Curable resin composition for electronic materials

Abstract

This invention provides a curable resin composition for electronic materials that can be easily applied to electronic materials and can impart flame retardancy or improve the flame retardancy of electronic materials. The curable resin composition for electronic materials of this invention contains curable resin, feldspar, and phosphorus compounds, thus allowing for low viscosity and excellent coatability. It can be accurately and easily applied to the desired areas of electronic materials without compromising their functionality. The cured product of the curable resin composition for electronic materials exhibits excellent flame retardancy.

Description

[Technical Field]

[0001] This invention relates to a curable resin composition for electronic materials. [Previous Technology]

[0002] In the past, in order to suppress the spread of fire, flame retardancy has been promoted in automotive components, home appliances, electronic materials, sporting goods, building materials, etc.

[0003] In recent years, the field of electronic equipment has made significant progress, especially in the miniaturization, lightweighting, and high-density of electronic devices. Electronic materials, represented by printed circuit boards and light-emitting diodes (LEDs), increasingly require thinner, multilayered, and more precise designs. These electronic materials also need to be flame-retardant.

[0004] Patent Document 1 discloses a flame-retardant resin composition comprising: (A) a polymeric compound, (B) ammonium polyphosphate, (C) aluminum hydroxide and / or magnesium hydroxide, (D) a polyol, (E) a compound having a melamine backbone, and (F) hollow ceramic beads and / or expanded graphite. [Prior Art Documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2021-14513 [Summary of the Invention]

[0006] [The problem the invention aims to solve]

[0007] However, the flame-retardant resin composition of Patent Document 1 has the problem of high viscosity, making it difficult to apply to electronic materials.

[0008] This invention provides a curable resin composition for electronic materials that has excellent coatability, can be easily applied to electronic materials, and can impart flame retardancy to or improve the flame retardancy of electronic materials. [Technical Means for Solving the Problem]

[0009] The curable resin composition for electronic materials of the present invention is characterized in that it contains curable resin, feldspar and phosphorus compounds.

[0010] [Curing Resin] The curing resin can be a one-component curing resin or a two-component curing resin. A one-component curing resin contains a polymer that cures by introducing a cross-linking structure through moisture, light irradiation, or heat. A two-component curing resin contains a polymer that cures by introducing a cross-linking structure through mixing a main agent and a curing agent.

[0011] [One-component curing resin] Examples of one-component curing resins include polymers with hydrolyzable silicone groups, hydrolyzable crosslinking polysiloxane polymers, polymers with hydrolyzable isocyanate groups, and photocrosslinking polymers. Preferred examples include polymers with hydrolyzable silicone groups.

[0012] Regarding polymers containing hydrolyzable silicone groups, in the presence of water, the hydrolyzable silicone groups hydrolyze to generate silanol groups (≡SiOH). Subsequently, the silanol groups undergo dehydration condensation to form a cross-linked structure. Regarding hydrolyzable cross-linked polysiloxane polymers and polymers containing hydrolyzable isocyanate groups, in the presence of water, the hydrolyzable isocyanate groups generate carbon dioxide, and simultaneously generate urea bonds (-NHCONH-) to form a cross-linked structure.

[0013] A hydrolyzable silicon group refers to a group with 1 to 3 hydrolyzable groups bonded to a silicon atom. There are no particular limitations on the hydrolyzable groups in a hydrolyzable silicon group; examples include: hydrogen atom, halogen atom, alkoxy group, acetoxy group, ketoxymate group, amino group, acetaminophen group, acetaminophen group, aminooxy group, mercapto group, alkenoxy group, oxime group, etc.

[0014] Among them, alkoxysilyl is preferred as a hydrolyzable silicone group in terms of the stability of the hydrolysis reaction. Examples of alkoxysilyl groups include: trimethoxysilyl, triethoxysilyl, triisopropoxysilyl, and triphenoxysilyl, etc.; dialkoxysilyl, propyldimethoxysilyl, and methyldiethoxysilyl, etc.; and monoalkoxysilyl, such as dimethylmethoxysilyl and dimethylethoxysilyl.

[0015] Hydrolyzable isocyanate group refers to an isocyanate group that can form a urea bond (-NHCONH-) through hydrolysis.

[0016] [Polymers with hydrolyzable silicon groups] There is no particular limitation on polymers with hydrolyzable silicon groups. Examples include: polyalkylene oxides with hydrolyzable silicon groups, acrylic polymers with hydrolyzable silicon groups, urethane polymers with hydrolyzable silicon groups, and polyolefin polymers with hydrolyzable silicon groups. Preferably, the polymer containing hydrolyzable silicon groups is a polyalkylene oxide. Furthermore, polymers with hydrolyzable silicon groups can be used alone or in combination of two or more.

[0017] The content of the polymer with hydrolyzable silicone groups in the curable resin is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0018] [Polyepoxides with hydrolyzable silicone groups] Regarding polyepoxides with hydrolyzable silicone groups, the hydrolyzable silicone group is preferably alkoxysilyl, more preferably dialkoxysilyl, more preferably dimethoxysilyl, and even more preferably propyldimethoxysilyl.

[0019] A polyepoxide having hydrolyzable silicone groups preferably has an average of 1 to 4 hydrolyzable silicone groups per molecule. If the number of hydrolyzable silicone groups in a polyepoxide having hydrolyzable silicone groups is within the above range, the flame retardancy of the cured product of the curable resin composition for electronic materials is improved. A polyepoxide having hydrolyzable silicone groups preferably has a hydrolyzable silicone group at at least one of the two ends of its main chain.

[0020] Furthermore, the average number of hydrolyzable silicone groups per molecule in a polyepoxide with hydrolyzable silicone groups can be calculated based on the concentration of hydrolyzable silicone groups in the polyepoxide determined by 1H-NMR and the number average molecular weight of the polyepoxide determined by GPC.

[0021] As a polyepoxide constituting a hydrolyzable silicon-based polyepoxide, preferably, polymers whose main chain contains repeating units represented by the general formula: -(RO)m- (where R represents an alkyl group having 1 to 14 carbon atoms, and m is the number of repeating units and is a positive integer). The main chain backbone of the polyepoxide may contain only one repeating unit, or it may contain two or more repeating units.

[0022] In this invention, alkyl refers to a divalent group formed by removing two hydrogen atoms bonded to two different carbon atoms in an aliphatic saturated hydrocarbon, including both straight-chain and branched groups.

[0023] As an enyl group, examples include: enyl ethyl, enylpropyl [-CH(CH 3)-CH 2-], trimethylene [-CH 2-CH 2-CH 2-], enyl butyl, enylpentyl [-(CH 2) 5-], enyl hexyl, etc.

[0024] Examples of polyoxyethylene backbones include: polyethylene oxide, polypropylene oxide, polybutane, polytetramethylene oxide, polyethylene oxide-propylene oxide copolymers, and polypropylene oxide-butane copolymers. Polypropylene oxide is preferred. Polypropylene oxide can reduce the viscosity of curable resin compositions for electronic materials, thereby improving coatability and enabling precise application of the curable resin compositions for electronic materials to narrow application areas.

[0025] The number average molecular weight of the polyepoxide having hydrolyzable silicon groups is preferably 3,000 or more, more preferably 10,000 or more. The number average molecular weight of the polyepoxide having hydrolyzable silicon groups is preferably 50,000 or less, more preferably 40,000 or less, and more preferably 30,000 or less. If the number average molecular weight of the polyepoxide is 3,000 or more, the polyepoxide is not easily thermally decomposed into low molecular weight polymers, and therefore the cured product of the curable resin composition for electronic materials has excellent flame retardancy. If the number average molecular weight of the polyepoxide is 50,000 or less, the coatability of the curable resin composition for electronic materials is improved, and it can be precisely coated onto the desired areas of small electronic materials.

[0026] Furthermore, in this invention, the number average molecular weight of the polyepoxide having hydrolyzable silicone groups refers to the value converted from polystyrene by GPC (gel permeation chromatography).

[0027] The number average molecular weight of hydrolyzable silicon-based polyepoxides can be determined, for example, by means of the following measuring apparatus and measuring conditions. Measuring apparatus: Trade name "HLC-8121GPC / HT" manufactured by TOSOH Corporation Measuring conditions: Column: TSKgelGMHHR-H(20)HT×3 tubes TSKguardcolumn-HHR(30)HT×1 tube Mobile phase: o-DCB 1.0 mL / min Sample concentration: 1 mg / mL Detector: Blythe refractometer Standard material: Polystyrene (manufactured by TOSOH Corporation, molecular weight: 500~8420000) Dissolution conditions: 145℃ SEC temperature: 145℃

[0028] Commercially available polyepoxides with hydrolyzable silicone groups are permitted. Examples of hydrolyzable silicone polyepoxides include: "MS Polymer S-203", "MS Polymer S-303", "MS Polymer S-303H", "SILYL Polymer SAT-200", "SILYL Polymer SAT-350", and "SILYL Polymer SAT-400" manufactured by Kaneka Corporation. Examples of hydrolyzable silicone polyepoxides include: "EXCESTAR ESS-3620", "EXCESTAR ESS-2420", "EXCESTAR ESS2410", and "EXCESTAR ESS3430" manufactured by Asahi Glass Co., Ltd.

[0029] A polyoxyethylene with a main chain of polyoxypropylene and (methoxymethyl)dimethoxysilane at the end of the polyoxypropylene is commercially sold by Kaneka under the trade name "HS-2".

