Substrate processing system and substrate processing tool

Abstract

The substrate processing system includes a pivot assembly configured to allow a substrate support and an RF bias assembly to slide relative to other components of the processing chamber from a mating position to a non-matting position. A switch-type connector is configured to supply fluid to at least one of the substrate support and the RF bias assembly. The switch-type connector includes a first portion containing a first fluid channel connected to a first conduit. A second portion contains a second fluid channel connected to a second conduit. The first fluid channel in the first portion is in fluid communication with the second fluid channel in the second portion. The first portion is configured to slide relative to the second portion and other portions of the processing chamber together with the substrate support and the RF bias assembly. The first portion is located inside the second portion.

Description

Cooling on / off type connector for substrate processing system [Cross-reference to related cases] This application claims a right in U.S. Provisional Application No. 62 / 984,081, filed March 2, 2020. The entire disclosure of the aforementioned provisional application is incorporated herein by reference. This disclosure relates to a substrate processing system, and more particularly to a system for connecting a coolant to a processing chamber. The background description provided herein is intended to provide a general overview of the contents of this disclosure. For the purposes described in this background section, the work of the inventors currently listed, and embodiments that cannot otherwise be described as prior art at the time of filing, are not expressly or impliedly considered to be prior art in conflict with the contents of this disclosure. Substrate processing systems can be used to process substrates such as semiconductor wafers. Exemplary processes that can be performed on the substrate include, but are not limited to, chemical vapor deposition (CVD), atomic layer deposition (ALD), conductor etching, and / or other etching, deposition, or cleaning processes. The substrate can be disposed on a substrate support, such as a base, electrostatic chuck, etc., within the processing chamber of the substrate processing system. During etching, a gas mixture including one or more precursors can be introduced into the processing chamber, and plasma can be used to initiate the chemical reaction. A substrate processing system includes a pivot assembly configured to allow a substrate support and an RF bias assembly of a processing chamber to slide relative to other components of the processing chamber from a mating position to a non-matting position. A switch-type connector is configured to supply fluid to at least one of the substrate support and the RF bias assembly. The switch-type connector includes a first portion containing a first fluid channel connected to a first conduit. A second portion contains a second fluid channel connected to a second conduit. The first fluid channel in the first portion is in fluid communication with the second fluid channel in the second portion. Fasteners removably connect the first portion to the second portion. The first portion is configured to slide relative to the second portion and other portions of the processing chamber, together with the substrate support and the RF bias assembly. The first portion is located within the second portion relative to the sliding direction from the mating position to the non-matting position. Among other features, when the on / off connector is in the mating position, the first part is connected to the second part. When the on / off connector is in the non-mating position, the first part is disconnected from the second part. The pivoting assembly is configured to allow the substrate support and RF bias assembly to slide from the mating position to the non-mating position, and then pivot to a position greater than 90 degrees. oThe predetermined angle. Among other features, the on / off connector is housed within the housing. During operation, the housing is connected to a gas source and purged. The gas source is molecular nitrogen or clean, dry air. Among other features, the first portion includes a third fluid channel connected to a third conduit. The second portion includes a fourth fluid channel connected to a fourth conduit. The third fluid channel in the first portion is in fluid communication with the fourth fluid channel in the second portion. A tool includes a device front-end module, a substrate transfer module, a loading lock disposed between the device front-end module and the substrate transfer module, and the aforementioned 2N substrate processing systems. Wherein N is an integer from 1 to 5. Half of the 2N substrate processing systems are disposed on one side of the substrate transfer module, and the other half of the 2N substrate processing systems are disposed on the opposite side of the substrate transfer module. Among other features, the first portion of the on / off connector includes a plurality of holes. The second portion of the on / off connector includes a plurality of alignment pins that mate with the plurality of holes when the first portion is connected to the second portion. The further scope of application of this disclosure will become apparent from the detailed description, the claims of the patent application, and the drawings. The detailed description and specific embodiments are intended for illustrative purposes only and are not intended to limit the scope of this disclosure. A semiconductor fabrication (fab) room may include a plurality of tools, each tool including a plurality of plasma processing stations (hereinafter referred to as "stations"). Each station may be configured to perform conductor etching processes, dielectric etching processes, or other substrate processing. Space