Semiconductor process apparatus, methods for operating the same, and semiconductor process system

TWI941077BActive Publication Date: 2026-10-01ADVANCED SEMICON ENG INC
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Patent Information

Application Number
TW114106265
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Filing Date
2025-02-20
Publication Date
2026-10-01
Estimated Expiration
2045-02-19

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Abstract

This invention provides a semiconductor manufacturing apparatus. The apparatus includes a cavity, a stage for carrying a workpiece to be processed, and a lifting device. The stage is disposed below the cavity. The lifting device is connected to the stage and configured to adjust the height of the stage, thereby engaging the stage with the cavity.
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Claims

1. A semiconductor manufacturing apparatus, comprising: One cavity; A platform for carrying a workpiece to be processed is disposed below the cavity; and a lifting device is connected to the platform and configured to adjust the height of the platform so that the platform is engaged with the cavity, wherein the platform includes a groove and a leak-proof ring disposed in the groove, wherein the groove corresponds to a portion of the cavity so that the platform and the cavity are tightly fitted.

2. The semiconductor process apparatus of claim 1, wherein the lifting device comprises: one or more support rods; a lifting plate connected to the stage via the one or more support rods; and a drive element connected to the lifting plate and configured to adjust the height of the lifting plate, thereby adjusting the height of the stage accordingly.

3. The semiconductor manufacturing apparatus of claim 2, wherein each of the one or more support rods is connected to one edge of the lifting plate.

4. The semiconductor manufacturing apparatus of claim 3, wherein each of the one or more support rods is connected to one corner of the lifting plate.

5. The semiconductor manufacturing apparatus of claim 2, wherein the lifting device further includes a base plate disposed below the lifting plate, wherein the drive element is vertically disposed between the base plate and the lifting plate.

6. The semiconductor manufacturing apparatus of claim 2, wherein the driving element comprises an electric cylinder or a pneumatic cylinder.

7. The semiconductor process apparatus of claim 1, wherein the stage includes at least one pair of positioning structures, and the cavity includes at least one pair of positioning structures corresponding to the at least one pair of positioning structures of the stage, such that the stage and the cavity are accurately coupled.

8. The semiconductor process apparatus of claim 1, further comprising at least partially disposed within the cavity a microwave source configured to generate plasma.

9. The semiconductor manufacturing apparatus of claim 8, wherein the microwave source includes a water-cooled magnetron.

10. The semiconductor process apparatus of claim 1, further comprising a vacuum pump connected to the stage via a conduit, wherein the conduit includes a telescopic tube configured to extend or retract accordingly based on the height of the stage.

11. The semiconductor process apparatus of claim 10, wherein the vacuum pump is configured to evacuate the cavity until a vacuum state is achieved when the stage and the cavity are in contact.

12. A method for operating a semiconductor manufacturing apparatus, comprising: Provide a lifting device to support one of the platforms; The height of the platform is adjusted by the lifting device, so that the platform moves relative to a microwave source placed in a cavity until the platform is in close contact with the cavity; a vacuum pump is used to evacuate the cavity to regulate the air pressure inside the cavity; and the microwave source is driven to generate plasma.

13. The method of claim 12, wherein the stage is used to support a carrier on which one or more workpieces to be processed are placed.

14. The method of claim 12, wherein the lifting device includes a drive element configured to adjust the height of the platform.

15. The method of claim 12, wherein the stage includes at least one leak-proof ring corresponding to a portion of the cavity, such that the stage and the cavity are tightly fitted together.

16. The method of claim 12, wherein the stage includes at least one pair of alignment structures, and wherein the cavity includes at least one pair of alignment structures corresponding to the at least one pair of alignment structures of the stage, such that the stage and the cavity are accurately coupled.

17. The method of claim 12, wherein the microwave source includes a water-cooled magnetron.

18. The method of claim 12, further comprising a telescopic tube connecting the vacuum pump to the stage, wherein the telescopic tube is configured to extend and retract accordingly based on the height of the stage.

19. A semiconductor manufacturing system, comprising: Semiconductor process equipment such as any of claims 1-11; and a tray for carrying the workpiece to be processed, wherein the tray carrying the workpiece to be processed is loaded onto the platform of the semiconductor process equipment by a transport mechanism or a robot.

Citation Information

Patent Citations

  • In-situ hydroxylation apparatus

    TW201820456A

  • Semiconductor processing chamber with dual-lift mechanism for edge ring elevation management

    US20220415702A1