Circuit board structure and manufacturing method thereof

Abstract

A circuit board structure and a method for manufacturing the same are provided. The circuit board structure includes a substrate, electronic components, a filler layer, and a first dielectric layer. The substrate has through-holes. The electronic components are embedded in the through-holes. The filler layer fills the through-holes and covers the electronic components, wherein the surface of the filler layer has one or more recesses. The first dielectric layer is disposed on the filler layer and fills the recesses.

Description

Technical Field

[0001] This disclosure relates to circuit board structures, and in particular to circuit board structures with embedded electronic components and methods for their manufacture. Prior Technology

[0002] Printed circuit boards (PCBs) are widely used in various electronic devices, including motherboards for desktop and laptop computers. PCBs not only mount various electronic components but also electrically connect these components to each other. While existing PCB structures have gradually met their intended uses, they are not perfect in every aspect. Therefore, some issues regarding PCB structure still need to be addressed. Summary of the Invention

[0003] A circuit board structure is provided. It includes a substrate, electronic components, a fill layer, and a first dielectric layer. The substrate has through-holes. The electronic components are embedded in the through-holes. The fill layer fills the through-holes and covers the electronic components, wherein the surface of the fill layer has one or more recesses. The first dielectric layer is disposed on the fill layer and fills the recesses.

[0004] A method for manufacturing a circuit board structure is provided. The method includes: providing a substrate having through holes; attaching the substrate to an adhesive; processing the adhesive to form one or more vent holes; placing electronic components in the through holes, with the adhesive fixing the electronic components; forming a filling layer in the through holes and covering the electronic components, wherein the filling layer has one or more recesses corresponding to the vent holes; removing the adhesive; and forming a first dielectric layer on the filling layer and filling the recesses.

[0005] The circuit board structure and manufacturing method disclosed herein can be applied to various electronic devices. To make the features and advantages of this disclosure more apparent and understandable, various embodiments are described below in detail with reference to the accompanying drawings. Simple Explanation of the Diagram

[0006] According to industry standard practice, some features may not be drawn to scale. In order to describe them clearly, the dimensions of different features may be increased or decreased. Figures 1 to 7 are schematic diagrams showing the circuit board structure at various stages of the manufacturing process according to some embodiments of the present disclosure. Figure 8 is a side view of a circuit board structure according to some other embodiments of the present disclosure. Implementation

[0007] The following description provides many different embodiments for implementing various forms of some embodiments of this disclosure. The specific elements and arrangements described below are merely for the simple and clear description of some embodiments of this disclosure. Similar and / or corresponding element symbols may be used to identify similar and / or corresponding elements in different embodiments, and do not represent any relationship between the different embodiments and / or structures discussed.

[0008] The ordinal numbers used in the specification and claims, such as "first" and "second," to modify elements are not intended to imply any prior ordinal number for that element (or those elements), nor to indicate the order of one element with another, or the order of manufacturing processes. These ordinal numbers are used solely to clearly distinguish one named element from another with the same name. The claims and specification may not use the same terminology; for example, the first element in the specification may be the second element in the claims.

[0009] In some embodiments disclosed herein, terms such as "connect," "interconnect," and "bond," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, these terms may include situations where both structures are movable or both are fixed. Additionally, the terms "electrical connection" or "electrical coupling" include any direct or indirect electrical connection means.

[0010] In this text, the terms "approximately," "about," and "substantially" typically indicate a range within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. The given quantity is an approximate quantity; that is, even without specific mention of "approximately," "about," or "substantially," the meaning of "approximately," "about," or "substantially" is implied. The phrase "the range is between the first value and the second value" indicates that the range includes the first value, the second value, and other values ​​in between. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value equals the second value, it implies that there may be an error between the first and second values ​​within approximately 10%, 5%, 3%, 2%, 1%, or 0.5%. If the first direction is perpendicular to the second direction, the angle between the first and second directions can be between 80 and 100 degrees. If the first direction is parallel to the second direction, the angle between the first and second directions can be between 0 and 10 degrees.

[0011] Circuit boards with embedded electronic components are gradually replacing those using traditional wire bonding and package-on-package (PoP) architectures due to their thinner profile. However, this has created new problems. For example, when filling vias of a substrate containing electronic components with filler materials such as resin or ink, the presence of gas in the vias and the adhesive used to secure the components can hinder gas removal. Consequently, gas can remain near the surface of the filler material close to the adhesive, requiring refilling to improve surface smoothness. Furthermore, even after the filler material has cured to form a filler layer, gas may remain within it. If this gas cannot be effectively reduced or eliminated, it can damage the circuit board structure and cause failure during subsequent processes (such as forming add-on structures or reliability testing).

