Composition for preparing polyimide film and package structure

Abstract

This disclosure provides a composition for preparing a polyimide film and an encapsulation structure. The composition for preparing the polyimide film disclosed herein comprises 100 parts by weight of a polyimide and 1-10 parts by weight of a crosslinking agent. The polyimide is composed of n main chain repeating units and 2 end capping groups, wherein n / 2 is from 10 to 550.

Description

[Technical Field]

[0001] This disclosure relates to a composition and a packaging structure. [Previous Technology]

[0002] With the trend of semiconductor devices becoming thinner, temporary bonding / removal technology has become one of the important technologies developed in recent years. This is because thinner components are brittle and lack support, so temporary adhesives are used to bond the workpiece (e.g., wafer) to the support substrate, so that subsequent processing such as wiring and metallurgy can be carried out on the workpiece. After the processing is completed, the temporary adhesive is removed to separate the workpiece from the support substrate.

[0003] Because semiconductor manufacturing processes often require high-temperature operating conditions, such as soldering or reflow processes which typically need to be performed at temperatures exceeding 250°C, temporary adhesives must not only possess excellent adhesion but also heat resistance and removability. During processing, the temporary adhesive can stably fix the workpiece to the support substrate and withstand the high-temperature operating conditions of semiconductor manufacturing processes, while after processing, it can be easily peeled off and cleaned.

[0004] In the automated process of removing workpieces from the substrate, mechanical lift-off (MLO) or laser lift-off (LLO) processes are mainly used. For smaller workpieces (such as micro LED devices), mechanical lift-off processes are prone to damage (e.g., contact detachment), while laser lift-off processes are less likely to damage the workpiece. However, not all temporary adhesives are suitable for laser lift-off processes.

[0005] Therefore, the industry needs a novel adhesive material suitable for laser removal processes. [Summary of the Invention]

[0006] According to embodiments of this disclosure, this disclosure provides a composition. The composition comprises 100 parts by weight of a polyimide and 1-10 parts by weight of a crosslinking agent. The polyimide is composed of n main chain repeating units and 2 end capping groups, wherein n / 2 is from 10 to 550.

[0007] According to an embodiment of this disclosure, this disclosure also provides a packaging structure. The packaging structure includes a substrate; a polyimide film disposed on the substrate, wherein the polyimide film is a cured product of the composition described in this disclosure; and an electronic component disposed on the polyimide film.

Implementation Method

[0009] The following provides a detailed description of the compositions and packaging structures disclosed herein. It should be understood that the following description provides many different embodiments or examples for implementing different variations of this disclosure. The specific elements and arrangements described below are merely illustrative of this disclosure. Of course, these are for illustrative purposes only and not as limiting the scope of this disclosure. In this disclosure, the term "about" means an amount that can increase or decrease by a size that is generally and reasonably understood by one skilled in the art.

[0010] Furthermore, the use of ordinal numbers such as "first," "second," and "third" in the specification and the claims to modify the elements of the claims does not imply or represent any prior ordinal number of the claimed element, nor does it represent the order of one claimed element with another claimed element, or the order of manufacturing methods. The use of these ordinal numbers is only to enable a claimed element with a certain name to be clearly distinguished from another claimed element with the same name.

[0011] It should be understood that the elements specifically described or illustrated may exist in various forms well known to those skilled in the art. Furthermore, when a layer is "on" other layers or substrates, it may mean "directly" on other layers or substrates, or it may mean a layer is on other layers or substrates, or it may mean a layer is sandwiched between other layers or substrates. In the drawings, the shape or thickness of embodiments may be enlarged and indicated for simplification or convenience. Moreover, portions of the elements in the drawings will be described separately. It is worth noting that elements not shown or described in the drawings are in forms known to those skilled in the art. Furthermore, specific embodiments are merely to disclose specific ways of using this disclosure and are not intended to limit this disclosure.

[0012] This disclosure provides a composition and an encapsulation structure. According to an embodiment of this disclosure, the composition comprises a polyimide and a crosslinking agent. By using an end-capping agent to control the number of repeating units in the main chain of the polyimide within a specific range (i.e., controlling the main chain length of the polyimide), the adhesion and heat resistance of the polyimide film prepared from the polyimide composition are improved, and the stress of removing electronic components from the substrate can be further reduced in subsequent laser removal processes. By selecting a specific end-capping agent, the polyimide can undergo a crosslinking reaction with the crosslinking agent. Furthermore, since the selected end-capping agent and crosslinking agent can absorb light of a specific wavelength, the polyimide film can absorb energy and undergo photolysis in the subsequent laser removal process, achieving the effect of removing the electronic components from the substrate and avoiding damage to the bonding layer disposed on the electronic components. In this way, the electronic components can be smoothly separated from the substrate during the transfer process.

[0013] According to embodiments of the present disclosure, the present disclosure provides a composition comprising 100 parts by weight of polyimide and 1-10 parts by weight (e.g., 2 parts by weight, 3 parts by weight, 4 parts by weight, 5 parts by weight, 6 parts by weight, 7 parts by weight, 8 parts by weight, or 9 parts by weight) of a crosslinking agent.

[0014] According to the embodiments disclosed herein, the polyimide is composed of n main chain repeating units and 2 end capping groups, wherein n / 2 (the ratio of the number of main chain repeating units to the number of end capping groups) is in the range of about 10 to 550, for example, about 15, 20, 30, 50, 80, 100, 120, 150, 200, 250, 300, 350, 400, 450, 500, or 520. If the n / 2 value is too high, the polyimide film prepared from this composition is not easily photodecomposed and is not suitable for laser removal processes. If the n / 2 value is too low, the polyimide film prepared from this composition has lower adhesion and heat resistance.

[0015] According to the embodiments disclosed herein, the polyimide may be composed of more than one polyimide having a different number of main chain repeating units, and the number (n) of each polyimide main chain repeating unit conforms to the following: n / 2 is in the range of 10 to 550.

[0016] According to the embodiments disclosed herein, the capping group may be derived from the reaction of a diamine with an anhydride-type capping agent, or the capping group may be derived from the reaction of a dianhydride with an amine-type capping agent.

[0017] According to the embodiments disclosed herein, the anhydride-type capping agent may be, or, wherein R1 is independently hydrogen, fluorine, hydroxyl, amino, C1-C8 alkyl group, C1-C8 fluoroalkyl group, C6-C12 aryl, C2-C8 carboxyalkyl group, C2-C8 alkenyl group, C2-C8 isocyanatoalkyl group, C1-C8 alkylamino, C4-C8 acryloxyalkyl group, C5-C9 methacryloxyalkyl group, C3-C8 epoxyalkyl group, C4-C8 oxetanylalkyl group, or 3,4-epoxycyclohexyl group. According to embodiments of this disclosure, in this anhydride-type capping agent, at least one R1 group is independently hydroxyl, C2-C8 carboxyalkyl group, C2-C8 alkenyl group, C2-C8 isocyanatoalkyl group, C4-C8 acryloxyalkyl group, C5-C9 methacryloxyalkyl group, C3-C8 epoxyalkyl group, C4-C8 oxetanylalkyl group, or 3,4-epoxycyclohexyl group. According to embodiments of this disclosure, the anhydride-type capping agent is, for example, allyl succinic anhydride.

