with a limit post 121 at each end of its extension direction, and the guide rail 23 is provided with a row of positioning holes 231 and a positioning post 232 at each end of its extension direction. This facilitates installation without distinguishing between front and back, thereby improving efficiency. During specific adjustments, only one set of positioning holes 231 is selected. First, one positioning post 232 is installed in the positioning hole 231 to cooperate with the limit post 121 to form a stop. Then, according to the size of the wafer 30, the other positioning post 232 is installed in the predetermined positioning hole 231. Finally, the end without the positioning post 232 is pushed into the slide 12 with the limit post 121 installed on one side, and the limit post 121 on the other side is installed. The mutual interference between the limiting post 121 and the positioning post 232 provides a reliable stop, preventing derailment due to excessive opening and closing. For disassembly, the temperature control device 20 can be disassembled by first separating it from the base 10 to expose the limiting post 121. The temperature control device 20 can then be removed by sliding it out, facilitating replacement, repair, and other subsequent maintenance. Similarly, the positioning post and positioning hole combination of the guide rail or chute is interchangeable with the limiting post.

[0025] 1 , in order to more accurately press the heating assembly 21 against the wafer 30 , the mounting rib 13 is provided with a stopper 131 protruding toward the other mounting rib 13 near both ends thereof. When the temperature control device 20 slides through the guide rails 23 and the slide grooves 12 but is not aligned with the base 10, the mounting plate 25 is located above one of the limit portions 131. At this time, if the operating member 22 is rotated, the limit portion 15 will abut against the mounting plate 25, making it impossible for the operating member 22 to be pressed down; when the temperature control device 20 continues to slide through the guide rails 23 and the slide grooves 12 to a position aligned with the base 10, that is, the position shown in Figure 7, the mounting plate 25 slides to between the limit portions 131 at both ends of the mounting rib 13, so that the limit portions 131 no longer abut against the mounting plate 25, and the operating member 22 is pressed down, and the mounting plate 25 can move downward, causing the two sets of electrical connectors 14 and 14a to be aligned with each other and electrically connected. The interaction between the limit portion 131 and the mounting plate 25 can ensure that the heating component 21 moves to the target position. In addition, since there are no other limit settings on the slide 12 and the guide rail 23, when the test is terminated, the operating member 22 can be guaranteed to drive the temperature control device 20 away from the wafer 30 smoothly to the greatest extent, which can greatly reduce the risk of burns.

[0026] The above descriptions are only some of the embodiments of the present invention, not all of the embodiments. Any equivalent changes made to the technical solution of the present invention by ordinary technicians in this field after reading the specification of the present invention are covered by the patent scope of the present invention.

[0027] 100: Chip heating device 10: Base 11: Chip placement area 12: chute 121: Limit column 13: Install the ribs 131: Limiting part 14, 14a: Electrical connector 20: Temperature control device 21: Heating component 22: Operating parts 221: horizontal bar 222: Vertical bar 2211: Straight line segment 223: Shaft 224: Eccentric wheel 23: Guide rail 231: Positioning hole 232: Positioning column 24: Support 241: Wire Trough 25: Mounting plate 251: Groove 26: Heat dissipation device 27: Elastic parts 281, 282: Roller 30: Chip

Claims

1. A wafer heating device, comprising: The base has a chip placement area for placing the chip; A temperature control device includes a heating element aligned with the wafer placement area and an operating member for pressing down the heating element to approach the wafer. One of the base and the temperature control device is provided with a groove, and the other is provided with a guide rail adapted to the groove. The temperature control device slides into the base to heat the wafer. The operating member is provided with an eccentric wheel, and the temperature control device is provided with a linear slider. When the operating member presses down, its eccentric wheel rotates and presses down the linear slider, thereby causing the temperature control device to move downwards so that the heating element comes into contact with the wafer.

2. The wafer heating device as described in claim 1, wherein the operating member is a metal plate structure, the eccentric wheel has a straight line segment, and when the operating member is in the pressed-down state, the straight line segment presses against the linear sliding member.

3. The wafer heating device as described in claim 1, wherein the temperature control device includes a pair of support members and a mounting plate, the heating component is installed in the middle of the mounting plate, the linear sliding member is installed in the grooves provided on both sides of the mounting plate and is rotatable in the grooves; the guide rail or slide is provided on the bottom surface of each support member, the operating member is pivotally installed between the two support members, and the mounting plate is placed between the two support members and can move up and down elastically relative to the support members by means of the elastic member provided thereon.

4. The wafer heating device as described in claim 3, wherein a set of linear sliding members are installed on each of the two end faces of the mounting plate to assist the elastic member in driving the mounting plate to move up and down relative to the support member.

5. The wafer heating apparatus as described in claim 4, wherein the linear slider is a roller or roller structure.

6. The wafer heating device as described in claim 3, wherein a heat dissipation device is fixed above the mounting plate, and the heating element is first fixed below the heat dissipation device and then fixed together to the mounting plate.

7. The wafer heating device as claimed in claim 3, wherein a mounting rib is provided at each end of the base, and the slide extends along the mounting rib.

8. The wafer heating device as described in claim 7, wherein the slide groove passes through both ends of the mounting rib, and the bottom surface of the slide groove is provided with a limiting post for cooperating with the positioning post in the positioning hole provided on the bottom surface of the guide rail; the mounting rib is provided with a limiting part protruding towards the other mounting rib near its two ends.

9. The wafer heating apparatus as claimed in claim 7, wherein an electrical connector is further installed between the mounting plate and the mounting rib and the wafer placement area.

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