Manufacturing method of transparent component and cover component

Abstract

The method for manufacturing a transparent component includes: a process (S1) of forming a plurality of through holes (18) on a transparent substrate (MG) by machining; a process (S2) of grinding the main surface (MGa) of the transparent substrate (MG); and a process (S3) of etching the plurality of through holes (18).

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a transparent component and a cover component. Prior Art

[0002] For example, Patent Document 1 discloses an airtight package comprising: a substrate on which a light-emitting element (LED element) is mounted; and a transparent cover member fixed to the substrate so as to cover the light-emitting element.

[0003] The package substrate is quadrilateral in plan view. The package cover member (transparent body) comprises a plate-shaped frame (edge) and a dome-shaped protrusion (convex cover) protruding from the frame. The frame is quadrilateral in plan view, corresponding to the shape of the substrate (see paragraphs 0014, 0019, and Figures 1 and 2 of the document).

[0004] A preferred method for efficiently manufacturing a cover member is to divide a large transparent substrate into a plurality of individual pieces, and use the edges of the divided pieces as the cover member. For example, Patent Document 2 discloses a method for manufacturing a transparent member comprising a first step of forming a plurality of through-holes in a transparent substrate, and a second step of dividing the transparent substrate along a virtual line connecting the centers of the plurality of through-holes to obtain the transparent member (see claim 1 of the document).

[0005] Specifically, the first step comprises: irradiating a transparent substrate with laser light at a location where a through-hole is to be formed to provide a modified portion; and etching the transparent substrate where the modified portion is to be provided to provide a through-hole (see claim 3 of the document). Furthermore, the through-hole has a polygonal shape when viewed from above, and in the second step, the transparent substrate is divided along a virtual line connecting the vertices of the polygons of the plurality of through-holes (see claim 2 of the document). [Prior Art Literature] [Patent Document]

[0006] [Patent Document 1] International Publication No. 2021 / 251102 [Patent Document 2] International Publication No. 2023 / 095734 Summary of the Invention

[0007] [Problems to be solved by the invention] In addition to laser irradiation as described in the first step above, other methods for forming through-holes in a transparent substrate include mechanical processing of the transparent substrate. In such cases, machining can create chips or microcracks in the through-holes, potentially damaging the transparent substrate or cover member.

[0008] The present invention is completed in view of the above circumstances, and its technical problem is to prevent the damage of the transparent component caused by the through hole formed by mechanical processing. [Technical means to solve the problem]

[0009] (1) The method for manufacturing a transparent component of the present invention is used to solve the above-mentioned problem, and is characterized by comprising: a process of forming a plurality of through holes in a transparent substrate by mechanical processing; a process of grinding the main surface of the aforementioned transparent substrate; and a process of etching the aforementioned plurality of through holes.

[0010] This feature allows a transparent substrate having a plurality of through-holes to be polished and etched to reliably remove debris or microcracks formed in the through-holes during machining. This prevents damage to the transparent substrate caused by the through-holes.

[0011] (2) The method for manufacturing a transparent component described in (1) above may further include, after the etching process is performed on the plurality of through holes, a process of dividing the transparent substrate along a virtual line connecting the plurality of through holes.

[0012] According to this feature, the transparent substrate can be divided along the virtual line, thereby efficiently manufacturing a plurality of transparent components.

[0013] (3) The method for manufacturing a transparent component described in (1) or (2) above may further include, after etching the plurality of through holes, a step of heat-forming the transparent substrate so that a portion of the main surface becomes convex.

[0014] According to this feature, a portion of the transparent substrate can be formed into a convex shape, thereby forming a space for accommodating the packaged light-emitting element.

[0015] (4) The method for manufacturing a transparent component described in any one of (1) to (3) above, wherein the aforementioned machining may include sandblasting.

[0016] (5) A method for manufacturing a transparent component as described in any one of (1) to (4) above, wherein the through hole is configured as a polygonal shape when viewed from above, the through hole has a plurality of corners, and the corners of the through hole may be configured as a curved shape when viewed from above.

[0017] According to this feature, the corners of the through hole can be formed into a curved shape, thereby preventing the transparent substrate from being damaged by the corners.

[0018] (6) The method for manufacturing a transparent member according to any one of (1) to (5) above, wherein the etching process for the plurality of through holes does not substantially change the size of the through holes. This feature allows the transparent member to be manufactured with high precision.

[0019] (7) The method for manufacturing a transparent component described in any one of (1) to (6) above, wherein the method may further include a process of forming a film on the main surface of the transparent substrate after the process of forming the plurality of through holes and before the process of dividing the transparent substrate.

[0020] According to this feature, a film can be formed on the main surface of the transparent substrate before the process of dividing the transparent substrate, thereby efficiently manufacturing a transparent member having a film.

[0021] (8) The method for manufacturing a transparent component described in any one of (2) to (7) above, wherein the process of dividing the transparent substrate may include a cutting process.