[0018] According to the embodiments disclosed herein, the amine-type capping agent may be, , , , , , , , , , , or, wherein R2 is independently hydrogen, fluorine, hydroxyl, C1-C8 alkyl group, C1-C8 fluoroalkyl group, C6-C12 aryl, C2-C8 carboxyalkyl group, C2-C8 alkenyl group, C2-C8 isocyanatoalkyl group, C4-C8 acryloxyalkyl group, C5-C9 methacryloxyalkyl group, C3-C8 epoxyalkyl group, C4-C8 oxetanylalkyl group, or 3,4-epoxycyclohexyl group; and R3 is independently hydrogen, fluorine, C1-C4 alkyl group, or C1-C4 fluoroalkyl group. According to the embodiments disclosed herein, in this amine-type capping agent, at least one R2 group is independently hydroxyl, C2-C8 carboxyalkyl group, C2-C8 alkenyl group, C2-C8 isocyanatoalkyl group, C4-C8 acryloxyalkyl group, C5-C9 methacryloxyalkyl group, C3-C8 epoxyalkyl group, C4-C8 oxetanylalkyl group, or 3,4-epoxycyclohexyl group.

[0019] According to embodiments of this disclosure, the C1-C8 alkyl group described herein may be a linear or branched alkyl group. According to embodiments of this disclosure, the C1-C8 alkyl group may be methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, or an isomer thereof. For example, the C1-C8 alkyl group described herein may be methyl, ethyl, n-propyl, isopropyl, n-butyl, sec-butyl, isobutyl, or tert-butyl.

[0020] According to the embodiments disclosed herein, the C1-C8 fluoroalkyl groups referred to herein are alkyl groups in which all or part of the hydrogen on the carbon atom is replaced by fluorine, and may be linear or branched, such as fluoromethyl, fluoroethyl, fluoropropyl, fluorobutyl, fluoropentyl, fluorohexyl, or their isomers. Here, the fluoromethyl group referred to herein may be monofluoromethyl, difluoromethyl, or perfluoromethyl, while the fluoroethyl group may be monofluoroethyl, difluoroethyl, trifluoroethyl, tetrafluoroethyl, or perfluoroethyl.

[0021] According to the embodiments disclosed herein, the C6-C12 aromatic group may be phenyl, biphenyl, or naphthyl.

[0022] According to the embodiments disclosed herein, the C2-C8 alkenyl group may be a linear or branched alkenyl group, and contains at least one carbon-carbon double bond, such as ethenyl, propenyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, or isomers thereof.

[0023] According to the embodiments disclosed herein, the C2-C8 carboxyalkyl group mentioned herein refers to C1-C7 alkyl groups, in which the hydrogen on the carbon is replaced by a carboxyl group.

[0024] According to the embodiments disclosed herein, the C2-C8 isocyanatoalkyl group mentioned herein refers to C1-C7 alkyl groups, in which the hydrogen on the carbon is replaced by isocyanato groups.

[0025] According to the embodiments disclosed herein, the C4-C8 acryloxyalkyl group mentioned herein refers to C1-C5 alkyl groups, in which the hydrogen on the carbon is replaced by acryloxyalkyl group.

[0026] According to the embodiments disclosed herein, the C5-C9 methacryloxyalkyl group mentioned herein refers to C1-C5 alkyl groups, in which the hydrogen on the carbon is replaced by methacryloxyalkyl group.

[0027] According to the embodiments disclosed herein, the C3-C8 epoxyalkyl group refers to C1-C6 alkyl groups, in which the hydrogen on the carbon is replaced by an oxyethylene group.

[0028] According to the embodiments disclosed herein, the C4-C8 oxetanylalkyl group mentioned herein refers to C1-C5 alkyl groups, in which the hydrogen on the carbon is replaced by oxetanyl group.

[0029] According to the embodiments disclosed herein, the main chain repeating unit may be derived from the reaction of a diamine with a dianhydride.

[0030] According to the embodiments disclosed herein, the diamine may be 1,3-bis(4'-aminophenoxy)benzene (TPE-R), 3,3'-diaminodiphenyl ether (3,3'-oxydianiline, 3,3'-ODA), 4,4'-diaminodiphenyl ether (4,4'-oxydianiline, 4,4'-ODA), bis(4-aminophenyl) terephthalate (BPTP), 1,3-bis(3-aminophenoxy)benzene (APB-N), 4,4'-oxybis[3-(trifluoromethyl)aniline] (TMDA), or 2,2-bis[4-(4-aminophenoxy)phenyl]propane (2,2-bis... [4-(4-aminophenoxy)phenyl]propane (BAPP), 4,4'-bis(4-aminophenoxy)benzophenone (BAPK), 4,4'-[naphthalene-2,7-diylbis(oxy)]dianiline (NDA), 4,4'-bis(4-aminophenoxy)biphenyl (4,4′-(1,1′-biphenyl-4,4′-diyldioxy)dianiline (BAPB), 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane (HFBAPP), isophorone diamine diamine (IPDA), 1-methyl-2,4-cyclohexane-1,3-diamine (HTDA), 4,4'-methylenebis(cyclohexylamine) (PACM), 4,4'-methylenebis(2-methylcyclohexylamine) (MACM), bicyclo[2.2.1]heptanedimethylamine (bis(aminomethyl)norbornane, NORB), 1,3-adamantanediamine (adamantane-1,3-diamine (ADDA), bis(aminomethyl)tricyclo[5.2.1.02,6]decane (octahydro-4,7-methanoindene-1(2),5(6)-dimethanamine), 2,2'-bis(trifluoromethyl)benzidine (TFMB), 2,2'-dimethyl-4,4'-biphenyldiamine (m-TBHG), o-tolidine, 4,4'-methylenedianiline (4,4'-DAPM), 3,4'-methylenedianiline (3,4'-DAPM) 4,4'-diamino-3,3'-dimethyldiphenylmethane (MDA), 4,4'-methylenebis(2-ethylbenzenamine) (MOEA), and 4,4'-methylenebis(2,6-diethylaniline) (MDEA) 9,10-bis(4-aminophenyl)anthracene, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 2,6-naphthalenediamine, 2,6-anthracenediamine, 4,4'-diamino-p-terphenyl, 2,2-bis(4-aminophenyl)hexafluoropropane (AAF), α,α'-bis(4-aminophenyl)-1,4-diisopropylbenzene (Bisaniline) P), 9,9-bis(4-aminophenyl)fluorene (FDA), 3,3',5,5'-tetramethylbenzidine (3,3',5,5'-tetramethylbenzidine (TMB), 4,4-diamino-2,2'-dimethoxybiphenyl (m-DS), 4,4'-diaminobenzophenone (DABP), bis[4-(4-aminophenoxy)phenyl]sulfone (BAPS), 4,4'-diaminobenzanilide (DABA), or combinations thereof.

