Apparatus and method for dispensing fluid material, and cooling device

Abstract

This application provides an apparatus and method for dispensing fluid materials, as well as a cooling device. The apparatus may include: a syringe container configured to contain a fluid material; a dispensing pump in fluid communication with the syringe container and configured to dispense the fluid material onto an object; and a cooling device comprising: a coolant source configured to generate a coolant flow; and a cooling body in fluid communication with the coolant source and configured to direct the coolant flow to the syringe container to cool the fluid material therein.

Description

[Technical Field]

[0001] This application generally relates to semiconductor technology, and more specifically, to an apparatus and method for dispensing fluid materials, and a cooling device. [Previous Technology]

[0002] The semiconductor industry has faced complex integration challenges as consumers demand smaller, faster, and higher-performing electronic devices and increasingly package more functions into a single device. In the manufacture of semiconductor devices, various dispensing devices are used to dispense different fluid materials, such as solder paste, adhesives, thermal pastes, and sealants. However, the viscosity of the fluid material can increase during the dispensing process, causing it to harden and become difficult to dispense from the dispensing device.

[0003] Therefore, there is a need for a device for smoothly distributing fluid materials. [Summary of the Invention]

[0004] The purpose of this application is to provide an apparatus for the smooth dispensing of fluid materials.

[0005] According to one aspect of this application, an apparatus for dispensing a fluid material is provided. The apparatus may include: a syringe container configured to contain a fluid material; a dispensing pump in fluid communication with the syringe container and configured to dispense the fluid material onto an object; and a cooling device comprising: a coolant source configured to generate a coolant flow; and a cooling body in fluid communication with the coolant source and configured to direct the coolant flow to the syringe container to cool the fluid material therein.

[0006] According to another aspect of this application, a cooling apparatus is provided for cooling a fluid material in a container. The cooling apparatus may include: a coolant source configured to generate a coolant flow; and a cooling body in fluid communication with the coolant source and configured to direct the coolant flow to the container to cool the fluid material therein.

[0007] According to another aspect of this application, a method for dispensing a fluid material is provided. The method may include: generating a coolant flow from a coolant source; directing the coolant flow to a syringe container for cooling the fluid material contained therein by a cooling body in fluid communication with the coolant source; and dispensing the fluid material onto an object by a dispensing pump in fluid communication with the syringe container.

[0008] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and do not limit the invention. Furthermore, the drawings incorporated in and forming a part of this specification illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

Implementation Method

[0019] The following detailed description of exemplary embodiments of this application refers to the drawings that form part of the description. The drawings illustrate specific exemplary embodiments in which this application may be practiced. The detailed description, including the drawings, describes these embodiments in sufficient detail to enable those skilled in the art to practice this application. Those skilled in the art can further utilize other embodiments of this application and make logical, mechanical, and other changes without departing from the spirit or scope of this application. Therefore, the reader of the following detailed description should not interpret the description in a limiting sense, and only the appended claims define the scope of the embodiments of this application.

[0020] In this application, unless otherwise specified, the use of the singular includes the plural. In this application, unless otherwise specified, the use of "or" means "and / or". Furthermore, the use of the term "comprising" and other forms such as "including" and "containing" is not restrictive. Additionally, unless otherwise specified, terms such as "element" or "component" cover elements and components comprising one unit, as well as elements and components comprising more than one sub-unit. Furthermore, the section headings used herein are for organizational purposes only and should not be construed as limiting the subject matter described.

[0021] For ease of description, spatial relative terms such as "below," "below," "above," "above," "upper," "lower," "left," "right," "vertical," "horizontal," and "side" may be used to describe the relationship between one element or feature and one or more other elements or features as shown in the diagrams. In addition to the orientations depicted in the diagrams, the spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein may be interpreted accordingly. It should be understood that when an element is referred to as "connected to" or "coupled to" another element, it may be directly connected to or coupled to the other element, or there may be an intermediate element present.

[0022] Referring to Figure 1, a perspective view of an apparatus 100 for dispensing fluid material onto a semiconductor device is shown.