[0030] A polyoxyethylene with a main chain of polyoxypropylene and isopropyl dimethoxymethylsilyl groups at the ends of the polyoxypropylene is commercially sold by Kaneka under the trade name "SAX720".

[0031] [Acrylic polymer with hydrolyzable silicone group] The hydrolyzable silicone group contained in the acrylic polymer with hydrolyzable silicone group is preferably alkoxy silicone group, more preferably trialkoxy silicone group, and even more preferably trimethoxy silicone group, in terms of the stability of the hydrolysis reaction.

[0032] Regarding acrylic polymers containing hydrolyzable silicone groups, the average number of hydrolyzable silicone groups per molecule is preferably 1 or more, more preferably 2 or more. Regarding acrylic polymers containing hydrolyzable silicone groups, the average number of hydrolyzable silicone groups per molecule is preferably 4 or less, more preferably 2.5 or less. If the number of hydrolyzable silicone groups is 1 or more, the flame retardancy of the cured product of the curable resin composition for electronic materials is improved. If the number of hydrolyzable silicone groups is 4 or less, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability. The curable resin composition for electronic materials can be precisely applied to narrow coating areas, and when applied to the coating area, the curable resin composition for electronic materials flows smoothly at the coating area, exhibiting excellent leveling properties. The acrylic polymer having hydrolyzable silicone groups preferably has hydrolyzable silicone groups at at least one of the two ends of its main chain.

[0033] Acrylic polymers having hydrolyzable silicone groups can also be used in combination with acrylic polymers not having hydrolyzable silicone groups. In this case, the number of hydrolyzable silicone groups per molecule of both polymers is preferably 0.3 or more, more preferably 0.5 or more. If the number of hydrolyzable silicone groups is 0.3 or more, the curability of the curable resin composition for electronic materials is improved. On the other hand, the number of hydrolyzable silicone groups per molecule of both polymers is preferably 2.0 or less, more preferably 1.8 or less. If the number of hydrolyzable silicone groups is 2.0 or less, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability. The curable resin composition for electronic materials can be precisely applied to narrow coating areas, and when the curable resin composition for electronic materials is applied to the coating area, it flows smoothly at the coating area, exhibiting excellent leveling properties.

[0034] There is no particular limitation on the method of introducing hydrolyzable silicone groups into acrylic polymers. For example, a method of introducing unsaturated groups into a copolymer of monomers that constitute the main chain backbone and then silicifying it by the action of hydrosilanes with hydrolyzable silicone groups can be listed.

[0035] Furthermore, the average number of hydrolyzable silicone groups per molecule in the acrylic polymer with hydrolyzable silicone groups is calculated based on the concentration of hydrolyzable silicone groups in the acrylic polymer with hydrolyzable silicone groups determined by 1H-NMR and the number average molecular weight of the acrylic polymer with hydrolyzable silicone groups determined by GPC.

[0036] The main chain backbone of the acrylic polymer having hydrolyzable silicone groups is preferably a copolymer containing monomers of methyl methacrylate and butyl methacrylate, more preferably a copolymer containing monomers of methyl methacrylate and butyl acrylate, and even more preferably a copolymer containing monomers of methyl methacrylate and n-butyl acrylate. By using an acrylic polymer with the above-mentioned copolymer as the main chain backbone and having hydrolyzable silicone groups, the flame retardancy of the cured product of the curable resin composition for electronic materials is improved. Furthermore, (methyl)acrylate refers to methacrylate and / or acrylate.

[0037] Regarding the acrylic polymer with hydrolyzable silicone groups, the content of methyl methacrylate is preferably 3% by mass or more, and more preferably 5% by mass or more. Regarding the acrylic polymer with hydrolyzable silicone groups, the content of methyl methacrylate is preferably 70% by mass or less, and more preferably 50% by mass or less. By having a methyl methacrylate content of 3% by mass or more, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability. This allows for precise and accurate application of the curable resin composition for electronic materials to narrow application areas, and when applied to the application area, the curable resin composition for electronic materials flows smoothly and exhibits excellent leveling properties. By using methyl methacrylate (MMA) content of 70% or less, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability and enabling precise application of the curable resin composition for electronic materials to narrow application areas.

[0038] Regarding the acrylic polymer with hydrolyzable silicone groups, the content of butyl methacrylate is preferably 30-97% by mass, more preferably 50-95% by mass. By having the content of butyl methacrylate at 30% by mass or more, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability and enabling the curable resin composition for electronic materials to be precisely applied to narrow coating areas.

[0039] Regarding acrylic polymers with hydrolyzable silicone groups, the monomers used in the polymer constituting the main chain backbone may include methyl acrylate, methyl methacrylate, butyl acrylate, and butyl methacrylate, and may further include other monomers. Other monomers include, for example: styrene, indene, α-methylstyrene, p-methylstyrene, p-chlorostyrene, p-chloromethylstyrene, p-methoxystyrene, p-tert-butoxystyrene, divinylbenzene, and other styrene derivatives; vinyl acetate, vinyl propionate, vinyl butyrate, vinyl hexanoate, vinyl benzoate, vinyl cinnamate, and other compounds containing vinyl groups; maleic anhydride, N-vinylpyrrolidone, N-vinylline, methacrylonitrile, acrylonitrile, acrylonitrile, acrylamide, methacrylamide, N-cyclohexylcis-butene diimide, N-phenylcis-butene diimide, N-laurylcis-butene diimide, N-benzylcis-butene diimide, n-propyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, tert-butyl vinyl ether, tert-pentyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, dodecyl vinyl ether, octadecyl vinyl ether Compounds containing ethylene oxide, such as 2-chloroethyl vinyl ether, ethylene glycol butyl vinyl ether, triethylene glycol methyl vinyl ether, butyl benzoate (4-ethyleneoxy) ether, ethylene glycol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, tetraethylene glycol divinyl ether, 1,4-butanediol-divinyl ether, 1,6-hexanediol-divinyl ether, cyclohexane-1,4-diethanol-divinyl ether, di(4-ethyleneoxy)butyl isophthalate, di(4-ethyleneoxy)butyl glutarate, di(4-ethyleneoxy)butyl succinate, trimethylolpropane trivinyl ether, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, 6-hydroxyhexyl vinyl ether, cyclohexane-1,4-diethanol monovinyl ether, diethylene glycol monovinyl ether, 3-aminopropyl vinyl ether, 2-(N,N-diethylamino)ethyl vinyl ether, amine ester vinyl ether, polyester vinyl ether, etc. These monomers can be used alone or in combination of two or more.

[0040] There is no particular limitation on the polymerization method of acrylic polymers with hydrolyzable silicon groups. Known methods can be used, such as free radical polymerization, anionic polymerization, cationic polymerization, UV free radical polymerization, living anionic polymerization, living cationic polymerization, living free radical polymerization, and other polymerization methods.

[0041] The weight average molecular weight of the acrylic polymer with hydrolyzable silicone groups is preferably 1,000 to 50,000, more preferably 2,000 to 30,000, and even more preferably 3,000 to 15,000. By using an acrylic polymer with hydrolyzable silicone groups having a weight average molecular weight within the above range, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving coatability. This allows for precise and accurate application of the curable resin composition for electronic materials to narrow application areas, and when applied to the application area, the curable resin composition for electronic materials flows smoothly and exhibits excellent leveling properties.

[0042] [Amino ester polymers with hydrolyzable silicone groups] Amino ester polymers refer to polymers having a backbone formed by repeating amino ester bonds (-NHCOO-). Amino ester polymers with hydrolyzable silicone groups have a plurality of hydrolyzable silicone groups in the backbone. Preferably, the amino ester polymers with hydrolyzable silicone groups have hydrolyzable silicone groups at both ends of the backbone.

[0043] [Polyolefin polymers with hydrolyzable silicone groups] Examples of polyolefin polymers include polyethylene polymers and polypropylene polymers. The polyolefin polymer with hydrolyzable silicone groups has a plurality of hydrolyzable silicone groups in its main chain. Preferably, the polyolefin polymer with hydrolyzable silicone groups has hydrolyzable silicone groups at both ends of its main chain.

[0044] [Hydrolytically Crosslinked Polysiloxane Polymers] Polysiloxane polymers refer to polymers having molecular chains (main chains) formed by repeating siloxane bonds (-Si-O-). The main chain of polysiloxane polymers is preferably linear. Hydrolytically crosslinked polysiloxane polymers have hydrolyzable groups bonded to a portion of the silicon atoms constituting one part of the main chain.

[0045] If the curing resin contains a hydrolyzed crosslinked polysiloxane polymer, the cured product of the curing resin composition for electronic materials can expand rapidly in the early stage of combustion, thereby reducing the burning caused by the combustion of electronic materials and giving electronic materials excellent flame retardancy.

[0046] The hydrolyzable group is not particularly limited, and examples include: hydrogen atom, halogen atom, alkoxy group, acetoxy group, ketooxime ester group, amino group, acetamino group, acid acetamino group, aminooxy group, mercapto group, alkenoxy group, etc., with alkoxy group being preferred.

[0047] As an alkoxy group, examples include: methoxy, ethoxy, propoxy, butoxy, etc., with methoxy and ethoxy being preferred.

