Probe module, test system and test method

Abstract

This invention provides a testing system and a testing method applicable to the system. The testing system includes testing instruments and a probe module. The probe module includes a housing structure, a coaxial connector, a plate structure, a first telescopic probe, and a second telescopic probe. The plate structure includes a mounting portion disposed within the housing structure and an exposed portion exposed outside the housing structure. The first telescopic probe includes a first probe support portion and a first probe movable portion, the first probe support portion being disposed in the exposed portion and electrically connected to a first circuit of the plate structure. The second telescopic probe includes a second probe support portion and a second probe movable portion, the second probe support portion being disposed in the exposed portion and electrically connected to a second circuit of the plate structure. The aspect ratio of the exposed portion of the plate structure is greater than 5 times.

Description

[Technical Field]

[0001] This invention relates to a probe module, a testing system and a testing method, and particularly to a probe module with a coaxial connector, a testing system using the probe module and a testing method using the probe module. [Previous Technology]

[0002] In the prior art, flying probes are typically used for testing circuit boards. However, the emergence of new electronic applications, such as smartwatches, wireless smart headphones, augmented reality (AR), virtual reality (VR), and automotive devices, has increased the demand for high-end circuit boards. In addition, with the expanding application of 5G and artificial intelligence technologies, the demand for high-frequency testing (e.g., 10 GHz or above) of circuit boards is also gradually increasing.

[0003] When performing high-frequency testing on circuit boards containing electronic components, flying probes cannot meet the requirements of high-frequency testing. Therefore, circuit board suppliers provide a wiring area on the circuit board for setting up a test slot, which is then used in conjunction with a high-frequency ribbon cable for high-frequency testing. However, the circuit layout space on the circuit board is limited. Faced with the increasing processing volume and rapid response requirements of various technologies, the circuit board cannot free up extra space to set up the test slot.

[0004] Therefore, a solution for high-frequency testing of circuit boards is an urgent issue that needs to be addressed. [Summary of the Invention]

[0005] One of the objectives of this invention is to provide a probe module. In view of the above-mentioned issues, the main objective of this invention is to provide a probe module for high-frequency testing of circuit boards.

[0006] To achieve the above objectives, the present invention provides a probe module, comprising: a housing structure, a coaxial connector, a plate structure, a first telescopic probe, and a second telescopic probe. The coaxial connector is disposed on the housing structure. The plate structure includes a mounting portion disposed within the housing structure and an exposed portion exposed outside the housing structure. The first telescopic probe includes a first probe support portion and a first probe movable portion movably disposed within the first probe movable portion. The first probe support portion is disposed on the exposed portion and electrically connected to a first circuit disposed on the plate structure. The first probe movable portion has a first electrical contact end protruding from the exposed portion. The second telescopic probe includes a second probe support portion and a second probe movable portion movably disposed within the second probe movable portion. The second probe support portion is disposed on the exposed portion and electrically connected to a second circuit disposed on the plate structure. The second probe movable portion has a second electrical contact end protruding from the exposed portion. The aspect ratio of the exposed portion of the plate structure is greater than 5 times. Furthermore, another technical solution adopted by the present invention is to provide a testing system, which includes: a testing instrument and a probe module. The testing instrument is configured to generate a test signal. The probe module is electrically coupled to the testing instrument for testing a circuit board. In addition, yet another technical solution adopted by the present invention is to provide a testing method, which includes: providing a circuit board; and a probe module for testing the circuit board.

[0007] Accordingly, when performing circuit board testing, the probe module of the present invention can be used to test circuit boards with multiple electronic components (or upper components), or to test circuit boards without any electronic components (or bare boards). Since the aspect ratio of the exposed portion of the board structure is greater than 5 times, when the probe module (e.g., a high-frequency probe head) provided by the present invention is applied to test an "upper component board," the probe module can perform high-frequency testing on the circuit board by using the mounted first telescopic probe and second telescopic probe (e.g., a spring probe) without avoiding electronic components (or without interfering with electronic components). It is worth noting that the present invention can absorb the deformation (warpage) caused by poor flatness (or smoothness) of the circuit board through the use of the first telescopic probe and the second telescopic probe, and can also reduce the mismatch area of ​​the circuit board during high-frequency testing.

[0008] In one feasible embodiment, the probe module provided by the present invention further includes an anti-warping component, and the exposed portion of the board structure is disposed on the anti-warping component. When the exposed portion of the board structure maintains a certain degree of warpage, if the aspect ratio of the exposed portion is greater than 5 times, the warpage of the exposed portion from one end of the connecting mounting portion to the other end (or free end) will be significant. In other words, when the exposed portion of the probe module's board structure is placed horizontally, there will be a height offset from the free end of the exposed portion to the horizontal plane. The aforementioned offset will cause the first telescopic probe and the second telescopic probe to be easily bent and damaged during high-frequency testing of the circuit board, and will be unable to accurately align with the conductive contacts on the circuit board. However, the present invention can reduce the warpage of the exposed portion of the board structure by "disposing the exposed portion of the board structure on the anti-warping component," thereby reducing the aforementioned offset and solving the above-mentioned problems.