[0023] Device 100 may include a syringe container 104 and a dispensing pump 105 mounted on a body 102. The syringe container 104 may have a generally cylindrical body for containing fluid material and is mounted on the body 102 via a syringe holder 106. As shown in FIG1, the syringe container 104 includes an upper end portion and a lower end portion, and the lower end portion of the syringe container 104 is in fluid communication with the dispensing pump 105 through a hose or tube 108. The dispensing pump 105 may be configured to dispense fluid material onto an object, such as onto a semiconductor device. Device 100 may include a sensor 107 mounted on the syringe container 104 to detect the amount of fluid material in the syringe container 104, for example, to determine whether the fluid material in the syringe container 104 has been used up. Device 100 may further include a controller configured to control the operation of the syringe container 104 and the dispensing pump 105.

[0024] In one example, device 100 may be used to dispense epoxy resin adhesive. During the dispensing process, device 100 may be exposed to numerous heat dissipation devices, causing the temperature of the epoxy resin adhesive to rise. When the temperature of the epoxy resin adhesive rises, its viscosity increases, and therefore the epoxy resin adhesive may be difficult to dispense from the dispensing device.

[0025] To address the above-mentioned problems, some embodiments of this application provide an apparatus for dispensing fluid materials. In this apparatus, a cooling device is introduced into the dispensing device to cool the fluid material or maintain the fluid material at a suitable temperature. Therefore, the fluid material can be dispensed smoothly from the apparatus.

[0026] Referring to FIG2, a perspective view of an apparatus 200 for dispensing fluid materials is shown according to an embodiment of the present application.

[0027] As shown in FIG. 2, the device 200 may include a syringe container 214 and a dispensing pump 215 mounted on a body 212. The syringe container 214 is configured to contain a fluid material, and the dispensing pump 215 is in fluid communication with the syringe container 214 and configured to dispense the fluid material onto an object, such as onto a semiconductor device. The syringe container 214 may be in fluid communication with the dispensing pump 215 through a hose or tube 218. The device 200 may include a sensor 217 mounted on the syringe container 214 to detect the amount of fluid material in the syringe container 214, for example, to determine whether the fluid material in the syringe container 214 has been used up.

[0028] In some embodiments, device 200 can be used to dispense epoxy resin adhesive, that is, the fluid material contained in syringe container 214 can be epoxy resin adhesive. In one example, in order to smoothly dispense epoxy resin adhesive from device 200, the temperature of epoxy resin adhesive in syringe container 214 should be maintained at 23 ± 0.2°C. However, this application is not limited thereto. In some other embodiments, device 200 can be used to dispense other fluid materials, such as sealants, fluxes, solder pastes, thermal pastes, oils, inks, silicones, and any fluid material that may need to be maintained at an appropriate temperature, such as a temperature that will maintain its viscosity within an appropriate range.

[0029] The device 200 shown in Figure 2 may have a similar structure and configuration to the device 100 shown in Figure 1. Similar or identical parts between device 200 and device 100 will not be repeated herein. Unlike the device 100 shown in Figure 1, the device 200 shown in Figure 2 further includes a cooling device 220 to cool the fluid material in the syringe container 214 or to maintain the fluid material at an appropriate temperature. As shown in Figure 2, the cooling device 220 may include a coolant source 230 and a cooling body 240. The coolant source 230 is configured to generate a coolant flow, and the cooling body 240 is in fluid communication with the coolant source 230 and configured to direct the coolant flow to the syringe container 214 to cool the fluid material therein.

[0030] Referring to Figures 3A and 3B, perspective views and schematic diagrams of a coolant source 230 are shown according to embodiments of the present application. The coolant source 230 may be a vortex tube, and the coolant flow is a cooling airflow generated by the vortex tube.

[0031] As shown in Figures 3A and 3B, the vortex tube includes an inlet 231, a first outlet 232, and a second outlet 233 that intersect each other at the vortex spin chamber 234. When the vortex tube is supplied with a flow of compressed air (e.g., typically 80 to 100 PSIG (5.5 to 6.9 bar)) through the inlet 231, the air flow is directed into the vortex spin chamber 234 to generate a helical vortex at a speed of approximately 1,000,000 rpm. The helical vortex can flow to the first outlet 232, where a control valve 235 is housed. The control valve 235 allows a portion of the air to escape from the first outlet 232 while retaining the rest within the tube. The remaining air that does not escape can continue to spin, flow in the opposite direction, and return to the second outlet 233.