[0048] Regarding hydrolytically crosslinkable polysiloxane polymers, a crosslinked structure is formed by the condensation reaction of hydrolytic groups in the presence of moisture or a crosslinking agent, and, if necessary, a catalyst. When the hydrolytically crosslinkable polysiloxane polymer has an alkoxy group as a hydrolytic group, a portion of the alkoxy group is hydrolyzed to generate a hydroxyl group, which then undergoes a dealcoholization condensation reaction with the alkoxy group to form a crosslinked structure.

[0049] The content of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymer is preferably 5% by mass or more, more preferably 10% by mass or more. The content of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymer is preferably 50% by mass or less, more preferably 40% by mass or less, more preferably 35% by mass or less. If the content of hydrolyzable groups is 5% by mass or more, the hardness of the combustion residue of the cured product of the curable resin composition for electronic materials is increased, and it is stably present in the coating area of ​​the curable resin composition for electronic materials, thereby imparting excellent flame retardancy to the electronic materials. If the content of hydrolyzable groups is 50% by mass or less, the expansion property of the cured product of the curable resin composition for electronic materials is improved, thereby improving the flame retardancy of the curable resin composition for electronic materials. Furthermore, the content of hydrolyzable groups in hydrolyzable crosslinked polysiloxane polymers can be calculated based on the concentration of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymers determined by 1H-NMR and the number average molecular weight of the hydrolyzable crosslinked polysiloxane polymers determined by GPC.

[0050] The content of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymer is preferably 5 mol% or more, more preferably 10 mol% or more. The content of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymer is preferably 50 mol% or less, more preferably 40 mol% or less, more preferably 35 mol% or less. If the content of hydrolyzable groups is 5 mol% or more, the hardness of the combustion residue of the cured product of the curable resin composition for electronic materials is increased, and it is stably present in the coating area of ​​the curable resin composition for electronic materials in the electronic materials, thereby imparting excellent flame retardancy to the electronic materials. If the content of hydrolyzable groups is 50 mol% or less, the expansion property of the cured product of the curable resin composition for electronic materials is improved, thereby improving the flame retardancy of the curable resin composition for electronic materials. Furthermore, the content of hydrolyzable groups in hydrolyzable crosslinked polysiloxane polymers can be calculated based on the concentration of hydrolyzable groups in the hydrolyzable crosslinked polysiloxane polymers determined by 1H-NMR and the number average molecular weight of the hydrolyzable crosslinked polysiloxane polymers determined by GPC.

[0051] Preferably, methyl or phenyl groups are bonded to a portion of the silicon atoms in the hydrolytically crosslinked polysiloxane polymer. The hydrolytically crosslinked polysiloxane polymer preferably has silicon atoms bonded with methyl or phenyl groups. If methyl or phenyl groups are bonded to a portion of the silicon atoms in the hydrolytically crosslinked polysiloxane polymer, the flame retardancy of the curable resin composition for electronic materials can be improved.

[0052] Preferably, methyl and phenyl groups are bonded to a portion of the silicon atoms in the hydrolytic polysiloxane polymer. That is, the hydrolytic polysiloxane polymer preferably has silicon atoms bonded with methyl and phenyl groups. If methyl and phenyl groups are bonded to a portion of the silicon atoms in the hydrolytic crosslinked polysiloxane polymer, the flame retardancy of the curable resin composition for electronic materials can be improved.

[0053] Regarding the hydrolyzable polysiloxane polymer, the phenyl content is preferably 10 mol% or more, more preferably 20 mol% or more, more preferably 25 mol% or more, and more preferably 30 mol% or more. Regarding the hydrolyzable polysiloxane polymer, the phenyl content is preferably 80 mol% or less, more preferably 70 mol% or less, more preferably 60 mol% or less, more preferably 50 mol% or less, more preferably 40 mol% or less, and more preferably 35 mol% or less. If the phenyl content is 10 mol% or more, the flame retardancy of the curable resin composition for electronic materials can be improved. If the phenyl content is 80 mol% or less, the viscosity of the curable resin composition for electronic materials is reduced, and the coatability of the curable resin composition for electronic materials is improved.

[0054] The phenyl content (mol%) is expressed by the following formula: Phenyl content (mol%) = 100 × number of phenyl atoms / number of silicon atoms. Furthermore, "number of phenyl atoms" refers to the total number of phenyl atoms bonded to the silicon atoms constituting the straight-chain molecular chain (main chain) (polysiloxane) formed by repeating siloxane bonds (-Si-O-). "Number of silicon atoms" refers to the total number of remaining bonds after removing the bonds used to form the main chain from the four bonds possessed by the silicon atoms constituting the main chain. Regarding the silicon atoms at both ends of the main chain, the bonds used to form the main chain refer only to the bonds bonded to oxygen.

[0055] Regarding hydrolyzable polysiloxane polymers, the methyl content is preferably 10 mol% or more, more preferably 20 mol% or more, more preferably 30 mol% or more, more preferably 40 mol% or more, more preferably 50 mol% or more, and more preferably 55 mol% or more. Regarding hydrolyzable polysiloxane polymers, the methyl content is preferably 98 mol% or less, more preferably 96 mol% or less, more preferably 95 mol% or less, more preferably 90 mol% or less, more preferably 80 mol% or less, and more preferably 70 mol% or less. If the methyl content is 10 mol% or more, the viscosity of the curable resin composition for electronic materials decreases, and the coatability of the curable resin composition for electronic materials improves. If the methyl content is 98 mol% or less, the flame retardancy of the curable resin composition for electronic materials improves.

[0056] The methyl group content (mol%) is expressed by the following formula: Methyl group content (mol%) = 100 × number of methyl groups / number of bonds of silicon atoms. Furthermore, "number of methyl groups" refers to the total number of methyl groups bonded to silicon atoms constituting the straight-chain molecular chain (main chain) (polysiloxane) formed by repeating siloxane bonds (-Si-O-). "Number of bonds of silicon atoms" refers to the total number of remaining bonds after removing the bonds used to form the main chain from the four bonds possessed by the silicon atoms constituting the main chain. Regarding the silicon atoms at both ends of the main chain, the bonds used to form the main chain refer only to the bonds bonded to oxygen.

[0057] Regarding hydrolyzable polysiloxane polymers, the phenyl and methyl contents refer to values ​​measured according to the following procedures. The concentrations of methyl and phenyl groups in hydrolyzable crosslinked polysiloxane polymers are determined by NMR and calculated based on the signal intensity ratio obtained from Si-NMR. For example, the determination can be performed using the following apparatus and conditions: Apparatus: AVANCE 400 (manufactured by Bruker Biospin) Probe: Prodigy (BBO) Rotation speed: 20 Hz Measurement pulse: Single pulse Solvent: Deuterium chloroform Concentration: Approximately 5 wt / vol% of 29Si Temperature: 24.85℃ (298 K) Number of scans: 360 Chemical shift reference: TMS 0.0 ppm

[0058] Regarding the hydrolyzable polysiloxane polymer, the total content of phenyl and methyl groups is preferably 50 mol% or more, more preferably 60 mol% or more, and more preferably 70 mol% or more. Regarding the hydrolyzable polysiloxane polymer, the total content of phenyl and methyl groups is preferably 99 mol% or less, more preferably 96 mol% or less, and more preferably 95 mol% or less. If the total content of phenyl and methyl groups is 50 mol% or more, the flame retardancy of the curable resin composition for electronic materials can be improved. If the total content of phenyl and methyl groups is 99 mol% or less, the curing reaction of the curable resin composition for electronic materials proceeds smoothly, and therefore the obtained cured product has excellent hardness.

[0059] The viscosity of the hydrolyzed crosslinked polysiloxane polymer at 25°C is preferably 5 Pa·s or more, more preferably 10 Pa·s or more, and more preferably 13 Pa·s or more. The viscosity of the hydrolyzed crosslinked polysiloxane polymer at 25°C is preferably 1000 Pa·s or less, and more preferably 500 Pa·s or less. If the viscosity at 25°C is 5 Pa·s or more, the viscosity of the cured product of the curable resin composition for electronic materials is increased, and the curable resin composition for electronic materials does not separate during the curing process, maintaining a uniformly mixed state. As a result, the flame retardancy of the cured product of the curable resin composition for electronic materials is improved. If the viscosity at 25°C is 1000 Pa·s or less, the coatability of the curable resin composition for electronic materials is improved. Furthermore, the viscosity of hydrolyzed crosslinked polysiloxane polymers at 25°C refers to the value measured using a type B viscometer at 20°C and 60 rpm, according to JIS Z8803.

[0060] The content of hydrolyzed crosslinked polysiloxane polymer in the curing resin is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0061] [Polymers with Hydrolyzable Isocyanate Groups] Examples of polymers with hydrolyzable isocyanate groups include amine ester polymers. An amine ester polymer refers to a polymer having a main chain formed by repeating amine ester bonds (-NHCOO-). An amine ester polymer with hydrolyzable isocyanate groups has a plurality of hydrolyzable isocyanate groups in its main chain. Preferably, the amine ester polymer has hydrolyzable isocyanate groups at both ends of its main chain. Amino ester polymers include polyether-based amine ester polymers made from polyether polyols, polyester-based amine ester polymers made from polyester polyols, and either of these are also possible.

[0062] The content of the polymer having hydrolyzable isocyanate groups in the curable resin is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0063] [Photocrosslinkable polymers] Photocrosslinkable polymers have photocrosslinkable groups in their molecules. When exposed to light such as ultraviolet light, chemical bonds are formed between the molecules, forming a crosslinked structure and hardening.