[0022] (9) The present invention is used to solve the above-mentioned problems, and is a cover member made of transparent glass used for packaging containing light-emitting elements, which is characterized by comprising: a plate-shaped frame portion, a protrusion protruding from the aforementioned frame portion, the aforementioned frame portion comprising: a first main surface, a second main surface located on the side opposite to the aforementioned first main surface, and a side surface connecting the aforementioned first main surface and the second main surface, the aforementioned frame portion comprising: a plurality of corners and a plurality of sides when viewed from above, the aforementioned side surfaces of the aforementioned plurality of corners being etched surfaces, and the aforementioned side surface of at least one of the aforementioned plurality of sides being a cut surface. [Effects of the Invention]

[0023] According to the present invention, it is possible to prevent the transparent member from being damaged by the through hole formed by machining. Simple diagram description

[0024] [Figure 1] 3D view of the package. [Figure 2] Cross-sectional view of the package. [Figure 3] Cross-sectional view of the substrate. [Figure 4] Top view of the substrate. [Fig. 5] A cross-sectional view of a cover member. [Fig. 6] A bottom view of the cover member. [Fig. 7] A top view of a glass motherboard used in manufacturing a cover member. [Figure 8] A flow chart showing a method for manufacturing a cover member. [Figure 9] shows a cross-sectional view of the perforation process. [Figure 10] A top view of a glass motherboard with through holes formed therein. [Fig. 11] A top view of a through hole formed in a glass motherboard. [Figure 12] shows a side view of the grinding process. [Figure 13] A cross-sectional view showing the etching process. [Figure 14] is a cross-sectional view showing the forming process. Fig. 15 is a cross-sectional view showing the forming process. FIG16 shows a top view of the glass motherboard after the forming process. [Figure 17] A cross-sectional view showing the film forming process. [Figure 18] A cross-sectional view showing the cutting process. FIG19 is a top view showing the cover member after the cutting process. [Figure 20] A cross-sectional view showing the joining process. Implementation Method

[0025] The present embodiment will be described below with reference to the accompanying drawings. Figures 1 to 20 illustrate an embodiment of a package including a transparent cover member according to the present invention and a method for manufacturing the package. The present invention is not limited to cover members and can also be applied to the manufacture of other transparent members.

[0026] 1 and 2 , the package 1 includes a base 2, a light emitting element 3 supported by the base 2, a cover member 4 covering the base 2 and the light emitting element 3, and a sealing portion 5 for airtightly bonding the base 2 and the cover member 4.

[0027] Figures 3 and 4 show the base 2 before the lid member 4 is attached. The base 2 has a square shape when viewed from above. The base 2 has a first principal surface 2a that supports the light-emitting element 3, a second principal surface 2b located opposite the first principal surface 2a, and a metal layer 6 formed on the first principal surface 2a.

[0028] Furthermore, the base 2 has a plurality of straight edges 2c and a plurality of corners 2d. The corners 2d are chamfered. This results in the corners 2d having flat chamfered surfaces 2d1. The shape of the chamfered surfaces 2d1 is not limited to that of this embodiment and may also be curved or other shapes.

[0029] Examples of the material of the substrate 2 include ceramics such as aluminum nitride, aluminum oxide, silicon carbide, and silicon nitride, glass ceramics obtained by mixing and sintering these ceramics with glass powder, glass, Fe-Ni-Co alloy, Cu-W alloy, and alloys such as Kovar (registered trademark).

[0030] As shown in FIG4 , the metal layer 6 has a frame shape surrounding the light emitting element 3. The metal layer 6 is a square shape, but is not limited to this shape. The metal layer 6 may also be a circular shape, for example, so as to surround the light emitting element 3.

[0031] The metal layer 6 includes three layers, in order from the first main surface 2a side: a base layer, an intermediate layer, and a surface layer. Examples of metals used in the base layer include Cr, Ta, W, Ti, Mo, Ni, and Pt. Examples of metals used in the intermediate layer include Ni, Pt, and Pd. Examples of metals used in the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used in the metal layer 6 may be a single element or an alloy.

[0032] Examples of a method for forming the metal layer 6 on the first main surface 2 a of the base 2 include sputtering, vacuum deposition, vacuum deposition using ion assist or ion deposition, and CVD.

[0033] The light emitting element 3 is fixed to the first main surface 2a of the base 2. In this embodiment, an ultraviolet ray irradiation LED is used as the package 1 for the light emitting element 3. However, the light emitting element 3 of the present invention is not limited to this embodiment, and an infrared LED or a visible light LED may be used.

[0034] Figures 5 and 6 show the cover member 4 before being bonded to the base 2. The glass used for the cover member 4 is preferably alkali-free glass, borosilicate glass, aluminosilicate glass, quartz glass, or crystallized glass. Alkali-free glass, borosilicate glass, or aluminosilicate glass offer both high transmittance and excellent workability during molding. Furthermore, quartz glass maintains workability during molding while exhibiting significantly high transmittance in the ultraviolet region. Crystallized glass offers both high transmittance and high breaking strength.

