Resin Particles and Resin Compositions for Semiconductor Components

Abstract

This invention provides resin particles that exhibit dielectric loss factor, high heat resistance, and excellent flexibility. It also provides a resin composition for semiconductor components containing these resin particles. The resin particles of this invention contain a polymer P having a specific ether structure, and the recovery rate calculated by load unloading tests conducted under conditions of 20°C, 65% relative humidity, a load speed of 0.732 mN / s, a maximum load of 9.81 mN, and a minimum load of 1.96 mN is 4.6% or higher.

Description

Resin particles and resin composition for semiconductor components The present invention relates to resin particles and a resin composition for semiconductor components. In order to achieve high-speed information processing in electronic devices, attempts have been made to reduce the dielectric constant and dielectric loss factor of the insulating layer of a multilayer printed circuit board. For example, the following research has been conducted: By mixing resin particles in the resin forming the insulating layer, the dielectric constant and dielectric loss factor of the insulating layer are reduced. Resin particles for semiconductor component applications are required to have high heat resistance, that is, even when the resin in which the resin particles are mixed is heated during molding or soldering, the resin particles do not undergo substantial changes. In addition, resin particles for semiconductor component applications are required to have excellent flexibility, that is, when a load such as pressing is applied to the resin particles themselves or the resin in which the resin particles are mixed, deformation or breakage of the resin particles does not occur. A thermosetting resin molding material prepared by blending thermoplastic norbornene-based resin particles in a thermosetting resin raw material has been reported. It has excellent electrical properties such as insulation resistance, low dielectric constant, and low dielectric loss factor, and is useful as a material for circuit boards (Patent Document 1). However, thermoplastic norbornene-based resin particles are brittle and have poor flexibility. In addition, thermoplastic norbornene-based resin particles are particles obtained by pulverizing blocks, plates, granules, etc. of thermoplastic norbornene-based resin, so they are amorphous and have a problem of low filling property when mixed in resin. Hollow resin particles that can provide an organic insulating material with excellent insulating properties, low dielectric constant, and low dielectric loss factor have been reported (Patent Document 2). However, since they are hollow resin particles, they have a problem of poor flexibility. A resin sheet for insulating applications having a resin composition layer containing an epoxy resin, an organic solvent, an inorganic filler, and a stress relaxation material provided on a support has been reported (Patent Document 3). In the examples, core-shell rubber particles are used as particulate stress relaxation materials, and phenolic hydroxyl group-containing polybutadiene resins or polycarbonate resins are used as non-particulate stress relaxation materials. However, the core-shell rubber particles described as particulate stress relaxation materials have a problem of high dielectric constant and dielectric loss factor values and insufficient heat resistance because their shell part is an acrylic resin. The non-particulate stress relaxation materials are amorphous and have a problem of low filling property when mixed in resin. There is reported a composition for modifying an insulating film (Patent Document 4) containing a dispersion medium and core-shell polymers having a rubbery elastic core layer. However, regarding the core-shell polymers, since the polymer constituting the shell layer is an acrylic resin as known from the composition of styrene / methyl methacrylate / acrylonitrile / glycidyl methacrylate = 60 / 50 / 30 / 40 (weight ratio) described in the examples, there are problems such as high values of dielectric constant and dielectric loss factor and insufficient heat resistance. Prior Art Documents Patent Documents Patent Document 1: Japanese Patent Laid-Open No. 6-162856 Patent Document 2: Japanese Patent Laid-Open No. 2000-313818 Patent Document 3: International Publication No. 2022-196696 Patent Document 4: Japanese Patent Laid-Open No. 2016-094527 [Problems to be Solved by the Invention] The present invention has been completed to solve the above-mentioned prior problems, and its main object is to provide resin particles that can exhibit low dielectric loss factor, high heat resistance, and excellent flexibility. Further, a resin composition for semiconductor components containing such resin particles is provided. [Technical Means for Solving the Problems] [1] The resin particles of an embodiment of the present invention contain a polymer P having an ether structure represented by formula (1), and the recovery rate calculated by a load-unloading test conducted under the conditions of a temperature of 20°C, a relative humidity of 65%, a loading rate of 0.732 mN / second, a maximum load of 9.81 mN, and a minimum load of 1.96 mN is 4.6% or more. [Chemical 1] [2] The resin particles as described in [1] above may have a 3% weight loss temperature of 270 °C or higher when heated at 10 °C per minute in an air environment. [3] The resin particles as described in [1] or [2] above may have a dielectric loss factor of 0.0040 or less at a frequency of 10 GHz. [4] The resin particles as described in any one of [1] to [3] above may have a volume average particle diameter of 0.1 μm to 100 μm. [5] The resin particles as described in any one of [1] to [4] above may have a coefficient of variation of particle diameter of 10% to 50%. [6] The resin particles as described in any one of [1] to [5] above may have an average roundness of 0.95 to 1.00. [7] The resin particles as described in any one of [1] to [6] above may be solid particles. [8] The resin particles as described in any one of [1] to [7] above, wherein the polymer P may be a polymer obtained by a polymerization reaction of a monomer composition containing a compound A having an ether structure and a radical-reactive group represented by the above formula (1) and a monomer M that reacts with the compound A. [9] The resin particles as described in [8] above, wherein the monomer M may contain an aromatic monofunctional monomer m1 and an aromatic crosslinkable monomer m2.

[10] The resin particles as described in [8] or [9] above, wherein the content ratio of the compound A in the monomer composition may be 0.1% by weight or more and less than 60% by weight.

[11] The resin particles as described in [9] or

[10] above, wherein the content ratio of the aromatic monofunctional monomer m1 in the monomer M may be 50% by weight to 99% by weight.

[12] The resin particles as described in any one of [9] to

[11] above, wherein the content ratio of the aromatic crosslinkable monomer m2 in the monomer M may be 1% by weight to 50% by weight.

[13] The resin particles as described in any one of [9] to

[12] above, wherein in the monomer composition, as the content ratio of the aromatic crosslinkable monomer m2 relative to the compound A, when the compound A is 100 parts by weight, the amount of the aromatic crosslinkable monomer m2 may be 1 part by weight to 1000 parts by weight.

[14] The resin particles as described in any one of [8] to

[13] above, wherein in the monomer composition, a thiol compound of less than 2 parts by weight may be contained relative to 100 parts by weight of the monomer composition.

[15] The resin particles as described in any one of [1] to

[14] above may be for semiconductor components.

[16] The resin composition for semiconductor components according to an embodiment of the present invention contains the resin particles as described in