[0032] As shown in Figure 3B, the internal airflow (i.e., the remaining air returning to the second outlet 233) can release kinetic energy in the form of heat to the external airflow (i.e., the portion of air escaping from the first outlet 232). Therefore, the external airflow exits the vortex tube from the first outlet 232 as a hot airflow, and the internal airflow exits the vortex tube from the second outlet 233 as a cold airflow. In other words, the vortex tube can separate compressed air into two airflows: a hot airflow and a cold airflow. Depending on the shape of the vortex tube and the amount of compressed air input, the temperature of the hot airflow can rise to, for example, 200°C, and the temperature of the cold airflow can drop to, for example, -50°C. The temperature of the cold airflow can be easily adjusted by regulating the amount of compressed air input into the vortex tube. Since the vortex tube has no moving parts, the coolant source 230 is reliable and inexpensive, and no electrical components are required to generate the coolant flow.

[0033] In the above embodiments, the coolant source 230 is a vortex tube, and the coolant flow is a cooling air flow. However, this application is not limited thereto. In some other embodiments, the coolant source 230 may have other structures and configurations, and the coolant flow may be a liquid flow.

[0034] Figures 4A, 4B, and 4C illustrate another example of a device 200 for dispensing fluid materials according to an embodiment of the present application. Specifically, Figure 4A shows a cross-sectional view of the device 200, Figure 4B shows a cross-sectional view of the cooling body 240, and Figure 4C shows a perspective view of the syringe container 214.

[0035] The cooling body 240 may surround at least a portion of the syringe container 214. For example, as shown in Figures 4A and 4B, the cooling body 240 may have a rectangular or cylindrical shape. The cooling body 240 has a through-hole extending in the height direction or vertically, and the syringe container 214 is disposed in the through-hole.

[0036] Referring to Figures 4A and 4B, the cooling body 240 includes a first channel 242 and a second channel 244. The first channel 242 is formed inside the cooling body 240 and extends in the height direction of the cooling body 240.

[0037] The upper end of the first channel 242 is fluidly connected to the coolant source 230 to receive the coolant flow 280, and then guides the coolant flow 280 downward to the lower portion of the cooling body 240. A second channel 244 is formed on the inner surface of the cooling body 240 and adjacent to the syringe container 214. The second channel 244 is in fluid communication with the first channel 242 at the lower portion of the cooling body 242 via the lower end of the first channel 242. The second channel 244 is configured to guide the coolant flow 280 upward along the outer surface of the syringe container 241.

[0038] In some embodiments, the second channel 244 is a spiral groove formed on the inner surface of the cooling body 240. As shown in FIG4C, the spiral groove can increase the contact area between the coolant flow 280 and the syringe container 214, thereby improving cooling efficiency. It is understood that the second channel 244 may have other shapes, such as a mesh shape. It is understood that the cooling body 240 shown in FIG4A and FIG4B is merely exemplary, and the present application is not limited thereto. In some other embodiments, the cooling body 240 may have other structures and configurations.

[0039] Referring back to FIG2, the cooling device 220 may further include a temperature sensor (not shown) and a display unit 250. The temperature sensor may be mounted on the syringe container 214 and is configured to detect the temperature of the fluid material contained in the syringe container 214. The display unit 250 is configured to obtain the temperature of the fluid material directly from the temperature sensor or indirectly via a controller and to display the temperature of the fluid material. In this way, the operator of the device 200 can know the state of the fluid material, or more precisely, its temperature. Therefore, the operator can adjust the temperature of the cooling air, for example, by adjusting the amount of compressed air input to the vortex tube shown in FIG3A and FIG3B, in order to maintain the fluid material at an appropriate temperature. In some other examples, an automatic adjustment mechanism or algorithm may be used to adjust the amount of compressed air entering the vortex tube and thus adjust the temperature of the fluid material, for example, depending on the type of fluid material to be dispensed. It is understood that the above embodiments are merely exemplary and the present application is not limited thereto. In some other embodiments, the cooling device 220 may include a viscosity sensor for detecting the viscosity of the fluid material contained in the syringe container 214, or a pressure sensor for determining whether the fluid material has solidified, in order to determine whether the fluid material is within an appropriate temperature range.

[0040] In some embodiments, the device 200 may further include a controller (not shown) configured to control the operation of the syringe container 214, the dispensing pump 215, and the cooling device 220. For example, the controller may be electrically coupled to a temperature sensor and a coolant source 230, such that the controller can regulate the temperature of the coolant flow in response to a temperature signal received from the temperature sensor (e.g., by adjusting the amount of compressed air input to the vortex tube shown in FIG. 3A). The controller can automatically control the temperature of the fluid material using temperature information from the temperature sensor without human intervention.