[0035] When the glass is borosilicate glass, aluminosilicate glass, or alkali-free glass, the glass composition preferably contains, by mass%, SiO₂: 50-75%, Al₂O₃: 1-25%, B₂O₃: 1-30%, Li₂O + Na₂O + K₂O: 0-20%, and MgO + CaO + SrO + BaO: 0-20%. As long as the glass composition falls within the above range, it corresponds to the glass family. In the present invention, "Li₂O + Na₂O + K₂O" refers to the total amount of Li₂O, Na₂O, and K₂O, and "MgO + CaO + SrO + BaO" refers to the total amount of MgO, CaO, SrO, and BaO.

[0036] In the case of crystallized glass, the glass composition preferably contains SiO 2: 60-80%, Al 2O 3: 3-30%, Li 2O+Na 2O+ Low thermal expansion crystallized glass, composed of 1-20% K₂O and 5-20% MgO+CaO+SrO+BaO, deposits a β-quartz solid solution or β-spodumene as crystals from within the glass. Low thermal expansion refers to a thermal expansion coefficient within the range of -10×10⁻⁷ to 20×10⁻⁷ / °C within the temperature range of 30-300°C.

[0037] As shown in Figures 2 and 5, the cover member 4 includes a plate-shaped frame portion 7, a dome-shaped protrusion 8 protruding from the frame portion 7, and a connecting portion 9 connecting the frame portion 7 and the protrusion 8. Furthermore, the cover member 4 may include a first anti-reflection film 10a and a second anti-reflection film 10b.

[0038] The frame 7 has, for example, a certain thickness, but is not limited to this. The thickness of the frame 7 is, for example, not less than 0.2 mm and not more than 2 mm. The frame 7 has a first principal surface 7a, a second principal surface 7b located opposite the first principal surface 7a, and a side surface 7c connecting the first principal surface 7a and the second principal surface 7b.

[0039] As shown in Figure 6, the frame portion 7 is quadrilateral, but this is not limited to this shape. The frame portion 7 has a plurality of linear sides 7d and a plurality of corners 7e. The length of the sides 7d is, for example, between 2.5 mm and 100 mm. The corners 7e are chamfered. This results in flat chamfered surfaces 7e1. The shape of the chamfered surfaces 7e1 is not limited to this embodiment and may also be curved or other shapes. The chamfered surfaces 7e1 are formed as part of the side surfaces 7c, extending from the first principal surface 7a to the second principal surface 7b.

[0040] The protrusion 8, together with the first principal surface 2a of the base 2, forms a space for accommodating the light-emitting element 3. As shown in Figures 5 and 6, the protrusion 8 is formed in the center of the frame 7, but this is not limited to this configuration. The protrusion 8 has a concavely curved inner surface 8a, a convexly curved outer surface 8b, and an opening 8c formed on the inner surface 8a.

[0041] The protrusion 8 includes a base 11, a mid-portion 12, and a top 13. The base 11 is integrally formed with the connecting portion 9. The mid-portion 12 is located between the base 11 and the top 13. The inner surface 8a and outer surface 8b of the protrusion 8 form a continuous curved surface from the base 11 to the top 13.

[0042] The opening 8c of the protrusion 8 is used to allow the light emitting element 3 provided on the base 2 to enter the inner side of the protrusion 8 when the cover member 4 is fixed to the base 2. As shown in FIG6, the opening 8c of the protrusion 8 is formed into a circular shape, but is not limited to this shape.

[0043] As shown in Figures 2 and 5 , the connecting portion 9 has a curved shape to connect the base portion 11 and the frame portion 7. The connecting portion 9 has a first curved surface 9a connecting the first main surface 7a of the frame portion 7 and the inner surface 8a of the protrusion 8, and a second curved surface 9b connecting the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame portion 7.

[0044] The first anti-reflection film 10a is formed on the inner surface 8a of the protrusion 8 and the first main surface 7a of the frame 7. The first anti-reflection film 10a preferably has a multilayer film structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film alternately.

[0045] The portion of the first anti-reflection film 10a formed on the inner surface 8a of the protrusion 8 (hereinafter referred to as the "anti-reflection portion") 10a1 is configured so that the film thickness gradually decreases as it moves from the top 13 of the protrusion 8 toward the base 11. In other words, the thickness of the anti-reflection portion 10a1 is greatest at the top 13 and smallest at the base 11.

[0046] The first antireflection film 10a includes a portion (hereinafter referred to as a "buffer") 10a2 formed on the first principal surface 7a of the frame 7 and having a predetermined thickness. In addition to preventing ultraviolet light reflection, the buffer 10a2 also mitigates stress applied to the frame 7 when the cover member 4 is bonded to the base 2.