[0064] As a photocrosslinking group, it is sufficient to form a chemical bond through light irradiation. There are no particular limitations on the photocrosslinking group; examples include: thiol group, glycidyl group, oxetanyl group, vinyl group, (meth)acrylic acid group, benzophenone group, benzoyl group, 9-oxosulfuronyl group, etc., with benzophenone group, benzoyl group, and 9-oxosulfuronyl group being more preferred, and benzophenone group being even more preferred. Furthermore, (meth)acrylic acid group refers to methacrylic acid group or acrylonitrile group.

[0065] The main chain structure of photocrosslinkable polymers is not particularly limited, and examples include: polyolefin polymers, acrylic polymers, epoxy polymers, cyanoacrylate polymers, etc. As a method for introducing photocrosslinkable groups into the main chain, examples include methods for polymerizing monomer compositions containing monomers with photocrosslinkable groups.

[0066] Monomers containing photocrosslinking groups are not particularly limited, and examples include: glycidyl methacrylate, 4-hydroxybutyl acrylate glycidyl ether, 4-(meth)propenyloxybenzophenone, 4-[2-((meth)propenyloxy)ethoxy]benzophenone, 4-(meth)propenyloxy-4'-methoxybenzophenone, 4-(meth)propenyloxyethoxy-4'-methoxybenzophenone, 4-(meth)propenyloxy-4'-bromobenzophenone, 4-(meth)propenyloxyethoxy-4'-bromobenzophenone, etc., with 4-(meth)propenyloxybenzophenone and 4-[2-((meth)propenyloxy)ethoxy]benzophenone being preferred. Monomers (D) containing ultraviolet crosslinking groups can be used alone or in combination of two or more. Furthermore, (meth)acryloxy refers to methacryloxy or acryloxy.

[0067] The content of photocrosslinking polymer in the curing resin is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0068] [Two-component curing resin] There are no particular limitations on two-component curing resins. Examples include isocyanate polymers and epoxypropyl polymers.

[0069] Isocyanate polymers are two-component curable resins composed of a polyisocyanate-containing main agent and a polyol-containing curing agent. By mixing the main agent and the curing agent, the polyisocyanate reacts with the polyol to form amine bonds, thereby crosslinking and curing.

[0070] Examples of polyisocyanates include: aromatic aliphatic diisocyanates, aliphatic diisocyanates, and alicyclic diisocyanates. Examples of aromatic aliphatic diisocyanates include: diphenylmethane diisocyanate, 1,3-phenylenedimethyl diisocyanate, 1,4-phenylenedimethyl diisocyanate, 1,3-bis(1-isocyanate-1-methylethyl)benzene, 1,4-bis(1-isocyanate-1-methylethyl)benzene, ω,ω'-diisocyanate-1,4-diethylbenzene, and amine ester prepolymers having isocyanate groups at both ends.

[0071] As aliphatic diisocyanate esters, examples include: hexamethylene diisocyanate, tetramethylene diisocyanate, 2-methyl-pentane-1,5-diisocyanate, 3-methyl-pentane-1,5-diisocyanate, lysine diisocyanate, ethylene trioxide diisocyanate, etc.

[0072] As alicyclic diisocyanates, examples include: isophorone diisocyanate, cyclohexyl diisocyanate, hydrogenated diphenylmethane diisocyanate, norcamphene diisocyanate, hydrogenated toluene diisocyanate, hydrogenated xylene diisocyanate, hydrogenated tetramethylxylene diisocyanate, etc.

[0073] As a polyol, examples include: polyurethane polyol, polyester polyol, polyether polyol, acrylic polyol, polyolefin polyol, castor oil polyol, etc.

[0074] Epoxypropyl polymers are two-component curable resins composed of a main agent containing an epoxy polymer and a curing agent. The epoxy polymer is not particularly limited; examples include: bisphenol A-type epoxy polymers obtained by reacting bisphenol A with epichlorohydrin; bisphenol F-type epoxy polymers obtained by reacting bisphenol F with epichlorohydrin; their hydrides; epoxypropyl ester-type epoxy polymers; phenolic varnish-type epoxy polymers; amine-modified epoxy polymers; nitrogen-containing epoxy polymers such as trichloropropylene isocyanate; and rubber-modified epoxy polymers containing polybutadiene or NBR.

[0075] The curing agent is not particularly limited, but examples include: amine-based curing agents, acid anhydride-based curing agents, polyamide-based curing agents, imidazole-based curing agents, and polythiol (polymercaptan)-based curing agents.

[0076] As an amine-based curing agent, examples include: aliphatic polyamines such as polyoxypropylene triamine, diethylenetriamine, and triethylenetetramine, as well as aromatic polyamines such as m-phenylenediamine, diaminodiphenylmethane, diaminodiphenylmethane, and 2,4,6-tris(dimethylaminomethyl)phenol.

[0077] Examples of anhydride-based curing agents include: tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, pyromellitic anhydride, chlorobrittle anhydride, dodecenyl succinic anhydride, etc. Examples of polyamide-based curing agents include dimer acids, etc.

[0078] The content of the two-component curing resin in the curing resin is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0079] [Feldspars] ​​The curable resin composition for electronic materials contains feldspars. Because the curable resin composition for electronic materials contains feldspars, the cured product of the curable resin composition for electronic materials exhibits excellent flame retardancy. Feldspars encompass both feldspar and pseudofeldspar, preferably pseudofeldspar. Furthermore, feldspars can be used alone or in combination with two or more types.

[0080] As feldspar, examples include: alkaline feldspars such as orthoclase, sanidine, microcline, and anorthoclase; and plagioclase such as plagioclase, gray plagioclase, neutral feldspar, gray plagioclase, subgray plagioclase, and gray plagioclase.

[0081] As a pseudofeldspar, examples include: hexagonal potassium nepheline (Kalsilite), cancrinite, etc., nepheline, nepheline syenite, leucite, sodalite, hauyne, lazulite, nosean, meliite, etc., with nepheline syenite being the most preferred. Furthermore, nepheline syenite is sometimes also written as syenite.

[0082] The average particle size of the feldspar is preferably 0.1 μm or more, more preferably 1 μm or more, more preferably 2 μm or more, and more preferably 3 μm or more. The average particle size of the feldspar is preferably 50 μm or less, more preferably 25 μm or less, and more preferably 15 μm or less. If the average particle size of the feldspar is 0.1 μm or more, the cohesive force of the curable resin composition for electronic materials before curing is improved, and the curable resin composition for electronic materials can be accurately applied to narrow coating areas. If the average particle size of the feldspar is 50 μm or less, it can be uniformly dispersed in the curable resin composition for electronic materials, which can impart excellent mechanical strength to the cured product of the curable resin composition for electronic materials and impart excellent flame retardancy to the electronic materials for a long time. Furthermore, the average particle size of the feldspar refers to the value measured by image analysis using a transmission electron microscope. Specifically, a transmission electron microscope was used to take 100x magnified photographs of feldspars. Fifty feldspars were randomly selected, and their diameters were measured. The arithmetic mean of the diameters of all feldspars was taken as the average grain size of the feldspars. Furthermore, the diameter of a feldspar refers to the diameter of the perfect circle that can enclose the smallest diameter of the feldspar.

[0083] The content of feldspar in the curable resin composition for electronic materials is preferably 1 part by mass or more, more preferably 30 parts by mass or more, more preferably 50 parts by mass or more, and more preferably 80 parts by mass or more, relative to 100 parts by mass of the curable resin. The content of feldspar in the curable resin composition for electronic materials is preferably 800 parts by mass or less, more preferably 600 parts by mass or less, more preferably 450 parts by mass or less, more preferably 300 parts by mass or less, more preferably 200 parts by mass or less, more preferably 150 parts by mass or less, more preferably 100 parts by mass or less, and more preferably 80 parts by mass or less, relative to 100 parts by mass of the curable resin composition for electronic materials. If the content of feldspar is 1 part by mass or more, the hardness of the combustion residue in the cured product of the curable resin composition for electronic materials is increased, and it exists stably in the coating area of ​​the electronic material, thereby imparting excellent flame retardancy to the electronic material. If the content of feldspar is less than 800 parts by weight, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving the coating properties and enabling the curable resin composition for electronic materials to be precisely applied to narrow coating areas.

[0084] [Phosphorus compounds] The curable resin composition for electronic materials contains phosphorus compounds. By containing phosphorus compounds in the curable resin composition for electronic materials, the cured product of the curable resin composition for electronic materials expands during a fire, protecting the electronic materials and imparting excellent flame retardancy to the electronic materials.

[0085] As a phosphorus-based compound, it is only necessary to contain phosphorus atoms in the molecule. There are no particular limitations on phosphorus-based compounds. Preferred phosphorus-based compounds are ammonium polyphosphate and water-insoluble phosphorus-based compounds, and more preferably ammonium polyphosphate. Furthermore, phosphorus-based compounds can be used alone or in combination of two or more.

[0086] The content of ammonium polyphosphate in the phosphorus compound is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0087] The content of water-insoluble phosphorus compounds in the phosphorus compounds is preferably 50% by mass or more, more preferably 60% by mass or more, more preferably 70% by mass or more, more preferably 80% by mass or more, more preferably 90% by mass or more, and more preferably 100% by mass.