[0009] In one feasible embodiment, the rigidity of the structural assembly formed by the combination of the exposed portion of the board structure and the anti-warping component is greater than the rigidity of the exposed portion. The warpage provided by the combination of the exposed portion of the board structure and the anti-warping component is 0.01% to 0.3%, and the materials of the exposed portion of the board structure and the anti-warping component are different. That is, the rigidity of the anti-warping component and the exposed portion is achieved through the "selection of materials for both". For example, the material rigidity of the anti-warping component can be selected to be greater than that of the exposed portion, thereby providing stable support for the exposed portion and preventing warping. This will solve the problem that "the first telescopic probe and the second telescopic probe are easily bent and damaged when performing high-frequency testing on the circuit board under test and cannot be accurately aligned with the conductive contacts".

[0010] In one feasible embodiment, the exposed portion of the plate structure is mounted on the anti-warping member via an adhesive material. If the exposed portion is fixed to the anti-warping member in other ways, such as by clamping, it may cause electrical interference to the wiring or telescopic probes mounted on the exposed portion. Furthermore, there is not enough space in the area where the telescopic probes are mounted on the exposed portion for clamping and fixing. Therefore, the present invention utilizes an adhesive material fixing method to securely mount the exposed portion to the anti-warping member without causing electrical interference.

[0011] In one feasible embodiment, the first and second lines are disposed on the first surface of the exposed portion of the plate structure, and the anti-warping component is disposed on the second surface of the exposed portion of the plate structure, wherein the first and second surfaces are two opposite surfaces. Since the lines (first and second lines) are already disposed on the first surface of the exposed portion, if the anti-warping component is disposed on the same surface as the lines, the anti-warping component may cause electrical interference to the lines (or telescopic probes). Therefore, the present invention avoids the anti-warping component causing electrical interference to the lines or probes in the exposed portion by disposing the lines and the anti-warping component on different surfaces of the exposed portion.

[0012] In one feasible embodiment, the outer surface of the anti-warping component has an insulating layer. By providing an insulating layer on the outer surface of the anti-warping component, the present invention enables the anti-warping component to achieve electrical insulation. Specifically, providing an insulating layer on the outer surface of the anti-warping component prevents the probe of the telescopic probe from contacting the circuit board and retracting, thus preventing the anti-warping component from directly contacting the circuit board and causing a short circuit, resulting in erroneous electrical test results.

[0013] In one feasible embodiment, the first electrical contact end of the first probe movable part and the second electrical contact end of the second probe movable part are configured to contact a circuit board on which a plurality of electronic components are disposed, wherein the length of the exposed portion of the board structure is greater than the height defined from the upper surface of the electronic components to the upper surface of the circuit board. That is, the length of the exposed portion must be greater than the height of any electronic component. In this way, when the probe module uses telescopic probes to contact the circuit board for electrical testing, structural interference between the exposed portion and the electronic components due to insufficient length being limited by the height of the electronic components can be avoided.

[0014] In one feasible embodiment, the first electrical contact terminal of the first probe movable part and the second electrical contact terminal of the second probe movable part can be electrically connected to a contact pin disposed in a slot of a circuit board through an intermediate plate. It is worth mentioning that if the first telescopic probe and the second telescopic probe directly contact the contact pin in the slot, the overall electrical test results of the probe module and the circuit board will be unstable. However, the present invention can solve the above-mentioned problem by using the technical means of "the first electrical contact terminal of the first probe movable part and the second electrical contact terminal of the second probe movable part being electrically connected to a contact pin disposed in a slot of a circuit board through an intermediate plate".

[0015] It is worth noting that the present invention further provides a testing method, which includes: testing a circuit board without any electronic components using a probe module; recording the results obtained by the probe module testing the circuit board without any electronic components as first data using a testing instrument; testing a circuit board with electronic components using the probe module; and recording the results obtained by the probe module testing the circuit board with electronic components as second data using a testing instrument. Therefore, since the present invention can use the same probe module to perform electrical testing on both a "circuit board without any electronic components (i.e., a bare board)" and a "circuit board with multiple electronic components (i.e., an upper board)," it can save time in replacing different probe modules, thereby improving the efficiency of electrical testing.

Implementation Method

[0031] The following describes the implementation of the "probe module, test system, and test method" disclosed in this invention through specific embodiments. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. In addition, the accompanying drawings of this invention are only simple schematic illustrations and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. In addition, it should be understood that although terms such as "first," "second," and "third" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another element. In addition, the term "or" used herein may include, depending on the actual situation, any combination of any one or more of the associated listed items.

[0032] [First Embodiment]

[0033] Referring to Figures 1 to 3, the first embodiment of the present invention provides a probe module M. The probe module M may be, for example, a high-frequency probe head, suitable for high-frequency testing of circuit boards. The probe module M includes: a housing structure 1, a coaxial connector 2, a board structure 3, a first telescopic probe 4, a first circuit 5, a second telescopic probe 6, and a second circuit 7.

[0034] A first telescopic probe 4, a first circuit 5, a second telescopic probe 6, and a second circuit 7 are disposed on the plate structure 3. The first circuit 5 is electrically connected to the first telescopic probe 4, and the second circuit 7 is electrically connected to the second telescopic probe 6. The first telescopic probe 4 and the second telescopic probe 6 are adjacent to each other. Specifically, the two ends of the first circuit 5 are electrically connected to the first telescopic probe 4 and one of the coaxial connectors 2, respectively, and the two ends of the second circuit 7 are electrically connected to the second telescopic probe 6 and the other coaxial connector 2, respectively.