[15] above. [Advantages of the Invention] According to an embodiment of the present invention, resin particles that can exhibit low dielectric loss factor, high heat resistance, and excellent flexibility can be provided. Also, a resin composition for semiconductor components containing such resin particles can be provided. Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to these embodiments. In this specification, when the expression “(meth)acryloyl” is present, it means “acryloyl and / or methacryloyl”, and when the expression “(meth)acrylate” is present, it means “acrylate and / or methacrylate”. ≪Resin particles≫ Regarding the resin particles of the embodiments of the present invention, the recovery rate calculated by the load-unloading test conducted under the conditions of a temperature of 20°C, a relative humidity of 65%, a loading speed of 0.732 mN / second, a maximum load of 9.81 mN, and a minimum load of 1.96 mN is preferably 4.6% or more, more preferably 5% or more, still more preferably 5.5% or more, still more preferably 6.0% or more, still more preferably 6.2% or more, particularly preferably 6.3% or more, and most preferably 6.5% or more. The higher the above-mentioned recovery rate, the better. However, in reality, the upper limit value can be 30% or less. The higher the above-mentioned recovery rate within the above range, the more excellent flexibility the resin particles of the embodiments of the present invention can exhibit. If the above-mentioned recovery rate is low and exceeds the above range, the flexibility of the resin particles becomes low, and when a load such as pressing is applied to the resin particles themselves or a resin in which the resin particles are mixed, there is a risk of deformation or breakage of the resin particles. The measurement method of the above-mentioned load-unloading test will be described in detail below. The 3% weight loss temperature when the resin particles of the embodiments of the present invention are heated at a rate of 10°C per minute in an air environment is preferably 270°C or higher, more preferably 280°C or higher, still more preferably 290°C or higher, still more preferably 300°C or higher, particularly preferably 310°C or higher, and most preferably 320°C or higher. The higher the above-mentioned 3% weight loss temperature, the better. However, in reality, the upper limit value can be 500°C or lower. The higher the above-mentioned 3% weight loss temperature within the above range, the higher heat resistance the resin particles of the embodiments of the present invention can exhibit. If the above-mentioned 3% weight loss temperature is low and exceeds the above range, the resin particles will be deformed by heating. For example, when the resin particles are kneaded with a thermosetting resin, there is a risk of deformation of the resin particles due to the heating for the curing reaction, and the effect of reducing the dielectric loss factor may decrease. The measurement method of the above-mentioned 3% weight loss temperature will be described in detail below. The dielectric loss factor of the resin particles of the embodiments of the present invention at a frequency of 10 GHz is preferably 0.0040 or less, more preferably 0.0030 or less, still more preferably 0.0020 or less, particularly preferably 0.0015 or less, and most preferably 0.0010 or less. As the lower limit value of the above-mentioned dielectric loss factor, it is preferably 0 or more. If the above-mentioned dielectric loss factor is within the above range, the resin particles of the embodiments of the present invention themselves or a resin in which the resin particles are mixed can exhibit a reduction in the dielectric loss factor. The measurement method of the above-mentioned dielectric loss factor will be described in detail below. The volume average particle diameter of the resin particles of the embodiment of the present invention is preferably from 0.1 μm to 100 μm. If the above volume average particle diameter is within the above range, the resin particles of the embodiment of the present invention can be used for various purposes. The method for measuring the above volume average particle diameter will be described in detail below. In the case of resin particles for semiconductor component applications, the volume average particle diameter of the resin particles of the embodiment of the present invention is preferably from 0.1 μm to 100 μm, more preferably from 0.1 μm to 50 μm, still more preferably from 0.1 μm to 30 μm, particularly preferably from 0.1 μm to 20 μm, and most preferably from 0.1 μm to 10 μm. For applications that require resin particles in the micron size range, the volume average particle diameter of the resin particles of the embodiment of the present invention is preferably from 0.1 μm to 100 μm, more preferably from 0.3 μm to 50 μm, still more preferably from 0.6 μm to 30 μm, particularly preferably from 0.8 μm to 20 μm, and most preferably from 1 μm to 10 μm. For applications that require resin particles in the submicron size range, the volume average particle diameter of the resin particles of the embodiment of the present invention is preferably from 0.1 μm to 100 μm, more preferably from 0.1 μm to 50 μm, still more preferably from 0.1 μm to 10 μm, particularly preferably from 0.1 μm to 5 μm, and most preferably from 0.1 μm to 1 μm. The coefficient of variation of the particle diameter of the resin particles of the embodiment of the present invention is preferably from 10% to 50%, more preferably from 15% to 45%, still more preferably from 18% to 42%, particularly preferably from 20% to 40%, and most preferably from 22% to 38%. If the coefficient of variation of the above particle diameter is within the above range, for example, when resin particles are mixed in a resin, the resin particles are easily dispersed in the resin, and moreover, adverse effects caused by an increase in the amount of coarse resin particles can be suppressed. When the coefficient of variation of the particle diameter of the resin particles is too large and exceeds the above range, due to an increase in the amount of coarse resin particles, for example, when made into a resin layer by being mixed in a resin, there is a risk of difficulty in thinning or uneven thickness. When the coefficient of variation of the particle diameter of the resin particles is too small and exceeds the above range, when resin particles are mixed in a resin, the resin particles are not easily dispersed in the resin, and for example, when made into a resin layer by being mixed in a resin, there is a risk of uneven thickness. The method for measuring the coefficient of variation of the above particle diameter will be described in detail below. The average circularity of the resin particles of the embodiment of the present invention is preferably 0.95 to 1.00, more preferably 0.96 to 1.00, still more preferably 0.97 to 1.00, particularly preferably 0.98 to 1.00, and most preferably 0.99 to 1.00. When the above average circularity is within the above range, the shape of the resin particles of the embodiment of the present invention is close to a true spherical shape. Therefore, for example, when mixed and present in the resin, the filling property becomes higher. If the above average circularity is low and exceeds the above range, the shape of the resin particles deviates from the true spherical shape, so there is a risk that the filling property, for example, when mixed and present in the resin, may decrease. The resin particles of the embodiment of the present invention are preferably solid particles. If the resin particles of the embodiment of the present invention are solid particles, more excellent flexibility can be exhibited. <Polymer P> Representatively, the resin particles of the embodiment of the present invention contain a polymer P having an ether structure represented by the formula (1). By making the polymer P have the ether structure represented by the formula (1), the effects of the present invention can be further exhibited. [Chemical formula 2] The polymer P may be only one kind or two or more kinds. The ether structure represented by the formula (1) possessed by the polymer P may be only one kind or two or more kinds. It can be confirmed that the polymer P has the ether structure represented by the formula (1) by any suitable identification methods such as NMR (nuclear magnetic resonance), IR (infrared ray), and MS (Mass spectrometry). Regarding the content ratio of the polymer P in the resin particles of the embodiment of the present invention, in terms of further exhibiting the effects of the present invention, it is preferably 60% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, still more preferably 80% by weight to 100% by weight, still more preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably 98% by weight to 100% by weight. A preferred embodiment of the polymer P is a polymer obtained by a polymerization reaction of a monomer composition containing a compound A having an ether structure represented by the formula (1) and a radical-reactive group and a monomer M that reacts with the compound A. Here, the monomer composition contains the compound A and the monomer M and does not contain a polymerization initiator used in the polymerization reaction. Therefore, a preferred embodiment of the polymer P contains an ether structure represented by formula (1) and a structural unit derived from the monomer contained in the monomer M. For example, when the monomer M contains an aromatic monofunctional monomer m1 and an aromatic crosslinkable monomer m2 as described below, a preferred embodiment of the polymer P has an ether structure represented by formula (1), a structural unit derived from the aromatic monofunctional monomer, and a structural unit derived from the aromatic crosslinkable monomer. Here, the so-called "structural unit derived from a monomer" refers to a structural unit of a polymer formed by the cleavage of a radical-reactive group (typically a carbon-carbon unsaturated double bond) possessed by the monomer contained in the monomer composition during the polymerization of the monomer composition. For example, the structural unit of a monomer having a structure of "RpRqC=CRrRs" (Rp, Rq, Rr, Rs are any suitable groups bonded to a carbon atom by a single bond) refers to a structural unit of "-RpRqC-CRrRs-" formed by the cleavage of the carbon-carbon unsaturated double bond "C=C" due to a polymerization reaction. Furthermore, the content ratio of the structural unit derived from each monomer in the polymer can be known from various structural analyses of the polymer (such as NMR, etc.). Also, even without performing such various structural analyses, the content ratio of the structural unit derived from each monomer in the polymer can be calculated based on the amount of each monomer used in the preparation of the polymer and the polymerization reaction rate. Also, the content ratio of the structural unit derived from each monomer in the polymer can be determined by any other suitable method. Compound A may be only one kind, or may be two or more kinds. As the radical-reactive group possessed by compound A, as long as it is a group commonly known as a radical-reactive group, any suitable radical-reactive group can be adopted within the range that does not impair the effects of the present invention. In terms of further demonstrating the effects of the present invention, as such a radical-reactive group, a group having a carbon-carbon unsaturated double bond is preferably exemplified. Specifically, for example, vinyl, acryloyl, methacryloyl, acrylamide group, allyl group can be exemplified. As compound A, as long as it has an ether structure represented by formula (1) and a radical-reactive group, any suitable compound can be adopted within the range that does not impair the effects of the present invention. In terms of further demonstrating the effects of the present invention, as such compound A, polyphenylene ether (PPE) is preferably exemplified. As compound A, for example, polyphenylene ether (PPE) having a structure represented by formula (2) can be exemplified. Of course, compound A is not limited to polyphenylene ether (PPE) having a structure represented by formula (2) as long as it has an ether structure represented by formula (1) and a radical-reactive group. [Chemical formula 3] In formula (2), m and n represent the number of repeating units (addition mole number) of the ether structure represented by formula (1), X 1 , X 2 is an organic group having a free-radical reactive group, and Y is an organic group not having a free-radical reactive group. m and n are not particularly limited, and may be, for example, 1 to 100, may be 2 to 70, may be 4 to 50, may be 5 to 30, respectively. Examples of commercially available products of polyphenylene ether include: the product name "NORYL (registered trademark)" series (such as NORYL (registered trademark) SA9000, etc.) (manufactured by SABIC), the product name "Lupiace (registered trademark)" series (manufactured by Mitsubishi Chemical Corporation), the product name "Zylon (registered trademark)" series (manufactured by Asahi Kasei Corporation), the product name "OPE-2St" series (manufactured by Mitsubishi Gas Chemical Company, Inc.), the product name "DPPE-VBT50" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.). In terms of further exhibiting the effects of the present invention, compound A may be an oligomer. In this case, the number-average molecular weight Mn of compound A is preferably 500 to 5000, more preferably 800 to 3500, still more preferably 1000 to 3000, particularly preferably 1200 to 2500, and most preferably 1400 to 2000. In terms of further exhibiting the effects of the present invention, the content ratio of compound A in the monomer composition is preferably 0.1% by weight or more and less than 60% by weight, more preferably 0.1% by weight or more and less than 55% by weight, still more preferably 0.1% by weight or more and less than 50% by weight, still more preferably 0.1% by weight or more and less than 45% by weight, still more preferably 0.1% by weight or more and less than 40% by weight, still more preferably 1% by weight to 35% by weight, still more preferably 3% by weight to 30% by weight, still more preferably 5% by weight to 25% by weight, particularly preferably 7% by weight to 22% by weight, and most preferably 9% by weight to 21% by weight. If the content ratio of compound A in the monomer composition is too low and exceeds the above range, there is a risk that the effects of the present invention cannot be exhibited. For example, there is a risk that high heat resistance cannot be exhibited, or excellent flexibility cannot be exhibited. If the content ratio of compound A in the monomer composition is too high and exceeds the above range, there is a risk that the effects of the present invention cannot be exhibited. For example, since compound A is difficult to dissolve in the monomer composition, there is a risk that resin particles cannot be obtained. As monomer M, as long as it is a monomer different from compound A and reacts with compound A, any suitable monomer can be used within the range that does not impair the effects of the present invention. Monomer M may be only one kind, or two or more kinds. As the monomer M, in terms of further exhibiting the effects of the present invention, it is preferably composed of an aromatic monofunctional monomer m1 and an aromatic crosslinkable monomer m2. The aromatic monofunctional monomer m1 may be only one kind, or two or more kinds. The aromatic crosslinkable monomer m2 may be only one kind, or two or more kinds. As long as the aromatic monofunctional monomer m1 is a monofunctional aromatic monomer, any suitable aromatic monofunctional monomer can be used within the scope that does not impair the effects of the present invention. As such an aromatic monofunctional monomer m1, in terms of further exhibiting the effects of the present invention, for example, styrene, ethyl vinylbenzene, α-methylstyrene, vinyltoluene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, vinyl biphenyl, and vinylnaphthalene can be cited. In terms of further exhibiting the effects of the present invention and the aspect of reactivity, as the aromatic monofunctional monomer m1, it is preferably at least one selected from the group consisting of styrene and ethyl vinylbenzene. As long as the aromatic crosslinkable monomer m2 is an aromatic monomer having crosslinkability, any suitable aromatic crosslinkable monomer can be used within the scope that does not impair the effects of the present invention. As such an aromatic crosslinkable monomer m2, in terms of further exhibiting the effects of the present invention, for example, divinylbenzene, divinylnaphthalene, and diallyl phthalate can be cited. In terms of further exhibiting the effects of the present invention and the aspect of reactivity, as the aromatic crosslinkable monomer m2, divinylbenzene is preferably used. Regarding the total content ratio of the aromatic monofunctional monomer m1 and the aromatic crosslinkable monomer m2 in the total amount of the monomer M, in terms of further exhibiting the effects of the present invention, it is preferably 50% by weight to 100% by weight, more preferably 80% by weight to 100% by weight, still more preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably 98% by weight to 100% by weight. As the monomer M, any other suitable monomer different from the compound A, the aromatic monofunctional monomer m1, and the aromatic crosslinkable monomer m2 can be used within the scope that does not impair the effects of the present invention. The other monomer may be only one kind, or two or more kinds. As other monomers, for example, the following can be cited: monomers containing a carboxyl group such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, fumaric acid, itaconic acid, etc.; maleic anhydride; (meth)acrylic acid methyl ester, (meth)acrylic acid ethyl ester, (meth)acrylic acid butyl ester, (meth)acrylic acid cyclopentyl ester, (meth)acrylic acid cyclohexyl ester, (meth)acrylic acid adamantyl ester, (meth)acrylic acid norbornenyl ester, (meth)acrylic acid isobornyl ester, (meth)acrylic acid tricyclodecyl ester, (meth)acrylic acid tetracyclododecanyl tetracyclododecyl ester, (meth)acrylic acid cetyl ester, etc. (meth)acrylic acid alkyl esters; dicarboxylic acid ester monomers such as dimethyl maleate, diethyl fumarate, dimethyl fumarate, diethyl fumarate, etc.; methacrylic acid derivatives monomers having a carboxyl group and an ester bond such as 2-methacryloyloxyethyl succinate, 2-methacryloyloxyethyl maleate, 2-methacryloyloxyethyl phthalate, 2-methacryloyloxyethyl hexahydrophthalate, etc.; polyfunctional (meth)acrylic acid esters such as ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, glycerol tri(meth)acrylate, etc.; polyfunctional allyl derivatives monomers such as diallylamine, tetraallyloxyethane, etc.; conjugated diene monomers such as butadiene, isoprene, etc.; chlorine-containing monomers such as vinyl chloride, vinylidene chloride, etc.; (meth)acrylamide; polyfunctional acrylamide derivative monomers such as N,N'-methylenebis(meth)acrylamide, N,N'-ethylenebis(meth)acrylamide, etc.; (meth)acrylonitrile; vinyl acetate; monomers containing an epoxy group; N-vinylcarbazole. As for the content ratio of other monomers in the total amount of monomer M, in terms of further expressing the effects of the present invention, it is preferably 0 wt% to 50 wt%, more preferably 0 wt% to 20 wt%, still more preferably 0 wt% to 10 wt%, particularly preferably 0 wt% to 5 wt%, and most preferably 0 wt% to 2 wt%. As the content ratio of monomer M in the monomer composition, in terms of further demonstrating the effects of the present invention, it is preferably more than 40% by weight and 99.9% by weight or less, more preferably more than 45% by weight and 99.9% by weight or less, still more preferably more than 50% by weight and 99.9% by weight or less, still more preferably more than 55% by weight and 99.9% by weight or less, still more preferably more than 60% by weight and 99.9% by weight or less, still more preferably 65% by weight to 99% by weight, still more preferably 70% by weight to 97% by weight, still more preferably 75% by weight to 95% by weight, particularly preferably 78% by weight to 93% by weight, and most preferably 79% by weight to 91% by weight. If the content ratio of monomer M in the monomer composition is too low and exceeds the above range, there is a risk that the effects of the present invention cannot be demonstrated. For example, since compound A is difficult to dissolve in the monomer composition, there is a risk that resin particles cannot be obtained. If the content ratio of monomer M in the monomer composition is too high and exceeds the above range, there is a risk that the effects of the present invention cannot be demonstrated. For example, there is a risk that high heat resistance cannot be demonstrated, or excellent flexibility cannot be demonstrated. Regarding the content ratio of the aromatic monofunctional monomer m1 in monomer M, in terms of further demonstrating the effects of the present invention, it is preferably 50% by weight to 99% by weight, more preferably 60% by weight to 97% by weight, still more preferably 70% by weight to 95% by weight, still more preferably 80% by weight to 93% by weight, particularly preferably 85% by weight to 92% by weight, and most preferably 87% by weight to 91% by weight. Regarding the content ratio of the aromatic crosslinkable monomer m2 in monomer M, in terms of further demonstrating the effects of the present invention, it is preferably 1% by weight to 50% by weight, more preferably 3% by weight to 40% by weight, still more preferably 5% by weight to 30% by weight, still more preferably 7% by weight to 20% by weight, particularly preferably 8% by weight to 15% by weight, and most preferably 9% by weight to 13% by weight. In the monomer composition, as the content ratio of the aromatic crosslinkable monomer m2 relative to compound A, in terms of further demonstrating the effects of the present invention, when compound A is set to 100 parts by weight, the amount of the aromatic crosslinkable monomer m2 is preferably 1 part by weight to 1000 parts by weight, more preferably 10 parts by weight to 500 parts by weight, still more preferably 20 parts by weight to 400 parts by weight, still more preferably 25 parts by weight to 300 parts by weight, particularly preferably 30 parts by weight to 250 parts by weight, and most preferably 35 parts by weight to 200 parts by weight. The polymer P is obtained by the polymerization reaction of the monomer composition. The polymerization reaction is preferably a suspension polymerization reaction. When performing the suspension polymerization reaction, typically, an oil phase is added to the aqueous phase and dispersed, and then the polymerization reaction is carried out. Regarding dispersion, as long as the oil phase can exist in the form of droplets in the aqueous phase, any suitable dispersion method can be adopted within the range that does not damage the effects of the present invention. As such a dispersion method, a representative one is the dispersion method using a homomixer or a homogenizer. For example, it can be exemplified by: a high-speed homomixer, a Polytron Homogenizer, an ultrasonic homogenizer, and a high-pressure homogenizer. Typically, the