[0047] The second anti-reflection film 10b is formed on the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame 7. The second anti-reflection film 10b preferably has a multilayer film structure including, for example, a silicon oxide film (SiO2) as a first film and a hafnium oxide film (HfO2) as a second film alternately.

[0048] The portion of the second anti-reflection film 10b formed on the outer surface 8b of the protrusion 8 (hereinafter referred to as the "anti-reflection portion") 10b1 is configured so that the thickness gradually decreases as it moves from the top 13 toward the base 11. In other words, the thickness of the anti-reflection portion 10b1 is greatest at the top 13 and smallest at the base 11.

[0049] As shown in Figures 2, 5, and 6, a metal layer 14 and a bonding portion 15 are formed on the buffer portion 10a2 of the first anti-reflection film 10a. The Young's modulus of the buffer portion 10a2 is preferably 250 GPa or less, more preferably 200 GPa or less, more preferably 150 GPa or less, and particularly preferably 100 GPa or less. By setting this upper limit, the cushioning properties of the buffer portion 10a2 are enhanced, thereby alleviating stress caused by the difference in thermal expansion coefficient between the bonding portion 15 and the cover member 4 (frame 7).

[0050] As shown in Figures 5 and 6, the metal layer 14 is formed to overlap the buffer portion 10a2. The metal layer 14 is formed on the surface of the buffer portion 10a2 opposite the surface of the buffer portion 10a2 that contacts the first main surface 7a of the frame portion 7. As shown in Figure 6, the metal layer 14 has a rectangular frame shape corresponding to the shape of the metal layer 6 of the substrate 2. The shape of the metal layer 14 is not limited to this embodiment. The metal layer 14 may also have various other frame shapes, such as a circular shape. The metal layer 14 includes three layers, in order from the buffer portion 10a2 side: a base layer, an intermediate layer, and a surface layer.

[0051] Examples of metals used in the base layer include Cr, Ta, W, Ti, Mo, Ni, and Pt. When Cr is used in the base layer, the Young's modulus of the base layer is preferably 279 GPa or less. Examples of metals used in the intermediate layer include Ni, Pt, and Pd. Examples of metals used in the surface layer include Au, Sn, Ag, Ni, and Pt. The metal used in the metal layer 14 may be a single element or an alloy.

[0052] As shown in Figures 5 and 6 , the bonding portion 15 is formed as a layer overlapping the metal layer 14. As shown in Figure 5 , the bonding portion 15 contacts the metal layer 14 at a location opposite to the location contacting the buffer portion 10a2. As shown in Figure 6 , the bonding portion 15 has a rectangular frame shape corresponding to the shapes of the buffer portion 10a2 and the metal layer 14. The shape of the bonding portion 15 is not limited to this embodiment and may also have various other frame shapes, such as a circle.

[0053] The joint 15 is made of a metal-based bonding material. Solder or other materials available as solder can be used as the metal-based bonding material. Examples of metal-based bonding materials include Au-Sn alloys, Pb-Sn alloys, Au-Ge alloys, and Sn-Ni alloys. Furthermore, by making the width of the joint 15 narrower than that of the buffer portion 10a2, the effects of stress caused by the difference in thermal expansion coefficients between the joint 15 and the lid member 4 can be reduced.

[0054] The sealing portion 5 is formed by integrally bonding the metal layer 6 of the base 2 and the metal layer 14 of the cover member 4 via a bonding portion 15 .

[0055] Next, a method for manufacturing the package 1 will be described. This method includes a preparation step of preparing the base 2 and the cover member 4, and a bonding step of bonding the base 2 and the cover member 4.

[0056] In the preparation process, after forming the metal layer 6 on the first main surface 2 a of the base 2 , the light emitting element 3 is mounted on the first main surface 2 a .

[0057] Furthermore, during the preparatory process, a plurality of cover members 4 are manufactured from a large glass motherboard, which is a transparent substrate. The following describes a method for manufacturing the cover members 4 with reference to Figures 7 to 19. As shown in Figure 7, the glass motherboard MG is configured in a quadrilateral shape, but this shape is not limited to this. In Figure 7, the cover members 4 that can be manufactured from the glass motherboard MG are indicated by virtual lines CL. In this example, nine cover members 4 can be manufactured from the glass motherboard MG, but the number of cover members 4 manufactured from the glass motherboard MG is not limited to this embodiment.

[0058] As shown in FIG. 8 , the method for manufacturing the cover member 4 includes a punching step S1 , a grinding step S2 , an etching step S3 , a forming step S4 , a film forming step S5 , and a cutting step S6 .

[0059] The drilling step S1 is a process of forming a plurality of through-holes in the glass motherboard MG by mechanical processing. In this embodiment, sandblasting is used as an example of mechanical processing, but this is not limiting. The glass motherboard MG can also be processed by various other processes such as drilling. As shown in Figure 9, the glass motherboard MG has a first main surface MGa corresponding to the inner surface 8a of the protrusion 8 of the cover member 4 and the first main surface 7a of the frame portion 7, and a second main surface MGb corresponding to the outer surface 8b of the protrusion 8 and the second main surface 7b of the frame portion 7.