[0088] The water-insoluble phosphorus compounds are not particularly limited, but may include, for example: aluminum phosphite, aluminum dihydrogen phosphate, aluminum monohydrogen phosphate, aluminum phosphate, aluminum metaphosphate, condensed aluminum phosphate, and other water-insoluble inorganic phosphorus compounds; polyphosphate melamine, polyphosphate melamine, polyphosphate melamine, and other water-insoluble organophosphite compounds; preferably, it includes water-insoluble inorganic phosphorus compounds, more preferably, it includes aluminum phosphite or ammonium dihydrogen phosphate, and even more preferably, it includes aluminum phosphite. Furthermore, water-insoluble phosphorus compounds may be used alone or in combination with two or more.

[0089] "Water-insoluble phosphorus compounds" refers to phosphorus compounds whose saturation concentration (solubility) in a saturated solution obtained by dissolving the phosphorus compound in 100 g of water at 25°C is less than 0.03 g / 100 g H₂O. Specifically, an excess amount of phosphorus compound, sufficient to produce a small amount of precipitate, is supplied to 1000 g of water at 25°C, and stirred to dissolve it, thus preparing a solution. The solution is then filtered through a vacuum filter using five types of C filter paper according to JIS P3801 to remove insoluble components, thus preparing a saturated solution. The saturated solution is heated to 100°C to evaporate the water, obtaining a precipitate of the phosphorus compound. The mass of the precipitate is measured, and 1 / 10 of the mass of the precipitate is taken as the solubility (g / 100 g H₂O). Furthermore, during the removal of insoluble components, a portion of the water is absorbed onto the filter paper, but this is a very small amount compared to 1000 g of water. Therefore, the mass of water absorbed onto the filter paper will not affect the solubility value and can be ignored.

[0090] The content of phosphorus compounds in the curable resin composition for electronic materials is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, more preferably 70 parts by mass or more, more preferably 80 parts by mass or more, more preferably 90 parts by mass or more, more preferably 100 parts by mass or more, and more preferably 110 parts by mass or more, relative to 100 parts by mass of the curable resin. The content of phosphorus compounds in the curable resin composition for electronic materials is preferably 200 parts by mass or less, more preferably 180 parts by mass or less, more preferably 160 parts by mass or less, and more preferably 140 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of phosphorus compounds is 50 parts by mass or more, the cured product of the curable resin composition for electronic materials can expand more effectively in the event of a fire, can more reliably protect electronic materials, and can impart superior flame retardancy to electronic materials. If the content of phosphorus compounds is less than 200 parts by mass, the hardness of the combustion residue of the hardened resin composition for electronic materials is increased, and it is stably present in the coating area of ​​the hardened resin composition for electronic materials, thereby giving the electronic materials excellent flame retardancy.

[0091] Regarding the curable resin composition for electronic materials, the ratio of feldspar content to phosphorus compound content (mass of feldspar / mass of phosphorus compound) is preferably 0.05 or more, and more preferably 0.08 or more. Regarding the curable resin composition for electronic materials, the ratio of feldspar content to phosphorus compound content (mass of feldspar / mass of phosphorus compound) is preferably 1.00 or less, and more preferably 0.90 or less. If the ratio of feldspar content to phosphorus compound content is 0.05 or more, the hardness of the combustion residue of the cured product of the curable resin composition for electronic materials is increased, providing more effective protection for electronic materials in the event of a fire and improving the flame retardancy of the electronic materials. If the ratio of feldspar content to phosphorus compound content is 1.00 or less, the cured product of the curable resin composition for electronic materials can expand more effectively in the event of a fire, protecting the electronic materials and imparting flame retardancy to the electronic materials.

[0092] [Titanium oxide] The curable resin composition for electronic materials preferably contains titanium oxide. If the curable resin composition for electronic materials contains titanium oxide, the hardness of the combustion residue of the cured product of the curable resin composition for electronic materials is further improved by the reaction of titanium oxide with phosphorus compounds, which can more effectively protect electronic materials in the event of a fire and improve the flame retardancy of electronic materials.

[0093] The average particle size of titanium oxide is preferably 0.005 μm or more, more preferably 0.01 μm or more, and even more preferably 0.02 μm or more. The average particle size of titanium oxide is preferably 10 μm or less, more preferably 8 μm or less, and even more preferably 5 μm or less. If the average particle size of titanium oxide is 0.05 μm or more, the rapid increase in viscosity of the curable resin composition for electronic materials is reduced, and the coatability of the curable resin composition for electronic materials is improved. If the average particle size of titanium oxide is 10 μm or less, the dispersibility of titanium oxide in the curable resin composition for electronic materials is improved, and the hardness of the combustion residue in the cured product of the curable resin composition for electronic materials is improved. Therefore, it is stably present in the coating area of ​​the electronic material, thus imparting excellent flame retardancy to the electronic material. Furthermore, the average particle size of titanium oxide refers to the particle size D50, which is the 50% by mass of the particle size accumulated from the smaller particle size side in the particle size distribution of the volume reference measured by laser diffraction.

[0094] The content of titanium oxide in the curable resin composition for electronic materials is preferably 1 part by mass or more, more preferably 3 parts by mass or more, more preferably 5 parts by mass or more, and more preferably 8 parts by mass or more, relative to 100 parts by mass of the curable resin. The content of titanium oxide in the curable resin composition for electronic materials is preferably 20 parts by mass or less, more preferably 18 parts by mass or less, more preferably 16 parts by mass or less, more preferably 14 parts by mass or less, and more preferably 12 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of titanium oxide is 1 part by mass or more, the hardness of the combustion residue of the cured product of the curable resin composition for electronic materials is further increased by the reaction of titanium oxide with phosphorus compounds. The cured product of the curable resin composition for electronic materials is stably present in the coated area of ​​the electronic material during a fire, thereby imparting excellent flame retardancy to the electronic material. If the content of titanium oxide is less than 20 parts by mass, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving the coatability and enabling the curable resin composition for electronic materials to be applied precisely to narrow coating areas.

[0095] [Glass Factant] The curable resin composition for electronic materials preferably contains glass factant. The glass factant acts as a binder in the combustion residue of the cured product of the curable resin composition for electronic materials, binding the combustion residue of the cured resin with feldspar, thereby giving the combustion residue excellent hardness. Therefore, the combustion residue of the cured product of the curable resin composition for electronic materials is stably present in the coating area of ​​the curable resin composition for electronic materials, thus imparting excellent flame retardancy to the electronic materials.

[0096] Examples of glasses constituting glass materials include: phosphate-based glasses, borate-based glasses, bismuth oxide-based glasses, silicate-based glasses, sodium oxide-based glasses, etc., with phosphate-based glasses and borate-based glasses being more preferred, and phosphate-based glasses being even more preferred. These glass materials can be obtained by adjusting the specific composition ratios of B₂O₃, P₂O₅, ZnO, SiO₂, Bi₂O₃, Al₂O₃, BaO, CaO, MgO, MnO₂, ZrO₂, TiO₂, CeO₂, SrO, V₂O₅, SnO₂, Li₂O, Na₂O, K₂O, CuO, Fe₂O₃, etc.

[0097] The content of glass frit in the curable resin composition for electronic materials is preferably 5 parts by mass or more, more preferably 20 parts by mass or more, and more preferably 40 parts by mass or more, relative to 100 parts by mass of the curable resin. The content of glass frit in the curable resin composition for electronic materials is preferably 200 parts by mass or less, more preferably 100 parts by mass or less, and more preferably 80 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of glass frit is 5 parts by mass or more, the combustion residue of the cured product of the curable resin composition for electronic materials has excellent hardness and is stably present in the coating area of ​​the curable resin composition for electronic materials in the electronic materials, thereby imparting excellent flame retardancy to the electronic materials. If the content of glass frit is 200 parts by mass or less, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving the coatability and enabling the curable resin composition for electronic materials to be precisely coated in narrow coating areas.

[0098] [Calcium carbonate] The curable resin composition for electronic materials may also contain calcium carbonate. Examples of calcium carbonate include heavy calcium carbonate, precipitated calcium carbonate, colloidal calcium carbonate, and light calcium carbonate, with colloidal calcium carbonate being preferred.

[0099] Heavy calcium carbonate can be obtained, for example, by crushing natural calcium carbonate such as chalk, marble, and limestone into fine powder.

[0100] Precipitated calcium carbonate can be produced, for example, by using limestone as a raw material and through a chemical reaction.

[0101] The average particle size of the primary particles of calcium carbonate is preferably 0.01 μm or more, more preferably 0.03 μm or more, more preferably 0.05 μm or more, and more preferably 0.06 μm or more. The average particle size of the primary particles of calcium carbonate is preferably 5.0 μm or less, more preferably 2.5 μm or less, more preferably 1.0 μm or less, and more preferably 0.5 μm or less. If the average particle size of the primary particles of calcium carbonate is 0.01 μm or more, the viscosity of the curable resin composition for electronic materials can be reduced, thereby improving the coatability and enabling the curable resin composition for electronic materials to be precisely coated onto narrow coating areas. If the average particle size of the primary particles of calcium carbonate is 5.0 μm or less, the hardness of the combustion residue in the cured product of the curable resin composition for electronic materials is increased, and it exists stably on the coating area of ​​the electronic material, thereby imparting excellent flame retardancy to the electronic material.

