Integrated sensor package strcuture

Abstract

This invention discloses an integrated sensor packaging structure. The integrated sensor packaging structure includes a substrate, a plurality of sensor packaging units, and a packaging layer. The substrate has a first surface and a second surface. The plurality of sensor packaging units are disposed on the first surface. Each sensor packaging unit includes a sensing chip disposed on the first surface, a light-transmitting element disposed above the sensing chip, and an optical module disposed on the surface of the light-transmitting element. The optical module includes a frame disposed on the sensing chip and a lens mounted within the frame. The packaging layer surrounds each of the sensor packaging units. The thickness of the sensing chip in at least one of the sensor packaging units is different from the thickness of the sensing chip in another sensor packaging unit.

Claims

1. An integrated sensor packaging structure, comprising: a substrate having a first surface and a second surface opposite to each other; and a plurality of sensor packaging units disposed on the first surface; wherein, Each of the sensor packaging units includes: a sensing chip disposed on the first plate surface; a light-transmitting element disposed above the sensing chip; and an optical module disposed on the surface of the light-transmitting element away from the sensing chip; wherein the optical module includes: a frame disposed on the sensing chip; at least one lens mounted within the frame; and an encapsulation layer surrounding the sensing chip and the light-transmitting element of each of the sensor packaging units; wherein the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit; and wherein the thickness of the light-transmitting element of at least one of the sensor packaging units is different from the thickness of the light-transmitting element of another sensor packaging unit.

2. The integrated sensor package structure as described in claim 1, wherein, The encapsulation layer is formed from liquid encapsulating adhesive.

3. The integrated sensor package structure as described in claim 1, wherein, In each of the sensor packaging units, the thickness of the sensing chip is inversely related to the thickness of the light-transmitting element.

4. The integrated sensor package structure as described in claim 3, wherein, In each of the sensor packaging units, the sum of the thickness of the sensing chip and the thickness of the light-transmitting element is less than 2 mm.

5. The integrated sensor package structure as described in claim 1, wherein, The distance between the light-transmitting element and the substrate of any one of the sensor packaging units is the same as the distance between the light-transmitting element and the substrate of the other sensor packaging unit.

6. The integrated sensor package structure as described in claim 1, wherein, Each of the sensor packaging units includes a support adhesive layer, which is annular and located between the sensor chip and the light-transmitting element, and the support adhesive layer, the sensor chip and the light-transmitting element can together form a closed space.

7. The integrated sensor package structure as described in claim 6, wherein, Each of the sensor packaging units includes multiple wires, one end of each wire is connected to the first plate surface, and the other end of each wire is connected to the sensor chip and located in the support adhesive layer.

8. An integrated sensor packaging structure, comprising: a substrate having a first plate surface and a second plate surface opposite to each other; a plurality of sensor packaging units disposed on the first plate surface; wherein, Each of the sensor packaging units includes: a sensing chip disposed on the first plate surface; a light-transmitting element disposed above the sensing chip; and an optical module disposed on the surface of the light-transmitting element away from the sensing chip; wherein the optical module includes: a frame disposed on the sensing chip; at least one lens mounted within the frame; and an encapsulation layer surrounding the sensing chip and the light-transmitting element of each of the sensor packaging units; wherein the thickness of the sensing chip of at least one of the sensor packaging units is different from the thickness of the sensing chip of another sensor packaging unit.

9. The integrated sensor package structure as described in claim 8, wherein, The encapsulation layer is formed from liquid encapsulating adhesive.

10. The integrated sensor package structure as described in claim 8, wherein, In each of the sensor packaging units, the thickness of the sensing chip is positively correlated with the distance between the light-transmitting element and the substrate.

11. The integrated sensor package structure as described in claim 8, wherein, At least one of the sensor packaging units has a light-transmitting element with an annular barrier formed on the surface away from the sensor chip.

12. The integrated sensor package structure as described in claim 11, wherein, The distance between the light-transmitting element and the substrate of at least one of the sensor packaging units is less than the distance between the light-transmitting element and the substrate of the other sensor packaging unit.

13. The integrated sensor package structure as described in claim 8, wherein, Each of the sensor packaging units includes a support adhesive layer, which is annular and located between the sensor chip and the light-transmitting element, and the support adhesive layer, the sensor chip and the light-transmitting element can together form a closed space.

14. The integrated sensor package structure as described in claim 13, wherein, Each of the sensor packaging units includes multiple wires, one end of each wire is connected to the first plate surface, and the other end of each wire is connected to the sensor chip and located in the support adhesive layer.

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