aqueous phase contains an aqueous solvent. As the aqueous solvent, typically exemplified are: water, a mixed solvent of water and a lower alcohol (such as methanol, ethanol, etc.). The usage amount of the aqueous solvent can be any suitable usage amount within the range that does not damage the effects of the present invention. As the usage amount of such an aqueous solvent, relative to 100 parts by weight of the monomer composition, it is preferably 10 parts by weight to 5000 parts by weight, more preferably 50 parts by weight to 3000 parts by weight, still more preferably 100 parts by weight to 2000 parts by weight. The oil phase may contain an organic solvent. As the organic solvent, typically exemplified are organic solvents with a boiling point below 100 °C. As the organic solvent with a boiling point below 100 °C, for example, it can be exemplified by: heptane, hexane, cyclohexane, methyl acetate, ethyl acetate, methyl ethyl ketone, chloroform, carbon tetrachloride. The organic solvent with a boiling point below 100 °C can be a mixed solvent. The usage amount of the organic solvent is preferably 20 parts by weight to 250 parts by weight relative to 100 parts by weight of the monomer composition. However, when the resin particles in the embodiment of the present invention are solid particles, it is preferably not to use an organic solvent. The usage amount of the organic solvent is preferably less than 20 parts by weight relative to 100 parts by weight of the monomer composition, more preferably 10 parts by weight or less, still more preferably 5 parts by weight or less, particularly preferably 1 part by weight or less, and most preferably 0.1 part by weight or less. When carrying out the polymerization reaction of the monomer composition, any suitable additive B that does not belong to either compound A or monomer M can be used within the range that does not damage the effects of the present invention. Additive B can be only one kind, or two or more kinds. As additive B, for example, it can be exemplified by: a polymerization initiator, a surfactant, a dispersion stabilizer, a thiol compound, an antioxidant. As a polymerization initiator, any suitable polymerization initiator can be used within the range that does not impair the effects of the present invention. The polymerization initiator can be only one kind or two or more kinds. Examples of such polymerization initiators include organic peroxides such as lauroyl peroxide (LPO), benzoyl peroxide, o-chlorobenzoyl peroxide, o-methoxybenzoyl peroxide, 3,5,5-trimethylhexanoyl peroxide, tert-butyl 2-ethylhexanoate peroxide, di-tert-butyl peroxide, etc.; azo compounds such as 2,2'-azobisisobutyronitrile, 1,1'-azobiscyclohexanecarbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), etc. Among these polymerization initiators, if an organic peroxide is used, more excellent low dielectric loss factor of resin particles can be exhibited. The polymerization initiator can be added to the aqueous phase or the oil phase, but typically it is added to the oil phase. The addition amount of the polymerization initiator is preferably 0.01 parts by weight to 10 parts by weight, more preferably 0.1 parts by weight to 5 parts by weight, based on 100 parts by weight of the monomer composition. As the surfactant, any suitable surfactant can be used within the range that does not impair the effects of the present invention. The surfactant can be only one kind or two or more kinds. In terms of further exhibiting the effects of the present invention, as the surfactant, it is preferably at least one selected from the group consisting of amphoteric surfactants and anionic surfactants. As the amphoteric surfactant, any suitable amphoteric surfactant can be used within the range that does not impair the effects of the present invention. As such amphoteric surfactants, known amphoteric surfactants that can be used in the manufacture of resin particles can be used. Examples of amphoteric surfactants include lauryldimethylamine oxide, lauryldimethylaminoacetic betaine, phosphate ester-based surfactants, phosphite ester-based surfactants. The amphoteric surfactant can be only one kind or two or more kinds. As the anionic surfactant, any suitable anionic surfactant can be used within the range that does not impair the effects of the present invention. Examples of such anionic surfactants include fatty acid salts, polysulfonates, polycarboxylates, alkyl sulfates, alkyl aryl sulfonates, alkyl naphthalene sulfonates, dialkyl sulfonates, dialkyl sulfosuccinates, alkyl phosphates, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl aryl ether sulfates, naphthalene sulfonic acid formalin condensates, polyoxyethylene alkyl phosphosulfonates, glycerol borate fatty acid esters, polyoxyethylene glycerol fatty acid esters. Specifically, for example, sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium polyoxyethylene lauryl ether sulfate, ammonium polyoxyethylene lauryl ether sulfate, polyoxyethylene nonylphenyl ether sulfate salt, sodium salt of β-naphthalene sulfonic acid formalin condensate. The anionic surfactant can be only one kind or two or more kinds. The surfactant can be added to the aqueous phase or the oil phase, but typically it is added to the aqueous phase. The amount of the surfactant used is preferably 0.001 to 1 part by weight, more preferably 0.005 to 0.5 part by weight, and still more preferably 0.01 to 0.1 part by weight, based on 100 parts by weight of the aqueous solvent contained in the aqueous phase. As the dispersion stabilizer, any suitable dispersion stabilizer can be used within the range that does not impair the effects of the present invention. The dispersion stabilizer can be a single kind or two or more kinds. In terms of further demonstrating the effects of the present invention, examples of the dispersion stabilizer include: polyvinyl alcohol; polycarboxylic acid; cellulose such as hydroxyethyl cellulose and carboxymethyl cellulose; polyvinylpyrrolidone; inorganic water-soluble polymers such as sodium tripolyphosphate; phosphates such as calcium phosphate, magnesium phosphate, aluminum phosphate, and zinc phosphate; pyrophosphates such as calcium pyrophosphate, magnesium pyrophosphate, aluminum pyrophosphate, and zinc pyrophosphate; water-insoluble inorganic compounds such as calcium carbonate, magnesium carbonate, calcium hydroxide, magnesium hydroxide, aluminum hydroxide, calcium metasilicate, calcium sulfate, barium sulfate, and colloidal silica. Among them, magnesium pyrophosphate is preferred in terms of further demonstrating the effects of the present invention. The dispersion stabilizer can be added to the aqueous phase or the oil phase, but typically it is added to the aqueous phase. The amount of the dispersion stabilizer used is preferably 0.1 to 50 parts by weight, more preferably 0.5 to 10 parts by weight, based on 100 parts by weight of the aqueous solvent contained in the aqueous phase. As the thiol compound, any suitable thiol compound can be used within the range that does not impair the effects of the present invention. The thiol compound can be a single kind or two or more kinds. Examples of such thiol compounds include: polyfunctional thiol-based compounds, and monofunctional thiol-based compounds having an alkyl group with 1 to 20 carbon atoms in the molecule. As a polyfunctional thiol compound, any suitable polyfunctional thiol compound can be used within the range that does not impair the effects of the present invention, as long as it is a compound having two or more thiol groups in the molecule. The polyfunctional thiol compound can be only one kind, or two or more kinds. Examples of such polyfunctional thiol compounds include: 1,2-ethanedithiol, 1,3-propanedithiol, 1,4-butanedithiol, 1,6-hexanedithiol, 1,8-octanedithiol, 1,2-cyclohexanedithiol, decanedithiol, ethylene glycol bis(mercaptoacetate), ethylene glycol bis(mercaptopropionate), ethylene glycol bis(mercaptoacetate) (EGTG), 1,4-butanediol bis(mercaptopropionate) (BDTG), trimethylolpropane tris(mercaptoacetate) (TMTG), trimethylolpropane tris(mercaptopropionate), pentaerythritol tetrakis(mercaptoacetate) (PETG), pentaerythritol tetrakis(mercaptopropionate), dipentaerythritol hexakis(mercaptopropionate), tris(mercaptopropionate) tris(2-hydroxyethyl) isocyanurate, 1,4-dimethylthiophene, 2,4,6-trimercapto-s-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-s-triazine. Among them, ethylene glycol bis(mercaptoacetate) (EGTG), 1,4-butanediol bis(mercaptopropionate) (BDTG), trimethylolpropane tris(mercaptoacetate) (TMTG), and pentaerythritol tetrakis(mercaptoacetate) (PETG) are preferred. As a monofunctional thiol compound having an alkyl group with 1 to 20 carbon atoms in the molecule, any suitable monofunctional thiol compound having an alkyl group with 1 to 20 carbon atoms in the molecule can be used within the range that does not impair the effects of the present invention, as long as it is a compound having one thiol group in the molecule and having an alkyl group with 1 to 20 carbon atoms. The monofunctional thiol compound having an alkyl group with 1 to 20 carbon atoms in the molecule can be only one kind, or two or more kinds. Examples of such monofunctional thiol compounds having an alkyl group with 1 to 20 carbon atoms in the molecule include: methanethiol, ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, heptanethiol, octanethiol, dodecanethiol, and compounds having a branched-chain structure thereof. The addition amount of the thiol compound is preferably 5 parts by weight or less, more preferably 0.05 to 5 parts by weight, still more preferably 0.1 to 3 parts by weight, and particularly preferably 0.3 to 2 parts by weight, based on 100 parts by weight of the monomer composition. That is, in the monomer composition, preferably 5 parts by weight or less of the thiol compound is contained, more preferably 0.05 to 5 parts by weight of the thiol compound is contained, still more preferably 0.1 to 3 parts by weight of the thiol compound is contained, and particularly preferably 0.3 to 2 parts by weight of the thiol compound is contained, based on 100 parts by weight of the monomer composition. The thiol compound can function as a chain transfer agent and can become a structural unit of the polymer P. In a radical polymerization system (for example, a radical polymerization system using a hydrolyzable silicon compound having a hydrolyzable silyl group and a group reactive with a radically polymerizable unsaturated group, a monofunctional (meth)acrylic monomer, and a polyfunctional (meth)acrylic monomer), the thiol compound receives radicals by the self-growing polymer chain to stop the elongation of the polymer chain and generates new radicals, which can initiate the growth reaction of another polymer chain. Therefore, the molecular weights of the obtained polymer P and even the resin particles of the embodiments of the present invention can be made consistent, and the particle size distribution can be made consistent. As the antioxidant, any suitable antioxidant can be employed within the range that does not impair the effects of the present invention. The antioxidant can be only one kind or two or more kinds. As such an antioxidant, for example, an antioxidant having a melting point of 30°C or higher and 105°C or lower can be cited. When an antioxidant having a melting point below 30°C is used, there is a risk that the antioxidant will be liquefied due to the external air temperature when the resin particles are recovered as a dry powder. When an antioxidant having a melting point exceeding 105°C is used, there is a risk of affecting the dispersion stability of the dispersion of the resin particles during the heat treatment. As the antioxidant, those in a powdery