[0102] Furthermore, the average particle size of primary particles of calcium carbonate refers to the value calculated using the specific surface area per 1 g of calcium carbonate based on the following formula. Furthermore, the specific surface area per 1 g of calcium carbonate can be measured, for example, using a commercially available powder specific surface area measuring device manufactured by Shimadzu under the trade name "SS-100". Average particle size of calcium carbonate (μm) = 6 × 10000 / (specific gravity × specific surface area)

[0103] The calcium carbonate content in the curable resin composition for electronic materials is preferably 10 parts by mass or more, more preferably 20 parts by mass or more, and more preferably 30 parts by mass or more, relative to 100 parts by mass of the curable resin. The calcium carbonate content in the curable resin composition for electronic materials is preferably less than 100 parts by mass, more preferably less than 80 parts by mass, and more preferably less than 60 parts by mass, relative to 100 parts by mass of the curable resin. If the calcium carbonate content is 10 parts by mass or more, the hardness of the combustion residue in the cured product of the curable resin composition for electronic materials is increased, and it exists stably in the coating area of ​​the electronic material, thereby imparting excellent flame retardancy to the electronic material. If the calcium carbonate content is less than 100 parts by mass, the coatability of the curable resin composition for electronic materials is stable, which is preferable.

[0104] [Silanol Condensation Catalyst] Curable resin compositions for electronic materials may also contain silanol condensation catalysts. When the curable resin is a polymer with hydrolyzable silicon groups or a hydrolyzable crosslinked polysiloxane polymer, the term silanol condensation catalyst refers to a catalyst used to promote the curing of the curable resin through a condensation reaction.

[0105] As a silanol condensation catalyst, examples include: dibutyltin diacetylpyruvate, 1,1,3,3-tetrabutyl-1,3-dilauoxycarbonyl-distannoxane, dibutyltin dilaurate, dibutyltin oxide, dibutyltin diacetate, dibutyltin phthalate, 1,3-dilauoxy-1,1,3,3-tetrabutyldistannoxane, bis(acetylpyruvate)dibutyltin, bis(maleic acid monoester)dibutyltin, tin octanoate, dibutyltin octanoate, dioctyltin oxide, bis(triethoxysilicone)dibutyltin, bis(bistriethoxysilicone dibutyltin), and oxybisethoxysilicone dibutyltin, etc.; organotin compounds such as tetra-n-butoxytitanate and tetraisopropoxytitanate, etc., preferably organotin compounds. These silanol condensation catalysts can be used alone or in combination with two or more.

[0106] 1,1,3,3-Tetrabutyl-1,3-dilauoxycarbonyl-distannoxane is preferred as the silanol condensation catalyst. With this silanol condensation catalyst, the curing speed of curable resin compositions for electronic materials can be easily adjusted.

[0107] The content of the silanol condensation catalyst in the curable resin composition for electronic materials is preferably 0.1 parts by mass or more, more preferably 0.2 parts by mass or more, and more preferably 0.3 parts by mass or more, relative to 100 parts by mass of the curable resin. The content of the silanol condensation catalyst in the curable resin composition for electronic materials is preferably 10 parts by mass or less, more preferably 8 parts by mass or less, more preferably 6 parts by mass or less, and more preferably 5 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of the silanol condensation catalyst in the curable resin composition for electronic materials is 0.1 parts by mass or more, the curing speed of the curable resin composition for electronic materials can be accelerated, thereby shortening the curing time required for the curable resin composition for electronic materials. If the content of silanol condensation catalyst in the curable resin composition for electronic materials is less than 10 parts by mass, the curable resin composition for electronic materials has an appropriate curing speed, which can improve the storage stability and operability of the curable resin composition for electronic materials.

[0108] [Dehydrating Agent] The curable resin composition for electronic materials preferably contains a dehydrating agent. By means of the dehydrating agent, when storing the curable resin composition for electronic materials, it is possible to inhibit the curing of the curable resin composition for electronic materials due to moisture contained in the air, etc.

[0109] Examples of dehydrating agents include: vinyltrimethoxysilane, dimethyldimethoxysilane, tetraethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, tetramethoxysilane, phenyltrimethoxysilane, and diphenyldimethoxysilane, as well as silane compounds such as methyl orthoformate, ethyl orthoformate, methyl orthoacetate, and ethyl orthoformate. These dehydrating agents can be used alone or in combination of two or more. Vinyltrimethoxysilane is preferred.

[0110] The content of the dehydrating agent in the curable resin composition for electronic materials is preferably 0.5 parts by mass or more, and more preferably 1 part by mass or more, relative to 100 parts by mass of the curable resin. The content of the dehydrating agent in the curable resin composition for electronic materials is preferably 20 parts by mass or less, and more preferably 15 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of the dehydrating agent in the curable resin composition for electronic materials is 0.5 parts by mass or more, the effect obtained by the dehydrating agent can be sufficiently obtained. Furthermore, if the content of the dehydrating agent in the curable resin composition for electronic materials is 20 parts by mass or less, the curable resin composition for electronic materials has excellent curing properties.

[0111] [Other Additives] Curable resin compositions for electronic materials may also contain thixotropic agents, antioxidants, ultraviolet absorbers, pigments, dyes, precipitation inhibitors, aminosilane coupling agents, thixotropic agents, plasticizers, and solvents, etc., to the extent that their physical properties are not impaired. Among these, thixotropic agents, ultraviolet absorbers, and antioxidants are preferred.

[0112] The curable resin composition for electronic materials preferably contains a black pigment (e.g., carbon black) as a pigment. By making the cured product of the curable resin composition for electronic materials black, light reflection can be reduced, thereby improving the optical properties of the cured product.

[0113] The curable resin composition for electronic materials preferably contains an aminosilane coupling agent. By using an aminosilane coupling agent, the rubber elasticity or adhesion of the cured product of the curable resin composition for electronic materials can be improved. Furthermore, an aminosilane coupling agent refers to a compound containing a silicon atom bonded with an alkoxy group and a functional group containing a nitrogen atom in one molecule.

[0114] Specifically, examples of aminosilane coupling agents include: 3-aminopropyltrimethoxysilane, 3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltriethoxysilane, N,N'-bis-[3- [(trimethoxysilyl)propyl]ethylenediamine, N,N'-bis-[3-(triethoxysilyl)propyl]ethylenediamine, N,N'-bis-[3-(methyldimethoxysilyl)propyl]ethylenediamine, N,N'-bis-[3-(trimethoxysilyl)propyl]hexamethylenediamine, N,N'-bis-[3-(triethoxysilyl)propyl]hexamethylenediamine, etc. These aminosilane coupling agents can be used alone or in combination of two or more.

[0115] Among them, 3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and N-(2-aminoethyl)-3-aminopropyltriethoxysilane are preferred examples of aminosilane coupling agents, and N-(2-aminoethyl)-3-aminopropyltriethoxysilane is even more preferred.

[0116] The content of the aminosilane coupling agent in the curable resin composition for electronic materials is preferably 1 to 10 parts by weight, and more preferably 1 to 5 parts by weight, relative to 100 parts by weight of the curable resin. If the content of the aminosilane coupling agent is within the above range, the rubber elasticity or adhesion of the cured product of the curable resin composition for electronic materials can be improved.

[0117] The thixotropic agent is only required to enable the curable resin composition of electronic materials to exhibit thixotropy. Preferred thixotropic agents include hydrogenated castor oil, fatty acid diacetylamine, and fumed silica.

[0118] The content of the thixotropic agent in the curable resin composition for electronic materials is preferably 0.1 parts by mass or more, and more preferably 1 part by mass or more, relative to 100 parts by mass of the curable resin. The content of the thixotropic agent in the curable resin composition for electronic materials is preferably 200 parts by mass or less, and more preferably 150 parts by mass or less, relative to 100 parts by mass of the curable resin. If the content of the thixotropic agent in the curable resin composition for electronic materials is 0.1 parts by mass or more, thixotropy can be effectively imparted to the curable resin composition for electronic materials. Furthermore, if the content of the thixotropic agent in the curable resin composition for electronic materials is 200 parts by mass or less, the curable resin composition for electronic materials has an appropriate viscosity, and the workability of the curable resin composition for electronic materials is improved.

[0119] Examples of UV absorbers include benzotriazole-based UV absorbers and benzophenone-based UV absorbers, with benzotriazole-based UV absorbers being preferred. The content of the UV absorber in the curable resin composition for electronic materials is preferably 0.1 parts by weight or more relative to 100 parts by weight of the curable resin. The content of the UV absorber in the curable resin composition for electronic materials is preferably 20 parts by weight or less relative to 100 parts by weight of the curable resin, and more preferably 10 parts by weight or less.

[0120] Examples of antioxidants include hindered phenolic antioxidants, monophenolic antioxidants, bisphenolic antioxidants, and polyphenolic antioxidants, with hindered phenolic antioxidants being a preferred example. The antioxidant content in the curable resin composition for electronic materials is preferably 0.1 parts by weight or more, and more preferably 0.3 parts by weight or more, relative to 100 parts by weight of the curable resin. The antioxidant content in the curable resin composition for electronic materials is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, relative to 100 parts by weight of the curable resin.

[0121] [Light Stabilizer] The curable resin composition for electronic materials preferably contains a hindered amine light stabilizer. With the hindered amine light stabilizer, a curable resin composition for electronic materials can be provided that can maintain excellent rubber elasticity for a longer period after curing.