[0031] According to the embodiments disclosed herein, the dianhydride may be 3,4'-oxydiphthalic anhydride (3,4'-ODPA), 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA), p-phenylenebis(trimellitate anhydride) (TAHQ), 2,6-dihydroxynaphthalenebis(trimellitate anhydride) (2,6-TANA), pyromellitic dianhydride (PMDA), or cyclobutane-1,2,3,4-tetracarboxylic dianhydride. CBDA), 1,2,4,5-cyclohexanetetracarboxylic dianhydride (H-PMDA), bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (B1317), bicyclooctanetetracarboxylic dianhydride (BODA), dicyclohexyl-3,4,3',4'-tetracarboxylic dianhydride ( ... dianhydride (H-BPDA), 3-(carboxymethyl)-1,2,4-cyclopentanetricarboxylic acid 1,4:2,3-dianhydride ([3-(carboxymethyl)-1,2,4-cyclopentanetricarboxylic acid 1,4:2,3-dianhydride], TCA-AH), 1,2,3,4-butanetetracarboxylic dianhydride (1,2,3,4-Butanetetracarboxylic dianhydride, BDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (3,3',4,4'-biphenyl tetracarboxylic dianhydride, 4,4'-BPDA), 2,3,3',4'-Biphenyltetracarboxylic acid dianhydride (2,3,3',4'-biphenyltetracarboxylic acid dianhydride) dianhydride (3,4'-BPDA), 5-[4-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione (5-[4-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione (1,4-PIB), 5-[3-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione (5-[3-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione (1,3-PIB), 4,4'-hexafluoroisopropylidene diphthalic anhydride (4,4'-(hexafluoroisopropylidene)diphthalic anhydride) (6FDA) anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (BPAF), N-[4-[4-[(1,3-dioxo-2-benzofuran-5-carbonyl)amino]-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl) [Phenyl]-1,3-dioxo-2-benzofuran-5-carboxamide (N,N'-(2,2'-bis(trifluoromethyl)-[1,1'-biphenyl]-4,4'-diyl)bis(1,3-dioxo-1,3-dihydroisobenzofuran-5-carboxamide, TA-TFMB), 1,2,3,4-cyclopentanetetracarboxylic dihydride (CPDA), or combinations thereof.

[0032] According to embodiments of this disclosure, the crosslinking agent disclosed herein may be a compound having at least two reactive groups, wherein the reactive groups can react with the end-capping groups of the polyimide. The reactive groups may be isocyanato group, hydroxy group, epoxy group, acryloxy group, or methacryloxy group.

[0033] According to embodiments of this disclosure, the crosslinking agent disclosed herein may be trimethylol propane triglycidyl ether, glycerol triglycidyl ether, glycerol propoxylate triglycidyl ether, N,N-Diglycidyl-4-glycidyloxyaniline, Tris(2,3-epoxypropyl)isocyanurate, O-Cresol Novolak Epoxy Resin, or triphenylol methane triglycidyl ether. ether), N,N,N',N'-tetracyclooxypropyl-4,4'-diaminodiphenylmethane (4,4'-Methylenebis(N,N-diglycidylaniline)), tetraphenylolethane glycidyl ether, poly(ethylene adipate) diol, poly(1,4-butylene adipate) diol, poly(ethylene dodecanoate) diol, poly(1,6-hexathylene adipate) diol, polyethylene glycol (PEG), polypropylene glycol (PPG), polytetramethylene ether glycol (PTMEG), ethylene glycol 1,3-propylene glycol, glycerol, 1,4-butylene glycol, 1,5-pentylene glycol, neopentylene glycol, 1,6-hexylene glycol, 1,7-heptylene glycol, 2,5-Furandiol (2,5-furandiol), toluene diisocyanate (TDI), phenylene diisocyanate, 4,4'-diphenyl diisocyanate, naphthalene diisocyanate (NDI), diphenylmethane diisocyanate (MDI), toluidine diisocyanate (TODI), hexamethylene diisocyanate (HDI), trimethylhexamethylene diisocyanate, methyl caprate 2,6-diisocyanate, 1,3-cyclopentane diisocyanate, norbornane diisocyanate diisocyanate (NBDI), bis(isocyanatomethyl)cyclohexane (H6XDI), 1,6-hexanediol diacrylate (HDDA), 1,6-hexanediol dimethacrylate (DDDA), 1,9-nonanediol diacrylate (1,9-bis(acryloyloxy)nonane), 1,9-nonanediol dimethacrylate (1,9-bis(methacryloyloxy)nonane), 1,10-decanediol diacrylate (DDDA), 1,10-decanediol dimethacrylate (1,9-bis(acryloyloxy)nonane), 1,10-decanediol diacrylate (DDDA), 1,10-decanediol dimethacrylate (DDDA), 1,9 ...10-decanediol dimethacrylate), neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, polyethylene glycol (200) diacrylate (PEG200DA), polyethylene glycol (400) diacrylate (PEG400DA), pentaerythritol tetraacrylate (PETTA), dipentaerythritol hexaacrylate (DPHA), di(trimethylolpropane) tetraacrylate (Di-TMPTTA), trimethylolpropane triacrylate (TMPTMA), di(polypentaerythritol) polyacrylate, polypentaerythritol polyacrylate Polyacrylate, polybutadiene diacrylate (PBDDA), 3-methyl-1,5-pentanediol diacrylate (3-methyl-1,5-pentanediol diacrylate)5-pentanediol diacrylate (MPDA), ethoxylated 3-bisphenol A diacrylate (BPA3EODA), propoxylated 3-trimethylolpropane triacrylate (TMP3POTA), ethoxylated pentaerythritol tetraacrylate, ethoxylated 6-trimethylolpropane triacrylate (TMP6EOTA), ethoxylated 9-trimethylolpropane triacrylate (TMP9EOTA), ethoxylated 4-bisphenol A diacrylate (BPA4EODA), esterdiol diacrylate (EDDA), and alkoxylated diacrylate. Prooxylated 2-neopentyl glycol diacrylate (PONPGDA), propoxylated 3-glyceryl triacrylate (GPTA), polyurethane acrylate resin, or combinations thereof.