[0060] As shown in FIG9 , in the punching step S1, a mask member 16 is fixed to the first main surface MGa of the glass motherboard MG. The mask member 16 has an opening 16a having a shape corresponding to the through-hole formed in the glass motherboard MG. In the punching step S1, as indicated by the arrows in FIG9 , a sandblasting device 17 sprays compressed air containing sand from above the mask member 16 toward the glass motherboard MG. This forms a through-hole 18 in the glass motherboard MG having a shape corresponding to the opening 16a of the mask member 16.

[0061] As shown in Figure 10 , through-holes 18 formed in the glass motherboard MG are formed in portions corresponding to corners 7e of the frame portion 7 of the cover member 4. While the through-holes 18 are quadrilateral in plan view, this shape is not limited to this. The through-holes 18 may also have various other shapes besides the quadrilateral, such as polygonal, circular, or elliptical. The spacing (pitch) between the plurality of through-holes 18 is, for example, from 2.5 mm to 100 mm.

[0062] As shown in Figure 11, through-hole 18 has a plurality of linear sides 19 and a plurality of corners 20. Sides 19 are formed at a predetermined angle relative to side 7d of frame portion 7 of cover member 4. The length of side 19 is, for example, 0.3 mm to 10 mm. Corners 20 are chamfered. This creates a curved shape (e.g., an arc) when viewed from above. Specifically, corners 20 have a curved chamfered surface. The radius of curvature of the chamfered surface is preferably 0.3 mm to 5 mm, and more preferably 0.5 mm to 3 mm.

[0063] At the end of the drilling process S1 , chips may be generated at the edge of the through hole 18 or micro cracks may be generated on the inner surface of the through hole 18 .

[0064] As shown in FIG12 , polishing step S2 is a step in which the main surfaces MGa and MGb of the glass mother substrate MG are polished using a polishing device 21. The polishing device 21 includes a rotating table (polishing disc) 22, a polishing pad 23 mounted on the rotating table 22, and a pressing member 24 for pressing the glass mother substrate MG against the polishing pad 23.

[0065] As shown in Figure 12, in the polishing step S2, the first main surface MGa of the glass mother substrate MGa is brought into contact with the polishing pad 23, and the glass mother substrate MG is pressed from the second main surface MGb side by the pressing member 24. In this state, the turntable 22 is rotated while lubricant is supplied to the polishing pad 23, thereby polishing the first main surface MGa of the glass mother substrate MG. After this polishing is completed, the second main surface MGb of the glass mother substrate MG is also polished in the same manner. This removes debris formed in the through-hole 18 in the drilling step S1.

[0066] As shown in Figure 13, in etching step S3, the glass motherboard MG is immersed in an etching tank 26 containing an etching solution 25. This etch process is performed on the entire surface of the glass motherboard MG and the inner surfaces of the through-holes 18. This removes microcracks formed on the inner surfaces of the through-holes 18 during the drilling step S1. Furthermore, in etching step S3, rather than immersing the glass motherboard MG, the etching solution 25 may be injected into the through-holes 18 of the glass motherboard MG to etch the inner surfaces of the through-holes 18. This removes microcracks formed on the inner surfaces of the through-holes 18 during the drilling step S1.

[0067] In the etching step S3, it is preferable to perform the etching process in such a manner that the size of the through hole 18 does not substantially change. Here, the size of the through hole 18 does not substantially change, which means that the maximum dimension of the through hole 18 (for example, the distance between a pair of opposing sides 19) does not change by more than 50 μm.

[0068] The forming step S4 is a step of forming a portion of the main surfaces MGa and MGb of the glass mother board MG into a convex shape by heat forming. The convex portion formed on the glass mother board MG corresponds to the protrusion 8 of the cover member 4.

[0069] Figures 14 and 15 illustrate the forming apparatus used in forming step S4. The forming apparatus 27 includes a support table 28 for supporting the glass mother plate MG, a plurality of heat sources 29 for thermally deforming a portion of the glass mother plate MG to form the protrusion 8 of the cover member 4, and an external force generating device 30 for applying an external force to a portion of the glass mother plate MG.

[0070] The support platform 28 includes a plurality of fixing portions 31 for fixing the glass motherboard MG and a plurality of spaces 32 for allowing thermal deformation of a portion of the glass motherboard MG. Furthermore, the support platform 28 includes a plurality of openings 28a surrounded by the fixing portions 31 and a plurality of suction portions 28b for sucking a portion of the glass motherboard MG. Examples of materials constituting the support platform 28 include metals and ceramics.

[0071] The fixing portion 31 of the support platform 28 comprises a supporting surface 31a for supporting the glass motherboard MG and a suction portion 31b for attracting the glass motherboard MG. The supporting surface 31a is a flat surface facing upward. The suction portion 31b of the fixing portion 31 is formed so as to be exposed from the supporting surface 31a. The suction portion 31b is connected to the external force generating device 30.