[0035] A coaxial connector 2 is disposed on the housing structure 1. The housing 1 includes a first housing 11 and a second housing 12, which are assembled or disassembled with each other. The housing 1 further includes a base 13 that connects to the first housing 11 or the second housing 12, and the base 13 is fixed to a fixture. Figure 3 shows the portion of the plate structure 3 exposed inside the housing structure 1 after the second housing 12 is disassembled. The plate structure 3 includes a mounting portion 31 and an exposed portion 32. The mounting portion 31 is disposed inside the housing structure 1, and the exposed portion 32 is exposed outside the housing structure 1. Preferably, the aspect ratio of the exposed portion 32 (i.e., the ratio of length L to width W) is greater than 5. The plate structure 3 is, for example, a printed circuit board, and the material includes one or more of the following: glass fiber, multilayer ceramic substrate (MLC), multilayer organic substrate (MLO), etc., and the glass fiber is, for example, FR4, FR5, G10, G11, etc.

[0036] The probe module M further includes an anti-warping component 8, a portion of which is connected to the housing structure 1. An exposed portion 32 of the plate structure 3 is disposed on the anti-warping component 8. The material of the plate structure 3 is different from the material of the anti-warping component 8; more specifically, the material of the exposed portion 32 is different from the material of the anti-warping component 8. In this invention, the rigidity of the structural assembly formed by the combination of the exposed portion 32 of the plate structure 3 and the anti-warping component 8 is greater than the rigidity of the exposed portion 32. Furthermore, the thickness H1 of the anti-warping component 8 is greater than the thickness H2 of the exposed portion 32 of the plate structure 3. The anti-warping component 8 is mainly used to improve the warpage of the exposed portion 32 of the structural plate structure 3.

[0037] For example, warpage can be measured using a profile measuring instrument, a three-dimensional measuring instrument, or a 3D shape measuring instrument; this invention is not limited thereto. Referring to Figure 4, the warpage of the exposed portion 32 is equal to (offset L1 / length L) 100%, where offset L1 is also called warpage height. Furthermore, the overall warpage of the structural assembly formed by the combination of the exposed portion 32 of the plate structure 3 and the anti-warpage component 8 is 0.01% to 0.3%.

[0038] Because the probe module M of the present invention is a long probe (the aspect ratio of the exposed portion 32 is greater than 5 times), the offset of the exposed portion 32 of the probe is large. That is to say, while maintaining a certain degree of warpage, the exposed portion 32 of the board structure 3 will warp significantly from one end of the connecting mounting portion 31 to the other end (i.e., the free end 32B in FIG2) due to the aspect ratio of the exposed portion 32 being greater than 5 times. Therefore, during testing, the first telescopic probe 4 and the second telescopic probe 6 may not be able to contact the solder pads of the circuit board. In other words, when the exposed portion 32 of the board structure 3 is placed horizontally (as shown in FIG4), the free end 32B of the exposed portion 32 will have a height offset from the horizontal plane. This offset will cause the first telescopic probe 4 and the second telescopic probe 6 to be easily bent and damaged when performing high-frequency testing on the circuit board, and will not be able to accurately contact the conductive contacts on the circuit board, such as metal pads. Therefore, by configuring the anti-warping component 8, the exposed portion 32 of the plate structure 3 is placed on the anti-warping component 8 to prevent the warping of the anti-warping component 8 from being smaller than that of the exposed portion 32 and the rigidity of the anti-warping component 8 from being greater than that of the exposed portion 32, so as to achieve the effect of the anti-warping component 8 dominating the warping.

[0039] Furthermore, the rigidity of the anti-warping component 8 and the exposed portion 32 is achieved through the "selection of materials for both". For example, the material rigidity of the anti-warping component 8 can be selected to be greater than that of the material rigidity of the exposed portion 32, so that the anti-warping component 8 can provide stable support for the exposed portion 32 and prevent the exposed portion 32 from warping.

[0040] Referring to Figures 5 and 6, the first telescopic probe 4 includes a first probe support portion 41 and a first probe movable portion 42. The first probe movable portion 42 is movably disposed within the first probe support portion 41. Specifically, the first probe movable portion 42 is located at one end of the first probe support portion 41 and can move in and out of the first probe support portion 41. The first probe support portion 41 is disposed on the exposed portion 32 and is electrically connected to the first line 5. The first probe movable portion 42 has a first electrical contact end 421 protruding from the exposed portion 32.

[0041] Similarly, the second telescopic probe 6 includes a second probe support portion 61 and a second probe movable portion 62. The second probe movable portion 62 is movably disposed within the second probe support portion 61. Specifically, the second probe movable portion 62 is located at one end of the second probe support portion 61 and can move in and out of the second probe support portion 61. The second probe support portion 61 is disposed on the exposed portion 32 and is electrically connected to the second line 7. The second probe movable portion 62 has a second electrical contact end 621 protruding from the exposed portion 32. In other words, the first telescopic probe 4 and the second telescopic probe 6 can be, for example, spring probes (pogo pins).

