Determination method, determination apparatus, information processing method, storage medium, information processing apparatus, lithographic apparatus, and method for manufacturing article

Abstract

This invention relates to a determination method, a determination device, an information processing method, and a storage medium. A determination method includes: a first measurement step of measuring a first relative position; a second measurement step of measuring a second relative position; and determining whether an anomaly exists. The first relative position is the relative position between the conveyor unit and a component corresponding to one of the multiple corresponding measurement positions when the conveyor unit moves to the multiple corresponding measurement positions. The second relative position is the relative position between the conveyor unit and a component corresponding to one of the multiple corresponding measurement positions after the first measurement step and when the conveyor unit moves to the multiple corresponding measurement positions. Based on the measurement results of the first and second measurement steps, it is determined whether an anomaly exists in the conveyor unit and whether an anomaly exists in the floor at one of the multiple corresponding measurement positions.

Description

Technical Field

[0001] The present disclosure relates to a determination method, a determination device, an information processing method, a storage medium, an information processing device, a lithography device, and an object manufacturing method. Prior Art

[0002] In the manufacturing process of semiconductor devices or liquid crystal display devices, a substrate processing apparatus is used. The apparatus includes a conveyor unit for conveying substrates. If there is an abnormality in the relative position between the conveyor unit and a component such as a substrate, the conveyor unit and the component such as the substrate may interfere with each other.

[0003] Japanese Patent Laid-Open No. 2008-141098 discusses a method for detecting an abnormality in the position of a conveying unit by obtaining the coordinates of the conveying unit at a specific position and comparing the coordinates with reference coordinates.

[0004] However, the relative position between the conveyor unit and a component such as a substrate may be abnormal due not only to the conveyor unit but also to other factors. For example, an abnormality may occur due to a sunken floor caused by the weight of components other than the conveyor unit. In order to appropriately correct an abnormality in the relative position between the conveyor unit and a component such as a substrate, it is desirable to identify and locate the cause of the abnormality. Summary of the Invention

[0005] The present disclosure aims to provide a determination method that facilitates identifying the cause of a change in the relative position between a conveying unit and a member such as a substrate.

[0006] According to one aspect of the present disclosure, a determination method includes: a first measuring step of measuring a first relative position, wherein the first relative position is the relative position between a component corresponding to a plurality of respective measurement positions and the conveying unit when the conveying unit moves to the plurality of respective measurement positions; a second measuring step of measuring a second relative position, wherein the second relative position is the relative position between a component corresponding to the plurality of respective measurement positions and the conveying unit when the conveying unit moves to the plurality of respective measurement positions after the first measuring step; and a determination step of determining whether there is an abnormality in the conveying unit and whether there is an abnormality in the floor at one of the plurality of respective measurement positions based on the measurement results of the first measuring step and the measurement results of the second measuring step.

[0007] Further features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the attached drawings. Simple diagram description

[0008] [ FIG. 1 ] is a schematic diagram showing the configuration of a substrate processing apparatus according to a first exemplary embodiment. [ FIG.

[0009] [ FIG. 2 ] is a diagram illustrating a configuration of an exposure unit according to a first exemplary embodiment.

[0010] [FIGS. 3A and 3B] are diagrams illustrating the configuration of a conveying unit according to the first exemplary embodiment.

[0011] [FIGS. 4A and 4B] are diagrams illustrating an example in which the conveying unit according to the first exemplary embodiment takes in a substrate from a supporting member.

[0012] [ FIG. 5 ] is a diagram showing a floor on which units in the substrate processing apparatus according to the first exemplary embodiment are arranged. [ FIG.

[0013] [FIGS. 6A and 6B] are schematic diagrams when the transport unit takes in the substrate placed on the substrate stage.

[0014] [FIGS. 7A to 7C] are schematic diagrams when the transport unit takes in the first substrate placed on the substrate stage and the second substrate placed on the temperature adjustment unit.

[0015] [FIGS. 8A to 8C] are diagrams showing gaps at units on the same floor at the first timing or the second timing.

[0016] [FIGS. 9A and 9B] show measurement results of a gap in a case where there is no abnormality in the floor panel according to the first exemplary embodiment.

[0017] [FIGS. 10A and 10B] Show measurement results of a gap in a case where there is an abnormality in the floor according to the present exemplary embodiment.

[0018] [ FIG. 11 ] An example of a flowchart for determining abnormality based on a change in the relative position between the conveying unit and a predetermined member according to the first exemplary embodiment. [ FIG. 11 ] FIG.

[0019] [ FIG. 12 ] Another example of a flowchart for determining abnormality based on a change in the relative position between the conveying unit and the predetermined member according to the first exemplary embodiment. [ FIG.

[0020] [ FIG. 13 ] is yet another example of a flowchart for determining abnormality based on a change in the relative position between the conveying unit and a predetermined member according to the first exemplary embodiment. [ FIG.

[0021] [ Fig. 14 ] is a diagram showing a configuration of a conveying unit according to a second exemplary embodiment.

[0022] [FIGS. 15A and 15B] are diagrams illustrating the configuration of a conveying unit according to a third exemplary embodiment.

[0023] [ Fig. 16 ] is a flowchart of an article manufacturing method according to a fourth exemplary embodiment. Implementation Method

[0024] The following describes exemplary embodiments of the present disclosure with reference to the accompanying drawings. The following exemplary embodiments are not intended to limit the disclosure set forth in the claims. Although the exemplary embodiments describe various features, not all of these features are essential to the present disclosure, and these features may be combined in any desired manner. In the accompanying drawings, identical or similar components are denoted by the same reference numerals, and redundant descriptions thereof will be omitted.

[0025] In this specification and the drawings, directions are generally expressed using an XYZ coordinate system, where the vertical direction is the Z axis, the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are orthogonal to each other. However, if an XYZ coordinate system is drawn in a drawing, the drawn XYZ coordinate system takes precedence.

[0026] A specific configuration of the exemplary embodiment will be described below.

[0027] A first exemplary embodiment will be described. FIG1 is a schematic diagram illustrating the configuration of a substrate processing apparatus 1 according to this exemplary embodiment. In this exemplary embodiment, the substrate processing apparatus 1 is a projection exposure apparatus for exposing a substrate to a pattern of a master plate (mask or reticle) via a projection optical system using a step-and-repeat method or a step-and-scan method. However, the substrate processing apparatus 1 is not limited to a projection exposure apparatus. For example, the substrate processing apparatus 1 may be a drawing apparatus that patterns a substrate by drawing a pattern on the substrate using an electron beam or an ion beam. The substrate processing apparatus 1 may be another lithography apparatus, such as an imprint apparatus, that forms a pattern on a substrate by molding an imprint material on the substrate. Alternatively, the substrate processing apparatus 1 may be another apparatus for processing a semiconductor wafer or glass plate substrate, such as an ion implantation apparatus, a developing apparatus, an etching apparatus, a film deposition apparatus, an annealing apparatus, a sputtering apparatus, or a vapor deposition apparatus. The substrate processing apparatus 1 may be a planarization apparatus that uses a planar plate to planarize a composition on a substrate.

[0028] The substrate processing apparatus 1 includes a chamber 2 that covers the entire apparatus, an exposure unit 20 that performs exposure processing, a temperature adjustment unit 3, a pre-alignment unit 4, a conveying unit 6 that conveys substrates to predetermined positions, a stage 7, and a determination unit (determination device) 8. The temperature adjustment unit 3 is configured to adjust the temperature of a substrate placed thereon. The pre-alignment unit 4 pre-aligns the substrate prior to exposure processing in the exposure unit 20. The conveying unit 6 is, for example, a horizontal articulated robot (scalar robot) having a hand. The stage 7 includes a support member 71 for supporting the substrate on its top surface and is configured so that the substrate can be temporarily placed thereon. The determination unit 8 determines abnormalities in the substrate processing apparatus 1. The specific determination method (information processing method) of the determination unit 8 will be described below. Although the determination unit 8 determines abnormalities in the substrate processing apparatus 1, it can also function as a control unit for controlling the substrate processing apparatus 1. The determination unit 8 includes a transmission unit 81 that transmits the determined information. According to this exemplary embodiment, the temperature adjustment unit 3 includes a first sensor 50, the pre-alignment unit 4 includes a second sensor 51, and the exposure unit 20 includes a third sensor 52. The first sensor 50, the second sensor 51, and the third sensor 52 detect the relative position between the conveyor unit 6 and a predetermined component at the respective sensor locations. Examples of the sensors include camera sensors for detecting position using a camera and laser sensors for detecting position using a laser. For example, the first sensor 50 detects the relative position between the conveyor unit 6 and a predetermined component at the temperature adjustment unit 3. An example of the predetermined component is a substrate.

[0029] Next, the substrate conveying sequence will be described. First, a substrate delivered to the substrate processing apparatus 1 is placed on a support member 71 protruding from the top surface of the stage 7. The substrate is then conveyed from the stage 7 to the temperature adjustment unit 3 by the conveyor unit 6, where its temperature is adjusted. The substrate, whose temperature has been adjusted by the temperature adjustment unit 3, is then conveyed by the conveyor unit 6 to the pre-alignment unit 4 and pre-aligned prior to exposure processing. Alignment performed by the pre-alignment unit 4 includes, for example, adjusting the position of the substrate in the XY plane and the rotation angle of the substrate. Once alignment is complete, the substrate is conveyed to the exposure unit 20 by the conveyor unit 6 and undergoes exposure processing there. While the sequence in which the conveyor unit 6 conveys substrates according to this exemplary embodiment has been described, the conveying destination and conveying sequence are not limited to the aforementioned example. The user can freely set the predetermined locations to which the substrates are to be conveyed and the conveying sequence.