within the fabrication room is limited, and therefore the amount of space available for receiving each tool is limited, whereby the tool is received for repair and / or maintenance to be performed at the station. The stations for the tools may be arranged in a star-shaped or linear pattern. In a star-shaped pattern, multiple stations are arranged around a centrally located substrate transfer module, which includes a robot. The robot moves the substrate from a loading lock chamber to each of the plasma processing stations and back to the loading lock. Although this arrangement of multiple stations provides access space between them, the density of the multiple stations is lower than that in a linear pattern arrangement. In a linear pattern, multiple stations are arranged side-by-side, forming two rows of multiple stations. These rows are located on each side of a substrate transfer module that can operate in atmospheric or vacuum environments. While the linear arrangement allows for a larger number of stations within a given area, it provides limited access to the sides of the stations. To improve maintainability, the processing station may include a sliding and pivoting assembly to allow the lower portion of the processing chamber (including the front wall or channel-facing wall of the processing chamber, the substrate support, and the RF bias assembly) to slide out and then pivot into a channel between adjacent tools. In some examples, the substrate support includes a base plate with coolant channels that allow fluid flow to control the temperature of the substrate support and the substrate disposed thereon. The top plate assembly can be removed for maintenance, repair, or replacement. The rest of the processing chamber remains in the same position. Before moving the sliding and pivot assembly to the service position, the connection between the substrate support and the RF bias assembly must be disconnected. In some examples, the substrate support and / or RF bias assembly can be cooled by fluid. Therefore, the fluid connection must be disconnected before moving the sliding and pivot assembly to the service position. In some examples, a combination of rigid and flexible conduits is used. Some fluid delivery elements remain in place with the rest of the processing chamber, while others move with the sliding and pivot assembly. As can be seen, it is difficult to provide a reliable on-off fluid connection in the relatively confined space below the bias assembly. Figures 1 and 2 show portions of two tools 100 and 102 arranged side-by-side in a manufacturing chamber (one is shown as a solid line at 100, and the other as a dashed line at 102). Each tool includes two rows of multiple stations (one row is shown for each tool). The multiple stations are located adjacent to the substrate transfer module (not shown in Figure 1 for clarity). There is limited space between tools 100 and 102. The width of the passage between tools 100 and 102 is shown as W. Width W provides a minimum amount of space between tools 100 and 102 for opening the processing chambers of the stations and for accessing the process module and the interior of the corresponding processing chambers. The examples presented in this case include sliding and pivoting assemblies that are pulled out and pivoted away from the corresponding processing chamber, allowing for repair or maintenance to be performed within the passageway. The sliding and pivoting assemblies are configured to repeatedly move from a fully docked state to a fully non-docked state, and to the same fully docked position. For example, the sliding and pivoting assemblies are configured to return the process module bias assembly to a position within ±25 micrometers (μm, referred to as micrometers) of the fully docked state. The sliding and pivoting assemblies are configured to handle and compensate for the heavy loads on the process module bias assembly. The exemplary total weight of the process module bias assembly and the corresponding sliding and pivoting assemblies is approximately 300 kilograms (kg). Tools 100 and 102 include a front-opening unified pod (FOUP) 104, an equipment front end module (EFEM) and loading lock 106, a station with an RF generator 107 and a gas chamber 108, and a power lock out and tag out panel 110. The station also includes a process module bias assembly 112, which includes separate sliding and pivot assemblies (as shown in Figure 4). Each station, individually or in combination, may be referred to as a substrate processing system. Each station may be used to etch a substrate, for example using radio frequency (RF) plasma. Each station includes a processing chamber, such as an inductively coupled plasma (ICP) chamber or a conductively coupled plasma (CCP) chamber. For example, the station may perform conductive etching or dielectric etching processes or other substrate processing. Figure 2 shows a plan view of tool 100. Tool 100 includes FOUP 104, EFEM and loading lock 106, station 109, and power-locked tag panel 110. The tool has a total footprint of 220. The tool also includes a substrate transfer module 222 for transferring substrates to and from station 109. Substrate transfer module 222 may include robots 224, 226, and a buffer 228 for temporarily storing substrates. Robots 224, 226 transfer substrates to and from station 109 and buffer 228. In some examples, substrate transfer module 222 operates in a vacuum or atmosphere. Figure 3 shows a side view of tool 100. Tool 100 includes FOUP 104, EFEM and loading lock 106, station 109, and power locking tag system 110. Station includes an RF generator and gas chamber (collectively referred to as 300), and a process module bias assembly 112 with sliding and pivoting components. The RF generator provides RF power to electrodes in the substrate support of the station. The gas chamber supplies gas to the processing chamber of the station. Substrate