[0012] To address this, this disclosure provides a circuit board structure and its manufacturing method, wherein the adhesive material used to fix electronic components is processed to form vent holes. This configuration improves the problem of venting being affected by the adhesive material, reducing gas generation or residue and thus achieving excellent filling properties. Furthermore, the process of refilling areas with residual gas, as described above, can be omitted, thereby reducing the number of processing steps and manufacturing costs. In addition, in some embodiments of this disclosure, the filler layer has recesses, and a first dielectric layer fills these recesses, thereby improving the adhesion between the filler layer and the first dielectric layer.

[0013] Referring to Figure 1, a substrate 100 is provided. The material of the substrate 100 may include bismaleimide triazine resin, paper phenolic resin, composite epoxy resin, polyimide (PI) resin, glass, glass fiber, other suitable insulating materials, or combinations thereof, but this disclosure is not limited thereto. For example, the substrate 100 may include a prepreg, which is a material obtained by impregnating resin with insulating paper, glass fiber, or other fibrous materials.

[0014] In some embodiments, a metal layer 110 is disposed on a substrate 100. For example, the metal layer 110 may completely cover the upper or lower surface of the substrate 100, or partially cover the upper or lower surface of the substrate 100 (e.g., as shown in FIG. 8). In other embodiments not shown, the metal layer 110 may also cover the sidewalls 102 of the substrate 100. In some embodiments, the metal layer 110 may be prepared using conventional electroplating, lamination, and coating processes, followed by an image transfer process, i.e., through the steps of applying photoresist, exposure, developing, etching, and stripping, to form the metal layer 110 on the substrate 100. In some embodiments, the material of the metal layer 110 may include copper (Cu), aluminum (Al), alloys thereof, or compounds thereof, and other suitable metallic materials or combinations thereof, but this disclosure is not limited thereto. For example, the metal layer 110 may include copper foil, such as brass, phosphor bronze, beryllium alloy, or oxygen-free copper.

[0015] In some embodiments, one or more vias 120 (or via structures 120) are formed on the substrate 100. The purpose of forming the vias 120 is to establish conductive paths on both the upper and lower surfaces of the substrate 100 to facilitate subsequent double-sided layering. In some embodiments, vias can be formed by drilling or etching processes, and the vias can be filled with a filler to form the vias 120, but this disclosure is not limited thereto. For example, drilling processes may include laser drilling, mechanical drilling, other suitable drilling processes, or combinations thereof. Alternatively, etching processes may include dry etching (e.g., reactive-ion etching (RIE)), wet etching, or other suitable etching methods, or combinations thereof. In some embodiments, fillers can be provided by plating processes. For example, plating processes may include electroplating, electroless plating, other suitable plating processes, or combinations thereof. In other embodiments, the method of applying the filler may also include a lamination process, a dip coating process, a roller coating process, a curtain coating process, a spray coating process, a printing process, a combination thereof, or other suitable processes. In some embodiments, the filler may include a conductive paste, aluminum, copper, alloys thereof, or compounds thereof. In other embodiments, the filler may also include metals, polymers, ceramics, or Ajinomoto build-up film (ABF). In some embodiments, the material of the filler may be similar to or the same as the material of the metal layer 110, but this disclosure is not limited thereto.

[0016] Referring to FIG1, a via 130 is formed in the substrate 100. The via 130 extends from the front side 104 to the back side 106 of the substrate 100 to expose the sidewalls 102 of the substrate 100 and the sidewalls 112 of the metal layer 110. The purpose of forming the via 130 is to embed the subsequently formed electronic component 300 (see FIG3) therein, thereby significantly reducing the overall package size. The size of the via 130 depends on the size of the electronic component 300 in the actual application. Generally, the size of the via 130 is usually slightly larger than the electronic component 300 to allow the electronic component 300 to be easily fixed and aligned. In some embodiments, the via 130 can be formed by a drilling process or an etching process, but this disclosure is not limited thereto.

[0017] In some embodiments, after the through hole 130 is formed, the metal layer 110 may be subjected to a surface treatment process as needed, which can improve the surface roughness of the metal layer 110, thereby improving the adhesion between the subsequent adhesive 200 (see FIG2) and the metal layer 110.