[0030] FIG2 is a diagram illustrating the configuration of an exposure unit 20 according to this exemplary embodiment. The exposure unit 20 includes an illumination optical system 23 for emitting light, a projection optical system 25, a reticle stage 24 for holding a reticle 21, and a substrate stage 5 for holding a substrate 22. The substrate stage 5 is configured to be movable in the X and Y directions. The substrate 22, which is transported to the exposure unit 20, is placed on the substrate stage 5. The reticle 21 is, for example, a master plate having a pattern to be transferred (e.g., a circuit pattern) formed of chromium on the surface of quartz glass. The substrate 22 is, for example, formed of single-crystal silicon. If the substrate processing apparatus 1 is an exposure apparatus, the substrate 22 transported to the substrate processing apparatus 1 has a photosensitive material (photoresist) applied to its surface. The illumination optical system 23 is a pattern forming unit for forming a pattern on the substrate 22. While this disclosure relates to an example of a lithography apparatus that forms a pattern using light, and the pattern forming unit is the illumination optical system 23, a lithography apparatus that cures a thermosetting material through heat may also be used. In this case, the pattern forming unit is, for example, a heating unit for heating a thermosetting material.

[0031] In substrate processing apparatus 1, exposure light from a light source (not shown) illuminates reticle 21 held by reticle stage 24 via illumination optical system 23. Light transmitted through reticle 21 is then irradiated onto substrate 22 via projection optical system 25. An image of the pattern formed on reticle 21 is formed on the surface of substrate 22. Thus, substrate processing apparatus 1 exposes a shot region on substrate 22, and similarly exposes multiple shot regions one by one.

[0032] FIG3A and FIG3B illustrate the configuration of the conveyor unit 6 according to this exemplary embodiment. FIG3A is a diagram of the conveyor unit 6 as viewed from the +Z direction side. The conveyor unit 6 includes a hand 65, and uses the hand 65 to hold and convey the substrate 22. The shape of the hand 65 may be other than that shown in FIG3A and is not particularly limited, as long as it can hold the substrate 22.

[0033] To position the hand 65 in the four axial directions (X, Y, Z, and θZ), the conveyor unit 6 includes a drive mechanism 61 for horizontal driving, a drive mechanism 62 for vertical driving, and drive mechanisms 63 and 64 for rotational driving. The drive mechanism 62 for vertical driving, the drive mechanisms 63 and 64 for rotational driving, and the hand 65 are coupled to a drive shaft 66. The combination of drive mechanisms is not limited to the aforementioned example, and the configuration, type, and number are not limited.

[0034] FIG3B is a view of the transport unit 6, viewed from the direction α shown in FIG3A, when it is picking up the substrate 22 placed on the stage 7. The substrate 22 is placed on the support member 71 protruding from the top surface of the stage 7. With the hand 65 inserted below the substrate 22, the hand 65 is moved by the drive mechanism 62 to approach the substrate 22. Through this movement, the hand 65 picks up the substrate 22 from the stage 7.

[0035] While the substrate processing apparatus 1 is in operation, the conveying unit 6 continues the conveying operation.

[0036] Therefore, the drive shaft 66, which is part of the conveyor unit 6, wears over time as the conveyor unit 6 continues to deliver and the number of deliveries it makes. Due to this wear (long-term degradation), the tilt of the drive shaft 66 changes over time. As the drive shaft 66 wears and tilts, the position of the components coupled to it changes, and the position of the hand 65 in contact with the substrate 22 is also affected and changes. Specifically, the change in the tilt of the drive shaft 66 over time causes the side of the hand 65 facing away from the drive shaft 66 to lower in the -Z direction, causing the hand 65 to sag. As a result, the relative position of the hand 65 and a predetermined component (such as a substrate) changes.

[0037] In addition to secular changes, other factors can also cause changes in the position of hand 65. For example, the position of hand 65 may change due to an abnormal initial attachment position of drive shaft 66. If the initial attachment position of drive shaft 66 is abnormal, hand 65 may not only tilt in the downward direction (-Z direction) but also warp upward (+Z direction).

[0038] 4A and 4B illustrate an example in which the conveying unit 6 according to the present exemplary embodiment takes the substrate 22 from the supporting member 71. Fig. 4A illustrates a case in which the driving shaft 66 is not tilted. The hand 65 can contact the substrate 22 in a parallel state.

[0039] FIG4B shows a case where the drive shaft 66 is tilted. The hand 65 and the substrate 22 are in contact in an abnormal non-parallel state. In such an abnormal state (abnormal tilt), the contact between the hand 65 and the substrate 22 may damage the hand 65 and the substrate 22.

[0040] The gap g shown in Figures 4A and 4B is the distance between the substrate holding surface of the hand 65, which is part of the conveyor unit 6, and the bottom surface of the substrate 22 placed on the support member 71. Even when the movement command for the conveyor unit 6 is the same, the gap g varies between when the drive shaft 66 is tilted and when it is not tilted. For example, the gap g in Figure 4B is smaller than the gap g in Figure 4A. In other words, by measuring the gap g, changes in the position state (tilt state) of the hand 65 can be detected. The first sensor 50, the second sensor 51, and the third sensor 52 measure the gap g between a predetermined member (in this exemplary embodiment, the substrate 22) and the conveyor unit 6 (hand 65) at a predetermined position. The gap g indicates the relative position between the predetermined member and the conveyor unit 6.

[0041] 5 is a diagram showing a floor on which units of the substrate processing apparatus 1 according to this exemplary embodiment are installed. These units are the exposure unit 20, the temperature adjustment unit 3, the pre-alignment unit 4, the determination unit 8, the conveying unit 6, and the stage 7 constituting the substrate processing apparatus 1.

[0042] Each unit is arranged in one of two modules. The two modules include the first floor panel 100 or the second floor panel 200. For example, the first floor panel 100 and the second floor panel 200 according to this exemplary embodiment are both a single member (plate member).

[0043] The module comprising the first floor 100 includes a conveyor unit 6, a stage 7, and a temperature adjustment unit 3 mounted on the first floor 100. The module comprising the second floor 200 includes a pre-alignment unit 4, an exposure unit 20, and a determination unit 8 mounted on the second floor 200. In this exemplary embodiment, the units in the substrate processing apparatus 1 are divided between the two modules, such that the pre-alignment unit 4 and the exposure unit 20 belong to one module, and the temperature adjustment unit 3 and the conveyor unit 6 belong to the other module. However, the number of modules and the internal configuration of the modules are not limited to the examples described in this exemplary embodiment and are not specifically limited.

[0044] If the interior of the substrate processing apparatus 1 (the interior of the chamber 2) is divided into modules in this manner, the floor of one of the modules in the chamber 2 having a heavier unit will sink, causing the floor height of that module to be lower than the floor height of the other modules. Figures 6A and 6B are schematic diagrams of the transport unit 6 receiving the substrate 22 placed on the substrate stage 5, as viewed from the β direction shown in Figure 5. The substrate 22 is supported by a support member 26, which is arranged on the substrate stage 5 and is movable in the Z-axis direction.

[0045] FIG6A illustrates a case where the first floor 100 and the second floor 200 are at the same height. FIG6B illustrates a case where the exposure unit 20 is heavy, the second floor 200 on which the substrate stage 5 of the exposure unit 20 is mounted has sunk, and the height of the second floor 200 is lower than that of the first floor 100. The gap g measured by the third sensor 52 in FIG6B , which indicates the relative position between the hand 65 and the substrate 22, is smaller than the gap g in FIG6A . Therefore, in addition to long-term changes caused by wear of the drive shaft 66, the relative position between the conveyor unit 6 and the predetermined member (in this exemplary embodiment, the substrate 22) has changed due to the floor sinking.

[0046] Figures 7A to 7C are schematic diagrams of the transport unit 6 as it retrieves a first substrate 28 (second member) placed on the substrate stage 5 (second measurement position) and a second substrate 29 (first member) placed on the temperature adjustment unit 3 (first measurement position). Figures 7A to 7C show the situation as viewed from the β direction shown in Figure 5. The second substrate 29 is supported by a support member 36 disposed on the temperature adjustment unit 3 and movable along the Z axis. The transport unit 6 is shown in dashed lines as it retrieves the second substrate 29 placed on the temperature adjustment unit 3.

[0047] FIG7A shows a situation at a first timing, where the first floor 100 and the second floor 200 are at the same height. FIG7B shows a situation at a second timing, when a period of time has elapsed since the first timing, where the first floor 100 and the second floor 200 are at the same height. FIG7C shows a situation at a second timing, when a period of time has elapsed since the first timing, where the exposure unit 20 is heavy and the second floor 200 on which the substrate stage 5 of the exposure unit 20 is disposed has sunk, and the height of the second floor 200 is lower than that of the first floor 100.

[0048] In this exemplary embodiment, the timing for measuring the relative position between a predetermined component and the conveyor unit 6 at multiple measurement positions pre-set by the user is assumed to be when the conveyor unit 6 moves to the corresponding measurement positions. Specifically, if the predetermined component is a substrate, the relative position is measured each time the substrate is placed at a measurement position (e.g., the temperature adjustment unit 3, the pre-alignment unit 4, and the substrate stage 5). To describe long-term changes, the first and second timings according to this exemplary embodiment are assumed to be the timings where a certain period of time has elapsed since the first timing. In this exemplary embodiment, the measurement of the relative position at the first timing will be referred to as the first measurement process, while the measurement of the relative position at the second timing will be referred to as the second measurement process.

[0049] The measurement results obtained by measuring the gap g indicating the relative position between the index hand 65 and the first substrate 28 at the substrate stage 5 using the third sensor 52 will be referred to as first gaps (g1, g3, and g5). The measurement results obtained by measuring the gap g indicating the relative position between the index hand 65 and the second substrate 29 at the temperature adjustment unit 3 using the first sensor 50 will be referred to as second gaps (g2, g4, and g6).

[0050] As shown in Figure 7A, at a first timing when the floor has not sunk and the reference position (reference relative position) of the hand 65 relative to the substrate at the temperature adjustment unit 3 is the same as the reference position (reference relative position) of the hand 65 relative to the substrate at the substrate stage 5, gap g1 and gap g2 are the same. Here, the reference position can be the position where the hand 65 is positioned below the substrate to begin acquiring the substrate, or it can be the position where the hand 65, positioned below the substrate, has moved a predetermined height or for a predetermined time. The first gap g1 and the second gap g2 are the first relative positions.