[0034] According to embodiments of the present disclosure, the composition disclosed herein may further contain 0.1-2 parts by weight (e.g., 0.2 parts by weight, 0.5 parts by weight, 1 part by weight, or 1.5 parts by weight) of an initiator, which can generate free radicals to promote the reaction of the polyimide terminal reactive functional groups with the crosslinking agent. The initiator may be an azo compound, a cyanovaleric-acid-based compound, a peroxide, a benzoin-based compound, an acetophenone-based compound, a thioxanthone-based compound, a ketal compound, a benzophenone-based compound, an α-aminoacetophenone compound, an acylphosphine oxide compound, a biimidazole-based compound, a triazine-based compound, or a combination thereof.

[0035] According to the embodiments disclosed herein, the azo compounds may be 2,2'-azobis(2,4-dimethylvaleronitrile), dimethyl 2,2'-azobis(2-methylpropionate), 2,2-azobisisobutyronitrile (hereinafter referred to as AIBN), 2,2-azobis(2-methylisobutyronitrile), 1,1'-azobis(cyclohexane-1-carbonitrile), 2,2'-azobis[N-(2-propenyl)-2-methylpropionamide](N- (2-propenyl)-2-methylpropionamide), 1-[(cyano-1-methylethyl)azo]formamide, 2,2'-azobis(N-butyl-2-methylpropionamide), or 2,2'-azobis(N-cyclohexyl-2-methylpropionamide). Peroxides can be benzoyl peroxide (BPO), 1,1-bis(tert-butylperoxy)cyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethylcyclohexane, 2,5-bis(tert-butylperoxy)-2,5-dimethyl-3-cyclohexyne.5-Dimethyl-3-cyclohexyne, bis(1-(tert-butylpeorxy)-1-methylethyl)benzene, tert-butyl hydroperoxide, tert-butyl peroxide, tert-butyl peroxybenzoate, cumene hydroperoxide, cyclohexanone peroxide, didicumyl peroxide, or lauroyl peroxide. Benzoin compounds can be benzoin, benzoin methyl ether, or benzyl dimethyl ether. ketal); acetophenone compounds can include p-dimethylamino-acetophenone, α,α'-dimethoxyazoxy-acetophenone, 2,2'-dimethyl-2-phenyl-acetophenone, p-methoxy-acetophenone, 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, and 2-benzyl-2-azine-dimethylamine. -1-(4-morpholinophenyl)-1-butanone (2-benzyl-2-N,N-dimethylamino-1-(4-morpholinophenyl)-1-butanone); benzophenone compounds can include benzophenone, 4,4-bis(dimethylamino)benzophenone, 4,4-bis(diethylamino)benzophenone, 2,4,6-trimethylaminobenzophenone, methyl-o-benzoyl benzoate, 3,3,3-dimethyl-4-methoxybenzophenone and 3,3,4,4-tetra(t-butylperoxycarbonyl)benzophenone; thioxanthone compounds can be thioxanthone, 2,4-diethyl-thioxanthanone, and thioxanthone-4-sulfone; diimidazole compounds can be 2,2'-bis(o-chlorophenyl)-4,4'- 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-biimidazole, 2,2'-bis(o-fluorophenyl)-4,4',5,5'-tetraphenyl-biimidazole, 2,2'-bis(o-methylphenyl)-4,4',5,5'-tetraphenyl-biimidazole [zole], 2,2'-bis(o-methoxyphenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(o-ethylphenyl)-4,4',5,5'-tetraphenylbiimidazole, 2,2'-bis(p-methoxyphenyl)-4,4',5,5'-tetraphenylbiimidazole [4',5,5'-tetraphenyl-biimidazole], 2,2'-bis(2,2',4,4'-tetramethoxyphenyl)-4,4',5,5'-tetraphenyl-biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyl-biimidazole, 2,2'-bis(2,4',5,5'-tetraphenyl-biimidazole], 2,2'-bis(2,4',5,5'-tetraphenyl-biimidazole], 2,2'-bis(2,4-Dichlorophenyl)-4,4',5,5'-tetraphenyl-biimidazole [2,2'-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyl-biimidazole]; phosphine oxide compounds can be 2,4,6-trimethylbenzoyl diphenylphosphine oxide and bis(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide; triazine compounds can be 3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionic acid [3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionic acid 1,1,1,3,3,3-hexafluoroisopropyl-3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionate, ethyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, 2-epoxyethyl-2 2-epoxyethyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, cyclohexyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, benzyl-2-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}acetate, 3-{chloro-4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionic acid, 3-{4-[2,4-bis(trichloromethyl)-s-triazine-6-yl]phenylthio}propionamide, 2,4-bis(trichloromethyl)-6-p-methoxystyryl-s-triazine, 2,4-bis( 2,4-bis(trichloromethyl)-6-(1-p-dimethylaminophenyl)-1,3-butadienyl-s-triazine, or 2-trichloromethyl-4-amino-6-p-methoxystyryl-s-triazine.

[0036] According to the embodiments disclosed herein, the composition may further include a solvent such that the components of the composition are uniformly dispersed in the solvent.

[0037] According to embodiments of this disclosure, the solid content of the composition can be from 1% to 30% (e.g., about 2%, 5%, 10%, 15%, 20%, or 25%). Here, the solid content refers to the weight percentage of all components except the solvent, based on the total weight of the composition. According to embodiments of this disclosure, the thickness of the polyimide film prepared from the composition is proportional to the solid content of the composition. In other words, the thickness of the polyimide film prepared from the composition can be adjusted by the solid content of the composition.

[0038] According to the embodiments disclosed herein, the solvent may be benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, decahydronaphthalene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethyl cyclohexane, methyl cyclohexane, p-menthane, dipropyl ether, dibutyl ether, anisole, butyl acetate, pentyl acetate, or methyl isobutyl ketone. Cyclohexylbenzene, cyclohexanone, cyclopentanone (CPN), triethylene glycol dimethyl ether, 1,3-dimethyl-2-imidazolidinone (DMI), N-methyl-2-pyrrolidone (NMP), methyl ethyl ketone (MEK), N,N-dimethylacetamide (DMAc), γ-butyrolactone (GBL), N,N-dimethylformamide (DMF), propylene glycol methyl ether acetate (PGMEA), dimethyl sulfoxide (DMSO), cresol, or combinations thereof.