[0018] Referring to Figure 2, the substrate 100 is attached to the adhesive material 200. In some embodiments, the substrate 100 is attached to the adhesive surface 202 of the adhesive material 200 with its front side 104 facing the adhesive surface 200. In other embodiments, the substrate 100 may also be attached to the adhesive material 200 with its back side 106 facing the adhesive surface 202. The material of the adhesive material 200 can be any material that has adhesive properties and can be used to fix the subsequently placed electronic components 300, and the adhesive material 200 may include single-sided tape, polyimide (PI), polybenzoxazole (PBO), epoxy resin, other suitable materials, or combinations thereof. In this embodiment, the adhesive material 200 may be single-sided tape.

[0019] Referring again to Figure 2, the adhesive 200 is processed 210 to form one or more vent holes 220. The purpose of forming the vent holes 220 is to allow gas to escape during the subsequent formation of the filler material, thereby reducing gas generation or residue and facilitating subsequent processes. In some embodiments, the processing 210 may process region 206 of the adhesive 200 in a top-to-bottom direction (e.g., the -Z direction) to form the vent holes 220 in region 206. The aforementioned direction may be substantially perpendicular to the extension direction of the adhesive 200 (e.g., the X direction). Region 206 of the adhesive 200 may be the region corresponding to the through-hole 130 of the substrate 100, i.e., the region where the electronic component 300 will be subsequently fixed. In some embodiments, the processing 210 may be, for example, a drilling process or an etching process.

[0020] In some embodiments, in a cross-sectional view, the vent 220 has, for example, a circular shape, a square shape, or a geometrically irregular shape. In one embodiment, the cross-sectional profile of the vent 220 may have an inverted conical shape. For example, as shown in FIG2, the vent 220 may have an inverted conical shape in which the width gradually narrows from the non-adhesive surface 204 of the self-adhesive material 200 toward the adhesive surface 202. In other embodiments, the vent 220 may have a conical shape. For example, the vent 220 may have a conical shape in which the width gradually widens from the non-adhesive surface 204 of the self-adhesive material 200 toward the adhesive surface 202.

[0021] In some embodiments, the end of the vent 220 has an open protrusion structure 220p. For example, the protrusion structure 220p may protrude toward the through hole 130 from the adhesive surface 202 of the adhesive material 200. In some embodiments, the processing 210 may be laser drilling. For example, laser light may be directed toward the non-adhesive surface 204 from the region 206 of the adhesive material 200 to penetrate the adhesive surface 202 to the through hole 130 at the predetermined location where the vent 220 is formed, thereby causing a portion of the adhesive material 200 to protrude toward the through hole 130 and remain on the adhesive surface 202. In this way, the formed vent 220 penetrates from the non-adhesive surface 204 of the adhesive material 200 to the adhesive surface 202 and has an inverted conical cross-sectional profile. In other words, by laser drilling, the vent 220 can be made into an inverted cone shape, which helps to prevent the filling material from flowing out of the vent 220 during subsequent formation. Additionally, the portion of adhesive material 200 remaining on the adhesive surface 202 can form a protrusion structure 220p at the end of the vent 220. In other words, the protrusion structure 220p can be formed by the portion of adhesive material 200 originally located in the vent 220 protruding towards the through hole 130 from the adhesive surface 202. In some embodiments, the height of the protrusion structure 220p can be substantially the same as the thickness T1 of the adhesive material 200 (e.g., the distance from the non-adhesive surface 204 to the adhesive surface 202). In some embodiments, the height of the protrusion structure 220p is, for example, 1% to 100% of the thickness T1 of the adhesive material 200.

[0022] Referring to Figures 2 and 3, a flipping step is performed on the substrate 100 and the adhesive material 200 thereon, so that the back side 106 of the substrate 100 faces upward and the front side 104 faces downward. Then, an electronic component 300 is placed in the through-hole 130 of the substrate 100 and fixed by the adhesive material 200. For example, there may be a contact surface 208 between the adhesive material 200 and the electronic component 300. In other words, the electronic component 300 can be fixed to the adhesive material 200 via the contact surface 208. In some embodiments, the electronic component 300 may be disposed by a pick-and-place process, a transfer process, other suitable processes, or a combination thereof, but this disclosure is not limited thereto. In some embodiments, the electronic component 300 may include passive and active components. As shown in Figure 3, the electronic component 300 is, for example, a capacitor, and may have a first electrode 310 and a second electrode 320 disposed opposite to each other. For example, the first electrode 310 and the second electrode 320 may extend along opposite sidewalls of the electronic component 300 and extend to and partially cover the upper and / or lower surfaces of the electronic component 300. In some embodiments, the end 312 of the first electrode 310 and the end 322 of the second electrode 320 may expose a portion of the surface of the electronic component 300 and may contact the adhesive 200 via the contact surface 208, respectively.