[0051] As shown in FIG7B , at a second timing, some time after the first timing, and in the absence of floor sinking, the relative position between the hand 65 and the substrate is affected by long-term changes (temporal changes in the inclination of the hand 65) due to wear of the drive shaft 66. The gap measured at the second timing in FIG7B , indicating the relative position between the first substrate 28 on the substrate stage 5 and the conveyor unit 6, is the first gap g3. The gap measured at the second timing, indicating the relative position between the second substrate 29 on the temperature adjustment unit 3 and the conveyor unit 6, is the second gap g4. The first gap g3 and the second gap g4 represent the second relative position.

[0052] The change in the first gap at the substrate stage 5 between the first and second timings (the second tendency) is represented by the difference G3 or g3-g1 between the first gap g3 and the first gap g1. The change in the second gap at the temperature adjustment unit 3 between the first and second timings (the first tendency) is represented by the difference G4 or g4-g2 between the second gap g4 and the second gap g2. In Figure 7B , there is no floor sinking, and the change in the gap depends on the long-term change in the inclination of the hand 65. In other words, the difference G3 and the difference G4 have similar tendencies. Specifically, the difference G3 and the difference G4 have the same or similar values.

[0053] Figure 7C shows a second timing, after a period of time has passed since the first timing. The exposure unit 20 is heavy, and the second floor 200 of the substrate stage 5 on which the exposure unit 20 is mounted has sunk, with the height of the second floor 200 being lower than that of the first floor 100. In this case of floor sinking, the change in the relative position between the hand 65 and the substrate depends on multiple factors. Specifically, the relative position depends on the change in the position of the unit due to the sinking floor and the long-term change (over-time change in the tilt of the hand 65) caused by wear of the drive shaft 66. The gap measured at the second timing in Figure 7C, indicating the relative position of the first substrate 28 on the substrate stage 5 and the conveyor unit 6, is the first gap g5. The gap measured at the second timing, indicating the relative position of the second substrate 29 on the temperature adjustment unit 3 and the conveyor unit 6, is the second gap g6. The first gap g5 and the second gap g6 represent the second relative position.

[0054] The change in the first gap at the substrate stage 5 between the first and second timings (the second tendency) is represented by the difference G5 between the first gap g5 and the first gap g1, or g5-g1. The change in the second gap at the temperature adjustment unit 3 between the first and second timings (the first tendency) is represented by the difference G6 between the second gap g6 and the second gap g2, or g6-g2. Because of floor subsidence in Figure 7C, the change in the gap depends on the long-term change in the inclination of the hand 65 and the change in the position of the unit that has sunk due to the floor subsidence. In other words, the difference G5 and the difference G6 have different tendencies. Specifically, the absolute value of the difference G5 is greater than the difference G6. The difference in the values ​​of the differences G5 and G6 is as great as the effect of the floor subsidence.

[0055] Next, we will describe a case where the floor sinks and tilts, and the relative position (gap g) between the conveyor unit 6 and the predetermined member (base plate) fluctuates even for units installed on the same floor. This floor tilt depends on the weight of the unit and the unit's installation location.

[0056] Figures 8A to 8C are diagrams showing the gap g at the units on the same floor at the first or second timing. Figures 8A to 8C are schematic diagrams showing the conveyor unit 6 capturing the first substrate 28 (second member) placed on the substrate stage 5 (second measurement position) mounted on the second floor 200 and the third substrate 30 (first member) placed on the pre-alignment unit 4 (first measurement position) mounted on the second floor 200. Figures 8A to 8C show the situation as viewed in the β direction shown in Figure 5. The third substrate 30 is supported by a support member 46 arranged on the pre-alignment unit 4 and movable along the Z axis. The conveyor unit 6 (hand 65) is shown in dotted lines when capturing the first substrate 28 placed on the substrate stage 5.

[0057] The measurement results obtained by measuring the gap g indicating the relative position of the index hand 65 and the first substrate 28 at the substrate stage 5 using the third sensor 52 will be referred to as third gaps (g7, g9, and g11). The measurement results obtained by measuring the gap g indicating the relative position of the index hand 65 and the third substrate 30 at the pre-alignment unit 4 using the second sensor 51 will be referred to as fourth gaps (g8, g10, and g12).

[0058] As shown in Figure 8A , at the first timing when the floor has not sunk, and when the reference position (reference relative position) of the hand 65 relative to the substrate at the pre-alignment unit 4 is the same as the reference position (reference relative position) of the hand 65 relative to the substrate at the substrate stage 5, the third gap g7 and the fourth gap g8 are the same. Here, the reference position can be the position where the hand 65 is positioned below the substrate to begin acquiring the substrate, or it can be the position where the hand 65, located below the substrate, has moved a predetermined height or for a predetermined time. The third gap g7 and the fourth gap g8 are the first relative positions.

[0059] FIG8B illustrates a case where the second floor panel 200 is sunk parallel to the first floor panel 100. In the case of FIG8B , if the reference position (reference relative position) of the hand 65 relative to the substrate at the pre-alignment unit 4 is the same as the reference position (reference relative position) of the hand 65 relative to the substrate at the substrate stage 5, the third gap g9 and the fourth gap g10 are the same.

[0060] In FIG8B , the difference G9 between the third gap g7 and the third gap g9, or g9-g7, represents the change in the gap at the substrate stage 5 between the first and second timings (a second tendency). The difference G10 between the fourth gap g8 and the fourth gap g10, or g10-g8, represents the change in the gap at the pre-alignment unit 4 between the first and second timings (a first tendency). In FIG8B , since the second floor panel 200 is sunk parallel to the first floor panel 100, the difference G9 and the difference G10 have similar tendencies. Specifically, the difference G9 and the difference G10 have the same or similar values. The third gap g9 and the fourth gap g10 represent the second relative position.

[0061] FIG8C illustrates a case where the second floor 200 sinks to tilt relative to the first floor 100. In the case of FIG8C , if the reference position (reference relative position) of the hand 65 relative to the substrate at the pre-alignment unit 4 is the same as the reference position (reference relative position) of the hand 65 relative to the substrate at the substrate stage 5, the third gap g11 is smaller than the fourth gap g12 because the heavier substrate stage 5 sinks more.

[0062] In FIG8C , the change in the gap at the substrate stage 5 between the first and second timings (the second tendency) is represented by the difference G11 between the third gap g7 and the third gap g11, or g11-g7. The change in the gap at the pre-alignment unit 4 between the first and second timings (the first tendency) is represented by the difference G12 between the fourth gap g8 and the fourth gap g12, or g12-g8. In FIG8C , because the second floor 200 sinks and tilts relative to the first floor 100, the difference G11 and the difference G12 have different tendencies. Specifically, the absolute value of the difference G11 is greater than the difference G12. The difference in value between the differences G11 and G12 is as large as the height change caused by the tilt of the floor 200. The third gap g11 and the fourth gap g12 represent the second relative position.

[0063] As described above, due to long-term changes in the transport unit 6 and the position and angle of the floor panels 100 and 200, the relative position between the transport unit 6 and the predetermined components arranged at different locations changes over time. Long-term changes in the transport unit 6 and the position and angle of the floor panels 100 and 200 have different tendencies for changes in the relative positions of the respective units. In other words, based on the tendency of the relative position changes between the transport unit 6 and the predetermined components at two or more units, it is possible to determine whether an abnormality exists in the transport unit 6 and whether an abnormality exists in the floor panels. By identifying the cause of the relative position change (abnormality) thus determined, the user can appropriately address the abnormality. For example, if the relative position between the transport unit 6 and the predetermined component changes due to long-term changes in the tilt of the drive shaft 66 of the transport unit 6, the tilt of the drive shaft 66 of the transport unit 6 can be corrected. Alternatively, the reference position of the insertion hand 65 at the respective unit can be corrected. On the other hand, if the relative position between the transport unit 6 and the predetermined component changes due to changes in the floor panels, the floor panel height can be corrected. Alternatively, the reference position of the insertion hand 65 at the corresponding unit may be corrected based on a change in the relative position affected by a change in the position and angle of the floor.

[0064] Figures 9A and 9B illustrate the measurement results of the gap g according to this exemplary embodiment, assuming there are no abnormalities in the floor. Figures 9A and 9B illustrate an example in which the gap g between the conveyor unit 6 and a predetermined component is measured five times (at five timings) at each of Unit A (temperature adjustment unit 3), Unit B (pre-alignment unit 4), and Unit C (substrate stage 5). Figure 9A is a table showing the measurement results. Figure 9B is a graph showing the measurement results. Based on the gap g measurement results, the determination unit 8 determines the difference δ between each measurement result and the previous measurement result for the predetermined component corresponding to each unit. The difference δ indicates the tendency of change in the relative position between the predetermined component and the conveyor unit 6. More specifically, in the aforementioned example, the difference δ indicates a first tendency and a second tendency. For example, the difference δA in the third measurement at Unit A is 0.1 mm, which is the difference between the third gap g measurement result of 1.1 mm and the second gap g measurement result of 1.0 mm.

[0065] Determination unit 8 also determines the difference Δ between the differences δ of the predetermined components corresponding to the respective units. The difference Δ indicates the difference in the tendency of change in the relative position between the predetermined component and conveyor unit 6. In other words, the difference Δ indicates the difference between the first tendency and the second tendency. For example, since the difference δA of the third measurement result of unit A is 0.1 (mm) and the difference δB of the third measurement result of unit B is 0.2 (mm), the difference ΔAB between the third measurement results of units A and B is 0.1 (mm). Here, the difference Δ is expressed as an absolute value. Determination unit 8 then determines the average value P of the differences Δ determined between the units (difference ΔAB and difference ΔBC). The average value of the differences ΔAB will be referred to as average value P(AB), while the average value of the differences ΔBC will be referred to as average value P(BC). As shown in Figures 9A and 9B, units A, B, and C have similar tendencies in long-term change. Here, the difference Δ indicates the difference between the first tendency and the second tendency. As the average value of the differences Δ, average value P also indicates the difference between the first tendency and the second tendency.