[0042] As shown in Figures 2 and 5, the shell structure 1 has an opening 10. The exposed portion 32 of the plate structure 3 has a connecting end 32A and a free end 32B. The connecting end 32A is connected to the mounting portion 31 through the opening 10. A first probe support portion 41 is provided on a first line 5 located at the free end 32B of the exposed portion 32. A first probe movable portion 42 protrudes from one end of the first probe support portion 41 from the free end 32B of the exposed portion 32. A second probe support portion 61 is provided on a second line 7 located at the free end 32B of the exposed portion 32. A second probe movable portion 62 protrudes from one end of the second probe support portion 61 from the free end 32B of the exposed portion 32.

[0043] Through the use of the first telescopic probe 4 and the second telescopic probe 6, that is, the telescopic structure design in which the first probe movable part 42 can move in and out of the first probe support part 41 and the second probe movable part 62 can move in and out of the second probe support part 61, the probe module M can absorb the deformation (warping) caused by the poor flatness (or smoothness) of the circuit board when performing high-frequency testing of the circuit board.

[0044] The exposed portion 32 of the plate structure 3 includes a first surface 321 and a second surface 322, which are two opposite surfaces. A first line 5 and a second line 7 are disposed on the first surface 321, and an anti-warping component 8 is disposed on the second surface 322. In addition, the plate structure 3 also includes three upper grounding layers 33, 34, and 35 and a lower grounding layer 36. The three upper grounding layers 33, 34, and 35 are disposed on the first surface 321 of the exposed portion 32, and the lower grounding layer 36 is disposed on the second surface 322 of the exposed portion 32. The first line 5 is located between two of the upper grounding layers 33 and 34, and the second line 7 is located between two of the upper grounding layers 34 and 35. The exposed portion 32 of the plate structure 3 further includes a plurality of conductive vias 30 for electrically connecting the upper grounding layers 33, 34, and 35 and the lower grounding layer 36 to achieve a common ground. The first line 5 has an impedance-matched circuit layout with the upper grounding layers 33, 35 and the lower grounding layer 36, and the second line 7 has an impedance-matched circuit layout with the upper grounding layers 33, 34 and the lower grounding layer 36. Therefore, the first probe carrier 41 of the first telescopic probe 4 can achieve impedance matching when it is set on the first line 5, and the first probe carrier 61 of the second telescopic probe 6 can achieve impedance matching when it is set on the second line 7. The first probe movable part 42 and the second probe movable part 62 are areas without impedance matching. This invention utilizes a first telescopic probe 4 and a second telescopic probe 6, specifically a telescopic structure design where the first probe movable part 42 can move in and out of the first probe carrier part 41, and the second probe movable part 62 can move in and out of the second probe carrier part 61. This allows the probe module M to retract into the first probe carrier part 41 and the second probe movable part 62 respectively during high-frequency testing of the circuit board. This shortens the length of the first probe movable part 42 outside the first probe carrier part 41 and the length of the second probe movable part 62 outside the second probe carrier part 61, reducing the area of ​​the probe module M without impedance matching, which is beneficial for high-frequency testing of the circuit board.

[0045] As shown in Figure 5, the plate structure 3 further includes a dielectric layer 37 disposed between the upper ground layers 33, 34, 35 and the lower ground layer 36. The surface of the dielectric layer 37 is provided with a circuit layout (first line 5 and second line 7) for impedance matching. Preferably, the dissipation factor (Df) of the dielectric layer 37 can be less than 0.003. It is worth mentioning that because the aspect ratio of the exposed portion 32 of the plate structure 3 is greater than 5 times, the energy loss of the plate structure 3 increases, leading to a decrease in the test frequency. This invention can improve the situation where the test frequency decreases after the plate structure 3 is lengthened by using the technical means of ensuring that the dissipation factor (Df) of the dielectric layer of the plate structure is less than 0.003.

[0046] Specifically, the coaxial connector 2 includes a center conductor S and an outer conductor G, with the outer conductor G surrounding the outside of the center conductor S. The center conductor S is electrically connected to the first line 5 and the second line 7 located on the first surface 321 of the plate structure 3, and the outer conductor G is electrically connected to the upper grounding layers 33, 34, and 35 located on the first surface 321 of the plate structure 3.

[0047] Referring to Figure 7, the exposed portion 32 of the plate structure 3 is adhered to the anti-warping component 8 through the adhesive material 9. However, the present invention is not limited to the method of fixing the adhesive material 9 to the anti-warping component 8. Furthermore, if the exposed portion 32 is fixed to the anti-warping component 8 in other ways, such as by clamping, it may cause electrical interference to the first circuit 5 and the second circuit 7 provided on the exposed portion 32, or the first telescopic probe 4 and the second telescopic probe 6. In addition, there is no extra space in the area where the first telescopic probe 4 and the second telescopic probe 6 are provided on the exposed portion 32 for clamping or screwing. Therefore, the present invention utilizes the fixing method of the adhesive material 9 to securely set the exposed portion 32 to the anti-warping component 8 without causing electrical interference.

[0048] In addition, the outer surface of the anti-warping component 8 has an insulating layer U, the outer surface including the upper surface 81, the lower surface 82, and the side surface 83. By providing an insulating layer U on the outer surface of the anti-warping component 8, the present invention enables the anti-warping component 8 to achieve electrical insulation. Specifically, by providing an insulating layer U on the outer surface of the anti-warping component 8, it can prevent the first probe movable part 42 of the first telescopic probe 4 and the second probe movable part 62 of the second telescopic probe 6 from contacting the circuit board and retracting, thus preventing the anti-warping component 8 from directly contacting the circuit board and causing a short circuit, resulting in incorrect electrical test results.