[0023] In some embodiments, the width W1 (or length) of the electronic component 300 (e.g., including the first electrode 310 and the second electrode 320) may be smaller than the width W2 (or length) of the through hole 130 to avoid friction or interference with the substrate 100 during the installation process, but this disclosure is not limited thereto. In some embodiments, the height H3 (or thickness) of the electronic component 300 may be less than, equal to, or greater than the height H4 (or thickness) of the through hole 130, but this disclosure is not limited thereto.

[0024] In some embodiments, the vent 220 may include adjacent first vent 222 and second vent 224. As shown in Figures 2 and 3, the first vent 222 is located between the sidewall 132 of the through hole 130 and the sidewall 302 of the electronic component 300, and the second vent 224 corresponds to the electronic component 300. In some embodiments, two or more first vents 222 are arranged symmetrically or asymmetrically on both sides of the electronic component 300. In some embodiments, the second vent 224 is located, for example, below the electronic component 300 and / or between the first electrode 310 and the second electrode 320. For example, the second vent 224 may be located between the end 312 of the first electrode 310 and the end 322 of the second electrode 320, i.e., corresponding to a portion of the exposed surface of the electronic component 300.

[0025] In some embodiments, the first vent 222 and the second vent 224 have open protrusion structures 222p and 224p, respectively, at their ends. For example, the protrusion structure 222p of the first vent 222 protrudes into the space between the sidewall 132 of the through hole 130 and the sidewall 302 of the electronic component 300, and the protrusion structure 224p of the second vent 224 protrudes into the space between the end portion 312 and the end portion 322. In some embodiments, the height H1 of the protrusion structure 222p is, for example, greater than the height H2 of the protrusion structure 224p, but this disclosure is not limited thereto. In other embodiments, the height H1 of the protrusion structure 222p may be less than or equal to the height H2 of the protrusion structure 224p.

[0026] It is worth noting that although only two first vent holes 222 and one second vent hole 224 are shown in Figure 3, this disclosure is not limited to this. In fact, any number of vent holes 220 can be provided in the region 206 of the adhesive material 200 according to design requirements. In one example, more than two second vent holes 224 can be provided. Alternatively or additionally, different numbers of first vent holes 222 can be provided on both sides of the electronic component 300. In another example, no second vent holes 224 can be provided, and only one first vent hole 222 can be provided.

[0027] Referring to Figure 4, a filler material 400 is formed on the substrate 100, adhesive 200, and electronic component 300 to fill the through-hole 130. For example, during the formation of the filler material 400, the gas contained in the through-hole 130 and / or the filler material 400, or the gas generated during the filling process, can be discharged through the vent holes 220 of the adhesive 200, thereby reducing or even eliminating the amount of gas contained in the filled filler material 400 and preventing gas accumulation or residue on the lower surface of the filler material 400 (e.g., near the surface of the adhesive 200). In some embodiments, the filler material 400 also fills the space below the electronic component 300, between end 312 and end 322. In some embodiments, the filler material 400 can be applied by a lamination process, dip coating process, roller coating process, curtain coating process, spray coating process, printing process, a combination thereof, or other suitable processes, but this disclosure is not limited thereto. In some embodiments, the filler material 400 may include ink, epoxy resin, polyimide (PI), laminated film material (ABF), prepreg, other suitable polymeric materials, or combinations thereof, but this disclosure is not limited thereto.