[0066] Although the average value is used as a value indicating the difference in long-term change trends between units in this exemplary embodiment, individual determinations may be made using the difference between corresponding measurement results rather than the average value. Coefficients calculated through curve fitting may be used. Other statistical techniques such as correlation and regression analysis may be used without any particular limitation.

[0067] Figures 10A and 10B show the measurement results of the gap g according to this exemplary embodiment, when an anomaly in the floor is present. As shown in Figures 10A and 10B, units A, B, and C have different trends in relative positional change. Units B and C have similar long-term change trends. These trends indicate an anomaly in the floor where units B and C are installed, indicating subsidence. This anomaly is also indicated by the average value P. In Figure 10A, the average value P(AB) for units A and B is 0.15 mm, which is 0.05 mm larger than the average value P(AB) in Figure 9A, where no anomaly is present. In other words, the anomaly can be detected by determining the average value P.

[0068] Determination unit 8 according to this exemplary embodiment can determine the presence and location of an abnormality by determining average value P. Specifically, determination unit 8 is capable of performing six types of determinations: no abnormality, an abnormality in the conveying unit, an abnormality in the floor (floor sinking), an abnormality in the floor (floor sinking) and an abnormality in the conveying unit, an abnormality in the floor (floor sinking and floor tilting), and an abnormality in the floor (floor sinking and floor tilting) and an abnormality in the conveying unit.

[0069] Figure 11 is an example of a flowchart for determining an abnormality based on a change in the relative position between the conveyor unit 6 and a predetermined component according to this exemplary embodiment. In step S10, the first sensor 50, the second sensor 51, and the third sensor 52 measure the gap g between the predetermined component and the conveyor unit 6 at their respective locations. In step S20, the determination unit 8 determines whether the number of measurements in step S10 has reached a predetermined number of measurements. The predetermined number of measurements can be freely set by the user. The greater the predetermined number of measurements, the longer the period of time during which an abnormality is determined based on long-term changes. In this exemplary embodiment, the relative position between the predetermined component and the conveyor unit 6 is measured each time the conveyor unit 6 moves to each measurement position where the predetermined component is located. However, the relative position between the predetermined component and the conveyor unit 6 does not need to be measured each time the conveyor unit 6 moves to each measurement position, and the timing of relative position measurement can be temporarily managed. For example, the user can pre-set step S10 to be performed monthly. With this setting, if the predetermined number of measurements is five and the current number of measurements in step S10 is four, step S10 can be skipped until the next scheduled time (one month later). In step S20, if the number of measurements has not yet reached the predetermined number ("No" in step S20), the process returns to step S10. If the number of measurements has reached the predetermined number ("Yes" in step S20), the process proceeds to step S30. In step S30, the determination unit 8 determines the difference δ between the measurement result of the gap g at each cell and the corresponding previous measurement result. In step S40, the determination unit 8 determines the difference Δ between the differences δ of the corresponding cells and determines the average value P of the differences Δ.

[0070] In step S50, determination unit 8 determines whether the gap g measured at each unit (first and second relative positions) falls within range V (first range). The determination in step S50 is intended to determine whether an abnormality exists. While the determination in step S50 is based on the first and second relative positions in this exemplary embodiment, the determination may be based on the last measured gap g. Range V is set for each unit and is determined by the user based on the gap g between the conveyor unit 6 and a predetermined component in the absence of an abnormality in the conveyor unit 6 or the floor. If, in step S50, gap g falls within the first range ("YES" in step S50), processing proceeds to step S60. In step S60, determination unit 8 determines that an abnormality exists in the conveyor unit 6 or the floor. Processing ends.

[0071] In step S50, if it is determined that the gap g (at least one of the first relative position and the second relative position) at any unit falls outside the first range ("No" in step S50), processing proceeds to step S70. In step S70, determination unit 8 determines whether the average value P(AB), indicating the difference between the first and second inclinations of unit A installed on the same floor as conveyor unit 6 and unit B installed on a different floor, is less than a threshold value W (first threshold value). Step S70 is intended to determine whether there is a floor subsidence anomaly. By determining the average value P(AB) of units A and B installed on different floors, determination unit 8 determines an anomaly based on the long-term trend of changes in units A and B. Threshold value W is set by the user based on the long-term change in gap g between conveyor unit 6 and a predetermined component when only an anomaly exists in conveyor unit 6 and no floor subsidence anomaly exists. If average value P(AB) is greater than or equal to threshold value W ("No" in step S70), processing proceeds to step S90. Here, determination unit 8 determines that at least a floor subsidence anomaly exists. If the average value P(AB) is less than the threshold value W, determination unit 8 determines that there is no abnormality of floor subsidence. For example, assume that the threshold value W is set to 0.1 (mm) in the examples of Figures 9A to 10B. In the examples of Figures 9A and 9B, determination unit 8 determines that there is no abnormality of floor subsidence. In the examples of Figures 10A and 10B, determination unit 8 determines that there is an abnormality of floor subsidence.

[0072] In step S70, if average value P(AB) is less than threshold value W ("YES" in step S70), processing proceeds to step S80. In step S80, since the long-term changes in units installed on different floors indicate similar trends, determination unit 8 determines that there is no abnormality related to floor subsidence, as described above. Since determination unit 8 determined in step S50 that an abnormality exists, and in step S70 determined that the abnormality cannot be attributed to an abnormality related to floor subsidence, determination unit 8 now determines that an abnormality exists in conveyor unit 6.

[0073] In step S90, determination unit 8 determines whether the average value P(BC) indicating the difference between the first and second inclinations of units B and C, which are installed on a different floor from conveyor unit 6, is less than a threshold value X (a second threshold value). Step S90 is intended to determine whether the floor is tilted. By determining the average value P(BC) of units B and C, which are installed on the same floor, it is determined whether there is an abnormality in the floor tilt.

[0074] The user sets the threshold value X based on the long-term change in the gap g between the conveyor unit 6 and the predetermined member when there is no abnormal floor tilt. If the average value P(BC) is greater than or equal to the threshold value X, the determination unit 8 determines that there is an abnormal floor tilt. If the average value P(BC) is less than the threshold value X, the determination unit 8 determines that there is no abnormal floor tilt.

[0075] The presence of a floor tilt anomaly also means the presence of a floor sinking anomaly. Although in this exemplary embodiment, the presence of a floor tilt anomaly is determined after the presence of a floor sinking anomaly is determined, the order of determination is not particularly limited. In other words, the presence of a floor sinking anomaly can be determined after the presence of a floor tilt anomaly is determined.

[0076] In step S90, if the average value P(BC) is less than the threshold value X ("YES" in step S90), the process proceeds to step S100. Here, since the long-term changes in the units installed on the same floor indicate similar trends, as described above, determination unit 8 determines that there is no abnormality in the floor tilt. Since determination unit 8 determined in step S70 that there is an abnormality in the floor, and in step S90 that there is no abnormality in the floor tilt, determination unit 8 here determines that there is an abnormality in the floor sinking.

[0077] In step S100, determination unit 8 determines whether the gap g measured at unit A (the first relative position and the second relative position) falls within range Y (the second range). Step S100 is intended to determine whether an abnormality exists in conveyor unit 6 other than the floor sinking abnormality. While the determination in step S100 is based on the first and second relative positions in this exemplary embodiment, the determination may be based on the last measured gap g. Range Y is set by the user based on the gap g between the predetermined component at unit A and conveyor unit 6, assuming no abnormality exists in conveyor unit 6. In step S100, if both the first and second relative positions fall within the second range ("Yes" in step S100), processing proceeds to step S110. In step S110, determination unit 8 determines that the floor sinking abnormality exists. If, in step S100, at least one of the first and second relative positions falls outside the second range ("No" in step S100), processing proceeds to step S120. In step S120, the determination unit 8 determines that there are both an abnormality in the conveying unit 6 and an abnormality in the floor sinking.

[0078] In step S90, if the average value P(BC) is determined to be greater than or equal to the threshold value X ("No" in step S90), processing proceeds to step S130. Since the long-term changes in units B and C installed on the same floor have different trends, the floor on which units B and C are installed is indicated to be tilted. In step S130, determination unit 8 determines whether the gap g measured at unit A (first and second relative positions) falls within range Y (second range). Step S130 is intended to determine whether an abnormality exists in conveyor unit 6 in addition to the abnormality of floor sinking and the abnormality of floor tilting. While the determination in step S130 is based on the first and second relative positions in this exemplary embodiment, the determination can also be based on the last measured gap g. In step S130, if both the first and second relative positions fall within the second range ("Yes" in step S130), processing proceeds to step S140. In step S140, determination unit 8 determines the presence of both the abnormality of floor sinking and the abnormality of floor tilting. If at least one of the first relative position and the second relative position falls outside the second range in step S130 ("No" in step S130), the process proceeds to step S150. In step S150, determination unit 8 determines that an abnormality exists in conveyor unit 6 concurrently with the abnormality of floor sinking and the abnormality of floor tilting. The processes from step S50 to step S150 are referred to as determination processing.

[0079] In step S160, after the determination in step S80, step S110, step S120, step S140, or step S150, the determination unit 8 issues a notification regarding the determined abnormality(s). The process ends. To issue this abnormality notification, the determination unit 8 may control the transmission unit 81 to transmit abnormality-related information to a display control unit (not shown). The display control unit may then notify the user of the abnormality(s) by displaying the abnormality-related information on a display unit (not shown). Alternatively, the determination unit 8 may control the emission of a warning sound and use the warning sound to notify the user of the abnormality(s). The determination unit 8 may be configured to notify the user of the abnormality and stop conveyance by the conveyor unit 6 when an abnormality occurs. Stopping conveyance by the conveyor unit 6 when an abnormality occurs can prevent interference between the conveyor unit 6 and components such as substrates.