state at room temperature (25°C) can be used. Also, those obtained by dispersing or dissolving in water, alcohol, etc. can be used. As the antioxidant, for example, phenolic antioxidants, phosphorus-based antioxidants, sulfur-based antioxidants, and amine-based antioxidants can be cited. From the viewpoint of further exhibiting the effects of the present invention, etc., an antioxidant having a radical scavenging ability is preferred, phenolic antioxidants and amine-based antioxidants are preferred, and phenolic antioxidants are more preferred. As the phenolic antioxidant, any suitable phenolic antioxidant can be employed within the range that does not impair the effects of the present invention. As such a phenolic antioxidant, a compound having a substituent such as an alkyl group at the ortho position relative to the phenolic hydroxyl group is preferred. Also, from the viewpoint of further exhibiting the effects of the present invention, etc., it is preferred not to use p-methoxyphenol. As the phenolic antioxidant, for example, n-octadecyl 3-(4'-hydroxy-3',5-di-tert-butylphenyl)propionate, ethylene bis(oxyethylene) bis[3-(5-tert-butyl-4-hydroxy-m-tolyl)propionate], 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 4-[[4,6-bis(octylthio)-1,3,5-triazin-2-yl]amino]-2,6-di-tert-butylphenol, 2,2'-thiobis(ethyl) bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] can be cited. As a phosphorus-based antioxidant, any suitable phosphorus-based antioxidant can be used within the range that does not impair the effects of the present invention. Examples of such phosphorus-based antioxidants include 3,9-di-octadecyl-1-yl-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane. As a sulfur-based antioxidant, any suitable sulfur-based antioxidant can be used within the range that does not impair the effects of the present invention. Examples of such sulfur-based antioxidants include bis(十八烷基酯) of 3,3'-thiodipropionic acid, pentaerythritol tetra[3-(十二烷硫基)propionate]. As an amine-based antioxidant, any suitable amine-based antioxidant can be used within the range that does not impair the effects of the present invention. Examples of such amine-based antioxidants include bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate, tetra(1,2,2,6,6-pentamethyl-4-piperidyl) butane-1,2,3,4-tetracarboxylate, 2,2,6,6-tetramethyl-4-piperidyl methacrylate. The addition amount of the antioxidant is preferably 0.05 parts by weight to 5 parts by weight, more preferably 0.1 parts by weight to 3 parts by weight, based on 100 parts by weight of the monomer composition. As long as the polymerization temperature is suitable for suspension polymerization, any suitable polymerization temperature can be used within the range that does not impair the effects of the present invention. Examples of such polymerization temperatures include, for example, as the initial temperature of polymerization, 30°C to 80°C, and then the temperature is raised, and as the final temperature of polymerization, 70°C to 120°C. As long as the polymerization time is suitable for suspension polymerization, any suitable polymerization time can be used within the range that does not impair the effects of the present invention. Examples of such polymerization times include, at the initial temperature of polymerization, preferably 1 hour to 48 hours, and at the final temperature of polymerization, preferably 1 hour to 24 hours. After polymerization, if necessary, decomposition treatment, washing, separation, drying, etc. of a dispersion stabilizer such as magnesium pyrophosphate are carried out, whereby the resin particles of the embodiment of the present invention can be obtained. ≪Resin Particles for Semiconductor Components and Resin Composition for Semiconductor Components≫ In terms of further utilizing the effects of the present invention, the resin particles of the embodiment of the present invention are suitable for semiconductor components. That is, the resin particles of the embodiment of the present invention are preferably for semiconductor components. The so-called conductor components refer to the components constituting a semiconductor, and examples thereof include semiconductor packages or semiconductor modules. A semiconductor package is composed of an IC chip as an essential component and uses at least one component selected from molding resins, underfill materials, molded underfill materials, die attach materials, prepregs for semiconductor package substrates, metal foil laminates for semiconductor package substrates, and printed circuit boards for semiconductor packages. The semiconductor module has a semiconductor package as an essential component, and is composed of at least one component selected from prepregs for printed circuit boards, metal foil laminates for printed circuit boards, build-up materials for printed circuit boards, solder resists, cover layer films, electromagnetic wave shielding films, and adhesive sheets for printed circuit boards. The resin particles of the embodiment of the present invention can exhibit a low dielectric loss factor, can exhibit high heat resistance, and can exhibit excellent flexibility, so they can be preferably used in the resin composition for semiconductor components. That is, the resin composition for semiconductor components of the embodiment of the present invention contains the resin particles of the embodiment of the present invention. In this specification, the resin composition for semiconductor components refers to the resin composition used for semiconductor components. Typically, the resin composition for semiconductor components of the embodiment of the present invention contains the resin particles of the embodiment of the present invention and a resin component. As the resin component, any suitable resin component used in semiconductor components can be adopted. The content ratio of the resin particles of the embodiment of the present invention in the resin composition for semiconductor components of the embodiment of the present invention can be appropriately set according to the purpose. ≪Other uses of resin particles≫ In addition to the use for semiconductor components, the resin particles of the embodiment of the present invention can also be applied to any other suitable uses such as for coating compositions, cosmetics, light diffusing compositions, light diffusing films, etc. <Coating composition> The resin particles of the embodiment of the present invention can impart excellent appearance to the coating film containing them, so they can be suitably used in coating compositions. Such coating compositions contain the resin particles of the embodiment of the present invention. The coating composition preferably contains at least one selected from binder resins and UV curable resins. The binder resin can be only one kind, or two or more kinds. The UV curable resin can be only one kind, or two or more kinds. As the binder resin, any suitable binder resin can be adopted within the range that does not impair the effects of the present invention. As such binder resins, for example, resins soluble in organic solvents or water, and emulsion-type water-based resins dispersible in water can be cited. Specifically, as the binder resin, for example, acrylic resins, alkyd resins, polyester resins, polyurethane resins, chlorinated polyolefin resins, and amorphous polyolefin resins can be cited. As the UV curable resin, any suitable UV curable resin can be used within the scope that does not impair the effects of the present invention. Examples of such UV curable resins include, for example, polyfunctional (meth)acrylate resins and polyfunctional urethane acrylate resins. Preferably, polyfunctional (meth)acrylate resins are used, and more preferably, polyfunctional (meth)acrylate resins having 3 or more (meth)acryloyl groups in one molecule. Specific examples of polyfunctional (meth)acrylate resins having 3 or more (meth)acryloyl groups in one molecule include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, 1,2,4-cyclohexane tetra(meth)acrylate, pentaglycerol triacrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tripentaerythritol triacrylate, and tripentaerythritol hexaacrylate. When the coating composition contains at least one selected from the binder resin and the UV curable resin, the content ratio can be any suitable content ratio according to the purpose. Typically, relative to the total amount of at least one selected from the binder resin (when it is an emulsion-type aqueous resin, converted to the solid content) and the UV curable resin and the resin particles of the embodiment of the present invention, the resin particles of the embodiment of the present invention are preferably 5% by weight to 50% by weight, more preferably 10% by weight to 50% by weight, and still more preferably 20% by weight to 40% by weight. When using a UV curable resin, it is preferably used in combination with a photoinitiator. As the photoinitiator, any suitable photoinitiator can be used within the scope that does not impair the effects of the present invention. Examples of such photoinitiators include, for example, acetophenones, benzoins, benzophenones, phosphine oxides, ketals, α-hydroxyalkyl phenyl ketones, α-aminoalkyl phenyl ketones, anthraquinones, 9-oxathioxanthones , azo compounds, peroxides (described in Japanese Patent Laid-Open No. 2001-139663, etc.), 2,3-dialkyldione compounds, disulfide compounds, fluoroamine compounds, aromatic sulfonium salts, onium salts, borates, active halogen compounds, and α-acyl oxime esters. The coating composition may also contain a solvent. The solvent can be only one kind or two or more kinds. When the coating composition contains a solvent, the content ratio can be any suitable content ratio according to the purpose. As a solvent, any suitable solvent can be used within the range that does not impair the effects of the present invention. As such a solvent, a solvent that can dissolve or disperse the binder resin or the UV curable resin is preferred. When it is an oil-based paint, examples of such a solvent include: hydrocarbon solvents such as toluene and xylene; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone; ester solvents such as ethyl acetate and butyl acetate; ether solvents such as dioxane, ethylene glycol diethyl ether, and ethylene glycol monobutyl ether. When it is a water-based paint, examples include: water and alcohols. The coating composition can be diluted as needed to adjust the viscosity. As a diluent, any suitable diluent can be used according to the purpose. Examples of such a diluent include the above-mentioned solvents. The diluent can be only one kind, or two or more kinds. The coating composition can contain its components as needed, such as surface modifiers, fluidity modifiers, ultraviolet absorbers, light stabilizers, curing catalysts, extender pigments, coloring pigments, metallic pigments, mica powder pigments, and dyes. When forming a coating film using the coating composition, as the coating method, any suitable coating method can be used according to the purpose. Examples of such a coating method include: spray coating method, roll coating method, brush coating method, reverse roll coating method, gravure coating method, die coating method, kiss roll coating method, and spraying method. When forming a coating film using the coating composition, as the forming method, any suitable forming method can be used according to the purpose. Examples of such a forming method include the following method: coating on any coating surface of a substrate to produce a coating film, drying the coating film, and then, if necessary, hardening the coating film to form a coating film. Examples of the substrate include: metals, woods, glasses, plastics (such as PET (polyethylene terephthalate), PC (polycarbonate), acrylic resins, TAC (triacetyl cellulose), etc.). <Light Diffusing Resin Composition> The resin particles of the embodiment of the present invention can impart light diffusibility to the coating film containing them, so they can be preferably used in a light diffusing resin composition. Such a light diffusing resin composition contains the resin particles of the embodiment of the present invention. The light diffusing resin composition preferably contains at least one selected from binder resins and UV curable resins. Regarding the binder resin and the UV curable resin, the descriptions about the coating composition above can be cited. The light diffusing resin composition can contain a solvent. Regarding the solvent, the descriptions about the coating composition above can be cited. The light diffusing resin composition can be diluted as needed to adjust the viscosity. As a diluent, the descriptions about the coating composition above can be cited. The light-diffusing resin composition may contain other components as required, such as surface modifiers, fluidity modifiers, ultraviolet absorbers, light stabilizers, curing catalysts, extender pigments, coloring pigments, metallic pigments, mica powder pigments, and dyes. As the coating method and forming method when forming a coating film using the light-diffusing resin composition, the description of the coating composition above can be cited. <Light-diffusing film> The resin particles of the embodiment of the present invention can impart excellent light diffusibility to the film having a coating film containing the same, so it can be preferably used for a light-diffusing film. Such a light-diffusing film contains the resin particles of the embodiment of the present invention. The light-diffusing film includes a light-diffusing layer formed of the light-diffusing resin composition and a substrate. Furthermore, the light-diffusing layer may be the outermost layer of the light-diffusing film or may not be the outermost layer. The light-diffusing film of the embodiment of the present invention may contain any suitable other layers according to the purpose. Examples of such other layers include, for example: a protective layer, a hard coat layer, a planarization layer, a high refractive index layer, an insulating layer, a conductive resin layer, a conductive metal fine particle layer, a conductive metal oxide fine particle layer, and a primer layer. Examples of the substrate include, for example: metals, wood, glass, plastic films, plastic sheets, plastic lenses, plastic panels, cathode ray tubes, fluorescent display tubes, and liquid crystal display panels. Examples of the plastics constituting the plastic film, plastic sheet, plastic lens, and plastic panel include, for example: PET (polyethylene terephthalate), PC (polycarbonate), acrylic resins, and TAC (triacetyl cellulose). Examples Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited by these examples. Furthermore, unless otherwise specified, "parts" means "parts by weight" and "%" means "% by weight". <Method for Measuring Volume Average Particle Diameter and Coefficient of Variation of Particle Diameter of Resin Particles> The volume average particle diameter in terms of spherical conversion of resin particles is measured by a precision particle size distribution measuring device (product name "Coulter Multisizer (registered trademark) 3", manufactured by Beckman Coulter, Inc.). The measurement is carried out using an aperture calibrated in accordance with the Multisizer (registered trademark) 3 user's guide issued by Beckman Coulter, Inc. Furthermore, regarding the aperture used for measurement, when the expected volume average particle diameter of the particles to be measured is 1 μm or more and 10 μm or less, an aperture with a size of 50 μm is selected; when the expected volume average particle diameter of the particles to be measured is greater than 10 μm and 30 μm or less, an aperture with a size of 100 μm is selected; when the expected volume average particle diameter of the particles is greater than 30 μm and 90 μm or less, an aperture with a size of 280 μm is selected; when the expected volume average particle diameter of the particles is greater than 90 μm and 150 μm or less, an aperture with a size of 400 μm is selected, etc., that is, appropriately selected according to the size of the particles to be measured. When the volume average particle diameter after measurement is different from the expected volume average particle diameter, change to an aperture with an appropriate size and measure again. Current (aperture current) and Gain (gain) are appropriately set according to the size of the selected aperture. For example, when an aperture with a size of 50 μm is selected, Current (aperture current) is set to -800 and Gain (gain) is set to 4; when an aperture with a size of 100 μm is selected, Current (aperture current) is set to -1600 and Gain (gain) is set to 2; when apertures with sizes of 280 μm and 400 μm are selected, Current (aperture current) is set to -3200 and Gain (gain) is set to 1. Specifically, the following is used: 0.1 g of resin particles to be measured are dispersed in 10 ml of a 0.1 mass% nonionic surfactant aqueous solution using a touch mixer ("TOUCHMIXER MT-31" manufactured by Yamato Scientific Co., Ltd.) and an ultrasonic cleaner ("ULTRASONIC CLEANER VS-150" manufactured by Velvo Clear Co., Ltd.) to prepare a dispersion. During the measurement, stirring is slowly carried out in the beaker to prevent air bubbles from entering, and the measurement is ended when 100,000 resin particles have been measured. The volume average particle diameter of the resin particles to be measured is the arithmetic mean diameter of the particle size distribution based on the volume of 100,000 particles. The coefficient of variation of particle diameter (CV value) of the particles is calculated by the following formula.Coefficient of variation of particle size (%) = (standard deviation of particle size distribution based on particle volume ÷ volume average particle size) × 100 (%). <Method for Measuring Roundness and Method for Calculating Average Roundness> The roundness of resin particles was measured using a flow-type particle image analysis device ("FPIA (registered trademark)-3000S" manufactured by Sysmex Corporation). As a specific measurement method, 0.05 g of sodium dodecylbenzenesulfonate as a dispersant was added to 20 mL of ion-exchanged water to obtain an aqueous surfactant solution. Subsequently, 0.2 g of resin particles to be measured was added to the obtained aqueous surfactant solution, and an ultrasonic disperser "BRANSON SONIFIER 450" (output 400 W, frequency 20 kHz) manufactured by BRANSON was used as a disperser, and ultrasonic waves were irradiated for 5 minutes to perform a dispersion treatment for dispersing the resin particles to be measured in the aqueous surfactant solution, thereby preparing a dispersion liquid for measurement. During the measurement, the above flow-type particle image analysis device equipped with a standard objective lens (10 times) was used. As the sheath liquid used in the above flow-type particle image analysis device, Particle Sheath ("PSE-900A" manufactured by Sysmex Corporation) was used. The dispersion liquid for measurement prepared according to the above procedure was introduced into the above flow-type particle image analysis device, and the measurement was performed according to the following [Measurement Conditions for Roundness]. At the time of measurement, before the start of measurement, a suspension of a standard polymer particle group (for example, "5200A" manufactured by Thermo Fisher Scientific Company (obtained by diluting standard polystyrene particles with ion-exchanged water)) was used to perform automatic focus adjustment of the above flow-type particle image analysis device. The roundness refers to the value obtained by dividing the circumference calculated from the diameter of a true circle having the same projected area as the image obtained by photographing the resin particles by the circumference of the image obtained by photographing the resin particles. The average roundness refers to the value obtained by dividing the sum of the roundness of each resin particle by the sum of the frequencies based on the number of particles. Regarding the number ratio of hollow particles having an average roundness of 0.90 or less, it was calculated based on the data of the frequencies based on the number of particles at intervals of 0.010 (for example, 0.200 or more and less than 0.990) measured by the above measurement. [Measurement Conditions for Roundness] - Measurement mode: LPF (Low-Pass Filter) measurement mode or HPF (High-Pass Filter) measurement mode (appropriately selected according to the sphere-equivalent volume average particle diameter. As a standard, the HPF measurement mode is selected when the sphere-equivalent volume average particle diameter is 8 μm or less, and the LPF measurement mode is selected when the sphere-equivalent volume average particle diameter is more than 8 μm) - Number of resin particles to be measured: 1000 - Measurement range of sphere-equivalent volume average particle diameter: 0.5 μm to 200 μm - Measurement range of roundness of resin particles: 0.2 to 1.0 <3% Weight Loss Temperature of Resin Particles> The 3% weight loss temperature of resin particles was measured using the "TG / DTA6200, AST-2", a differential thermal-thermogravimetric simultaneous measurement device manufactured by SII NanoTechnology Inc. Regarding the sampling method and temperature conditions, the following procedures were carried out. On the bottom of a platinum measurement container, 10.5 ± 0.5 mg of the sample was filled in a seamless manner as the measurement sample. Under the condition of an air flow rate of 230 mL / minute, using alumina as the reference substance, the 3% weight loss temperature was measured. The TG / DTA curve was obtained by heating the sample from 30°C to 500°C at a heating rate of 10°C / minute. Using the analysis software attached to the device, the temperature at 3% weight loss was calculated from the obtained curve as the 3% weight loss temperature. <Recovery Rate of Resin Particles> The measurement of the recovery rate of resin particles was carried out by a load-unloading test using a micro compression tester "MCTM-200" manufactured by Shimadzu Corporation under the following measurement conditions. Specifically, a dispersion obtained by dispersing resin particles in ethanol was coated on a polished steel specimen stage and dried to prepare a measurement sample. Subsequently, in an environment of room temperature 20°C and relative humidity 65%, an independent fine resin particle (a state where there are no other resin particles within at least a diameter range of 100 μm) was selected using the optical microscope of MCTM-200, and the diameter of the selected resin particle was measured using the diameter measurement cursor of MCTM-200. The selected resin particles were fine particles within the diameter range of 7 μm to 9 μm, and resin particles outside this range were not used for the measurement of compressive strength. Next, the test indenter was lowered to the apex of the selected resin particle at the following load speed, thereby measuring the diameter A of the resin particle when the load was applied to the maximum load of 9.81 mN and the diameter B when it was unloaded to the minimum test force of 1.96 mN thereafter. Based on the displacement amount (recovery amount) obtained from diameter A and diameter B, the recovery rate of a single particle was calculated using the following formula. The measurement was carried