[0028] In some embodiments, the filling material 400 may form one or more recesses 410 at corresponding locations on the vent 220. For example, the mechanism for forming the recesses 410 is presumably as follows: the filling material 400 may be compressed by the protruding structure 220p of the vent 220, forming recesses 410 on the lower surface of the filling material 400, and the filling material 400 does not easily flow out of the vent 220 (especially when the vent 220 is inverted conical). In some embodiments, the filling material 400 may form a first recess 412 at a corresponding location on the first vent 222 and a second recess 414 at a corresponding location on the second vent 224. For example, the first recess 412 is located between the sidewall 132 of the through hole 130 and the sidewall 302 of the electronic component 300, and the second recess 414 corresponds to the electronic component 300. In other words, in one example, the projection range of the first recess 412 does not overlap with the projection range of the electronic component 300, while the projection range of the second recess 414 overlaps with the projection range of the electronic component 300.

[0029] In some embodiments, in a cross-sectional view, the recess 410 may have a circular, square, or geometrically irregular shape, for example. In some embodiments, the shape of the recess 410 may correspond to the shape of the vent 220. For example, the shape of the first recess 412 may correspond to the shape of the first vent 222, and may have a tapered shape in which the adhesive surface 202 of the self-adhesive 200 gradually narrows in width toward the through hole 130. In some embodiments, the shape of the second recess 414 may correspond to the shape of the space between the lower end 312 and the end 322 of the electronic component 300. For example, as shown in FIG4, the second recess 414 may have a square shape. In other embodiments, the shape of the second recess 414 may correspond to the shape of the second vent 224, for example, being tapered. In some embodiments, the depth of the recess 410 may be substantially the same as the height of the protrusion structure 220p. In some embodiments, the depth of the recess 410 may be, for example, 1% to 100% of the thickness T1 of the adhesive 200. In some embodiments, the depth D1 of the first recess 412 is, for example, greater than the depth D2 of the second recess 414, but this disclosure is not limited thereto. In other embodiments, the depth D1 of the first recess 412 may be less than or equal to the depth D2 of the second recess 414.

[0030] Referring to Figures 5 and 6, the adhesive 200 is removed. Next, the filler material 400 is planarized 500 to form a filler layer 402. Then, the substrate 100 and the electronic components 300 embedded therein are flipped so that the front side 104 of the substrate 100 faces upward and the back side 106 faces downward. In some embodiments, the adhesive 200 can be removed by a stripping process or an etching process, but this disclosure is not limited thereto. In some embodiments, the planarization process 500 is, for example, a chemical mechanical polishing (CMP) process, brush wheel, belt abrasive mechanical polishing, plasma etching, etc.

[0031] Referring to Figure 6, after removing the adhesive 200, the first surface 404 of the filler layer 402 is exposed. After planarization 500, a second surface 406 of the filler layer 402 is formed relative to the first surface 404. In some embodiments, as shown in Figure 6, the second surface 406 of the filler layer 402 is a flat surface. For example, the second surface 406 of the filler layer 402 may be substantially parallel to the back surface 106 of the substrate 100. In some embodiments, the second surface 406 of the filler layer 402 may be flush with the bottom surface of the metal layer 110 and the bottom surface of the via 120, but this disclosure is not limited thereto.

[0032] As shown in FIG6, the filler layer 402 fills the through-hole 130 and covers the electronic component 300. In some embodiments, the adhesive 200 is attached to the front side 104 of the substrate 100 and fixes the electronic component 300. After the adhesive 200 is removed, the portion of the electronic component 300 that contacts the adhesive 200 via the contact surface 208 is exposed, such as the ends 312 and 322. In this way, the electronic component 300 is disposed in the filler layer 402, for example, close to the front side 104 of the substrate 100, and the first surface 404 of the filler layer 402 can expose the electronic component 300. In some embodiments, the filler layer 402 has one or more recesses 410 corresponding to the vent holes 220. For example, the first surface 404 of the filler layer 402 has adjacent first recesses 412 and / or second recesses 414. In some embodiments, the second recesses 414 may be located above the electronic component 300, for example, between the first electrode 310 and the second electrode 320.

[0033] Referring to Figure 7, a first dielectric layer 700 is formed on the first surface 404 of the filler layer 402, and a second dielectric layer 710 is formed on the second surface 406 of the filler layer 402. In some embodiments, the first dielectric layer 700 fills the recesses 410, for example, filling the first recess 412 and the second recess 414. This can improve the adhesion between the filler layer 402 and the first dielectric layer 700. In some embodiments, the first dielectric layer 700 and / or the second dielectric layer 710 can be formed by lamination, dip coating, roller coating, curtain coating, spray coating, printing, combinations thereof, or other suitable processes, but this disclosure is not limited thereto. In some embodiments, the first dielectric layer 700 and / or the second dielectric layer 710 may include paper phenolic resin, composite epoxy resin, polyimide resin, resin polymer, laminated film material (ABF), polyphenylene ether (PPE), polypropylene (PP), or other suitable insulating materials or combinations thereof.