[0080] FIG12 is another example of a flowchart for determining an abnormality based on a change in the relative position between the conveyor unit and a predetermined component according to this exemplary embodiment, which differs from the flowchart of FIG11 . FIG12 illustrates a case where measurements are taken and abnormalities are determined at two measurement locations: unit A, which is installed on the same floor as conveyor unit 6, and unit B, which is installed on a different floor.

[0081] In step S210, the first sensor 50, the second sensor 51, and the third sensor 52 first measure the gap g between the predetermined component and the conveyor unit 6 at the corresponding unit. In step S220, the determination unit 8 determines whether the number of measurements in step S210 has reached the predetermined number of measurements. If the number of measurements in step S220 has not reached the predetermined number of measurements ("No" in step S220), the process returns to step S210. If the number of measurements in step S220 has reached the predetermined number of measurements ("Yes" in step S220), the process proceeds to step S230. In step S230, the determination unit 8 determines the difference δ between the measurement result of the gap g at each unit and the corresponding previous measurement result. In step S240, the determination unit 8 determines the difference Δ between the differences δ of the corresponding units and determines the average value P of the differences Δ.

[0082] In step S250, determination unit 8 determines whether the gap g measured at each unit (first and second relative positions) falls within range V (first range). The determination in step S250 is intended to determine whether an abnormality exists. While the determination in step S250 is based on the first and second relative positions in this exemplary embodiment, the determination may be based on the last measured gap g. Range V is set for each unit and is determined by the user based on the gap g between the conveyor unit 6 and a predetermined component in the absence of an abnormality in the conveyor unit 6 or the floor. If, in step S250, gap g falls within the first range ("YES" in step S250), processing proceeds to step S260. In step S260, determination unit 8 determines that an abnormality exists in the conveyor unit 6 or the floor. Processing ends.

[0083] In step S250 , if it is determined that the gap g at any cell (at least one of the first relative position and the second relative position) falls outside the first range (“No” in step S250 ), the process proceeds to step S270 .

[0084] In step S270, determination unit 8 determines whether the average value P(AB), indicating the difference between the first and second inclinations of unit A installed on the same floor as conveyor unit 6 and unit B installed on a different floor, is less than a threshold value W (first threshold value). Step S270 is intended to determine whether a floor subsidence anomaly exists. By determining the average value P(AB) of units A and B installed on different floors, determination unit 8 determines an anomaly based on the long-term changing trends of units A and B. Threshold value W is set by the user based on the long-term change in the gap g between conveyor unit 6 and a predetermined component when only an anomaly exists in conveyor unit 6 and no floor subsidence anomaly exists. If average value P(AB) is greater than or equal to threshold value W ("No" in step S270), processing proceeds to step S290. Here, determination unit 8 determines that at least a floor subsidence anomaly exists. If average value P(AB) is less than threshold value W, determination unit 8 determines that a floor subsidence anomaly does not exist.

[0085] In step S270, if average value P(AB) is less than threshold value W ("YES" in step S270), processing proceeds to step S280. In step S280, since the long-term changes in units installed on different floors indicate similar trends, determination unit 8 determines that there is no abnormality related to floor subsidence, as described above. Since determination unit 8 determined in step S250 that an abnormality existed, and in step S270 determined that the abnormality could not be attributed to an abnormality related to floor subsidence, determination unit 8 now determines that there is an abnormality in conveyor unit 6.

[0086] In step S290, determination unit 8 determines whether the gap g (first and second relative positions) measured at unit A falls within range Y (second range). Step S290 is intended to determine whether, in addition to the floor sinking anomaly, there is an abnormality in conveyor unit 6. While the determination in step S290 is based on the first and second relative positions in this exemplary embodiment, the determination can also be based on the last measured gap g. If both the first and second relative positions fall within the second range in step S290 ("Yes" in step S290), processing proceeds to step S300. In step S300, determination unit 8 determines that there is a floor sinking anomaly. If at least one of the first and second relative positions falls outside the second range in step S290 ("No" in step S290), processing proceeds to step S310. In step S310, determination unit 8 determines that both an abnormality in conveyor unit 6 and a floor sinking anomaly exist. The process from steps S250 to S310 is referred to as determination processing.

[0087] In step S320, after the determination in step S280, step S300, or step S310, the determination unit 8 issues a notification regarding the determined abnormality(ies). The process ends.

[0088] FIG13 is another example of a flowchart for determining an abnormality based on a change in the relative position between the conveyor unit and a predetermined component according to this exemplary embodiment, which differs from the flowcharts of FIG11 and FIG12 . FIG13 illustrates a case where measurements are taken and abnormalities are determined at two measurement locations: unit B and unit C, which are installed on a different floor than conveyor unit 6. Unit B and unit C are installed on the same floor.

[0089] In step S410, the first sensor 50, the second sensor 51, and the third sensor 52 first measure the gap g between the predetermined component and the conveyor unit 6 at the corresponding unit. In step S420, the determination unit 8 determines whether the number of measurements in step S410 has reached the predetermined number of measurements. If the number of measurements in step S420 has not reached the predetermined number of measurements ("No" in step S420), the process returns to step S410. If the number of measurements in step S420 has reached the predetermined number of measurements ("Yes" in step S420), the process proceeds to step S430. In step S430, the determination unit 8 determines the difference δ between the measurement result of the gap g at each unit and the corresponding previous measurement result. In step S440, the determination unit 8 determines the difference Δ between the differences δ of the corresponding units and determines the average value P of the differences Δ.

[0090] In step S450, determination unit 8 determines whether the gap g measured at each unit (first and second relative positions) falls within range V (first range). The determination in step S450 is intended to determine whether an abnormality exists. While the determination in step S450 is based on the first and second relative positions in this exemplary embodiment, the determination can also be based on the last measured gap g. Range V is set for each unit and is determined by the user based on the gap g between the conveyor unit 6 and the predetermined component in the absence of an abnormality in the conveyor unit 6 or the floor. If, in step S450, gap g falls within the first range ("YES" in step S450), processing proceeds to step S460. In step S460, determination unit 8 determines that an abnormality exists in the conveyor unit 6 or the floor. Processing ends.

[0091] In step S450 , if it is determined that the gap g at any cell (at least one of the first relative position and the second relative position) falls outside the first range (“No” in step S450 ), the process proceeds to step S470 .

[0092] In step S470, determination unit 8 determines whether the average value P(BC), indicating the difference between the first and second inclinations of units B and C installed on a different floor from conveyor unit 6, is less than a threshold value X (a second threshold value). Step S470 is intended to determine whether the floor is tilted. By determining the average value P(BC) of units B and C installed on the same floor, it is determined whether an abnormality due to floor tilt exists. The threshold value X is set by the user based on the long-term change in the gap g between conveyor unit 6 and a predetermined component, when an abnormality exists only in conveyor unit 6 and not in floor tilt. If the average value P(BC) is greater than or equal to the threshold value X, determination unit 8 determines that a floor tilt abnormality exists. If the average value P(BC) is less than the threshold value X, determination unit 8 determines that a floor tilt abnormality does not exist. The presence of a floor tilt abnormality also means a floor sinking abnormality.

[0093] In step S470, if the average value P(BC) is less than the threshold value X ("YES" in step S470), the process proceeds to step S480. In step S480, since the long-term changes in the units installed on the same floor indicate similar trends, determination unit 8 determines that there is no abnormality in the floor tilt, as described above. Since determination unit 8 determined in step S450 that there is an abnormality in the floor, and in step S470 that there is no abnormality in the floor tilt, determination unit 8 now determines that there is an abnormality in conveyor unit 6.

[0094] If it is determined in step S470 that the average value P(BC) is greater than or equal to the threshold value X ("No" in step S470), the process proceeds to step S490. This means that the long-term changes in the gap g at units B and C, installed on the same floor, have different trends, and the floor on which units B and C are installed is tilted. In step S490, determination unit 8 determines whether the gap g measured at each unit (first relative position and second relative position) falls within range Y (second range). Step S490 is intended to determine whether an abnormality exists in conveyor unit 6 other than the floor sinking abnormality. While the determination in step S490 is based on the first and second relative positions in this exemplary embodiment, the determination may be based on the last measured gap g. If both the first and second relative positions fall within the second range in step S490 ("Yes" in step S490), the process proceeds to step S500. In step S500, determination unit 8 determines that the floor sinking abnormality exists. If at least one of the first relative position and the second relative position falls outside the second range in step S490 ("No" in step S490), the process proceeds to step S510. In step S510, determination unit 8 determines that both an abnormality in conveyor unit 6 and an abnormality in floor subsidence exist. The process from steps S450 to S510 is referred to as determination processing.

[0095] In step S520, after the determination in step S480, step S500, or step S510, the determination unit 8 issues a notification regarding the determined abnormality(ies). The process ends.

[0096] While determination unit 8 is located within substrate processing apparatus 1 in this exemplary embodiment, determination unit 8 may alternatively be a processing unit of an information processing device located outside substrate processing apparatus 1 and communicating information with substrate processing apparatus 1. In this case, determination unit (processing unit) 8 determines an abnormality based on information regarding gap g measured within substrate processing apparatus 1 and notifies substrate processing apparatus 1 of the determination result. This configuration allows the burden of determination processing to be handled externally to substrate processing apparatus 1.

[0097] Specifically, the information processing device includes an acquisition unit and a processing unit. The acquisition unit acquires the relative positions between the component and the conveyor unit 6 corresponding to multiple measurement positions, and the processing unit determines an abnormality based on the information acquired by the acquisition unit. The acquisition unit acquires a measurement result of a first relative position, which is the relative position between the component and the conveyor unit 6 corresponding to the multiple measurement positions when the conveyor unit 6 moves to the multiple measurement positions. The acquisition unit also acquires a measurement result of a second relative position, which is the relative position between the component and the conveyor unit 6 corresponding to the multiple measurement positions after the first relative position is measured. The process by which the acquisition unit acquires the measurement results of the first and second relative positions is referred to as acquisition processing. Based on the measurement results of the first and second relative positions acquired by the acquisition unit, the processing unit determines whether an abnormality exists in the conveyor unit 6 and whether an abnormality exists in the floor at one of the measurement positions (determination processing).