[0041] In some embodiments, the device 200 may further include a heating device (not shown) configured to heat the fluid material contained in the syringe container 214. Therefore, the controller may be configured to control the cooling device 220 to cool the fluid material contained in the syringe container 214 when the temperature is above a predetermined temperature, and to control the heating device to heat the fluid material contained in the syringe container 214 when the temperature is below a predetermined temperature, making it easier to maintain the temperature of the fluid material at the predetermined temperature. In some embodiments, the heating device may include a resistance heater surrounding the exterior of the syringe container 214. In some embodiments, the heating device may receive a flow of hot air from a first outlet 232 of the vortex tube to heat the fluid material contained in the syringe container 214. For example, the controller may control the heating and cooling devices to allow a flow of hot air from the first outlet 232, a flow of cold air from the second outlet 233, or a mixture of the hot and cold air flows into the cooling body 240. The controller may adjust the temperature of the fluid material contained in the syringe container 214 by adjusting the ratio of the flow rates of the hot and cold air entering the cooling body 240.

[0042] In experiments using the dispensing device according to an embodiment of the present application, although the external ambient temperature of the device 200 varies significantly at about 26°C, the temperature of the epoxy resin adhesive contained in the syringe container 214 of the device 200 can be precisely maintained at 23°C, thereby ensuring that the epoxy resin adhesive is successfully dispensed from the device 200.

[0043] According to another aspect of this application, a method for dispensing fluid materials is provided. The method may be implemented, for example, by the dispensing device shown in FIG2.

[0044] Referring to FIG5, a flowchart illustrating a method 500 for dispensing fluid material according to an embodiment of the present application is shown. As shown in FIG5, in block 510, method 500 may begin by generating a coolant flow through a coolant source, such as coolant source 230 shown in FIG2, 3A and 3B. Subsequently, in block 520, a cooling body in fluid communication with the coolant source may be used to direct the coolant flow to a syringe container containing the fluid material. For example, cooling body 240 shown in FIG2, 4A and 4B may be used to direct the coolant flow to syringe container 214 shown in FIG2, 4A and 4C to cool the fluid material contained therein. Then, in block 530, a dispensing pump in fluid communication with the syringe container may be used to dispense the fluid material onto an object. For example, the dispensing pump shown in FIG2 may be used to dispense the fluid material onto an object.

[0045] In some embodiments, the coolant source may include a vortex tube, the coolant flow is a cooling air flow generated by the vortex tube, and the method 500 may include: adjusting the temperature of the cooling air by adjusting the amount of compressed air input into the vortex tube. In some embodiments, the fluid material may include an epoxy resin adhesive.

[0046] Further details regarding the method can be found in the devices and apparatus described in the above embodiments, and will not be described in detail herein.

[0047] The discussions herein contain numerous illustrative diagrams showing various parts of apparatuses and methods for distributing fluid materials and cooling devices. For clarity, such diagrams do not show all aspects of every example apparatus. Any example apparatus and / or method provided herein may share any or all characteristics with any or all other apparatus and / or method provided herein.

[0048] Various embodiments have been described herein with reference to the accompanying drawings. However, it will be apparent that various modifications and changes can be made thereto, and other embodiments can be implemented, without departing from the broader scope of the invention as set forth in the appended claims. Furthermore, other embodiments will be apparent to those skilled in the art upon consideration of the description and practice of one or more embodiments of the invention disclosed herein. Therefore, this application and the examples herein are intended to be considered merely exemplary, wherein the true scope and spirit of the invention are indicated by the following list of exemplary claims. [Simplified Explanation of the Diagram]

[0009] The drawings referenced herein form a part of this specification. The features shown in the drawings illustrate only some embodiments of this application, and not all embodiments of this application, unless the detailed description clearly indicates otherwise, and the reader of this specification should not infer the contrary.

[0010] Figure 1 is a perspective view showing a device for dispensing fluid material onto a semiconductor device.

[0011] FIG2 is a perspective view showing an apparatus for dispensing fluid materials according to an embodiment of the present application.

[0012] FIG3A is a perspective view showing a coolant source according to an embodiment of the present application.

[0013] Figure 3B is a schematic diagram illustrating the principle of a coolant source according to an embodiment of the present application.

[0014] FIG4A is a cross-sectional view showing an apparatus for dispensing fluid materials according to an embodiment of the present application.