[0039] According to embodiments of this disclosure, the polyimide disclosed herein can be prepared by the following steps. First, a diamine, a dianhydride, and a capping agent (e.g., an amine-type capping agent or an anhydride-type capping agent) are added to a reaction flask and dissolved in a solvent to obtain a solution. The solid content of this solution can be from about 10% to 50% (e.g., about 11%, 12%, 14%, 15%, 18%, 20%, 21%, 22%, 25%, 27%, 29%, 30%, 32%, 34%, 35%, 38%, 40%, 42%, 44%, 46%, or 48%). The definitions of diamine, dianhydride, and capping agent are as described above. According to embodiments of this disclosure, the molar ratio of diamine to dianhydride can be from about 1:1.05 to 1.05:1. When the amount of diamine used is larger than that of dianhydride, an anhydride-type capping agent can be added to control the main chain length of the polyimide. When the amount of dianhydride used is greater than that of diamine, an amine-type capping agent can be added to control the main chain length of the polyimide. According to the embodiments disclosed herein, the main chain length of the polyimide is controlled by the amount of capping agent added. Specifically, the main chain length of the polyimide disclosed herein is inversely proportional to the amount of capping agent added. To increase the number of repeating units in the main chain of the polyimide, the amount of capping agent can be reduced (i.e., the molar ratio of capping agent to diamine (or capping agent to dianhydride) can be reduced); to reduce the number of repeating units in the main chain of the polyimide, the amount of capping agent can be increased (i.e., the molar ratio of capping agent to diamine (or capping agent to dianhydride) can be increased).

[0040] According to an embodiment of this disclosure, a catalyst may be added to the above solution as needed to accelerate the polymerization reaction to form polyimide. Then, the solution is reacted at 180 °C to 250 °C for 4-12 hours to obtain a solution containing the polyimide described in this disclosure (polyimide solution). According to an embodiment of this disclosure, the catalyst may be any catalyst suitable for amide reaction, such as a tertiary amine. For example, tertiary amines may include triethylenediamine (DABCO), N,N-dimethylcyclohexylamine, 1,2-dimethylimidazole, trimethylamine, triethylamine, tripropylamine, tributylamine, triethanolamine, N,N-dimethylethanolamine, N,N-diethylethanolamine, triethylenediamine, N-methylpyrrolidone, N-ethylpyrrolidone, N-methylhexahydropyrrolidone, N-ethylhexahydropyrrolidone, imidazole, pyridine, methylpyridine, dimethylpyridine, quinoline, or isoquinoline.

[0041] According to embodiments of this disclosure, the composition disclosed herein may consist of the polyimide and the crosslinking agent. According to embodiments of this disclosure, the composition disclosed herein may consist of the polyimide, the crosslinking agent, and the initiator. According to embodiments of this disclosure, the composition disclosed herein may be a combination of the polyimide, the crosslinking agent, the initiator, and the solvent.

[0042] According to embodiments of this disclosure, the composition described herein is substantially composed of the polyimide described herein, the crosslinking agent, the initiator, and the solvent. In other words, the polyimide, the crosslinking agent, and the initiator are the main components of the composition, and the total weight of the polyimide and the crosslinking agent accounts for approximately 90 wt% to 99.99 wt% of the composition (e.g., 93 wt%, 95 wt%, 98 wt%, 99 wt%, or 99.5 wt%).

[0043] Furthermore, the components of the composition other than the polyimide, the crosslinking agent, the initiator, and the solvent are defined as minor components. According to embodiments of this disclosure, the minor component may be a catalyst used to prepare the polyimide, a diamine or dianhydride used to prepare the polyimide but which has not fully reacted, an additive, or a combination thereof. The total weight of the minor component accounts for about 0.01 wt% to 10 wt% of the composition. According to embodiments of this disclosure, the additive may be an additive known in the art, such as a filler, flame retardant, viscosity modifier, thixotropic agent, defoamer, leveling agent, surface treatment agent, stabilizer, antioxidant, or a combination thereof. According to other embodiments of this disclosure, the composition of this disclosure may consist of the above-mentioned major and minor components.

[0044] According to an embodiment of the present disclosure, the present disclosure also provides an encapsulation structure 10, as shown in Figure 1. The encapsulation structure 10 may include a substrate 20, a polyimide film 30 disposed on the substrate 20, and an electronic component 40 disposed on the polyimide film 30, wherein the polyimide film 30 is a cured product obtained by baking the composition described in the present disclosure.

[0045] According to the embodiments disclosed herein, the polyimide film 30 is used to fix the electronic component 40 onto the substrate 20 to obtain the packaging structure 100. According to the embodiments disclosed herein, before fixing the electronic component 40 onto the substrate 20 with the polyimide film 30, a redistribution layer (RDL) (not shown) can be formed on the polyimide film 30, and then the electronic component 40 is connected to the redistribution layer (RDL).

[0046] According to the embodiments of this disclosure, the thickness of the polyimide film 30 is not particularly limited and can be selected according to actual needs. According to the embodiments of this disclosure, the average thickness of the polyimide film 30 can be from about 1 μm to 500 μm, for example, 2 μm, 3 μm, 4 μm, 5 μm, 8 μm, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 100 μm, 150 μm, 200 μm, 300 μm, or 400 μm. According to the embodiments of this disclosure, the substrate 20 can be a transparent substrate, such as a glass substrate or a polymer film. According to the embodiments disclosed herein, the polymer film can be a polyethylene terephthalate (PET) film, a polybutylene terephthalate (PBT) film, a polyethylene (PE) film, a polyethylene naphthalate (PEN) film, a polypropylene (PP) film, a polyvinyl chloride (PVC) film, or a polyacrylate film. According to the embodiments disclosed herein, the electronic component 40 is not particularly limited and can be an optoelectronic component, such as a semiconductor wafer, a display element, or a light-emitting diode (e.g., an organic light-emitting diode, or a micro-light-emitting diode). The polyimide film prepared from this composition contains polyimide molecular chain segments and cross-linked segments capable of receiving laser light energy in the 200nm to 300nm wavelength band; therefore, irradiation with a laser beam can decompose the polyimide film and disassemble the encapsulation structure.

[0047] According to an embodiment of this disclosure, the encapsulation structure 10 can be prepared by the following steps. First, a substrate 20 is provided. Next, the composition described in this disclosure is used to form a coating on the substrate 20 by a coating process. According to an embodiment of this disclosure, the coating process can be screen printing, spin coating, bar coating, blade coating, roller coating, dip coating, spray coating, or brush coating. Next, a baking process is performed on the coating to form the polyimide film 30. The temperature of the baking process can be from about 50 °C to 350 °C, and the baking time can be from 30 minutes to 8 hours. According to embodiments disclosed herein, the baking process can be a one-stage or multi-stage baking process, such as baking at 100 °C to 200 °C for 15 minutes to 2 hours, or baking at 200 °C to 350 °C for 15 minutes to 6 hours. After forming the polyimide film 30, the electronic component 40 can be disposed on the polyimide film 30. According to other embodiments disclosed herein, after forming the polyimide film 30, a redistribution layer (RDL) can be formed on the polyimide film 30, and then the electronic component 40 can be disposed on the redistribution layer (RDL) to connect the electronic component 40 to the redistribution layer.

[0048] According to an embodiment of this disclosure, this disclosure also provides a method 100 for disassembling a package structure. Referring to Figure 2, the method for disassembling a package structure disclosed herein includes the following steps. First, the package structure disclosed herein is provided (step 101), and a laser beam is used to irradiate the polyimide film of the package structure, so that the electronic component is separated from the substrate (step 102).