[0049] In the first embodiment, the probe module M includes two coaxial connectors 2 and two probes (a first telescopic probe 4 and a second telescopic probe 6), with the two coaxial connectors 2 respectively connecting to the two probes. The center conductor S of the other coaxial connector 2 is electrically connected to the first telescopic probe 4, and the center conductor S of the other coaxial connector 2 is electrically connected to the second telescopic probe 6. Further, the center conductor S of the other coaxial connector 2 is electrically connected to a first line 5, and the first telescopic probe 4 is disposed on the first line 5, forming a situation where the center conductor S of the other coaxial connector 2 is electrically connected to the first telescopic probe 4. The center conductor S of the other coaxial connector 2 is electrically connected to a second line 7, and the second telescopic probe 6 is disposed on the second line 7, forming a situation where the center conductor S of the other coaxial connector 2 is electrically connected to the second telescopic probe 6. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention. The present invention is not limited to the number of coaxial connectors and probes. Other different embodiments are further listed below.

[0050] [Second Embodiment]

[0051] Referring to Figure 8, the probe module M includes a coaxial connector 2 and two probes (a first telescopic probe 4 and a second telescopic probe 6). The center conductor S of the coaxial connector 2 is electrically connected to the first telescopic probe 4, and the outer conductor G of the coaxial connector 2 is electrically connected to the second telescopic probe 6. Referring to Figures 2 and 5, the corresponding circuitry of the probe module M and the corresponding board structure 3 may differ. In this embodiment, there is only one coaxial connector 2, therefore only the first line 5 and the upper grounding layers 33 and 35 are disposed on the first surface 321, and the lower grounding layer 36 is disposed on the second surface 322. In this embodiment, the shape, size, and other appearance of the first line 5 and the upper grounding layers 33 and 35 may differ from other embodiments, but the first line 5 is electrically connected to the center conductor S of the coaxial connector 2, and the upper grounding layers 33 and 35 are electrically connected to the outer conductor G of the coaxial connector 2. The first telescopic probe 4 is disposed on the first line 5, and the second telescopic probe 6 is disposed on one of the upper grounding layers 33 and 35.

[0052] [Third Embodiment]

[0053] Referring to Figure 9, the probe module M includes a coaxial connector 2 and three probes (e.g., one first telescopic probe 4 and two second telescopic probes 6). The center conductor S of the coaxial connector 2 is electrically connected to the first telescopic probe 4, and the outer conductor G of the coaxial connector 2 is electrically connected to the two second telescopic probes 6. Referring to Figures 2 and 5, further, the corresponding circuitry of the probe module M and the corresponding board structure 3 may differ. In this embodiment, there is only one coaxial connector 2, therefore only the first line 5 and the upper ground layers 33 and 35 are disposed on the first surface 321, and the lower ground layer 36 is disposed on the second surface 322. In this embodiment, the shape, size, and other appearance of the first line 5 and the upper ground layers 33 and 35 may differ from other embodiments, but the first line 5 is electrically connected to the center conductor S of the coaxial connector 2, and the upper ground layers 33 and 35 are electrically connected to the outer conductor G of the coaxial connector 2. The first telescopic probe 4 is disposed on the first line 5, and the two second telescopic probes 6 are disposed on the upper ground layers 33 and 35, respectively. The first telescopic probe 4 is positioned between the two second telescopic probes 6.

[0054] [Fourth Embodiment]

[0055] Referring to Figure 10, the probe module M includes two coaxial connectors 2 and three probes (e.g., two first telescopic probes 4 and one second telescopic probe 6). The center conductors S of the two coaxial connectors 2 are electrically connected to the two first telescopic probes 4, while the outer conductors G of the two coaxial connectors 2 are electrically connected to the second telescopic probe 6. Please refer to Figures 2 and 5 simultaneously. Furthermore, the corresponding circuits of the probe module M and the corresponding board structure 3 will be different. In this embodiment, there are two coaxial connectors 2, so the first line 5, the second line 7, and the upper ground layers 33, 34, and 35 are disposed on the first surface 321, and the lower ground layer 36 is disposed on the second surface 322. In this embodiment, the shape, size, and other appearance of the first line 5, the second line 7, and the upper grounding layers 33, 34, and 35 may be the same as in the first embodiment or may differ according to actual design. However, the first line 5 is electrically connected to the center conductor S of the coaxial connector 2, the second line 7 is electrically connected to the center conductor S of another coaxial connector 2, the upper grounding layer 33 is electrically connected to the outer conductor G of the coaxial connector 2, the upper grounding layer 34 is electrically connected to the outer conductor G of another coaxial connector 2, and the upper grounding layer 35 is electrically connected to the outer conductors G of two coaxial connectors 2. A first telescopic probe 4 is disposed on the first line 5, another first telescopic probe 4 is disposed on the second line 7, and a second telescopic probe 6 is disposed on the upper grounding layer 33. The second telescopic probe 6 is disposed between the two first telescopic probes 4.