[0015] FIG4B is a cross-sectional view showing a cooling body according to an embodiment of the present application.

[0016] FIG4C is a perspective view showing a syringe container according to an embodiment of the present application.

[0017] Figure 5 is a flowchart illustrating a method for dispensing fluid materials according to an embodiment of this application.

[0018] Throughout the diagram, the same diagram symbols will be used to refer to the same or similar parts.

Claims

1. An apparatus for dispensing fluid materials, wherein, The device includes: a syringe container configured to contain a fluid material; a dispensing pump in fluid communication with the syringe container and configured to dispense the fluid material onto an object; and a cooling device including: a coolant source configured to generate a coolant flow; and a cooling body in fluid communication with the coolant source and configured to direct the coolant flow to the syringe container to cool the fluid material therein.

2. The device according to claim 1, wherein, The coolant source includes a vortex tube, and the coolant flow is a cooling air flow generated by the vortex tube.

3. The device according to claim 2, wherein, The vortex tube is configured to regulate the temperature of the cooling air by adjusting the amount of compressed air input into the vortex tube.

4. The device according to claim 1, wherein, The cooling body surrounds at least a portion of the syringe container and includes: a first channel formed inside the cooling body and extending in the height direction of the cooling body to guide the coolant flow downward from the coolant source to a lower portion of the cooling body; and a second channel formed on an inner surface of the cooling body and adjacent to the syringe container, wherein the second channel is in fluid communication with the first channel at the lower portion of the cooling body and is configured to guide the coolant flow in the second channel and upward along the outer surface of the syringe container.

5. The device according to claim 4, wherein, The second channel is a spiral groove formed on the inner surface of the cooling body.

6. The device according to claim 1, wherein, The cooling device further includes a temperature sensor, which is mounted on the syringe container and configured to detect the temperature of the fluid material contained in the syringe container.

7. The device according to claim 6, wherein, The cooling device further includes a display unit configured to obtain the temperature of the fluid material from the temperature sensor and display the temperature of the fluid material to the operator.

8. The device according to claim 1, wherein, The device further includes: a heating device configured to heat the fluid material contained in the syringe container.

9. The device according to claim 1, wherein, The fluid material includes an epoxy resin adhesive.

10. A cooling device for cooling fluid materials in a syringe container, wherein, The cooling device includes: a coolant source configured to generate a coolant flow; and a cooling body in fluid communication with the coolant source and configured to direct the coolant flow to a syringe container to cool the fluid material therein.

11. The cooling device according to claim 10, wherein, The coolant source includes a vortex tube, and the coolant flow is a cooling air flow generated by the vortex tube.

12. The cooling device according to claim 11, wherein, The vortex tube is configured to regulate the temperature of the cooling air by adjusting the amount of compressed air input into the vortex tube.

13. The cooling device according to claim 10, wherein, The cooling body surrounds at least a portion of the syringe container and includes: a first channel formed inside the cooling body and extending in the height direction of the cooling body to guide the coolant flow downward from the coolant source to a lower portion of the cooling body; and a second channel formed on an inner surface of the cooling body and adjacent to the syringe container, wherein the second channel is in fluid communication with the first channel at the lower portion of the cooling body and is configured to guide the coolant flow in the second channel and upward along the outer surface of the syringe container.

14. The cooling device according to claim 13, wherein, The second channel is a spiral groove formed on the inner surface of the cooling body.

15. The cooling device according to claim 10, wherein, The cooling device further includes: a temperature sensor, wherein the temperature sensor is mounted on the syringe container and configured to detect the temperature of the fluid material contained in the syringe container.

16. The cooling device according to claim 15, wherein, The cooling device further includes: a display unit, wherein the display unit is configured to obtain the temperature of the fluid material from the temperature sensor and display the temperature of the fluid material to an operator.

17. A method for dispensing fluid materials, wherein, The method includes: generating a coolant flow from a coolant source; directing the coolant flow to a syringe container for cooling the fluid material contained therein by a cooling body in fluid communication with the coolant source; and dispensing the fluid material onto an object by a dispensing pump in fluid communication with the syringe container.

18. The method according to claim 17, wherein, The coolant source includes a vortex tube, the coolant flow is a cooling air flow generated by the vortex tube, and the method further includes: adjusting the temperature of the cooling air by adjusting the amount of compressed air input into the vortex tube.

19. The method according to claim 17, wherein, The fluid material includes an epoxy resin adhesive.

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