[0049] According to the embodiments disclosed herein, when the polyimide film 30 of the packaging structure 10 is irradiated with a laser (i.e., a laser removal process is performed on the packaging structure 10), the polyimide film 30 can be decomposed. In this way, the electronic component 40 can be easily peeled off from the substrate 20 without any adhesive residue remaining on the electronic component 40 or causing damage to the electronic component 40, improving the reuse rate of the electronic component and accelerating the efficiency of the rework process. According to the embodiments disclosed herein, the wavelength of the laser beam can be from 200 nm to 300 nm, and the irradiation intensity of the laser beam can be from 2 mJ / cm² to 15 mJ / cm². If the irradiation intensity is too low, the packaging structure cannot be effectively disassembled. If the irradiation intensity is too high, it may cause damage to the electronic component (e.g., embrittlement, soldering, increased resistance, or contact breakage), making the electronic component unusable.

[0050] In order to make the above-mentioned contents and other objects, features and advantages of this disclosure more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings.

[0051] Preparation of polyimide

[0052] Table 1 lists the reagents involved in the preparation examples disclosed herein:

[0053] Table 1 abbreviation name structure 4,4'-ODA 4,4'-Diaminodiphenyl ether (4,4'-oxydianiline) 4,4'-ODA TFMB 2,2'-bis(trifluoromethyl)benzidine BAPS bis[4-(4-aminophenoxy)phenyl]sulfone B1317 Bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride H-PMDA 1,2,4,5-cyclohexanetetracarboxylic dianhydride 4,4'-BPDA 3,3',4,4'-biphenyl tetracarboxylic dianhydride 6FDA 4,4'-(hexafluoroisopropylidene)diphthalic anhydride alkydinosuccinic anhydride TMPTMA Trimethylolpropane triacrylate DPHA Dipentaerythritol hexaacrylate

[0054] Preparation Example 1 4,4'-Diaminodiphenyl ether (4,4'-ODA) (as a diamine), bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (B1317) (as a dianhydride), 4,4'-hexafluoroisopropylidene phthalic dianhydride (6FDA) (as a dianhydride), and alyl succinic anhydride (as a capping agent) were added to a reaction flask, wherein the molar ratio of the diamine to the dianhydride was approximately 1.0044, the molar ratio of B1317 to 6FDA was 1, and the molar ratio of the capping agent to the dianhydride was approximately 0.0177. Next, gamma-butyrolactone (GBL) was added to the reaction flask to obtain a solution (solid content approximately 30%). Next, the solution was reacted at 220 °C for 6 hours under nitrogen atmosphere, and the result was purified to obtain polyimide (1). The number of repeating units (n value) in the main chain of polyimide (1) was evaluated, and the results are shown in Table 2. The number of repeating units (n value) was evaluated by measuring the number average molecular weight (Mn) of polyimide using gel permeation chromatography (GPC) (with polystyrene as a standard to prepare the calibration curve), and the obtained number average molecular weight (Mn) was divided by the molecular weight of the main chain repeating unit to calculate the number of repeating units (n value).

[0055] Preparation Example 2 Preparation Example 2 was carried out in accordance with the method described in Preparation Example 1, except that the molar ratio of the capping agent to the dianhydride was reduced to 0.0154 to increase the number of main chain repeating units (n value) of the obtained polyimide (2). The results are shown in Table 2.

[0056] Preparation Example 3 Preparation Example 3 was carried out in accordance with the method described in Preparation Example 1, except that the molar ratio of the end-capping agent to the dianhydride was increased to 0.0221 to reduce the number of main chain repeating units (n value) of the obtained polyimide (3). The results are shown in Table 2.

[0057] Preparation Example 4 Preparation Example 4 was carried out in the manner described in Preparation Example 1, except that no capping agent was added, and polyimide (4) was obtained.

[0058] Preparation Example 5 Preparation Example 5 was carried out in accordance with the method described in Preparation Example 1, except that the molar ratio of the capping agent to the dianhydride was reduced to 0.011 to increase the number (n value) of the main chain repeating units of the obtained polyimide (5). The results are shown in Table 2.

[0059] Preparation Example 6 Preparation Example 6 was carried out in accordance with the method described in Preparation Example 1, except that 4,4'-ODA was replaced by 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB) as a diamine to obtain the number (n value) of the main chain repeating units of polyimide (6), and the results are shown in Table 2.

[0060] Preparation Example 7 Preparation Example 7 was carried out in accordance with the method described in Preparation Example 1, except that 3,3',4,4'-biphenyltetracarboxylic acid dianhydride (BPDA) was used to replace B1317 and 6FDA as dianhydrides, and the number (n value) of the main chain repeating units of polyimide (7) was obtained. The results are shown in Table 2.

[0061] Preparation Example 8 Preparation Example 8 was carried out in accordance with the manner described in Preparation Example 1, except that 4,4'-ODA was replaced by bis[4-(4-aminophenoxy)phenyl] benzo[BAPS] as a diamine and B1317 and 6FDA were replaced by 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride (H-PMDA) as dianhydrides, and the number of main chain repeating units (n value) of polyimide (8) was obtained, and the results are shown in Table 2.

[0062] Table 2 diamine Dihydride n n / 2 Preparation Example 1 4,4'-ODA 6FDA / B1317 ~600 ~300 Preparation Example 2 4,4'-ODA 6FDA / B1317 ~1000 ~500 Preparation Example 3 4,4'-ODA 6FDA / B1317 ~100 ~50 Preparation Example 4 4,4'-ODA 6FDA / B1317 - (Without end capping agent) - (Without end capping agent) Preparation Example 5 4,4'-ODA 6FDA / B1317 ~1600 ~800 Preparation Example 6 TFMB 6FDA / B1317 ~600 ~300 Preparation Example 7 4,4'-ODA BPDA ~600 ~300 Preparation Example 8 BAPS H-PMDA ~600 ~300

[0063] Preparation of the composition

[0064] Examples 1-7 In Examples 1-7, polyimide, crosslinking agent, and initiator were added to a reaction flask according to the components and contents shown in Table 3. Then, γ-butyrolactone (GBL) was added to dissolve the mixture, resulting in a composition (1)-(7) (solid content approximately 30%).