[0056] [Fifth Embodiment]

[0057] Referring to Figure 11, the probe module M includes two coaxial connectors 2 and four probes (e.g., two first telescopic probes 4 and two second telescopic probes 6). The center conductor S and outer conductor G of one coaxial connector 2 are electrically connected to one of the first telescopic probes 4 and one of the second telescopic probes 6, respectively. The center conductor S and outer conductor G of the other coaxial connector 2 are electrically connected to another first telescopic probe 4 and another second telescopic probe 6, respectively. Please refer to Figures 2 and 5 simultaneously. Furthermore, the corresponding circuits of the probe module M and the corresponding board structure 3 will be different. In this embodiment, there are two coaxial connectors 2, therefore, the first line 5, the second line 7, and the upper ground layers 33, 34, and 35 are disposed on the first surface 321, and the lower ground layer 36 is disposed on the second surface 322. In this embodiment, the shape, size, and other appearance of the first line 5, the second line 7, and the upper grounding layers 33, 34, and 35 may be the same as in the first embodiment or may differ according to the actual design. However, the first line 5 is electrically connected to the center conductor S of the coaxial connector 2, the second line 7 is electrically connected to the center conductor S of the other coaxial connector 2, the upper grounding layer 35 is electrically connected to the outer conductor G of the coaxial connector 2, the upper grounding layer 34 is electrically connected to the outer conductor G of the other coaxial connector 2, and the upper grounding layer 33 is electrically connected to the outer conductors G of the two coaxial connectors 2. A first telescopic probe 4 is disposed on the first line 5, another first telescopic probe 4 is disposed on the second line 7, and two second telescopic probes 6 are disposed on the upper grounding layers 34 and 35, respectively. The two first telescopic probes 4 are disposed between the two second telescopic probes 6.

[0058] [Sixth Embodiment]

[0059] Referring to Figure 12, the probe module M includes two coaxial connectors 2 and five probes (e.g., two first telescopic probes 4 and three second telescopic probes 6). The center conductor S and outer conductor G of one coaxial connector 2 are electrically connected to one of the first telescopic probes 4 and one of the second telescopic probes 6, respectively. The center conductor S and outer conductor G of the other coaxial connector 2 are electrically connected to another first telescopic probe 4 and another second telescopic probe 6, respectively. In addition, the outer conductor G of the two coaxial connectors 2 are further electrically connected to the second telescopic probe 6 located in the middle. Please refer to Figures 2 and 5 simultaneously. Furthermore, the corresponding circuits of the probe module M and the corresponding board structure 3 will be different. In this embodiment, there are two coaxial connectors 2, so the first line 5, the second line 7, and the upper ground layers 33, 34, and 35 are disposed on the first surface 321, and the lower ground layer 36 is disposed on the second surface 322. In this embodiment, the shape, size, and other appearance of the first line 5, the second line 7, and the upper grounding layers 33, 34, and 35 can be the same as in the first embodiment or may differ according to the actual design. The first line 5 is electrically connected to the center conductor S of the coaxial connector 2, the second line 7 is electrically connected to the center conductor S of another coaxial connector 2, the upper grounding layer 35 is electrically connected to the outer conductor G of the coaxial connector 2, the upper grounding layer 34 is electrically connected to the outer conductor G of another coaxial connector 2, and the upper grounding layer 33 is electrically connected to the outer conductors G of two coaxial connectors 2. A first telescopic probe 4 is disposed on the first line 5, another first telescopic probe 4 is disposed on the second line 7, and three second telescopic probes 6 are disposed on the upper grounding layers 33, 34, and 35, respectively. One of the first telescopic probes 4 is disposed between the two second telescopic probes 6.

[0060] Referring again to FIG. 13, the present invention provides a circuit board testing system. The testing system includes a testing instrument D and a probe module M. The probe module M can be any of the embodiments listed in the first to sixth embodiments. The following description uses the probe module M of the first embodiment as an example, and therefore FIG. 1 to FIG. 3, as well as FIG. 5 to FIG. 6, can be referred to together.

[0061] The probe module M is electrically coupled to the test instrument D. The outer conductor G of the coaxial connector 2 of the probe module M is electrically connected to the ground potential of the test instrument D, while the center conductor S is electrically connected to the test instrument D and receives the test signal output from the test instrument D. In addition, the probe module M electrically contacts a circuit board B under test through the first telescopic probe 4 and the second telescopic probe 6. Specifically, the first telescopic probe 4 electrically contacts the circuit board B through the first electrical contact end 421 of the first probe movable part 42, and the second telescopic probe 6 electrically contacts the circuit board B through the second electrical contact end 621 of the second probe movable part 62. After the circuit board B receives the test signal from the probe module M, it generates a corresponding induction signal, which is output to the test instrument D through the probe module M.

[0062] This invention is not limited to the form of the circuit board B. For example, the circuit board B can be a bare board without any electronic components. Referring to FIG13, the surface of the circuit board B (i.e., the bare board) is provided only with conductive contacts, such as conductive metal pads B1. It should be noted that the arrangement of the conductive metal pads B1 in FIG13 is only schematic and this invention is not limited thereto. When performing high-frequency testing, the first electrical contact end 421 of the first probe movable part 42 of the first telescopic probe 4 of the probe module M (in conjunction with FIG5) and the second electrical contact end 621 of the second probe movable part 62 of the second telescopic probe 6 directly make electrical contact with the conductive metal pads B1 to perform high-frequency testing. Referring to FIG1 at the same time, further, after the base 13 of the probe module M is fixed to the fixture, the probe module M should be substantially perpendicular to the surface of the circuit board B so that the first electrical contact end 421 and the second electrical contact end 621 directly contact the conductive metal pads B1.

