Abrasive conditioner and a method of fabricating the same
TWI940941BActive Publication Date: 2026-10-01KINIK
Patent Information
- Application Number
- TW113134686
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2026-10-01
- Estimated Expiration
- 2044-09-11
AI Technical Summary
Technical Problem
Existing CMP pad dressers compromise on aspects such as abrasive particle effectiveness, cost, and control of tip height, leading to reduced grinding performance and increased maintenance costs.
Method used
A grinding and dressing tool with protrusions on a substrate, where abrasive particles are fixed by an adhesive layer, allowing for better control of tip height and distribution, reducing contamination and improving the effective working area.
Benefits of technology
Enhances abrasive particle stability, reduces contamination, and extends the effective working time while maintaining consistent cutting force, thereby reducing production and maintenance costs.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure TWG2TB001913572_001 
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Abstract
A grinding and dressing device includes: a substrate having a plurality of bosses on one side, the plurality of bosses being spaced apart from each other by a plurality of recesses; and a plurality of abrasive particles, each fixed to the plurality of bosses in a one-to-one correspondence by an adhesive layer; wherein the adhesive layer extends into the plurality of recesses. The present invention also discloses a method for manufacturing the grinding and dressing device.
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Citation Information
Patent Citations
CMP conditioner and method for manufacturing the same
JP4508514B2
Chemical mechanical polishing conditioner
US20140302756A1
Composite conditioner and associated methods
US20190091832A1