[0072] The space portion 32 of the support base 28 is formed inside the concave portion having a bottom. The space portion 32 of the support base 28 is configured so that the entire protrusion 8 of the cover member 4 is formed in a non-contact state.

[0073] The opening 28a of the support platform 28 has a circular opening edge when viewed from above, but is not limited to this. It may also have a polygonal shape, such as a triangle or a square, or an elliptical shape. The suction portion 28b of the support platform 28 is formed at the bottom of the recessed portion of the support platform 28 and communicates with the space 32. The suction portion 28b is connected to the external force generating device 30 along with the suction portion 31b of the fixing portion 31. In other words, the external force generating device 30 can utilize a common suction mechanism to perform suction by the suction portion 28b and the suction portion 31b of the fixing portion 31.

[0074] The above structure is not limiting. A receiving jig for receiving the glass motherboard MG may also be provided in the space 32 to precisely shape the cover member 4. The receiving jig is made of metal or ceramic. As previously mentioned, it is preferred that the entire protrusion 8 of the cover member 4 be formed without contact. However, by improving the surface quality of the receiving jig in contact with the glass motherboard MG (reducing surface roughness and surface unevenness), the cover member 4 can be precisely formed even when a receiving jig is used.

[0075] As shown in Figure 14, a heat source 29 is disposed above the support table 28. In this embodiment, each heat source 29 is a burner that sprays flames FL toward the glass mother board MG. By using a burner, the glass mother board MG can be softened relatively quickly. Furthermore, the heating method of the heat source 29 may be, for example, resistance heating, laser heating, or heating using superheated steam. Superheated steam refers to high-temperature steam generated by further heating saturated steam generated by boiling water. Furthermore, the heat source 29 may be a combination of heat sources using different heating methods.

[0076] As the external force generating device 30, for example, a suction device (exhaust device) can be used. The suction device exhausts the gas within the space 32 of the support table 28, thereby creating a negative pressure within the space 32 of the support table 28. This draws a portion of the glass mother board MG into the space 32 of the support table 28, thereby promoting thermal deformation of a portion of the glass mother board MG. A pump using a Venturi mechanism is preferably used as the suction device.

[0077] As shown in Figure 14, in the forming step S4, the glass mother sheet MG is placed on the fixing portion 31 of the support table 28 while the external force generating device 30 is stopped. This causes the second main surface MGb of the glass mother sheet MG to contact the support surface 31a of the fixing portion 31. Next, the external force generating device 30 is activated to fix the glass mother sheet MG to the fixing portion 31. In this forming step S4, suction by the suction portion 28b of the support table 28 and suction by the suction portion 31b of the fixing portion 31 can be performed simultaneously. In this case, the suction direction D1 of the glass mother sheet MG by the suction portion 28b and the suction direction D2 of the glass mother sheet MG by the suction portion 31b of the fixing portion 31 can be aligned.

[0078] Next, the glass mother plate MG is heated from above the support table 28 by the heat source 29. The suction by the suction portion 28b thermally deforms a portion of the glass mother plate MG, as shown in Figures 15 and 16, thereby forming a plurality of protrusions 8. Furthermore, a portion corresponding to the frame portion 7 of the cover member 4 is formed around the protrusions 8. This results in a portion corresponding to the plurality of cover members 4 being formed on the glass mother plate MG. Furthermore, in the forming step S4, it is preferable to also heat the portion corresponding to the frame portion 7 to prevent warping. Furthermore, when the glass mother plate MG is heated from above the support table 28 by the heat source 29, if microcracks exist on the inner surface of the through-hole 18, external forces acting on the periphery of the through-hole 18 may cause the cracks to propagate around the through-hole 18, potentially damaging the glass mother plate MG. In the present invention, since microcracks formed on the inner surface of the through-hole 18 are removed, even when the glass mother plate MG is heated from above the support 28 by the heat source 29, cracks will not develop around the through-hole 18. Therefore, the risk of breakage of the glass mother plate MG can be reduced.

[0079] The film forming process S5 includes: a first film forming process of forming anti-reflection films 10a and 10b on the main surfaces MGa and MGb of the glass mother board MG; and a second film forming process of forming a metal layer 14 on a portion corresponding to the frame portion 7 of the cover member 4 after the first film forming process.

[0080] FIG17 shows the film forming apparatus used in film forming step S5. In this embodiment, a sputtering apparatus such as a magnetron sputtering apparatus is used as an example of the film forming apparatus. However, the present invention is not limited to this configuration; a film forming apparatus that performs other physical vapor deposition methods, such as vacuum vapor deposition, may also be used.

[0081] As shown in FIG. 17 , the film forming apparatus 33 includes a vacuum chamber 34 and targets 35 a and 35 b for scattering particles of a film forming material for the anti-reflection films 10 a and 10 b .