[0034] In some embodiments, a blind hole 720 is disposed in the first dielectric layer 700 and / or the second dielectric layer 710 and is electrically connected to the metal layer 110. The blind hole 720 may be made of the same or similar conductive material as the aforementioned metal layer 110 or via 120, which will not be described again here.

[0035] In some embodiments, a bonding pad 730 is disposed on and electrically connected to the via 720. At this point, the fabrication of the circuit board structure 10 is substantially complete. In some embodiments, the bonding pad 730 may be a conductive material that is the same as or similar to the aforementioned metal layer 110 or via 120, which will not be described again here. The via 720 and the bonding pad 730 can be formed using processes known in the art to form the circuit board structure. For the sake of brevity, the formation process of each of the above components will not be described in detail here.

[0036] In the embodiment illustrated in FIG7, the first dielectric layer 700, the second dielectric layer 710, the blind via 720, and the solder pad layer 730 above the front side 104 and back side 106 of the substrate 100 can be considered as an add-on structure. Although FIG7 only shows one add-on structure on the front side 104 and back side 106 of the substrate 100, this disclosure is not limited thereto. In fact, an add-on structure with any number of layers can be provided according to design requirements.

[0037] Figure 8 is a side view of a circuit board structure 20 according to some other embodiments of the present disclosure. It should be noted that the same or similar processes or components as in the foregoing embodiments will use the same component symbols, and their details will not be repeated. In some embodiments, the circuit board structure 20 of Figure 8 is similar to the circuit board structure 10 of Figure 7, except that the circuit board structure 20 further includes a third recess 800 disposed on the second surface 406 of the filling layer 402, and the second dielectric layer 710 fills the third recess 800. In some embodiments, the third recess 800 may correspond to the first recess 412 and / or the second recess 414. Additionally or alternatively, the third recess 800 may be located between the first recess 412 and the second recess 414. It is worth noting that although five third recesses 800 are shown in Figure 8, the present disclosure is not limited thereto. In fact, any number of third recesses 800 can be provided according to design requirements. In some embodiments, the size of the third recess 800 (e.g., the opening size) may be smaller than, equal to or larger than the size of the first recess 412 and / or the second recess 414 (e.g., the opening size), but this disclosure is not limited thereto.

[0038] In some embodiments, the process step of forming the third recess 800 is, for example, followed by the process step of FIG5 or FIG6. The process steps of FIG1 to FIG6 can be referred to above, and will not be repeated here for the sake of brevity.

[0039] In some embodiments, after forming the fill layer 402, the second surface 406 of the fill layer 402 may be further processed. In some embodiments, this processing may be the same as or similar to the processing 210 shown in FIG. 2. For example, the second surface 406 of the fill layer 402 may be laser-drilled or etched to form a third recess 800. Then, a build-up structure is formed following, for example, the process steps of FIG. 7, to form the circuit board structure 20. In some embodiments, a second dielectric layer 710 is formed on the fill layer 402 and fills the third recess 800. This can improve the adhesion between the fill layer 402 and the second dielectric layer 710.

[0040] In summary, this disclosure provides a circuit board structure and its manufacturing method. The circuit board structure has recesses disposed on the surface of a filler layer, and the dielectric layer fills these recesses, thereby improving the adhesion between the filler layer and the dielectric layer. Furthermore, the circuit board structure manufacturing method provided by this disclosure reduces gas generation or residue by forming vent holes in the adhesive material, thereby improving fillability and reducing process steps and manufacturing costs. Therefore, the circuit board structure and its manufacturing method disclosed in this disclosure effectively solve some problems of the prior art.

[0041] The above outlines several embodiments to enable those skilled in the art to better understand the viewpoints of the disclosed embodiments. Those skilled in the art should understand that other processes and structures can be designed or modified based on the disclosed embodiments to achieve the same purpose and / or advantages as the embodiments described herein. Those skilled in the art should also understand that such equivalent processes and structures do not depart from the spirit and scope of this disclosure, and that various changes, substitutions, and replacements can be made without departing from the spirit and scope of this disclosure.