[0065] Table 3 Polyimide Crosslinking agent Initiator Composition (1) Polyimide (1) 100 parts by weight TMPTMA 3.26 parts by weight BPO 0.78 parts by weight Composition (2) Polyimide (2) 100 parts by weight TMPTMA 2.85 parts by weight BPO 0.68 parts by weight Composition (3) Polyimide (3) 100 parts by weight TMPTMA 4.07 parts by weight BPO 0.97 parts by weight Composition (4) Polyimide (6) 100 parts by weight TMPTMA 2.67 parts by weight BPO 0.64 parts by weight Composition (5) Polyimide (7) 100 parts by weight TMPTMA 3.60 parts by weight BPO 0.86 parts by weight Composition (6) Polyimide (8) 100 parts by weight TMPTMA 2.72 parts by weight BPO 0.65 parts by weight Composition (7) Polyimide (1) 100 parts by weight DPHA 5.57 parts by weight BPO 0.78 parts by weight

[0066] Comparative Examples 1-4 In Comparative Examples 1-4, polyimide, crosslinking agent, and initiator were added to a reaction flask according to the components and contents shown in Table 4. Then, gamma-butyrolactone (GBL) was added to dissolve the mixture, resulting in a composition (8)-(11) (solid content approximately 30%).

[0067] Table 4 Polyimide Crosslinking agent Initiator Composition (8) Polyimide (4) 100 parts by weight - - Composition (9) Polyimide (5) 100 parts by weight TMPTMA 2.04 parts by weight BPO 0.48 parts by weight Composition (10) Polyimide (1) 100 parts by weight - BPO 0.78 parts by weight Composition (11) Polyimide (4) 100 parts by weight TMPTMA 3.27 parts by weight BPO 0.78 parts by weight

[0068] Packaging structure fabrication

[0069] Example 8 A miniature diode (manufactured by Epistar Corporation) is provided. Next, the composition (1) is spin-coated onto a glass substrate for 60 seconds at a rotation speed of 1,000 rpm. After baking at 300 °C for 60 minutes, a polyimide film (11 μm thick) disposed on the glass substrate is obtained. Then, a redistribution layer is formed on the polyimide film, and the miniature diode is disposed on and connected to the redistribution layer to obtain the encapsulation structure (1).

[0070] Examples 9-14 and Comparative Examples 5-8 Examples 9-14 and Comparative Examples 5-8 were carried out in accordance with the manner described in Example 8, except that compositions (1) were replaced by compositions (2)-(11) respectively to obtain encapsulation structures (2)-(11).

[0071] Packaging Structure Preparation and Evaluation Next, the micro diodes in the packaging structures (1)-(11) were evaluated to see if they could be separated from the glass substrate after a laser removal process. The evaluation method was as follows: A laser machine (purchased from Qinyou Optoelectronics) was used to irradiate the polyimide film of the packaging structure with laser light of wavelength 308nm (power 2-10kw, scanning irradiation rate 1-5M / m). The laser irradiation energy is shown in Table 5. After the scanning irradiation was completed, the packaging structure was removed, and the micro diodes in the packaging structures (1)-(11) were evaluated to see if they could be removed from the glass substrate by the cross-cut test method (according to ASTM D3359). If the cross-cut test result was 0B, it was determined that they could be removed. Next, after the scanning irradiation was completed, the glass substrate was observed to see if it turned yellow or charred. The results are shown in Table 5.

[0072] Table 5 Laser energy (kW) Scan speed (m / min) Laser beam irradiation intensity (mJ / cm)2 ) Can the LED be removed? Did the substrate show yellowing or charring? Example 8 Packaging structure (1) 2 4 2.5 Can be removed no Example 9 Packaging structure (2) 2 3 3.44 Can be removed no Example 10 Packaging structure (3) 2 5 2 Can be removed no Example 11 Packaging structure (4) 2 4 2.5 Can be removed no Example 12 Packaging structure (5) 2 4 2.5 Can be removed no Example 13 Packaging structure (6) 2 4 2.5 Can be removed no Example 14 Packaging structure (7) 2 4 2.5 Can be removed no Comparative Example 5 Packaging structure (8) 10 1 50 Unable to remove - Comparative Example 6 Packaging structure (9) 3 1 15 Unable to remove - Packaging structure (9) 5 1 25 Can be removed charred Comparative Example 7 Packaging structure (10) 2 4 2.5 Unable to remove - Comparative Example 8 Packaging structure (11) 2 4 2.5 Unable to remove -

[0073] As shown in Table 2-5, the ratio (n / 2) of the number of repeating main chain units to end capping groups in the polyimide used in compositions (1)-(7) is in the range of 10-550. With the use of an appropriate amount of crosslinking agent, the film prepared by compositions (1)-(7) is suitable for laser removal process (it can be decomposed by a laser beam with an irradiation intensity of less than 5 mJ / cm 2), so that the micro diode can be separated from the encapsulation structure. The polyimide used in composition (8) does not use an end capping agent to control the main chain length in its preparation. Even with the further use of a crosslinking agent (i.e., composition (11)), it is still not suitable for laser removal process. The polyimide used in composition (9) has an excessively long main chain length. Even with the use of an end capping agent in the polyimide process, it is still not suitable for laser removal process (it requires a laser beam with a high irradiation intensity, which can easily damage the device). Composition (10) uses polyimide with a specific main chain length as disclosed herein, but does not contain a crosslinking agent and is still not suitable for laser removal processes.

[0074] In summary, by using a specific polyimide (with a main chain repeating unit within a specific range) and a crosslinking agent, the composition disclosed herein is suitable for laser removal processes and can be applied to packaging structures. In this way, electronic components can be smoothly separated from the substrate during the transfer of electronic components without causing damage to them.

[0075] Although this disclosure has been disclosed above with reference to several embodiments, it is not intended to limit this disclosure. Anyone with ordinary knowledge in the art can make any modifications and alterations without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0008] Figure 1 shows a schematic diagram of the packaging structure according to an embodiment of the present disclosure. Figure 2 shows a flowchart of the steps of the method 100 for disassembling the packaging structure according to an embodiment of the present disclosure.

Claims

1. A composition for preparing a polyimide film, comprising: 100 parts by weight of a polyimide, wherein the polyimide is composed of n main chain repeating units and 2 end-capping groups, wherein n / 2 is from 10 to 550, wherein the main chain repeating unit is derived from the reaction of a diamine with a dianhydride; the end-capping group is derived from the reaction of the diamine with an anhydride-type end-capping agent; and the anhydride-type end-capping agent is, or wherein R1 is independently hydrogen, fluorine, hydroxyl, amino, C1-C8 alkyl, C1-C8 fluoroalkyl, C6-C12 aryl, C2-C8 carboxylalkyl, C2-C8 alkenyl, or C2-C8 isocyanate. The compound comprises, C1-C8 alkylamine, C4-C8 acryloxyalkyl, C5-C9 methacryloxyalkyl, C3-C8 epoxyalkyl, C4-C8 oxetylalkyl, or 3,4-epoxycyclohexyl, wherein at least one R1 group is independently C2-C8 carboxylalkyl, C2-C8 alkenyl, C2-C8 isocyanate alkyl, C4-C8 acryloxyalkyl, C5-C9 methacryloxyalkyl, C3-C8 epoxyalkyl, C4-C8 oxetylalkyl, or 3,4-epoxycyclohexyl; and 1-10 parts by weight of a crosslinking agent.