[0098] For example, the decision unit (processing unit) 8 can be composed of a programmable logic device (PLD) (such as a field programmable gate array (FPGA)), an application-specific integrated circuit (ASIC), a computer with a built-in program, or a combination of all or some of these. The decision unit (processing unit) 8 includes a central processing unit (CPU), a bus, read-only memory (ROM), random access memory (RAM), and storage devices. Each component functions based on a program. The CPU is a processing unit that performs calculations for control based on the program and controls the components connected to the bus. ROM is a memory dedicated to data reading and writing, and is used to store programs and data, as well as temporarily store data such as CPU calculation results. Storage devices are also used to store programs and data. Storage devices also serve as temporary storage areas for operating system (OS) programs and data for the decision unit (processing unit) 8. Storage devices are slower than RAM in data input and output, but can store large amounts of data. Storage devices are non-volatile storage devices that can store data permanently, allowing for long-term access. Storage devices primarily consist of magnetic storage devices (hard disk drives (HDDs)), but can also be loaded with external media such as compact discs (CDs), digital versatile discs (DVDs), and memory cards for data reading and writing.

[0099] The determination unit (processing unit) 8 determines abnormality based on a program stored therein.

[0100] According to this exemplary embodiment, the relative position between the conveying unit 6 and a predetermined member (e.g., a substrate) on the unit located at multiple measurement positions (different positions) can be determined, and the abnormal position can be identified based on the gap g between the conveying unit 6 and the predetermined member.

[0101] Specifically, based on the measurement results of the first and second measurement processes, it is possible to determine whether there is an abnormality in the conveyor unit 6 and whether there is an abnormality in the floor at one of the measurement locations. More specifically, if the substrate processing apparatus 1 is a lithography apparatus, the location of the abnormality occurring within the lithography apparatus can be identified.

[0102] The second exemplary embodiment will be described. In addition to the features of the first exemplary embodiment, the feature of the determination unit 8 according to this exemplary embodiment is that it performs control (determination) for adjusting the reference position of the hand 65 of the conveyor unit 6. FIG14 is a diagram illustrating the configuration of the conveyor unit 60 according to this exemplary embodiment. The conveyor unit 60 includes a drive mechanism 67 that is vertically movable along the Z axis. The drive mechanism 67 is attached to the drive mechanism 63.

[0103] The vertical movement of the drive mechanism 67 causes the drive mechanism 63 , the drive mechanism 64 , and the hand 65 to also move vertically.

[0104] The determination unit 8 according to this exemplary embodiment controls the adjustment of the reference position when inserting the hand 65 into each unit based on the abnormal position and the gap g at each unit. For example, assume there is an abnormality such as floor sinking, as shown in Figure 6B. In this case, because the gap g between the hand 65 and the substrate 22 is small, the reference position when inserting the hand 65 into the substrate stage 5 is adjusted in the -Z direction. This adjustment reduces the possibility of interference between the hand 65 and components such as the substrate 22 when inserting the hand 65 below the substrate 22 on the substrate stage 5. Specifically, if the gap g decreases by 0.2 mm due to floor sinking, the reference position of the conveyor unit 6 (hand 65) is adjusted by -0.2 mm relative to the unit mounted on the sunken floor.

[0105] For example, if an abnormality occurs in the conveyor unit 6 due to the drooping of the hand 65 as shown in FIG7B , the gap g between the hand 65 and the substrate 22 becomes smaller than the desired value in all units. In this case, the determination unit 8 controls the adjustment of the reference position in the -Z direction when the hand 65 is inserted in all units. The amount of adjustment of the reference position in the -Z direction is determined based on the gap g (relative position) between the conveyor unit 6 and the predetermined member.

[0106] The user can freely adjust the reference position. For example, the user can modify the reference position at a position that is not determined to have an abnormality, taking into account other conditions. For example, the user can adjust the reference position only at a predetermined position to account for slight changes in height that cannot be detected from the measurement of the gap g.

[0107] The reference position of the conveyor unit 6 does not necessarily need to be adjusted solely for the measurement unit. For example, suppose the gap g between the conveyor unit 6 and predetermined components at the temperature adjustment unit 3, pre-alignment unit 4, and substrate stage 5 is measured, and an abnormality is determined to exist in the floor 200. In this case, the determination unit 8 can also adjust the position of the conveyor unit 6 relative to the non-measured units on the second floor 200, taking into account the impact of the abnormality on the non-measured units on the second floor 200. This adjustment of the reference position can be performed regardless of the type of abnormality. For example, when an abnormality occurs in the conveyor unit 6, the reference position relative to the non-measured units can be adjusted. Alternatively, when an abnormality occurs in the floor, the reference position relative to the units mounted on the target floor can be adjusted. In addition to the aforementioned adjustment of the reference position, the reference position relative to the measurement unit can be further adjusted to the same extent as the measured displacement.

[0108] As described above, the determination unit 8 according to the present exemplary embodiment adjusts the position of the hand 65 based on the abnormal position and the gap g at the corresponding unit. Position adjustment is performed on some or all units according to the abnormal position.

[0109] According to this exemplary embodiment, the reference position of conveyor unit 6 can be adjusted based on the abnormal position, reducing the possibility of conveyor unit 6 interfering with a predetermined component such as a substrate. Furthermore, by also applying adjustments to units whose reference positions have not been measured, the possibility of conveyor unit 6 interfering with a predetermined component such as a substrate can be reduced across the entire apparatus.

[0110] A third exemplary embodiment will be described. The determination unit 8 according to this exemplary embodiment uses a method different from the method in the first exemplary embodiment to determine the gap g. Figures 15A and 15B are diagrams showing the structure of the conveying unit 80 according to this exemplary embodiment. The conveying unit 80 includes a hand 85, and uses the hand 85 to hold and convey the substrate 22. A suction port 86 for adsorbing and holding the substrate 22 is formed on the top surface of the hand 85. The suction port 86 is connected to an exhaust unit 88, such as a vacuum pump, for exhausting ambient air. The suction port 86 does not need to be arranged as shown in Figures 15A and 15B, as long as the substrate 22 can be adsorbed. For example, the suction port can be formed on the entire top surface of the hand 85, or multiple suction ports can be arranged. The layout is not particularly limited. The exhaust unit 88 and the suction port 86 are connected via an exhaust channel, and the exhaust channel is equipped with a sensor (pressure sensor) 89 for measuring pressure. Because the exhaust channel connecting exhaust unit 88 and suction port 86 communicates with the space between substrate 22 and hand 85, measuring the pressure in the exhaust channel is essentially the same as measuring the pressure in the space between substrate 22 and hand 85. Sensor 89 may be located elsewhere than in the exhaust channel connecting exhaust unit 88 and suction port 86, as long as it can measure the pressure in the space between substrate 22 and hand 85. Sensor 89 may be located in a position where it can directly measure the pressure in the space between substrate 22 and hand 85.

[0111] Figure 15B is a view of the transport unit 80, viewed from the γ direction shown in Figure 15A, capturing the substrate 22 placed on the stage 7. The substrate 22 is placed on the support member 71 protruding from the top surface of the stage 7. The hand 85 is inserted below the substrate 22 and then moves toward it. The exhaust unit 88 exhausts air as the hand 85 moves upward. The hand 85 holds the substrate 22 by suction, thereby transferring the substrate 22 from the stage 7 to the transport unit 80. Suctioning the substrate 22 to the hand 85 prevents displacement of the substrate 22 during transport. When the substrate 22 is suctioned to the hand 85, the suction port 86 is closed by the substrate 22, and the internal pressure of the exhaust duct changes from atmospheric pressure to negative pressure. The determination unit 8 can detect the suction of the substrate 22 to the hand 85 by detecting the change in the internal pressure of the exhaust duct using the sensor 89. In other words, the determination unit 8 can detect the suction of the substrate 22 to the hand 85 based on the measurement value of the sensor 89.

[0112] Determination unit 8 according to this exemplary embodiment considers the relative movement amount between hand 85 and substrate 22 from the time hand 85 acquires substrate 22 until substrate 22 is adsorbed as gap g. More specifically, in the example of FIG15B , the movement amount of hand 85 in the +Z direction to acquire substrate 22 until the measurement value of sensor 89 reaches a predetermined value indicating that substrate 22 is adsorbed to sensor 89 is considered gap g. This determination of gap g can simplify the apparatus because it eliminates the need to provide sensors for measuring gap g for the respective units.

[0113] A fourth exemplary embodiment will be described. This exemplary embodiment is characterized in that an object is manufactured using the determination method described in the first to third exemplary embodiments.

[0114] FIG16 is a flowchart of an article manufacturing method according to this exemplary embodiment. In step S600, a first measurement process is performed to measure a first relative position between a component corresponding to a plurality of measurement positions and the conveyor unit when the conveyor unit moves to the plurality of measurement positions. In step S610, a second measurement process is performed to measure a second relative position between a component corresponding to the plurality of measurement positions and the conveyor unit after the first measurement process. In step S620, a determination process is performed to determine whether an abnormality exists in the conveyor unit and whether an abnormality exists in the floor at one of the measurement positions based on the measurement results of the first and second measurement processes. In step S630, a formation process is performed to form a pattern on a substrate conveyed by the conveyor unit. In step S640, a manufacturing process is performed to manufacture an article using the substrate on which the pattern has been formed through the formation process.

[0115] Examples of objects manufactured by this manufacturing method include semiconductor integrated circuit (IC) devices, liquid crystal display devices, color filters, and micro-electromechanical systems (MEMS).

[0116] The formation process forms a pattern on the substrate by, for example, exposing a substrate (silicon wafer or glass plate) coated with a photosensitive material using an exposure device (lithography device).

[0117] The manufacturing process includes, for example, developing a patterned substrate (photosensitive material), etching the developed substrate and stripping the photoresist, dicing, bonding, and packaging. This manufacturing method makes it possible to identify device anomalies more quickly than before and address them appropriately.