[0042] 10,20: Circuit board structure 100:Substrate 102: Sidewall 104: Front 106: Back 110: Metal layer 112: Sidewall 120: Guide hole / Guide hole structure 130: Through hole 132,302: Sidewall 200: Adhesive Material 202: Sticky dough 204: Non-adhesive surface 206: Area 208: Contact surface 210: Processing 220: Air vent 220p, 222p, 224p: Protruding structure 222: First air guide hole 224: Second air guide hole 300: Electronic Components 310: First electrode 312,322: End 320: Second electrode 400: Filler material 402: Filler layer 404: First Surface 406: Second Surface 410: Hole 412: First dent 414: Second recess 500: Flattening process 700: First dielectric layer 710: Second dielectric layer 720: Guide hole 730: Weld pad layer 800: Third recess D1, D2: Depth H1, H2, H3, H4: Height T1: Thickness W1, W2: Width X, Z: Direction

Claims

1. A circuit board structure, comprising: A substrate having a through hole; an electronic component embedded in the through hole; a filling layer filling the through hole and covering the electronic component, wherein the surface of the filling layer has one or more recesses; and a first dielectric layer disposed on the filling layer and filling the recesses.

2. The circuit board structure as described in claim 1, wherein the recess is located between the sidewall of the through hole and the sidewall of the electronic component.

3. The circuit board structure as claimed in claim 1, wherein the electronic component has a first electrode and a second electrode disposed opposite to each other, and the recess is located between the first electrode and the second electrode.

4. The circuit board structure as described in claim 1, wherein the through-hole extends from a front side of the substrate to a back side, the electronic component is disposed in the filler layer near the front side, the filler layer includes a first surface exposing the electronic component, and the first surface has an adjacent first recess and a second recess, wherein... The projection range of the first recess does not overlap with the projection range of the electronic component, while the projection range of the second recess overlaps with the projection range of the electronic component.

5. The circuit board structure as claimed in claim 4, wherein the filler layer further includes a second surface opposite to the first surface, and the second surface has a third recess, and the circuit board structure further includes a second dielectric layer disposed on the second surface of the filler layer and filling the third recess.

6. The circuit board structure as described in claim 5, wherein the third recess is disposed on the second surface corresponding to the first recess and / or the second recess.

7. A method for manufacturing a circuit board structure, comprising: A substrate is provided having a through-hole; the substrate is attached to an adhesive; the adhesive is processed to form one or more vent holes; an electronic component is placed in the through-hole, and the adhesive fixes the electronic component; a filling layer is formed in the through-hole and covers the electronic component, wherein the filling layer has one or more recesses corresponding to the vent holes; the adhesive is removed; and a first dielectric layer is formed on the filling layer and fills the recesses.

8. A method for manufacturing a circuit board structure as described in claim 7, wherein the processing is laser drilling, the vent hole has an inverted conical shape, and the end of the vent hole has an open protrusion structure.

9. A method of manufacturing a circuit board structure as described in claim 8, wherein the protruding structure protrudes toward the through hole from the adhesive surface of the adhesive material.

10. A method of manufacturing a circuit board structure as claimed in claim 7, wherein the vent is formed in a region of the adhesive material corresponding to the through hole.

11. A method of manufacturing a circuit board structure as claimed in claim 10, wherein the vent hole includes a first vent hole, wherein the first vent hole is located between the sidewall of the through hole and the sidewall of the electronic component.

12. A method for manufacturing a circuit board structure as described in claim 11, wherein forming the filler layer comprises: A blanket is used to form a filling material on the substrate, the adhesive, and the electronic component to fill the through hole, wherein the filling material forms a first recess at the corresponding location of the first vent hole; and the filling material is planarized to form the filling layer.

13. A method of manufacturing a circuit board structure as claimed in claim 12, wherein the vent further includes a second vent adjacent to the first vent, wherein the second vent corresponds to the electronic component, and when the filling material is formed, the filling material further forms a second recess at the corresponding location on the second vent.

14. A method of manufacturing a circuit board structure as claimed in claim 12, wherein the filler layer has a first surface on which the first recess is formed, and the manufacturing method further includes: A third recess is formed on a second surface of the filling layer, opposite to the first surface, by means of laser drilling or etching processes; And a second dielectric layer is formed on the filler layer and fills the third cavity.

15. A method for manufacturing a circuit board structure as described in claim 7, wherein the depth of the recess is 1% to 100% of the thickness of the adhesive material.

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