transfer module 222 is also shown. The substrates scheduled for loading and processing are stored in FOUP 104. The substrates are transferred from FOUP 104 to station 109 via robots 224 and 226 through EFEM and loading lock 106, and via separate loading ports 302. In some examples, an RF generator and gas chamber 300 are positioned above station 109 and supply RF power and process gas to the process module of station 109. Figure 4A shows a plasma processing station 400 including a sliding and pivoting assembly 402. The sliding and pivoting assembly 402 allows the process module biasing assembly 406 to slide and pivot relative to other elements of the processing chamber 404. The sliding and pivoting assembly 402 allows the process module biasing assembly 406 to be pulled away from the processing chamber 404 and to pivot relative to the front of the processing chamber 404 by up to a predetermined angle. The process module biasing assembly 406 includes a housing 408, a portion 410 of the process module (including a process biasing bowl 412). In addition to the process biasing bowl 412, the process module biasing assembly 406 may also include an electrostatic chuck and / or other substrate supports, and a top plate assembly, as shown in Figure 4B. An illustrative width W of the passageway between display station 400 and the opposing station illustrates that the process module biasing assembly 406 can slide out and pivot within the passageway. This provides an open space 414 on the right side of the sliding and pivoting assembly 402 for technicians to access the interior of the process biasing bowl 412 and the processing chamber 404 for maintenance and repair purposes, including wet cleaning. The interior of the process biasing bowl 412 and the processing chamber 404 is accessed without interference from the right side of the process module biasing assembly 406. For example, no sliders, rails, and / or other components are located in the open space 414, and therefore they do not interfere with technicians' access to the interior of the processing chamber. Although the process module biasing assembly 406 is shown as pivoting to the left, the sliding and pivoting assembly can be configured and mounted on the right side of the processing chamber, allowing the process module and biasing assembly to be pulled out and pivoted to the right relative to the processing chamber. Figure 4B shows a substrate support 460 including a heating layer 470, which includes an electrostatic electrode 472 and / or an RF bias electrode 474. The heating layer 470 may be made of ceramic or other materials and is bonded to a base plate 482 via a bonding layer. The base plate 482 is typically made of aluminum and includes a coolant channel 480 and fluid channels 484 and 486 for supplying and receiving coolant from the base plate 482. The coolant helps control the temperature of the substrate support and the substrate during processing. Referring now to Figure 5, one of the stations is shown facing inward from the channel. The station includes an upper portion 510 and a lower portion 514. The upper portion 510 includes a process module biasing assembly 112 and a substrate support with sliding and pivoting assemblies. The sliding and pivoting assemblies of the upper portion 510 allow the process module to slide outward toward the channel and then pivot to allow access for cleaning, maintenance, or other repairs. In some examples, the sliding and pivoting assemblies of the upper portion 510 pivot outward more than 90° to allow greater access to the processing chamber. The lower portion 514 remains in the same position and includes a housing 520 with a removable cover 524. Other elements 518 of the processing module (e.g., other fluid and / or electrical components and / or housing) are disposed between the housing of the lower portion 514 and the lower edge of the upper portion 510. In some examples, the walls of the housing and / or conduits inside or outside the housing may be insulated to prevent condensation. As will be further described below, the internal portion of the on / off connector (see Figure 7) housed in housing 520 slides outward into the channel along with the sliding and pivoting assembly. Before sliding or pivoting, the outer portion of the on / off fluid connector is pulled outward and downward to allow unobstructed movement of the inner portion. This arrangement (with the second portion located outside the first portion) allows for easier alignment and connection of the second portion to the first portion (compared to the case where the second portion is located inside the first portion). Furthermore, the partial use of flexible wiring avoids tolerance accumulation that occurs in cases where fully rigid wiring is used for fluid transport. Referring now to Figure 6, the housing 520 of the on / off connector, which is used to deliver cooling fluid to a station, is shown in more detail. The housing 520 includes a vertical housing portion 610 and a horizontal housing portion 612 connected to the vertical housing portion 610. The vertical housing portion 610 and the horizontal housing portion 612 of the housing 520 define internal volumes for accommodating the on / off connector (see Figure 7) and other components. Cover 524 is attached to the sidewalls 616, 618, 620, 622, and top surface 624 of housing 520 by fasteners 614. In some examples, cover 524 includes a vertical surface 626 facing the channel and a top surface 630 extending inward at an angle of, for example, 90° relative to the vertical surface 626 facing the channel. Top surface 630 includes an opening 634 to allow fluid conduit 638 and connector 640 to pass through. Flexible sealing material 641 is disposed between top surface 630 and the top surface of sidewall 616 to form a seal around fluid conduit 638. In some examples, flexible sealing material 641 includes a foam material having orifices and / or slits extending