[0082] The vacuum chamber 34 houses the targets 35a and 35b. The interior of the vacuum chamber 34 is set to a predetermined vacuum level by a vacuum pump. An inert gas, such as argon, is supplied to the vacuum chamber 34.

[0083] The targets 35a and 35b include a first target 35a for forming the first antireflection film 10a on the first main surface MGa of the glass mother board MG and a second target 35b for forming the second antireflection film 10b on the second main surface MGb of the glass mother board MG.

[0084] The first target 35a and the second target 35b include a plurality of targets in order to form the first film (SiO 2 ) and the second film (HfO 2 ) of the first anti-reflection film 10a and the second anti-reflection film 10b .

[0085] As shown in FIG17 , in the first film formation step, the glass mother substrate MG is housed in a vacuum chamber 34. Subsequently, particles scattered from the first target 35a adhere to the first main surface MGa of the glass mother substrate MG, thereby forming a first anti-reflection film 10a. Similarly, particles scattered from the second target 35b adhere to the second main surface MGb of the glass mother substrate MG, thereby forming a second anti-reflection film 10b.

[0086] In the second film-forming step, after the first film-forming step, the metal layer 14 is formed so as to overlap the first anti-reflection film 10a. Specifically, a mask member for forming the metal layer 14 is fixed to the first main surface MGa of the glass mother MG. The mask member has an opening corresponding to a predetermined position (the planned position for forming the metal layer 14) in the portion of the glass mother MG corresponding to the frame portion 7.

[0087] Furthermore, a target for forming the metal layer 14 is placed within the vacuum chamber 34. Particles scattered from the target are allowed to pass through the openings of the mask member and adhere to the first main surface MGa of the glass mother MG. This forms a frame-shaped metal layer 14 having a predetermined thickness at a predetermined position on the glass mother MG.

[0088] Then, the bonding portion 15 is formed so as to overlap the metal layer 14. The bonding portion 15 is formed, for example, by applying a paste-like metallic bonding material so as to overlap the metal layer 14 (coating process). Specific examples of the coating process include a printing method using a mask (screen printing method) and a coating method using a dispenser.

[0089] The joining portion 15 is not limited to the above-described method, and may be formed by, for example, placing a formed body of a metal-based joining material formed into a frame shape in advance on the metal layer 14 in an overlapping manner.

[0090] After the metal bonding material of the bonding portion 15 is applied to the first main surface MGa of the glass mother board MG, a heat treatment process is performed to fix the metal bonding material to the metal layer 14. The heat treatment process includes a heating process and a cooling process.

[0091] During the heating process, the glass motherboard MG is heated using a heating device such as a reflow oven to melt the metal bonding material. The heating process can also be performed while the furnace is filled with nitrogen. During the heating process, the glass motherboard MG is heated to a temperature of 300°C or higher.

[0092] During the cooling process, the melted metallic bonding material on the first main surface MGa of the glass motherboard MG is cooled and solidified. A slow cooling rate of 50°C / min is preferred. During the cooling process, stress is generated in the glass motherboard MG due to the difference in thermal expansion coefficient between the glass motherboard MG and the bonding portion 15. However, the first anti-reflection film 10a mitigates this stress.

[0093] Furthermore, the glass motherboard MG is not damaged even by the above-mentioned stress because the debris around the through-hole 18 and the microcracks on the inner surface of the through-hole 18 are removed by the grinding process S2 and the etching process S3.

[0094] Cutting step S6 is a step for dividing the glass mother plate MG to form a plurality of cover members 4. In this embodiment, cutting step S6 illustrates an example of cutting the glass mother plate MG. Cutting step S6 is not limited to this embodiment; the glass mother plate MG may also be cut by marking or laser irradiation.

[0095] As shown in FIG18 , in the cutting step S6 , the glass mother board MG is cut by the dicing blade 36 along a virtual cutting line CL set on the glass mother board MG. Furthermore, as shown in FIG16 , the cutting line CL is set to be a straight line connecting the plurality of through-holes 18. Specifically, the cutting line CL is set to pass through the corners 20 of each through-hole 18.

[0096] 19, a plurality of cover members 4 are formed from the glass motherboard MG by the cutting step S6. By cutting the glass motherboard MG along the planned cutting lines CL as described above, the sides 19 of the through holes 18 become the corners 7e of the frame 7 of each cover member 4.

[0097] In the lid member 4 manufactured as described above, the side surface 7c of the edge 7d of the frame portion 7 is a cut surface, and the chamfered surface 7e1 of the corner 7e of the frame portion 7 is an etched surface. The surface roughness (arithmetic mean roughness) Ra of the cut surface is 1 μm to 100 μm. The surface roughness (arithmetic mean roughness) Ra of the etched surface is 0.5 nm to 100 nm.