[0063] Alternatively, for example, circuit board B can also be an upper board carrying a plurality of electronic components, slots, and cables. Referring to FIG14, circuit board B (i.e., upper board) includes a plurality of electronic components B2 and slots E. Slots E can be, for example, slots in the form of a land grid array (LGA), and the present invention is not limited thereto. When performing high-frequency testing, the first electrical contact end 421 of the first probe movable part 42 of the first telescopic probe 4 of the probe module M (in conjunction with FIG5) and the second electrical contact end 621 of the second probe movable part 62 of the second telescopic probe 6 electrically contact the contact pins (not shown) in the slots E on the circuit board B to perform high-frequency testing.

[0064] Further, as shown in Figure 14, when the probe module M performs high-frequency testing on the circuit board B, which is equipped with electronic component B2 and slot E, it is used with an intermediate plate IP and a fixture F. The first electrical contact end 421 of the first probe movable part 42 of the first telescopic probe 4 and the second electrical contact end 621 of the second probe movable part 62 of the second telescopic probe 6 electrically contact the intermediate plate IP through the opening F0 of the fixture F, and are electrically connected to the circuit board B through the intermediate plate IP for high-frequency testing. The fixture F is used to fix the position of the intermediate plate IP on the slot E.

[0065] Referring to Figure 15, the length L of the exposed portion 32 of the board structure 3 is greater than the height T defined by the distance from the upper surface of the electronic component B2 to the upper surface of the circuit board B. Since the heights of the electronic component B2 and the slot E on the circuit board B are different (the height of the electronic component B2 is greater than the height of the slot E), if the position of the electronic component B2 is too close to the slot E, it will interfere with the probe module M, causing the probe module M to be unable to electrically contact the slot E for testing. This invention overcomes the interference caused by the height difference of the electronic component B2 on the circuit board B by designing the aspect ratio of the exposed portion 32 of the board structure 3 to be greater than 5 times to increase the probe length, and by designing the length L of the exposed portion 32 to be greater than the height of the electronic component B2. Furthermore, when the probe module M provided by the present invention is used to test the "upper board", the probe module M can make electrical contact with the pads set on the intermediate board IP through the first telescopic probe 4 and the second telescopic probe 6 without avoiding electronic components (or without interfering with electronic components), thereby facilitating high-frequency testing of the circuit board.

[0066] It should also be noted that, under the same warpage, the shorter the length L of the exposed portion 32, the smaller the offset L1; conversely, the longer the length L of the exposed portion 32, the larger the offset L1. As shown in Figure 13, since the probe module M of the present invention is a long probe (the aspect ratio of the exposed portion 32 is greater than 5 times), the offset of the exposed portion 32 of the probe is large. During testing, the first telescopic probe 4 and the second telescopic probe 6 may not be able to contact the solder pads of the circuit board (i.e., the conductive metal pad B1 in Figure 13). Therefore, the present invention improves the warpage of the exposed portion 32 of the board structure 3 by setting the exposed portion 32 on the anti-warpage component 8, so that the exposed portion 32 of the board structure 3 and the anti-warpage component 8 are matched to form a structural component, thereby achieving the technical effect of reducing the offset.

[0067] Based on the test system shown in Figures 13 and 14, the present invention provides a test method, which includes at least the following steps:

[0068] Step S1: Referring to Figure 13, the circuit board B, which does not carry any electronic components, is tested through the probe module M;

[0069] Step S2: The results obtained by testing the circuit board B in Figure 13 without any electronic components through the probe module M using the test instrument D are recorded as the first data.

[0070] Step S3: Referring to Figure 14, a plurality of electronic components B2 are placed on the circuit board under test that does not carry any electronic components to form the circuit board B of Figure 14;

[0071] Step S4: Test the circuit board B with multiple electronic components in FIG14 through the probe module M;

[0072] Step S5: Using the testing instrument D, the results obtained from testing the circuit board B in Figure 14, which contains the electronic components, with the probe module M are recorded as second data; and

[0073] Step S6: After the step of recording the results obtained by testing the circuit board B with the electronic components in FIG14 by the probe module M as the second data, the first data and the second data are further compared.

[0074] The present invention can perform electrical tests on a "circuit board without any electronic components (i.e., bare board)" and a "circuit board with multiple electronic components (i.e., upper board)" by using the same probe module M, thereby saving the time of replacing different probe modules and improving the efficiency of electrical testing.

[0075] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0016] Figure 1 is a first perspective view of the probe module of the first embodiment of the present invention.

[0017] Figure 2 is a second perspective view of the probe module of the first embodiment of the present invention.

[0018] Figure 3 is a third perspective view of the probe module of the first embodiment of the present invention.

[0019] Figure 4 is a schematic diagram of the warping of the probe module in the first embodiment of the present invention.

[0020] Figure 5 is an enlarged schematic diagram of part V in Figure 2.

[0021] Figure 6 is a partially enlarged schematic diagram of the probe module of the first embodiment of the present invention.