from the orifices to one edge of flexible sealing material 641 to allow installation of fluid conduit 638. The horizontal housing portion 612 includes a cover 650, a sidewall 652, and a bottom surface 654. An opening 656 in the sidewall 652 and a flexible sealing material 658 (e.g., a foam with holes and slits as described above) are used to provide a flexible seal for a connector 660, which may include a fluid and / or electrical connector. Referring now to Figure 7, housing 520 is shown with cover 524 removed (see Figure 6). A switch-type connector 720 is located within housing 520 and includes a first portion 722 connected to a second portion 726 by one or more fasteners 724. In some examples, the fasteners 724 include bolts. As shown and described below with reference to Figures 11 through 13, the second portion 726 includes two (or more) alignment pins 728, 732 that pass through corresponding holes 736, 738 in the first portion 722 and facilitate mounting the first portion 722 onto the second portion 726. The first portion 722 is adjacent to the channel, and the second portion 726 is configured to transfer the module inward toward the substrate relative to the first portion 722. The ends of conduits 730 and 744 are connected to the first portion 722. The ends of conduits 734 and 746 are connected to the opposite ends of conduits 730 and 744. In some examples, conduits 730 and 744 are rigid circuits, and conduits 734 and 746 are flexible circuits. By way of example only, conduits 730 and 744 are joined to conduits 734 and 746 respectively by the beveled connector shown. Alternatively, conduits 730 and 734 may be joined by a fitting with a rounded bend. Furthermore, if the height of the housing 520 permits, conduits 744 and 746 may also be joined by a fitting with a rounded bend. The conduit 760 is connected to the second portion 726. In some examples, the conduit 760 includes rigid and / or flexible wiring. The housing 520 includes a flange 750 extending inwardly from its side. The flange 750 includes a hole for receiving a fastener to attach the cover 524 to the housing 520. When the cover 524 is attached, a protrusion 770 on the upper edge of the housing 520 can be used to lock and interlock with protrusions on the upper and inner ends of the cover 524. Referring now to Figures 8 through 10, the on / off connector 720 is shown in both the connected (Figure 8) and disconnected (Figures 9 and 10) positions. In these figures, alignment pins 728, 732 and holes 736, 738 are omitted to illustrate other features of the on / off connector 720. The first portion 722 includes openings on its side 822 for fluid connection to channels 810 and 812. Channels 810 and 812 are aligned with the ends of conduits 730 and 744 (Figure 7). Channels 810 and 812 extend into the first portion 722 and then rotate 90° toward the side 826 of the second portion 726 adjacent to the first portion 722 (see channels 870 and 872, respectively). Channels 874 and 876 in the second portion 726 are in fluid communication with channels 870 and 872. A seal (e.g., an O-ring 860 disposed in a recess 862) may be disposed on the abutting surface between the first portion 722 and the second portion 726, surrounding the fluid connection between flow channels 870 and 872 and flow channels 874 and 876. Flow channel 874 is rotated 90° upwards and exits the top surface of the second portion 726. One end of flow channel 874 is connected to conduit 760. Flow channel 876 extends horizontally through the rear wall of the second portion 726 and includes an end in fluid communication with conduit 830. The hole 840 in the first part 722 and the threaded hole 842 in the second part 726 receive threaded fasteners to connect the first part 722 and the second part 726 together. When the sliding and pivot assembly needs to be moved from the closed position to the service position, the first part 722 and the second part 726 of the on / off connector are separated, and the first part 722 is pulled forward and downward as shown in FIG. 9. As can be seen, the conduits 734 and 746 are flexible to allow bending. In other words, fastener 724 (see Figure 7) is removed, and the first portion 722 is pulled into the channel in an outward and downward direction as indicated by arrow 890. The second portion 726, located behind the first portion 722, remains attached to the sliding and pivot assembly and moves in the direction indicated by arrow 892. In some examples, housing 520 can be purged by a gas source 1010, which is connected to housing 520 via a conduit and optional valve 1014, as shown in Figure 10. Housing 520 can be connected to an exhaust system 1022 via a conduit and optional valve 1020. In some examples, the gas source supplies an inert gas, such as molecular nitrogen (N2). In other examples, clean dry air (CDA) is used. Using a purged housing reduces condensation in housing 520. Figures 11-13 show various views of the alignment pins 728 and 732 of the on / off connector 720. Figure 11 shows a cross-sectional view of the on / off connector 720. In the figure, only the alignment pin 732 in the second portion 726 of the on / off connector 720 and the corresponding hole 738 in the first portion 722 of the on / off connector 720 are visible. In the figure, the first and second portions 722 and 726 of the on / off connector 720 are shown mating. Therefore, the alignment pins 728 and 732 of the second portion 726 are shown inserted (i.e., mated) into the corresponding holes 736 and 738 in the first portion 722. When the first portion 722 is mounted onto the second portion 726, the alignment pins 728 and 732 guide the installation and facilitate the insertion and tightening of fasteners into the respective holes 840. Figure 12 shows a top view of the on / off connector 720. In the figure, the alignment pins 728 and 732 of the second portion 726 and the corresponding holes 736 and 738 in the first portion 722 are