2. The composition for preparing a polyimide film as described in claim 1, wherein the diamine is 1,3-bis(4'-aminophenoxy)benzene, 3,3'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether, bis(4-aminophenyl)terephthalate, 1,3-bis(3-aminophenoxy)benzene, 4,4'-oxybis[3-(trifluoromethyl)aniline], 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 4,4' -Bis(4-aminophenoxy)benzophenone, 4,4'-[naphthalene-2,7-dimethylbis(oxy)diphenylamine, 4,4'-bis(4-aminophenoxy)biphenyl, 2,2-bis[4-(4-aminophenoxy)benzene]hexafluoropropane, isophorone diamine, 1-methyl-2,4-cyclohexanediamine, 4,4'-diaminodicyclohexylmethane, 4,4'-methylenebis(2-methylcyclohexane), bis Cyclo[2.2.1]heptanedimethylamine, 1,3-adamantanediamine, bis(aminomethyl)tricyclo[5.2.1.02,6]decane, 2,2'-bis(trifluoromethyl)diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, o-dimethyl-p-diaminobiphenyl, 4,4'-diaminodiphenylmethane, 3,4'-diamino Diphenylmethane, 4,4'-diamino-3,3'-dimethylbiphenylmethane, 4,4'-methylenebis(2-ethyl)aniline, 4,4'-methylenebis(2,6-diethylaniline), 9,10-bis(4-aminophenyl)anthracene, p-phenylenediamine, m-phenylenediamine, o-phenylenediamine, 2,6-naphthylenediamine, 2,6-diaminoanthracene, 4,4'-diaminotriphenyl, 2,2-bis(4-amino) (Phenyl)hexafluoropropane, α,α'-bis(4-aminophenyl)-1,4-diisopropylbenzene, 9,9-bis(4-aminophenyl)fluorene, 3,3',5,5'-tetramethylbenzidine, 4,4-diamino-2,2'-dimethoxybiphenyl, 4,4'-diaminobenzophenone, bis[4-(4-aminophenoxy)phenyl] benzophenone, 4,4'-diaminobenzophenone, or combinations thereof.

3. The composition for preparing a polyimide film as described in claim 1, wherein the dianhydride is 3,4'-oxophthalic anhydride, 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, p-phenylenediamine bis(phenyltripterygium anhydride), 2,6-dihydroxyphenylenediamine bis(phenyltripterygium anhydride), pyromellitic dianhydride, cyclobutane-1,2,3,4-tetracarboxylic dianhydride, 1,2, 4,5-Cyclohexanetetracarboxylic dianhydride, bicyclo[2.2.2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride, dicyclooctanetetracarboxylic dianhydride, dicyclohexyl-3,4,3',4'-tetracarboxylic dianhydride, 3-(carboxymethyl)-1,2,4-cyclopentanetricarboxylic acid 1,4:2,3-dianhydride, 1,2,3,4-butanetetracarboxylic dianhydride, 3,3',4,4'-biphenyltetracarboxylic acid Dihydride, 2,3,3',4'-biphenyltetracarboxylic acid dianhydride, 5-[4-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione, 5-[3-(1,3-dioxo-2-benzofuran-5-yl)phenyl]-2-benzofuran-1,3-dione, 4,4'-hexafluoroisopropylidene diphthalic acid dianhydride, 3,3',4'-biphenyltetracarboxylic acid dianhydride, 4'-Benzophenone tetracarboxylic dianhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorenic anhydride, N-[4-[4-[(1,3-dioxo-2-benzofuran-5-carbonyl)amino]-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)phenyl]-1,3-dioxo-2-benzofuran-5-methylamine, 1,2,3,4-cyclopentane tetracarboxylic anhydride, or combinations thereof.

4. The composition for preparing a polyimide film as described in claim 1, wherein the molar ratio of the diamine to the dianhydride is from 1:1.05 to 1.05:

1.

5. The composition of claim 1, wherein the crosslinking agent is a compound having at least two reactive groups, wherein the reactive groups are isocyanate, epoxy, acryloxy, or methacryloxy.

6. The composition for preparing a polyimide film as described in claim 1, wherein the crosslinking agent is trimethylolpropane triglycidyl ether, glyceryl triglycidyl ether, glyceryl propoxy ester triglycidyl ether, N,N-diglycidyl-4-oxyglycidyl aniline, tris(2,3-epoxypropyl)isocyanurate, o-cresol epoxy resin, trihydroxyphenylmethane triglycidyl ether, N,N,N',N'-tetraglycidyl-4,4'-diaminodiphenylmethane, or tetrahydroxyphenylethane glycidyl ether. Toluene diisocyanate, phenyl diisocyanate, 4,4'-diphenyl diisocyanate, 1,5-naphthalene diisocyanate, diphenylmethane diisocyanate, toluidine diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, methyl 2,6-diisocyanate decanoate, 1,3-cyclopentane diisocyanate, norbornene diisocyanate, bis(methyl)cyclohexane, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, 1,9-Nonanediol diacrylate, 1,9-Nonanediol dimethacrylate, 1,10-Decanediol diacrylate, 1,10-Decanediol dimethacrylate, Neopentyl glycol diacrylate, Neopentyl glycol dimethacrylate, Polyethylene glycol (200) diacrylate, Polyethylene glycol (400) diacrylate, Pentaerythritol tetraacrylate, Dipentaerythritol hexaacrylate, Bis(trimethylolpropane) tetraacrylate, Trimethylolpropane trimethacrylate, Dipolypentaerythritol polyacrylate, Polypentaerythritol polyacrylate Polybutadiene diacrylate, 3-methyl-1,5-pentanediol diacrylate, ethoxylated 3-bisphenol A diacrylate, propoxylated 3-trimethylolpropane triacrylate, ethoxylated 4-pentaerythritol tetraacrylate, 6-trimethylolpropane triacrylate, ethoxylated 9-trimethylolpropane triacrylate, ethoxylated 4-bisphenol A diacrylate, ester diol diacrylate, alkyl oxidized diacrylate, propoxylated 2-neopentyl glycol diacrylate, propoxylated 3-glycerol triacrylate, polyurethane acrylate resin, or combinations thereof.

7. The composition for preparing a polyimide film as described in claim 1 further comprises: 0.1-2 parts by weight of an initiator.

8. The composition for preparing a polyimide film as claimed in claim 1 further comprises: a solvent, wherein the solid content of the composition for preparing a polyimide film is from 2 wt% to 20 wt%.

9. An encapsulation structure comprising: a substrate; a polyimide film disposed on the substrate, wherein the polyimide film is a cured product of the composition for preparing the polyimide film as described in any one of claims 1-8; and an electronic component disposed on the polyimide film.

10. The packaging structure as described in claim 9, wherein the electronic component is a semiconductor wafer, a display element, or a light-emitting diode.

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