[0098] As shown in Figure 20, in the bonding process, the cover member 4 manufactured in the preparatory process is overlapped with the base 2. Specifically, the first main surface 7a of the frame portion 7 of the cover member 4 faces the base 2, and the bonding portion 15 contacts the metal layer 6 formed on the first main surface 2a of the base 2.

[0099] After that, the metal layer 6 and the joint portion 15 are heated while being pressed together (heating process). This causes the metal bonding material of the joint portion 15 to be melted.

[0100] The molten metal bonding material is then cooled and solidified (cooling process). During the cooling process, stress is generated in the frame 7 of the cover member 4 due to the difference in thermal expansion coefficients between the base 2 and the frame 7. In this case, the buffer portion 10a2 of the first anti-reflection film 10a deforms to alleviate this stress. This prevents damage to the frame 7. Furthermore, the cover member 4 has chipping and microcracks from removing the through-holes 18 from the glass motherboard MG during the grinding process S2 and etching process S3. Therefore, even if the aforementioned stress acts on the cover member 4, the corners 7e of the cover member 4 will not be damaged.

[0101] After the cooling process is completed, the metal layer 6 of the base 2 and the metal layer 14 of the cover member 4 are bonded together at the joint 15 to form the sealing portion 5. The airtight package 1 is thus completed.

[0102] According to the embodiment described above, the glass mother plate MG having a plurality of through-holes 18 formed therein can be subjected to the grinding step S2 and the etching step S3, thereby reliably removing debris and microcracks formed in the through-holes 18 by machining (sandblasting). This prevents damage to the glass mother plate MG and the cover member 4 caused by the through-holes 18.

[0103] Furthermore, the present invention is not limited to the structure of the above-described embodiment, nor is it limited to the above-described effects. The present invention can be modified in various ways without departing from the spirit of the present invention.

[0104] While the above embodiment illustrates the cover member 4 and glass motherboard MG formed with the first anti-reflection film 10a and the second anti-reflection film 10b, the present invention is not limited to this structure. The cover member 4 and glass motherboard MG of the present invention may include only the first anti-reflection film 10a or only the second anti-reflection film 10b. Furthermore, both anti-reflection films 10a and 10b may be omitted.

[0105] In the above embodiment, the cover member 4 has one protrusion 8 , but the present invention is not limited thereto and the cover member 4 may have a plurality of protrusions 8 .

[0106] 1: Encapsulation 3: Light-emitting element 4: Cover member 7: Frame 7a: First main surface of the frame 7b: Second main surface of the frame 7c: Side of the frame 7d: Edge of the frame 7e: Corner of the frame 8: Protrusion 18:Through hole 20: Corner of through hole CL: Cutting line (virtual line) MG: Glass motherboard (transparent substrate) MGa: The first main surface of the glass motherboard MGb: Second main surface of glass motherboard S1: Perforation Engineering S2: Grinding Engineering S3: Etching process S4: Forming process S5: Film Formation Process S6: Cutting process

Claims

1. A method for manufacturing a transparent component, characterized by comprising: a process of forming a plurality of through holes in a transparent substrate by machining; a process of grinding the main surface of the transparent substrate; a process of etching the plurality of through holes; and a process of heat forming a portion of the main surface of the transparent substrate in a convex manner after etching the plurality of through holes.

2. A method for manufacturing a transparent component as described in claim 1, wherein, After performing the aforementioned etching process on the aforementioned plurality of through holes, the process includes: dividing the aforementioned transparent substrate along virtual lines that connect the aforementioned plurality of through holes to each other.

3. A method for manufacturing a transparent component as described in claim 1 or 2, wherein, The aforementioned machining process includes sandblasting.

4. A method for manufacturing a transparent component as described in claim 1 or 2, wherein, The aforementioned through hole has a polygonal shape when viewed from above. The aforementioned through hole has a plurality of corners. The aforementioned corners of the aforementioned through hole have a curved shape when viewed from above.

5. A method for manufacturing a transparent component as described in claim 1 or 2, wherein, In the process of performing the aforementioned etching process on the aforementioned plurality of through holes, the size of the aforementioned through holes will not change substantially.

6. A method for manufacturing a transparent component as described in claim 2, wherein, After the process of forming the aforementioned plurality of through holes, and before the process of dividing the aforementioned transparent substrate, a process of forming a film on the aforementioned main surface of the aforementioned transparent substrate is performed.

7. A method for manufacturing a transparent component as described in claim 2, wherein, The process of dividing the aforementioned transparent substrate includes a cutting process.

8. A cover member, a cover member made of transparent glass used for encapsulating a light-emitting element, comprising: a plate-shaped frame portion, a protrusion protruding from the frame portion, the frame portion comprising: a first main surface, a second main surface located on the side opposite to the first main surface, and a side surface connecting the first main surface and the second main surface, the frame portion comprising: a plurality of corner portions and a plurality of edges when viewed from above, the side surface of the plurality of corner portions being etched surfaces, and at least one of the plurality of edges having a cut surface.

Images