all visible. The first and second portions 722 and 726 are again shown as mating. Therefore, the alignment pins 728 and 732 of the second portion 726 are shown as inserted (i.e., mating) into the corresponding holes 736 and 738 in the first portion 722. Figure 13 shows a top view of the second part 726, in which alignment pins 728 and 732 are visible. Note that alignment pins 728 and 732 and their corresponding holes 736 and 738 are shown only illustratively as circular. Alternatively, alignment pins 728 and 732 and their corresponding holes 736 and 738 may have any other shape (e.g., square, hexagonal, etc.). The foregoing description is illustrative in nature and is in no way intended to limit the scope of this disclosure, its application, or its uses. The broad teachings of this disclosure can be implemented in various forms. Therefore, while this disclosure includes specific examples, its true scope should not be so limited, as other modifications will become apparent from a study of the drawings, the specification, and the claims of the following patent application. It should be understood that one or more steps in the method may be performed in a different order (or simultaneously) without altering the principles of this disclosure. Furthermore, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of this disclosure may be implemented in any other embodiment and / or combined with features of any other embodiment, even if such combination is not explicitly described. In other words, the embodiments are not mutually exclusive, and permutations and combinations of one or more embodiments remain within the scope of this disclosure. Spatial and functional relationships between components (e.g., between modules, between circuit elements, between semiconductor layers, etc.) are described using a variety of terms, including “connected,” “joined,” “coupled,” “adjacent,” “close,” “on top,” “above,” “below,” and “set.” Unless explicitly described as “direct,” in the foregoing disclosure, when describing the relationship between the first and second components, the relationship may be a direct relationship where no other intermediate components exist between the first and second components, or an indirect relationship where one or more (spatial or functional) intermediate components exist between the first and second components. As used herein, the phrase “at least one of A, B, and C” should be interpreted as meaning the logical “A or B or C” using the non-exclusive logical “OR”, and should not be interpreted as meaning “at least one of A, at least one of B, and at least one of C.” 100: Tool 102: Tool 104: Front-Opening Wafer Transfer Box (FOUP) 106: EFEM and Loading Lock 107: RF Generator 108: Gas Chamber 109: Station 110: Power Lock Tag Panel / System 112: Process Module Bias Assembly 220: Footprint 222: Substrate Transfer Module 224: Robot 226: Robot 228: Buffer 300: RF Generator and Gas Chamber 302: Loading Port 400: Station 402: Sliding and Pivot Shaft assembly 404: Processing chamber 406: Process module bias assembly 408: Housing 410: Part 412: Bowl-shaped part 414: Space 460: Substrate support 470: Heating layer 472: Electrode 474: Electrode 480: Channel 482: Base plate 484: Channel 486: Channel 510: Upper part 514: Lower part 518: Component 520: Housing 524: Cover 610: Vertical housing part 612: Horizontal housing part 614: Fastener 616: Side wall 618: Sidewall 620: Sidewall 622: Sidewall 624: Top Surface 626: Vertical Surface 630: Top Surface 634: Opening 638: Conduit 640: Connector 641: Sealing Material 650: Cap 652: Sidewall 654: Surface 656: Opening 658: Sealing Material 660: Connector 720: Connector 722: First Part 724: Fastener 726: Second Part 728: Alignment Pin 730: Conduit 732: Alignment Pin 734: Guide 736: Pipe 738: Pipe 744: Conduit 746: Conduit 750: Flange 760: Conduit 770: Protrusion 810: Flow channel 812: Flow channel 822: Side 826: Side 830: Conduit 840: Pipe 842: Pipe 860: O-ring 862: Groove 870: Flow channel 872: Flow channel 874: Flow channel 876: Flow channel 890: Arrow 892: Arrow 1010: Gas source 1014: Valve 1020: Valve 1022: Exhaust system W: Width The contents of this disclosure will be more fully understood from the detailed description and accompanying drawings, in which: Figure 1 is a perspective view of the two tools, including the exemplary sliding and pivot assemblies; Figure 2 is a top view of a portion of one of the tools in Figure 1; Figure 3 is a side view of a portion of one of the tools in Figure 1; Figure 4A is a top view of an example plasma processing station including sliding and pivot assemblies; Figure 4 shows a simplified cross-sectional view of an example of a B-series substrate support. Figure 5 is a side view of an example of a processing station according to the present disclosure, wherein the processing station includes a housing for a switching fluid connector. Figure 6 is a perspective view of an example housing of a switch-type connector according to the present disclosure, which is used for conveying cooling fluid to a processing station. Figure 7 is a perspective view of an example of the casing according to the present disclosure, wherein the cover has been removed; Figures 8 and 9 are side views of an example of a switch-type connector according to the present disclosure, showing the switch-type connector in the connected and disconnected positions, respectively. Figure 10 is a cross-sectional side view of an example of a switch-type connector according to this disclosure, in the open position; and Figure 11-13 shows various views of the alignment pins of a through-type connector; In the diagram, reference numbers may be used repeatedly to identify similar and / or identical elements. 100: Tools 104: Front-Opening Wafer Container (FOUP) 106: EFEM and Loading Lock 109: Station 110: Electric Lock Tag Panel / System 220: Area occupied 222: Substrate transfer module 224: Robots 226: Robots 228: Buffer