[0122] As hindered amine light stabilizers, examples include: a mixture of bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate and methyl 1,2,2,6,6-pentamethyl-4-piperidinyl sebacate, bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, dibutylamine-1,3,5-tris-N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl-1,6-hexamethylenediamine and N Condensation polymers of (2,2,6,6-tetramethyl-4-piperidinyl)butylamine, poly[{6-(1,1,3,3-tetramethylbutyl)amino-1,3,5-tris-2,4-diyl}{(2,2,6,6-tetramethyl-4-piperidinyl)imino}hexamethylene{(2,2,6,6-tetramethyl-4-piperidinyl)imino}], and condensation polymers of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinylethanol.

[0123] As a hindered amine light stabilizer, NOR-type hindered amine light stabilizers are preferred. With NOR-type hindered amine light stabilizers, it is possible to provide a curable resin composition for electronic materials that can suppress the time-dependent decrease in the elasticity of the rubber after curing.

[0124] The NOR-type hindered amine light stabilizer has a NOR structure in which an alkyl group (R) is bonded to the nitrogen atom (N) of the piperidine ring backbone via an oxygen atom (O). The alkyl group in the NOR structure preferably has 1 to 20 carbon atoms, more preferably 1 to 18, and even more preferably 18. Examples of alkyl groups include straight-chain alkyl groups, branched alkyl groups, and cyclic alkyl groups (saturated alicyclic hydrocarbon groups).

[0125] Examples of straight-chain alkyl groups include: methyl, ethyl, n-propyl, n-butyl, n-pentyl, n-hexyl, n-octyl, n-nonyl, n-decyl, etc. Examples of branched alkyl groups include: isopropyl, isobutyl, dibutyl, tributyl, etc. Examples of cyclic alkyl groups (saturated alicyclic hydrocarbon groups) include: cyclopentyl, cyclohexyl, cyclooctyl, etc. Furthermore, the hydrogen atoms constituting the alkyl group may be replaced by halogen atoms (e.g., fluorine atoms, chlorine atoms, bromine atoms, etc.) or hydroxyl groups, etc.

[0126] As NOR-type hindered amine light stabilizers, hindered amine light stabilizers represented by the following formula (I) can be listed.

[0127]

[0128] When using NOR-type hindered amine light stabilizers, it is preferable to use a combination of NOR-type hindered amine light stabilizers and benzotriazole-based or triazole-based ultraviolet absorbers. This provides a curable resin composition for electronic materials that can more effectively suppress the time-dependent decrease in the elasticity of the cured rubber.

[0129] The content of hindered amine light stabilizer in the curable resin composition for electronic materials is preferably 0.01 parts by weight or more, and more preferably 0.1 parts by weight or more, relative to 100 parts by weight of the curable resin. The content of hindered amine light stabilizer in the curable resin composition for electronic materials is preferably 20 parts by weight or less, and more preferably 10 parts by weight or less, relative to 100 parts by weight of the curable resin.

[0130] [Cureable Resin Compositions for Electronic Materials] Curable resin compositions for electronic materials can be manufactured by mixing curable resins, feldspar and phosphorus compounds, and additives as needed. Furthermore, curable resin compositions for electronic materials can also be in the form of suspensions or emulsions suspended or emulsified in aqueous solvents. Curable resin compositions for electronic materials can also be in the form of solutions dissolved in solvents. Examples of aqueous solvents include alcohols such as ethanol, methanol, and isopropanol; and water. Examples of solvents include xylene, toluene, and acetone.

[0131] Regarding the curable resin composition for electronic materials, by combining feldspar and phosphorus compounds, the cured product of the curable resin composition for electronic materials has excellent flame retardancy.

[0132] Furthermore, the curable resin composition for electronic materials, due to its low viscosity, exhibits excellent coatability, enabling precise application to specific, narrow application areas of increasingly miniaturized electronic materials. Therefore, the curable resin composition for electronic materials can be precisely applied to specific areas of electronic materials without affecting their performance, thus imparting or enhancing the flame retardancy of electronic materials and / or electronic devices containing electronic materials.

[0133] In particular, when the curable resin composition for electronic materials contains hydrolyzed crosslinked polysiloxane polymers, feldspar compounds, and phosphorus compounds, the hydrolyzed crosslinked polysiloxane polymers can rapidly expand in the early stages of combustion during a fire, further reducing the spread of combustion caused by the electronic materials. Furthermore, it can impart superior expansion properties to the curable resin composition for electronic materials, and superior hardness to the combustion residue of the cured product of the curable resin composition for electronic materials. Therefore, the curable resin composition for electronic materials can impart superior flame retardancy to electronic materials and / or electronic devices containing electronic materials, or further improve their flame retardancy.

[0134] Furthermore, there is no particular limitation on electronic machines. Examples include: car navigation systems, mobile phones, smartphones, game consoles, digital cameras, televisions, DVD players, electronic dictionaries, calculators, hard disk recorders, personal computers, camcorders, printers, LCD monitors, plasma displays, radios, electronic musical instruments, etc.

[0135] As electronic devices become increasingly miniaturized and lightweight, the electronic materials that constitute these devices also become increasingly miniaturized. There are no particular limitations on such electronic materials; examples include: printed circuit boards, light-emitting diodes (LEDs), LED wiring boards, flexible copper-clad laminates, bonding sheets, touch panels, and substrates for sensors.

[0136] There are no particular limitations on the method of applying a curable resin composition to a specific part of the electronic material. For example, the application method using a brush or the application method using a known application tool can be listed.

[0137] The viscosity of the curable resin composition for electronic materials is preferably 500 mPa·s or higher, more preferably 1000 mPa·s or higher, and more preferably 3000 mPa·s or higher. The viscosity of the curable resin composition for electronic materials is preferably 200,000 mPa·s or lower, more preferably 100,000 mPa·s or lower, and more preferably 50,000 mPa·s or lower. Furthermore, the viscosity of the curable resin composition for electronic materials refers to the value measured using a BH type viscometer under the conditions of 23°C, 10 rpm, and rotor No. 5.

[0138] An electronic material curable resin composition applied to an electronic material is cured by curing the curable resin. Furthermore, the curing of the curable resin can be carried out according to the type of curable resin and in accordance with known methods (e.g., supply of moisture, irradiation with ultraviolet light, heating, etc.).

[0139] Furthermore, the hardened resin composition for electronic materials expands due to combustion caused by heat during a fire, thereby generating a combustion residue with excellent hardness. This combustion residue remains stably disposed at the coated area even during a fire, exhibiting excellent flame retardancy. [Effects of the Invention]

[0140] The curable resin composition for electronic materials of the present invention has excellent coatability because it suppresses viscosity to a low level, and can be accurately and easily applied to the desired part of the electronic material without damaging its function.

[0141] Furthermore, the hardened material formed by hardening electronic materials with a curable resin composition expands under heat such as fire, generating combustion residue with higher hardness. The expansion of the combustion residue of the hardened material covers electronic materials or electronic devices containing electronic materials, thus protecting electronic materials from fire and suppressing the spread of fire.

[0142] Furthermore, the combustion residue of the hardened resin composition for electronic materials has excellent hardness, thus enabling the hardened resin composition for electronic materials to exist stably at the coating site, thereby imparting excellent flame retardancy to the electronic materials or improving the flame retardancy of the electronic materials.

Implementation Method

[0144] Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited thereto. [Examples]

[0145] The following raw materials were used in the manufacture of the curable resin composition for electronic materials in the Examples and Comparative Examples.

[0146] [Curing Resin] ・Polyepoxy with hydrolyzable silicone groups (polyepoxy with a main chain backbone composed of polypropylene oxide and dimethoxy silicone groups at the ends of the main chain; quantity average molecular weight: 38,000; trade name "EXCESTAR S303H" manufactured by Kaneka Corporation) ・Hydrolyzable crosslinkable polysiloxane polymer 1 (trade name "XR31-B2230" manufactured by Momentive Materials Japan Co., Ltd.; hydrolyzable group: alkoxy; alkoxy content: 5 mol%; phenyl content: 30 mol%; methyl content: 65 mol%; viscosity at 25°C: 16 Pa·s; regarding the silicon atoms constituting the linear main chain, methyl, phenyl or alkoxy groups are bonded to each of the bonds not used to constitute the main chain, and methyl and phenyl groups are bonded to some silicon atoms) • Hydrolyzed crosslinked polysiloxane polymer 2 (trade name "XR31-B2733" manufactured by Momentive Advanced Materials Japan Co., Ltd.; hydrolyzable group: alkoxy; alkoxy content: 5 mol%; methyl content: 95 mol%; viscosity at 25°C: 250 Pa·s; regarding the silicon atoms constituting the linear main chain, methyl or alkoxy groups are bonded to each of the bonds not used to form the main chain).

[0147] [Feldspars] ​​・Feldspars (Nepheline syenite; average grain size: 5 μm; trade name "NESPAR" manufactured by Shiraishi Calcium Co., Ltd.)

[0148] [Phosphorus compounds] ・Ammonium polyphosphate (trade name "AP462" manufactured by Clariant) ・Aluminum phosphite

[0149] [Titanium Oxide]・Titanium oxide (trade name "CR-90" manufactured by Ishihara Sangyo Co., Ltd.; average particle size: 0.25 μm)

[0150] [Carbon Black] ・Carbon Black (product name "SG-103" manufactured by Ishihara Sangyo Co., Ltd.)