[0022] Figure 7 is a schematic diagram of the exposed part of the plate structure and the anti-warping component of the first embodiment of the present invention.

[0023] Figure 8 is a schematic diagram of the probe module of the second embodiment of the present invention.

[0024] Figure 9 is a schematic diagram of the probe module of the third embodiment of the present invention.

[0025] Figure 10 is a schematic diagram of the probe module of the fourth embodiment of the present invention.

[0026] Figure 11 is a schematic diagram of the probe module of the fifth embodiment of the present invention.

[0027] Figure 12 is a schematic diagram of the probe module of the sixth embodiment of the present invention.

[0028] Figure 13 is a schematic diagram of the test system of the present invention testing a circuit board without electronic components.

[0029] Figure 14 is a schematic diagram of the test system of the present invention testing a circuit board carrying electronic components.

[0030] Figure 15 is another schematic diagram of the test system of the present invention testing a circuit board carrying electronic components.

Claims

1. A probe module, comprising: A shell structure; A coaxial connector is disposed on the housing structure; a plate structure includes a mounting portion disposed within the housing structure and an exposed portion exposed outside the housing structure; a first telescopic probe includes a first probe support portion and a first probe movable portion movably disposed within the first probe support portion, the first probe support portion being disposed on the exposed portion and electrically connected to a first circuit disposed on the plate structure, the first probe movable portion having a first electrical contact end protruding from the exposed portion; a second telescopic probe includes a second probe support portion and a second probe movable portion movably disposed within the second probe support portion, the second probe support portion being disposed on the exposed portion and electrically connected to a second circuit disposed on the plate structure, the second probe movable portion having a second electrical contact end protruding from the exposed portion; and an anti-warping component, the exposed portion of the plate structure being disposed on the anti-warping component; wherein the aspect ratio of the exposed portion of the plate structure is greater than 5 times.

2. The probe module as described in claim 1, wherein, The rigidity of the structural assembly formed by the exposed portion of the plate structure and the anti-warping component is greater than that of the exposed portion.

3. The probe module as claimed in claim 1, wherein the material of the exposed portion of the plate structure is different from the material of the anti-warping component.

4. The probe module as claimed in claim 1, wherein the warpage provided by the exposed portion of the plate structure in combination with the anti-warpage component is 0.01% to 0.3%.

5. The probe module as claimed in claim 1, wherein the exposed portion of the plate structure is disposed on the anti-warping component via an adhesive material.

6. The probe module as claimed in claim 1, wherein the first line and the second line are disposed on a first surface of the exposed portion of the plate structure, and the anti-warping component is disposed on a second surface of the exposed portion of the plate structure, wherein the first surface and the second surface are two opposite surfaces.

7. The probe module as claimed in claim 1, wherein the outer surface of the anti-warping component has an insulating layer.

8. The probe module as claimed in claim 1, wherein the thickness of the anti-warping component is greater than the thickness of the exposed portion of the plate structure.

9. The probe module as claimed in claim 1, wherein the first electrical contact of the first probe movable portion and the second electrical contact of the second probe movable portion are configured to contact a circuit board provided with a plurality of electronic components, the length of the exposed portion of the board structure being greater than the height defined from the upper surface of the electronic components to the upper surface of the circuit board.

10. The probe module as claimed in claim 9, wherein the first electrical contact of the first probe active portion and the second electrical contact of the second probe active portion are configured to contact the circuit board which does not carry any electronic components.

11. The probe module as claimed in claim 9 or 10, wherein the first electrical contact of the first probe movable part and the second electrical contact of the second probe movable part are electrically connected to the circuit board through an intermediary plate.

12. The probe module as described in claim 1, wherein, The housing structure has an opening, and the exposed portion has a connecting end and a free end. The connecting end of the exposed portion is connected to the mounting portion through the opening of the housing structure. The first telescopic probe and the second telescopic probe are adjacent to each other. The first probe support is disposed on a first line located at the free end of the exposed portion. The first probe movable part is movably inserted into and exits the first probe support at one end of the first probe support, and protrudes from the other end of the first probe support from the free end of the exposed portion. The second probe support is disposed on a second line located at the free end of the exposed portion. The second probe movable part is movably inserted into and exits the second probe support at one end of the second probe support, and protrudes from the other end of the second probe support from the free end of the exposed portion.

13. A test system with a probe module, comprising: A test instrument configured to generate a test signal; And a probe module as described in claim 1, which is electrically coupled to the test instrument.

14. A testing method using a probe module, comprising: Provide a circuit board; And to test the circuit board using a probe module as described in claim 1.

15. The test method as described in claim 14, wherein the circuit board is provided with a plurality of electronic components.

16. A testing method using a probe module, comprising the following steps: testing a circuit board under test (TBD) without any electronic components using the probe module as described in claim 1; recording the results of testing the TD without any electronic components using a testing instrument as first data; testing the TD with a plurality of electronic components using the probe module; and recording the results of testing the TD with the electronic components using the testing instrument as second data.

17. The test method as described in claim 16, further comprising, prior to the step of testing the circuit board under test on which the electronic components are disposed: These electronic components are placed on the circuit board under test, which does not carry any electronic components.

18. The test method of claim 16, after the step of recording the results obtained by testing the circuit board under test on which the probe module is provided with the electronic components as the second data, the test method further includes: Compare the first data with the second data.

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