Claims

1. A substrate processing system comprising: a pivoting assembly configured to allow a substrate support and an RF biasing assembly of a processing chamber to slide from a mating position to a non-matting position; and an on / off connector configured to supply fluid to at least one of the substrate support and the RF biasing assembly, wherein the on / off connector comprises: a first portion including a first fluid channel; a second portion including a second fluid channel; and a fastener removably connecting the first portion to the second portion, wherein the first portion is configured to slide relative to the second portion together with the substrate support and the RF biasing assembly.

2. The substrate processing system of claim 1, wherein when the on / off connector is in the mating position, the first part is connected to the second part.

3. The substrate processing system of claim 1, wherein when the on / off connector is in the non-mating position, the first part is disconnected from the second part.

4. The substrate processing system of claim 1, wherein the pivoting assembly is configured to allow the substrate support and the RF biasing assembly to slide from the mating position to the non-matting position and then pivot to a predetermined angle greater than 90°.

5. The substrate processing system of claim 1 further includes a housing, wherein the on / off connector is disposed within the housing.

6. The substrate processing system of claim 5, wherein the housing is connected to a gas source and purged during operation.

7. The substrate processing system of claim 6, wherein the gas source is purified by molecular nitrogen.

8. The substrate processing system of claim 6, wherein the gas source is cleaned by blowing with clean, dry air.

9. The substrate processing system of claim 1, wherein: The first portion includes a third fluid channel connected to a third conduit; the second portion includes a fourth fluid channel connected to a fourth conduit; and the third fluid channel in the first portion is in fluid communication with the fourth fluid channel in the second portion.

10. The substrate processing system of claim 1, wherein the pivoting assembly is configured to allow the substrate support and the RF biasing assembly to slide from the mating position to the non-matting position relative to other elements of the processing chamber.

11. The substrate processing system of claim 1, wherein the first portion is configured to slide relative to the second portion and other elements of the processing chamber together with the substrate support and the RF bias assembly.

12. The substrate processing system of claim 1, wherein the first portion is located within the second portion relative to one of the sliding directions from the mating position to the non-matting position.

13. The substrate processing system of claim 1, wherein: The first fluid channel is connected to a first conduit; the second fluid channel is connected to a second conduit; and the first fluid channel and the second fluid channel are in fluid communication.

14. The substrate processing system of claim 1, wherein: The first portion of the on / off connector includes a plurality of holes; and the second portion of the on / off connector includes a plurality of alignment pins, which mate with the plurality of holes respectively when the first portion is connected to the second portion.

15. A substrate processing tool, comprising: a device front-end module; a substrate transfer module; a loading lock disposed between the device front-end module and the substrate transfer module; and a number of 2N substrate processing systems as claimed in claim 1, wherein N is an integer from 1 to 5, wherein half of the number of 2N substrate processing systems is disposed on one side of the substrate transfer module, and the other half of the number of 2N substrate processing systems is disposed on the opposite side of the substrate transfer module.

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