[0118] The disclosure of this specification includes the following determination method, determination device, information processing method, storage medium, information processing device, lithography device, and object manufacturing method: [Project 1] A determination method comprising: a first measuring step of measuring a first relative position, wherein the first relative position is a relative position between the components corresponding to the plurality of corresponding measuring positions and the conveying unit when the conveying unit moves to the plurality of corresponding measuring positions; a second measuring step of measuring a second relative position, wherein the second relative position is a relative position between the component and the conveying unit corresponding to the plurality of corresponding measuring positions when the conveying unit moves to the plurality of corresponding measuring positions after the first measuring step; and A determination step of determining whether there is an abnormality in the conveying unit and whether there is an abnormality in the floor at one of the measurement positions based on the measurement result of the first measurement step and the measurement result of the second measurement step. [Project 2] The determination method according to item 1, wherein the determination is performed based on a first tendency and a second tendency, A first tendency indicates a tendency of change in the first relative position and the second relative position when the conveying unit moves to a first measurement position among the plurality of measurement positions in the first measurement step and the second measurement step, wherein the first relative position and the second relative position are relative positions between the first member and the conveying unit corresponding to the first measurement position. A second tendency indicates a tendency of change in the first relative position and the second relative position when the conveying unit moves to a second measurement position different from the first measurement position among the plurality of corresponding measurement positions in the first measurement step and the second measurement step, wherein the first relative position and the second relative position are relative positions between the second member and the conveying unit corresponding to the second measurement position. [Item 3] According to the determination method described in item 2, wherein, when the first measurement position is located on the same floor as the conveying unit, the second measurement position is located on a different floor from the conveying unit, and at least one of the first relative position and the second relative position falls outside a first range, it is determined that an abnormality exists; Wherein, when it is determined that an abnormality exists and the difference between the first tendency and the second tendency is less than a first threshold value, it is determined that there is no abnormality of floor sinking but an abnormality in the conveying unit. Wherein, when it is determined that an abnormality exists, the difference between the first inclination and the second inclination is greater than the first threshold value, and both the first relative position and the second relative position fall within a second range, it is determined that an abnormality of floor sinking exists, and Wherein, when it is determined that an abnormality exists, the difference between the first tendency and the second tendency is greater than the first threshold value, and at least one of the first relative position and the second relative position falls outside the second range, it is determined that both an abnormality of floor sinking and an abnormality in the conveying unit exist. [Item 4] According to the determination method described in item 2, wherein, when the first measurement position and the second measurement position are on the same floor and at least one of the first relative position and the second relative position falls outside a first range, it is determined that an abnormality exists, wherein, when it is determined that an abnormality exists and the difference between the first inclination and the second inclination is less than a first threshold value, it is determined that there is no abnormality in the floor tilt, but an abnormality in the conveying unit exists; wherein, when it is determined that an abnormality exists, the difference between the first inclination and the second inclination is greater than the first threshold value, and both the first relative position and the second relative position fall within a second range, it is determined that an abnormality exists in the floor tilt, and Wherein, when it is determined that an abnormality exists, the difference between the first inclination and the second inclination is greater than the first threshold value, and at least one of the first relative position and the second relative position falls outside the second range, it is determined that both an abnormality of floor tilt and an abnormality in the conveying unit exist. [Item 5] The determination method according to any one of items 1 to 4, wherein a reference position is adjusted based on a result of the determination step, the reference position being a position at which at least a portion of the conveying unit is inserted at one or more or all of the plurality of measurement positions. [Item 6] The determination method according to any one of items 1 to 5, wherein the reference position is adjusted based on a result of the determination step even at a position not included in the plurality of measurement positions. [Item 7] The determination method according to any one of items 1 to 6, wherein the component corresponding to the plurality of corresponding measurement positions is a substrate. [Item 8] The determination method according to any one of items 1 to 7, wherein the multiple measurement positions include at least one of the following positions: a substrate carrier for placing a substrate, a temperature adjustment unit configured to adjust the temperature of the substrate, and an alignment unit configured to align the substrate. [Item 9] The determination method according to any one of items 1 to 8, wherein the first measurement step and the second measurement step use: a sensor configured to detect the position of the conveying unit. [Item 10] The determination method according to any one of items 1 to 9, wherein the first measurement step and the second measurement step include determining the relative position based on the relative movement amount between the conveying unit and the component corresponding to the plurality of corresponding measurement positions when at least the conveying unit or the component moves in a direction in which the conveying unit and the component approach each other until the conveying unit acquires the component. [Item 11] The determination method according to item 10, wherein whether the conveying unit has acquired the component is determined based on a measurement value of a pressure sensor configured to measure a pressure between the conveying unit and the component. [Item 12] The determination method according to any one of items 1 to 11, wherein the relative position between the member and the conveying unit is measured each time the conveying unit moves to the plurality of corresponding measurement positions. [Item 13] A determination device comprising: a determination unit configured to determine an abnormality based on a relative position between a component and a conveying unit corresponding to a plurality of corresponding measurement values; Wherein, the determination unit is configured as follows: measuring a first relative position, wherein the first relative position is a relative position between the component and the conveying unit corresponding to the plurality of corresponding measurement positions when the conveying unit moves to the plurality of corresponding measurement positions, measuring a second relative position, where the second relative position is a relative position between the component and the conveying unit corresponding to the plurality of corresponding measurement positions when the conveying unit moves to the plurality of corresponding measurement positions after the first relative position is measured, and Based on the first relative position and the second relative position, it is determined whether there is an abnormality in the conveying unit and whether there is an abnormality in the floor at one of the measurement positions. [Item 14] A lithographic etching device for forming a pattern on a substrate, the lithographic etching device comprising: The determination device according to item 13, the determination device being configured to determine whether there is an abnormality in the conveying unit and whether there is an abnormality in the floor at one of the measurement positions inside the lithography apparatus; and The pattern forming unit is configured to form a pattern on the substrate. [Item 15] A method for manufacturing an object, the method comprising: forming a pattern on a substrate transported by a transport unit; Fabricating objects using patterned substrates; a first measuring step of measuring a first relative position, wherein the first relative position is a relative position between the components corresponding to the plurality of corresponding measuring positions and the conveying unit when the conveying unit moves to the plurality of corresponding measuring positions; a second measuring step of measuring a second relative position, wherein the second relative position is a relative position between the component and the conveying unit corresponding to the plurality of corresponding measuring positions when the conveying unit moves to the plurality of corresponding measuring positions after the first measuring step; and A determination step of determining whether there is an abnormality in the conveying unit and whether there is an abnormality in the floor at one of the measurement positions based on the measurement result of the first measurement step and the measurement result of the second measurement step.

[0119] The present disclosure is not limited to the aforementioned exemplary embodiments, and various variations and modifications may be made without departing from the spirit and scope of the present disclosure. Therefore, the appended claims disclose the scope of the present disclosure.

[0120] According to exemplary embodiments of the present disclosure, a determination method that facilitates identifying a cause of a change in the relative position between a conveying unit and a member such as a substrate can be provided. Other embodiments

[0121] The disclosed embodiment(s) may also be implemented as follows: a computer of a system or device that reads and executes computer-executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be more fully referred to as a "non-transitory computer-readable storage medium") to perform one or more functions of the aforementioned embodiment(s), and / or the system or device includes one or more circuits (e.g., application-specific integrated circuits (ASICs)) for performing one or more functions of the aforementioned embodiment(s); and a method performed by the computer of the system or device, for example, reading and executing computer-executable instructions from the storage medium to perform one or more functions of the aforementioned embodiment(s), and / or controlling the one or more circuits to perform one or more functions of the aforementioned embodiment(s). The computer may include one or more processors (e.g., central processing units (CPUs), microprocessor units (MPUs)), and may also include separate computers or networks of separate processors to read and execute the computer-executable instructions. The computer-executable instructions may be provided to the computer, for example, from a network or storage medium. The storage medium may include, for example, one or more of a hard drive, random access memory (RAM), read-only memory (ROM), memory of a distributed computing system, an optical disc (such as a compact disc (CD), a digital versatile disc (DVD), or a Blu-ray Disc (BD)™), a flash memory device, and a memory card.

[0122] Although the present disclosure has been described with reference to exemplary embodiments, it should be understood that the present disclosure is not limited to the disclosed exemplary embodiments. The scope of the appended claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

[0123] 1: Substrate processing equipment 2: Chamber 3: Temperature adjustment unit 4: Pre-alignment unit 5: Substrate carrier 6: Conveying unit 7: Carrier 8: Judgment unit 20: Exposure unit 21: Mask version 22:Substrate 23: Illumination optical system 24: Mask carrier 25: Projection Optical System 26: Supporting member 28: First substrate 29: Second substrate 30: The third substrate 36: Supporting member 46: Support member 50: First sensor 51: Second sensor 52: Third sensor 60: conveying unit 61: Driving mechanism 62: Driving mechanism 63: Driving mechanism 64: driving mechanism 65: Hands 66: Drive shaft 67: Driving mechanism 71: Support member 80: conveying unit 81: Sending unit 85: Hands 86: Suction port 88: Exhaust unit 89:Sensor 100: First Floor 200: Second floor A:Unit B:Unit C:Unit g: gap g1: first gap g10: fourth gap G10: Poor g11: third gap G11: Poor g12: fourth gap G12: Poor g2: second gap g3: first gap G3: Poor g4: second gap G4:Poor g5: first gap G5:Poor g6: Second gap G6: Poor g7: Third gap g8: Fourth gap g9: third gap G9: Poor P: Average value S10: Step S100: Steps S110: Step S120: Step S130: Step S140: Steps S150: Steps S160: Steps S20: Step S210: Step S220: Steps S230: Step S240: Steps S250: Steps S260: Steps S270: Steps S280: Steps S290: Steps S30: Step S300: Steps S310: Step S320: Step S40: Step S410: Step S420: Step S430: Step S440: Steps S450: Steps S460: Steps S470: Steps S480: Steps S490: Steps S50: Step S500: Steps S510: Step S520: Step S60: Steps S600: Steps S610: Step S620: Step S630: Step S640: Steps S70: Steps S80: Steps S90: Steps V: Range W: threshold value X: threshold value α: direction β: direction γ: direction δ: difference Δ: Difference δA: Difference ΔAB: Difference ΔAB: Difference δB: Difference ΔBC: Difference

Claims

1. A determination method, comprising: The first measurement step involves measuring a first relative position, wherein the first relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions when the conveyor moves to a plurality of corresponding measurement positions, and each substrate is disposed at a corresponding measurement position of the plurality of measurement positions; the second measurement step involves measuring a second relative position, wherein the second relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions after the first measurement step and when the conveyor moves to the plurality of corresponding measurement positions; and a determination step involves determining, based on the measurement results of the first measurement step and the measurement results of the second measurement step, whether there is an abnormality in the conveyor and whether there is an abnormality in the floor at one of the plurality of corresponding measurement positions.