out on 6 resin particles, and the maximum and minimum values were removed from the 6 recovery rates, and the average value of the remaining 4 data was taken as the recovery rate. [Calculation formula for recovery rate] Recovery rate (%) = Recovery amount (μm) / Particle diameter without load (μm) × 100 [Measurement conditions for recovery rate] Test temperature: Room temperature (20°C), relative humidity 65% Upper compression indenter: Plane indenter with a diameter of 50 μm (material: diamond) Lower compression plate: SKS flat plate Test type: Load-unloading test Maximum test force: 9.81 mN Minimum test force: 1.96 mN Load speed: 0.732 mN / sec Load holding time: 1 sec Unloading holding time: 1 sec <Dielectric Properties of Resin Particles> The dielectric properties of the resin particles were measured using a dielectric constant measuring device (ADMS01Nc series) manufactured by AET Co., Ltd. Under the conditions of a frequency of 10 GHz, a measurement environment of 23 °C, and a relative humidity of 51 ± 1%, the dielectric loss factor of the resin particles was calculated based on the perturbation theory using a resonator. <Dielectric Properties of Film Containing Resin Particles> The dielectric loss factor of the film containing the obtained resin particles was measured by the cavity resonance method (measurement frequency: 5.8 GHz). The measurement results were set as the relative ratio (%) with the measured value of the film without resin particles being 100%. [Example 1] Reactivity low molecular weight polyphenylene ether as a compound having an ether structure (trade name "Noryl® SA9000-111 resin", manufactured by SABIC Co., Ltd.): 20 g, styrene (St): 334.4 g, divinylbenzene (DVB) (trade name "DVB-810", manufactured by Nippon Steel Chemical & Material Co., Ltd., product containing 81% DVB, and the remaining 19% being ethyl vinylbenzene (EVB)): 45.6 g, 2,2'-azobis(2,4-dimethylvaleronitrile) as a polymerization initiator (trade name "V-65", manufactured by Fujifilm Wako Pure Chemical Corporation): 4 g, benzoyl peroxide: 1.08 g were mixed to prepare an oil phase. Sodium lauryl sulfate: 0.4 g was dissolved in magnesium pyrophosphate 2.2 wt% aqueous dispersion: 1075 g to prepare an aqueous phase. The oil phase was added to the aqueous phase, and the mixture was dispersed for 5 minutes at a rotation speed of 8300 rpm using a TK homomixer (manufactured by Primix Corporation) to prepare a suspension. After heating the obtained suspension at 55 °C for 5 hours, the internal temperature of the polymerization vessel was raised (secondary temperature rise) to 105 °C, and the mixture was stirred at 105 °C for 2 hours to complete the polymerization reaction. Hydrochloric acid was added to the obtained slurry to decompose magnesium pyrophosphate, and then the solid component was separated by filtration and dehydration, and purified by repeated washing with water, and then dried at 80 °C for 24 hours to obtain resin particles (1). The results are shown in Table 1. [Example 2] Except that SA9000 was changed to 40 g, St was changed to 316.8 g, and DVB-810 was changed to 43.2 g, the procedure was carried out in the same manner as in Example 1 to obtain resin particles (2). Further, using a planetary stirring degassing machine (manufactured by KURABO Industries Ltd., "MAZERUSTAR KK-250"), 0.425 g of the obtained resin particles (2), 8.3 g of ethyl acetate, and 1.7 g of a solvent-soluble polyimide KPI-MX300F (manufactured by Kawamura Sangyo Co., Ltd.) were subjected to degassing and stirring to prepare a mixture for evaluation. Using a coater set to a wet thickness of 250 μm, the obtained mixture for evaluation was coated on a glass plate with a thickness of 5 mm, and then heated at 60°C for 30 minutes, at 90°C for 10 minutes, at 150°C for 30 minutes, and at 200°C for 30 minutes to remove ethyl acetate. Thereafter, it was cooled to room temperature to obtain a film containing resin particles (2). The results are shown in Table 1. [Example 3] Except that SA9000 was changed to 80 g, St was changed to 279.2 g, and DVB-810 was changed to 40.8 g, the procedure was carried out in the same manner as in Example 1 to obtain resin particles (3). The results are shown in Table 1. [Example 4] Except that SA9000 was changed to 120 g, St was changed to 246.4 g, and DVB-810 was changed to 33.6 g, the procedure was carried out in the same manner as in Example 1 to obtain resin particles (4). The results are shown in Table 1. [Example 5] Mix SA9000: 40 g, St: 320 g, DVB-810: 40 g, dodecyl mercaptan as a mercaptan compound: 2 g, LPO (trade name "PEROYL L", manufactured by NOF Corporation) as a polymerization initiator: 5.2 g, benzoyl peroxide: 1.6 g to prepare an oil phase. Dissolve sodium lauryl sulfate: 1.2 g in a 2.2 wt% aqueous dispersion of magnesium pyrophosphate: 1280 g to prepare an aqueous phase. Add the oil phase to the aqueous phase, disperse it for 5 minutes at a rotation speed of 8300 rpm using a TK homogenizer, prepare a suspension, and then use a high-pressure emulsifier NVR (manufactured by Yoshida Kikai Kogyo Co., Ltd., model "EM055-P20-0600-Exp") to perform emulsification treatment under the conditions of an inlet treatment pressure of 17 MPa and an outlet pressure of 1 MPa to prepare a dispersion in which droplets of the oil phase are dispersed in the aqueous phase. After heating the obtained dispersion at 75°C for 3 hours, raise the internal temperature of the polymerization reactor (secondary temperature rise) to 110°C and stir at 110°C for 3 hours to complete the polymerization reaction. Add hydrochloric acid to the obtained slurry to decompose magnesium pyrophosphate, and then dehydrate by filtration to separate the solid component. After purification by repeated washing with water, dry at 80°C for 24 hours to obtain resin particles (5). Further, use a planetary stirring defoamer (manufactured by KURABO Industries Ltd., "MAZERUSTAR KK-250") to perform defoaming and stirring on the obtained resin particles (5): 0.425 g, ethyl acetate: 8.3 g, and solvent-soluble polyimide KPI-MX300F (manufactured by Kawamura Sangyo Co., Ltd.): 1.7 g to prepare an evaluation mixture. Apply the obtained evaluation mixture to a glass plate with a thickness of 5 mm using a coater set to a wet thickness of 250 μm, heat at 60°C for 30 minutes, heat at 90°C for 10 minutes, heat at 150°C for 30 minutes, and heat at 200°C for 30 minutes to remove ethyl acetate, and then cool to room temperature to obtain a film containing resin particles (5). The results are shown in Table 1. [Example 6] Mix SA9000: 80 g, St: 280 g, DVB-810: 40 g, dodecyl mercaptan as a mercaptan compound: 2 g, Irganox1010 (manufactured by BASF Japan Ltd.) as an antioxidant: 2 g, V-65 as a polymerization initiator: 4 g, 2,2'-azobisisobutyronitrile (AIBN): 1.2 g to prepare an oil phase. Dissolve sodium lauryl sulfate: 1.2 g in a 2.2 wt% aqueous dispersion of magnesium pyrophosphate: 1280 g to prepare an aqueous phase. Add the oil phase to the aqueous phase, and disperse it for 5 minutes at a rotation speed of 8300 rpm using a TK homomixer to prepare a suspension. Then, use a high-pressure emulsifier NVR (manufactured by Yoshida Kikai Kogyo Co., Ltd., model "EM055-P20-0600-Exp") to perform emulsification treatment under the conditions of an inlet treatment pressure of 17 MPa and an outlet pressure of 1 MPa, thereby preparing a dispersion in which droplets of the oil phase are dispersed in the aqueous phase. After heating the obtained dispersion at 60 °C for 2 hours, raise the internal temperature of the polymerization reactor (secondary temperature increase) to 90 °C, and stir at 90 °C for 2 hours to complete the polymerization reaction. Add hydrochloric acid to the obtained slurry to decompose magnesium pyrophosphate, and then dehydrate by filtration to separate the solid component. After purification by repeated washing with water, dry at 80 °C for 24 hours to obtain resin particles (6). The results are shown in Table 1. [Example 7] Mix reactive low molecular weight polyphenylene ether "OPE-2St" (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a compound having an ether structure: 160 g, St: 196.8 g, DVB-810: 43.2 g, PEROYL L as a polymerization initiator: 4 g, benzoyl peroxide: 1.6 g to prepare an oil phase. Dissolve sodium lauryl sulfate: 0.4 g in a 2.2 wt% aqueous dispersion of magnesium pyrophosphate: 1075 g to prepare an aqueous phase. Add the oil phase to the aqueous phase, and disperse it for 5 minutes at a rotation speed of 8300 rpm using a TK homomixer (manufactured by primix) to prepare a suspension. After heating the obtained suspension at 70 °C for 5 hours, raise the internal temperature of the polymerization reactor (secondary temperature increase) to 105 °C, and stir at 105 °C for 2 hours to complete the polymerization reaction. Add hydrochloric acid to the obtained slurry to decompose magnesium pyrophosphate, and then dehydrate by filtration to separate the solid component. After purification by repeated washing with water, dry at 80 °C for 24 hours to obtain resin particles (7). The results are shown in Table 1. [Example 8] Except for not using dodecyl mercaptan, perform in the same manner as in Example 5 to obtain resin particles (8). The results are shown in Table 1. [Comparative Example 1] Styrene (St): 356.8 g, divinylbenzene (DVB) (trade name "DVB-810", manufactured by Nippon Steel Chemical & Material Co., Ltd., product containing 81% DVB, the remaining 19% being ethyl vinylbenzene (EVB)): 43.2 g, 2,2'-azobis(2,4-dimethylvaleronitrile) (trade name "V-65", manufactured by Fujifilm Wako Pure Chemical Corporation) as a polymerization initiator: 4 g, benzoyl peroxide: 1.08 g were used to prepare an oil phase. Sodium lauryl sulfate: 0.4 g was dissolved in a 2.2 wt% aqueous dispersion of magnesium pyrophosphate: 1075 g to prepare an aqueous phase. The oil phase was added to the aqueous phase, and the mixture was dispersed using a TK homogenizer (manufactured by Primix Corporation) at a rotation speed of 8300 rpm for 5 minutes to prepare a suspension. After heating the obtained suspension at 55 °C for 5 hours, the internal temperature of the polymerization vessel was raised (secondary temperature rise) to 105 °C, and the mixture was stirred at 105 °C for 2 hours to complete the polymerization reaction. Hydrochloric acid was added to the obtained slurry to decompose magnesium pyrophosphate, and then the slurry was dehydrated by filtration to separate the solid component. After purification by repeated washing with water, the solid was dried at 80 °C for 24 hours to obtain resin particles (C1). Further, using a planetary stirring defoaming machine (manufactured by KURABO Industries Ltd., "MAZERUSTAR KK-250"), 0.425 g of the obtained resin particles (C1), 8.3 g of ethyl acetate, and 1.7 g of a solvent-soluble polyimide KPI-MX300F (manufactured by Kawamura Sangyo Co., Ltd.) were subjected to defoaming stirring to prepare an evaluation mixture. Using a coater set to a wet thickness of 250 μm, the obtained evaluation mixture was coated on a glass plate with a thickness of 5 mm, and then heated at 60 °C for 30 minutes, at 90 °C for 10 minutes, at 150 °C for 30 minutes, and at 200 °C for 30 minutes to remove ethyl acetate. Thereafter, the mixture was cooled to room temperature to obtain a film containing resin particles (C1). The results are shown in Table 1. [Comparative Example 2] Except that SA9000 was changed to 40 g, St was changed to 360 g, and DVB-810 was not used, the procedure was carried out in the same manner as in Example 1 to obtain resin particles (C2). The results are shown in Table 1. [Table 1] [Industrial Applicability] The resin particles of the embodiments of the present invention can be preferably used in semiconductor material applications and the like.

