Deployment method for achieving consistent positioning results across multiple apparatuses and method for improving positioning performance thereof

Abstract

A deployment method for achieving consistent positioning results among multiple devices and a method for improving positioning performance are disclosed. This method is applied to inspection equipment including a mobile device and an imaging device. The method includes a positioning step, a rotation correction step, and a coordinate compensation information establishment step. It improves the positioning performance of each inspection device by using a standard sheet comprising an array of multiple reference markers to obtain a coordinate compensation information table for each inspection device. When each inspection device is driven based on the same formula, it can perform position compensation control according to the corresponding coordinate compensation information table, enabling connectivity in coordinate position control between these devices, thereby achieving consistent positioning results and improved efficiency among multiple devices.

Claims

1. A positioning performance improvement method applied to a detection device including a moving device and an imaging device, the detection device being configured to drive a wafer stage of the moving device so that at least a portion of a standard wafer carried thereon can enter a field of view of the imaging device, the standard wafer including an array of multiple reference marks, the positioning performance improvement method comprising: a positioning step, aligning a reference position of the standard wafer with a reference position of the field of view; a rotation correction step, based on the geometric relationship formed by at least two reference marks arranged in the same row or column, ensuring that the standard wafer has no rotational offset; and a coordinate compensation information establishment step, obtaining offset information corresponding to each of the multiple target coordinates of the wafer stage to establish a coordinate compensation information table, as the basis for compensation when the wafer stage is subsequently driven, wherein... The wafer stage is driven to align the reference position with the target coordinates one by one. When the wafer stage completes the driving purpose of reaching a target coordinate, a target position of the target coordinate in the image of the field of view is obtained based on the distance information between the reference markers, and the degree of offset between the target position in the field of view and the reference position is used as the corresponding offset information.

2. The positioning performance improvement method as described in claim 1, wherein in the coordinate compensation information establishment step, at least one fine coordinate between two adjacent target coordinates is further included, and a fine offset information corresponding to the fine coordinate is obtained by interpolation using the two offset information corresponding to the two target coordinates, and is included in the coordinate compensation information table.

3. The positioning performance improvement method as described in claim 1 or 2, wherein the reference position is the center position of the standard piece and the reference position is the center of the field of view.

4. The positioning performance improvement method as described in claim 1 or 2, wherein each of the reference marks corresponds to a target coordinate, and when the wafer stage completes the drive to reach a target coordinate, the position of the reference mark closest to the reference position is the target position.

5. The positioning performance improvement method as described in claim 1 or 2, wherein the rotation correction step includes a correction procedure, obtaining a connecting line formed by the two reference marks, moving the standard wafer in a row direction or a column direction, and rotating the wafer stage to eliminate the angle based on an angle formed by the connecting line relative to the row direction or the column direction.

6. The positioning performance improvement method as described in claim 5, wherein the rotational correction step includes two correction procedures, wherein in the first correction procedure, the standard piece is moved to a near range close to the reference position, and in the second correction procedure, the standard piece is moved to a far range far from the reference position.

7. A deployment method for unifying positioning results among multiple devices, comprising: configuring a standard sheet including an array of multiple reference markers, such that each of the multiple detection devices, including a moving device and an imaging device, performs a positioning performance improvement method based on the standard sheet to obtain a marker compensation information table corresponding to each detection device, wherein... When each of the testing devices is driven based on a formula, a position compensation control is performed according to the corresponding coordinate compensation information table. Each of the testing devices is configured to drive a wafer stage of the moving device so that at least one part of the standard wafer it carries can enter a field of view of the imaging device. The positioning performance improvement method performed by each of the testing devices includes: a positioning step, aligning a reference position of the standard wafer with a reference position of the field of view; A rotational correction step, based on the geometric relationship formed by at least two reference markers arranged in the same row or column, ensures that the standard wafer has no rotational offset; and a coordinate compensation information establishment step, obtaining an offset information corresponding to each of the plurality of target coordinates of the wafer stage, to establish a coordinate compensation information table to which the detection device belongs, wherein the wafer stage is driven with the aim of aligning the reference position with the target coordinates one by one, and when the wafer stage completes the driving purpose of reaching a target coordinate, a target position of the target coordinate in the image of the field of view is obtained based on the distance information between the reference markers, and the degree of offset between the target position in the field of view and the reference position is used as the corresponding offset information.

8. The deployment method as described in claim 7, wherein in the coordinate compensation information establishment step, at least one fine coordinate between two adjacent target coordinates is further included, and a fine offset information corresponding to the fine coordinate is obtained by interpolation using the two offset information corresponding to the two target coordinates, and is included in the coordinate compensation information table.

9. The deployment method as described in claim 7 or 8, wherein the reference position is the center position of the standard piece and the reference position is the center of the field of view.

10. The deployment method as described in claim 7 or 8, wherein each of the reference markers corresponds to a target coordinate, and when the wafer stage completes the drive to reach a target coordinate, the position of the reference marker closest to the reference position is the target position.

11. The deployment method as described in claim 7 or 8, wherein the rotation correction step includes a correction procedure that obtains a connecting line formed by the two reference marks, moves the standard wafer in a row direction or a column direction, and rotates the wafer stage to eliminate the angle based on an angle formed by the connecting line relative to the row direction or the column direction.

12. The deployment method as described in claim 11, wherein the rotational correction step includes two correction procedures, wherein in the first correction procedure, the standard piece is moved to a near range close to the reference position, and in the second correction procedure, the standard piece is moved to a far range far from the reference position.

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