2. The determination method according to request item 1, wherein, The determination is based on: (i) a first tendency, which indicates the tendency of change of the first relative position and the second relative position when the conveyor moves to the first measurement position among the plurality of corresponding measurement positions in the first measurement step and the second measurement step, wherein the first relative position and the second relative position are the relative positions between the first substrate and the conveyor corresponding to the first measurement position; and (ii) a second tendency, which indicates the tendency of change of the first relative position and the second relative position when the conveyor moves to the second measurement position among the plurality of corresponding measurement positions, which is different from the first measurement position in the first measurement step and the second measurement step, wherein the first relative position and the second relative position are further the relative positions between the second substrate and the conveyor corresponding to the second measurement position.

3. The determination method according to claim 2, wherein, The first measurement position is located on the same floor as the conveyor, the second measurement position is located on a different floor from the conveyor, and at least one of the first relative position and the second relative position falls outside a first range, thereby determining that an anomaly exists, and wherein: (i) an anomaly is determined to exist and the difference between the first tendency and the second tendency is less than a first threshold value, thereby determining that the anomaly is not an anomaly of floor subsidence, but an anomaly in the conveyor; (ii) an anomaly is determined to exist, the difference between the first tendency and the second tendency is greater than the first threshold value, and both the first relative position and the second relative position fall within a second range, thereby determining that the anomaly exists is an anomaly of floor subsidence; or (iii) an anomaly is determined to exist, the difference between the first tendency and the second tendency is greater than the first threshold value, and at least one of the first relative position and the second relative position falls outside the second range, thereby determining that the anomaly exists is both an anomaly of floor subsidence and an anomaly in the conveyor.

4. The determination method according to claim 2, wherein, An anomaly is determined to exist when the first measurement position and the second measurement position are located on the same floor and at least one of the first relative position and the second relative position falls outside a first range, and wherein: (i) an anomaly is determined to exist and the difference between the first tendency and the second tendency is less than a first threshold value, thus the anomaly is determined to be not an anomaly of floor tilt, but an anomaly in the conveyor; (ii) an anomaly is determined to exist, the difference between the first tendency and the second tendency is greater than the first threshold value and both the first relative position and the second relative position fall within a second range, thus the anomaly is determined to exist as an anomaly of floor tilt; or (iii) an anomaly is determined to exist, the difference between the first tendency and the second tendency is greater than the first threshold value and at least one of the first relative position and the second relative position falls outside a second range, thus the anomaly is determined to exist as both an anomaly of floor tilt and an anomaly in the conveyor.

5. The determination method according to request item 1, wherein, The reference position (i) is a position at which at least a portion of the conveyor is inserted at one or more or all of the plurality of corresponding measurement positions, and (ii) the reference position is adjusted based on the result of the determination step.

6. The determination method according to claim 5, wherein, Even at locations not included in the plurality of corresponding measurement locations, the reference position is adjusted based on the result of the determination step.

7. The determination method according to claim 1, wherein, The conveyor operates to transport each of the substrates corresponding to the plurality of corresponding measurement positions to or from the respective measurement positions of the plurality of corresponding measurement positions.

8. The determination method according to claim 1, wherein, The plurality of corresponding measurement positions include at least one of the following: a substrate stage for placing the substrate, a temperature adjustment unit configured to adjust the temperature of the substrate, and an alignment unit configured to align the substrate.

9. The determination method according to claim 1, wherein, The first and second measurement steps use sensors configured to detect the position of the conveyor.

10. The determination method according to claim 1, wherein, The measurements in the first and second measurement steps each include: determining a corresponding relative position based on the amount of relative movement between the conveyor and the substrate corresponding to the plurality of corresponding measurement positions as at least the conveyor or the substrate moves in the direction of proximity between the conveyor and the substrate until it is determined that the conveyor has acquired the substrate.

11. The determination method according to claim 10, wherein, The determination is based on the measurement value of a pressure sensor, which is configured to measure the pressure between the conveyor and the substrate.

12. The determination method according to claim 1, wherein, Whenever the conveyor moves to the plurality of corresponding measurement positions, the relative position between the substrate and the conveyor is measured.

13. The determination method according to claim 1 further includes: Determine the difference δ between the measurement result at the relative position at the corresponding measurement location and the previous corresponding measurement result; Determine the difference Δ between the differences δ of the measurement results; determine the average value P of the difference Δ; And whether the measured first and second relative positions fall within a first range to determine that there is no abnormality, or whether the first and second relative positions do not fall within the first range to determine that there is an abnormality; whether the first average value of the average value P is less than a first threshold value to determine that the abnormality exists in the conveyor; The abnormality is determined by whether the second average value of the average value P is less than the second threshold value, and whether the measured first and second relative positions fall within the second range, thereby determining that the abnormality is floor subsidence or floor tilting if the measured first and second relative positions do not fall within the second range. Alternatively, the abnormality is determined by whether the second average value of the average value P is greater than or equal to the second threshold value, and whether the measured first and second relative positions fall within the second range, thereby determining that the abnormality is floor subsidence or floor tilting if the second average value of the average value P is greater than or equal to the second threshold value, and whether the measured first and second relative positions do not fall within the second range, thereby determining that the abnormality includes the abnormality in the conveyor and the abnormality of floor subsidence and floor tilting, and issuing the determined abnormality and no abnormality notifications.

14. The determination method according to claim 1, wherein, Includes one or more of the following: (i) the conveyor and the substrate corresponding to the plurality of corresponding measurement positions are located in a chamber or the same chamber; and / or (ii) the first and second relative positions are measured using one or more sensors arranged laterally or adjacently to the conveyor and the substrate, such that the one or more sensors operate to measure the relative positions between the substrate and the conveyor.

15. A determining device, comprising: One or more processors operate to determine anomalies based on the relative positions between a substrate and a conveyor corresponding to a plurality of corresponding measurements, wherein the one or more processors operate to perform operations including: measuring a first relative position, which is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions when the conveyor moves to the plurality of corresponding measurement positions, each substrate being disposed at a corresponding measurement position of the plurality of measurement positions; measuring a second relative position, which is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions after the first relative position is measured and when the conveyor moves to the plurality of corresponding measurement positions; and determining, based on the measurement results of the first relative position and the measurement results of the second relative position, whether there is an anomaly in the conveyor and whether there is an anomaly in the floor at one of the plurality of corresponding measurement positions.

16. A photolithography etching apparatus for forming patterns on a substrate, the photolithography etching apparatus comprising: A pattern forming unit is configured to form the pattern on the substrate; And the determination device according to claim 15, wherein the one measuring position is inside the photolithography apparatus, and the determination device is configured to determine whether there is an anomaly in the conveyor and whether there is an anomaly in the floor at the one measuring position inside the photolithography apparatus, wherein the substrate is one of the substrates.

17. An information processing method, comprising: A measurement result of a first relative position is obtained, wherein the first relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions when the conveyor moves to the plurality of corresponding measurement positions, and each substrate is disposed at the corresponding measurement position of the plurality of measurement positions; a measurement result of a second relative position is obtained, wherein the second relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions after the first relative position is measured and the conveyor moves to the plurality of corresponding measurement positions; Based on the obtained measurement results of the first relative position and the second relative position, it is determined whether there is an anomaly in the conveyor and whether there is an anomaly in the floor at one of the plurality of corresponding measurement positions.

18. A non-transitory computer-readable storage medium storing a program for causing a computer to perform the information processing method described in claim 17.

19. An information processing apparatus, comprising: One or more sensors are used to obtain the relative position between the substrate and the conveyor corresponding to multiple corresponding measurement positions; And one or more processors, operated to determine anomalies based on information obtained from the one or more sensors, wherein the one or more sensors operate to obtain a measurement result of a first relative position, the first relative position being the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions when the conveyor moves to the plurality of corresponding measurement positions, each substrate being disposed at a corresponding measurement position of the plurality of measurement positions, wherein the one or more sensors further operate to obtain a measurement result of a second relative position, the second relative position being the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions after measuring the first relative position and when the conveyor moves to the plurality of corresponding measurement positions, and wherein the one or more processors operate to determine, based on the measurement results of the first relative position and the measurement results of the second relative position obtained from the one or more sensors, whether there is an anomaly in the conveyor and whether there is an anomaly in the floor at one of the plurality of corresponding measurement positions.

20. A method for manufacturing an object, the method comprising: A pattern is formed on a substrate conveyed by a conveyor. Articles are manufactured using the patterned substrate; The first measurement step involves measuring a first relative position, wherein the first relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions when the conveyor moves to a plurality of corresponding measurement positions, and each substrate is disposed at a corresponding measurement position of the plurality of measurement positions; the second measurement step involves measuring a second relative position, wherein the second relative position is the relative position between the substrate and the conveyor corresponding to the plurality of corresponding measurement positions after the first measurement step and when the conveyor moves to the plurality of corresponding measurement positions; and a determination step involves determining, based on the measurement results of the first measurement step and the measurement results of the second measurement step, whether there is an abnormality in the conveyor and whether there is an abnormality in the floor at one of the plurality of corresponding measurement positions; wherein the substrate is one of the substrates.

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