[0151] [Calcium Carbonate]・Colloidal calcium carbonate (trade name "CCR" manufactured by Shiraishi Calcium Co., Ltd.; average primary particle size: 0.08 μm)

[0152] [Glass Material] ・Glass material (phosphate glass; "VY0144" manufactured by FRIT Corporation, Japan; main components: P2O5, Al2O3 and R2O, R-series alkali metal atoms; softening point: 404℃)

[0153] ・Silanol condensation catalyst (dibutyltin diacetylpyruvate, trade name "U220H" manufactured by Nitto Chemical Co., Ltd.)・Dehydrating agent (vinyltrimethoxysilane, trade name "KBM1003" manufactured by Shin-Etsu Chemical Co., Ltd.)・Aminosilane coupling agent (N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, trade name "KBM-603" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0154] (Examples 1-10, Comparative Examples 1-3) The curing resin, feldspar, phosphorus compound, titanium dioxide, carbon black, colloidal calcium carbonate, glass frit, silanol condensation catalyst, dehydrating agent and aminosilane coupling agent were mixed in the amounts shown in Table 1 using a planetary mixer under vacuum for 60 minutes until homogeneous, thereby obtaining a curing resin composition for electronic materials.

[0155] The flame retardancy, hardness after burning, coatability, expansion ratio and viscosity of the obtained curable resin composition for electronic materials were measured according to the following procedure, and the results are shown in Table 1.

[0156] (Flame retardancy) A test sheet with a thickness of 1.5 mm was prepared using a curable resin composition for electronic materials and cured at 23°C for 7 days. Five test sheets were made by cutting the test sheet into a flat rectangular shape with a length of 15 mm, a width of 130 mm, and a thickness of 1.5 mm.

[0157] Tests were conducted based on the UL94V-0 standard. Specifically, the test piece was held vertically by clamping one end in the lateral direction. Then, the other end (lower end) of the vertically suspended test piece was brought into contact with a flame for 3 seconds using a burner. After temporarily removing the burner from the test piece, the other end of the test piece in the lateral direction was brought into contact with a flame for 3 seconds using the burner, and the flame retardancy was measured. Evaluation was based on the following criteria: A... For each test piece, the residual flame time after two exposures was less than 10 seconds, and the total residual flame time of the five test pieces was less than 50 seconds. Furthermore, there were no test pieces that remained red-hot (smoldering) for more than 30 seconds after the second exposure. B... For each test piece, the residual flame time after two exposures was less than 10 seconds, and the total residual flame time of the five test pieces exceeded 50 seconds. Furthermore, there were no test pieces that remained red-hot (smoldering) for more than 30 seconds after the second exposure. C... Regarding each test piece, the residual flame time after two exposures is less than 10 seconds, and the total residual flame time of the five test pieces exceeds 50 seconds. Furthermore, there are test pieces that remain red-hot (smoldering) for more than 30 seconds after the second exposure. D... The situation where all test pieces burn out to the fixture, etc., does not meet any of A to C.

[0158] (Hardness after combustion) A hardened material is prepared by curing a curable resin composition for electronic materials at 23°C and 50% relative humidity for 1 week. 100 g of the hardened material is prepared as a test piece. The test piece is fed into a combustion furnace. The test piece is burned in the combustion furnace at 600°C for 30 minutes. After the combustion residue obtained from burning the test piece is completely burned, it is immediately placed at 23°C for 1 hour. Then, the rubber elasticity based on Shore A is measured using a Type A hardness tester at a measurement temperature of 23°C according to JIS K6253. Evaluation is based on the following criteria: A... Rubber hardness is 30 or higher. B... Rubber hardness is 20 or higher but less than 30. C... Rubber hardness is 10 or higher but less than 20. D... Rubber hardness is less than 10 or so brittle that it cannot be measured with a Type A hardness tester.

[0159] (Coating Properties) Electronic materials were filled into a volumetric syringe using a curable resin composition and mounted on a pneumatic dispensing device (Nordson, Performus X100). The coating properties were then measured. A substrate with coating grooves having widths of 0.5 mm, 1.0 mm, and 2.0 mm was prepared. Furthermore, the coating grooves with widths of 0.5 mm, 1.0 mm, and 2.0 mm were sequentially referred to as "Coating Grooves 1 to 3".

[0160] Under conditions of 23°C and 0.6 MPa, a pneumatic applicator is operated to apply a curable resin composition of electronic materials to coating tanks with widths of 0.5 mm, 1.0 mm, and 2.0 mm. Evaluation is based on the following criteria: A... Completely coats any of coating tanks 1 to 3. B... Completely coats coating tanks 2 and 3, but cannot completely coat coating tank 1. C... Completely coats coating tank 3, but cannot completely coat coating tanks 1 and 2. D... Cannot completely coat any of coating tanks 1 to 3.

[0161] (Expansion Ratio) A test piece is prepared by curing an electronic material using a curable resin composition. The test piece is a flat, square sheet (length: 2 cm; width: 2 cm; thickness: 2 mm). The test piece is placed in an electric furnace preheated to 600°C and heated for 10 minutes to burn. The combustion residue of the test piece is then removed from the furnace. The expansion ratio is calculated based on the following formula: Expansion Ratio (%) = 100 × Volume of Combustion Residue / Volume of Test Piece Before Combustion

[0162] (Viscosity) The viscosity of the curable resin composition for electronic materials was measured using a BH type viscometer at 23°C, 10 rpm, and rotor No.5.

[0163] [Table 1] Example Comparative example 1 2 3 4 5 6 7 8 9 10 1 2 3 Curable resin composition for electronic materials Polyepoxides with hydrolyzable silicone groups (parts by weight) 0 0 0 100 0 0 0 0 0 0 0 0 0 Hydrolyzed crosslinked polysiloxane polymer 1 (parts by weight) 100 100 100 0 100 100 100 0 100 100 100 100 100 2 parts by weight of hydrolyzed crosslinked polysiloxane polymer 0 0 0 0 0 0 0 100 0 0 0 0 0 Feldspar (parts by weight) 50 50 50 50 10 100 50 50 50 50 0 0 50 Ammonium polyphosphate (parts by weight) 120 120 120 120 120 120 0 120 120 120 120 120 0 Aluminum phosphite (parts by weight) 0 0 0 0 0 0 120 0 0 0 0 0 0 Titanium oxide (parts by weight) 0 0 10 0 0 0 0 0 0 0 0 0 0 Carbon black (parts by weight) 10 10 0 10 10 10 10 0 0 10 10 10 10 Glass material (parts by weight) 50 50 50 50 50 50 50 50 50 0 50 0 0 Colloidal calcium carbonate (parts by weight) 50 0 0 50 0 0 50 50 50 50 50 150 170 Silane alcohol condensation catalyst (parts by weight) 2 2 2 2 2 2 2 2 2 2 2 2 2 Dehydrating agent (parts by weight) 3 3 3 3 3 3 3 3 0 3 3 3 3 Aminosilane coupling agent (parts by weight) 3 3 3 3 3 3 3 2 0 3 3 3 3 Feldspar / phosphorus compounds 0.42 0.42 0.42 0.42 0.08 0.83 0.42 0.42 0.42 0.42 0 0 - evaluate Flame retardancy A A A B A A A B A A B D D Hardness after combustion A B A A B A A A A C D D A Expansion ratio (%) 10 10 15 10 14 8 5 10 12 10 12 1 5 Topical A A A B A B A A A A A D A Viscosity at 23°C (mPa·s) 30000 15000 20000 50000 28000 46000 28000 35000 30000 25000 28000 80000 30000 [Industrial Applicability]

[0164] The combustion residue of the hardened material generated by hardening the electronic material of the present invention by hardening the hardened resin composition expands and covers the electronic material or electronic machine containing the electronic material, which can protect the electronic material from fire and suppress the spread of fire.

[0165] (Cross-reference to related applications) This application claims priority based on Japanese Patent Application No. 2022-050856, filed on March 25, 2022, the disclosure of which is incorporated herein by reference in its entirety. [Simplified Explanation of the Diagram]

[0143] None

Claims

1. A curable resin composition for electronic materials, characterized in that it contains a curable resin, feldspar and a phosphorus compound, wherein the phosphorus compound contains ammonium polyphosphate.

2. As in claim 1, the curable resin composition for electronic materials, wherein, The ratio of the content of the aforementioned feldspars to the content of the aforementioned phosphorus compounds (mass of feldspars / mass of phosphorus compounds) is 0.05 to 1.

00.

3. The curable resin composition for electronic materials as claimed in claim 1 or 2 further contains titanium oxide.

4. The electronic material used in claim 1 or 2 is a curable resin composition that further contains glass frit.

5. The curable resin composition for electronic materials as described in claim 1 or 2, wherein, The aforementioned curable resin contains: a polyalkylene oxide having a hydrolyzable silicone group.

6. The curable resin composition for electronic materials as described in claim 1 or 2, wherein, The aforementioned curing resin contains a hydrolyzed crosslinked polysiloxane polymer.

7. As in claim 6, the curable resin composition for electronic materials, wherein, The above-mentioned hydrolytically crosslinked polysiloxane polymers contain silicon atoms bonded with methyl or phenyl groups.

8. The curable resin composition for electronic materials as described in claim 6, wherein, The above-mentioned hydrolytically crosslinked polysiloxane polymer contains silicon atoms bonded with methyl and phenyl groups.