Claims

1. A resin particle comprising a polymer P having an ether structure represented by formula (1), wherein polymer P is obtained by polymerization of a monomer composition comprising a compound A having an ether structure represented by formula (1) and a free radical reactive group, and a monomer M reacting with the compound A, wherein the monomer M comprises an aromatic monofunctional monomer m1 and an aromatic crosslinking monomer m2, wherein the aromatic monofunctional monomer m1 is at least one selected from the group consisting of styrene, ethylvinylbenzene, α-methylstyrene, vinyltoluene, o-chlorostyrene, m-chlorostyrene, p-chlorostyrene, vinylbiphenyl, and vinylnaphthalene, and the aromatic crosslinking monomer m2 is at least one selected from the group consisting of divinylbenzene, divinylnaphthalene, and diallyl phthalate, wherein the content of the aromatic monofunctional monomer m1 in the monomer M is 50% to 99% by weight, and the content of the aromatic crosslinking monomer m2 in the monomer M is 1% to 50% by weight. The content of compound A in the monomer composition is 0.1% by weight or more but less than 60% by weight, and the content of monomer M in the monomer composition is more than 40% by weight but less than 99.9% by weight. The recovery rate of the resin particles, calculated by load unloading test under the conditions of temperature 20°C, relative humidity 65%, load speed 0.732 mN / s, maximum load 9.81 mN, and minimum load 1.96 mN, is 4.6% to 30%, and the particles are solid particles; [Chemical 1].

2. The resin particles of Request 1 have a 3% weight loss temperature of 270°C or higher when heated at 10°C / minute in air.

3. The resin particles of claim 1 have a dielectric loss factor of 0.0040 or less at a frequency of 10 GHz.

4. The resin particles of Request 1 have a volume average particle size of 0.1 μm to 100 μm.

5. The coefficient of variation of the particle size of the resin particles as requested in item 1 is 10% to 50%.

6. The resin particles of Request 1 have an average roundness of 0.95 to 1.

00.

7. The resin particles of claim 1, wherein in the monomer composition, as the content ratio of the aromatic crosslinking monomer m2 to the compound A, when the compound A is set to 100 parts by weight, the amount of the aromatic crosslinking monomer m2 is 1 part by weight to 1000 parts by weight.

8. The resin particles of claim 1, wherein the monomer composition contains 5 parts by weight or less of a thiol compound relative to 100 parts by weight of the monomer composition.

9. The resin particles in claim 1 are for use in semiconductor components.

10. A resin composition for semiconductor components, comprising resin particles as claimed in claim 9.