Lead frame and discrete component assembly using thereof

Abstract

A leadframe includes a leadframe body and a plurality of connecting pins. The connecting pins are disposed on the outer periphery of the leadframe body, each connecting pin including a connecting portion and a pin portion, wherein the connecting portion is located between the leadframe body and the pin portion, and each pin portion includes at least one groove, the depth of which is 35% to 60% of the thickness of the pin portion. Forming at least one groove on the pin portion helps to increase the contact area between the solder and the pin, thereby improving the overall bonding strength.

Claims

1. A conductor frame, comprising: a conductor frame body; and a plurality of connecting pins disposed on the outer periphery of the conductor frame body, each connecting pin including a connecting portion and a pin portion, wherein the connecting portion is located between the conductor frame body and the pin portion, and each pin portion including at least one groove, the depth of the groove being 35 to 60% of the thickness of the pin portion, and a surface of the connecting pin having an average roughness (Ra) of 0.5 to 5.

2. The conductor frame as claimed in claim 1, wherein the surface of the connecting pin has an average roughness (Ra) of 1 to 3.

2.

3. The lead frame as described in claim 1, wherein the length of the groove is 70% to 85% of the length of the pin portion.

4. The lead frame as described in claim 1, wherein the pin portion includes a plurality of grooves.

5. The lead frame as claimed in claim 1, wherein each of the connecting pins comprises a metal body and a surface plating having a thickness of 1 to 25 μm.

6. The lead frame as claimed in claim 5, wherein the metal body is copper (Cu), and the surface plating comprises at least one plating layer, each of which is selected from a combination of nickel (Ni), platinum (Pt), palladium (Pd), copper (Cu), gold (Au), silver (Ag), lead (Pb), tin (Sn), or alloys thereof.

7. A discrete component assembly comprising: a leadframe, including: a leadframe body; and a plurality of connection pins disposed on the outer periphery of the leadframe body, each connection pin including a connection portion and a pin portion, wherein the connection portion is located between the leadframe body and the pin portion, and each pin portion includes at least one groove, the depth of the groove being 35% to 60% of the thickness of the pin portion, and a surface of the connection pin having an average roughness (Ra) of 0.5 to 5; at least one electronic component connected to the leadframe body; and a packaging unit encapsulating the leadframe body and the at least one electronic component, wherein at least a portion of the connection portion and the pin portion of each connection pin are exposed in the packaging unit.

8. The discrete component assembly as claimed in claim 7, wherein the surface of the connecting pin has an average roughness (Ra) of 1 to 3.

2.

9. The discrete component assembly as claimed in claim 7, wherein the length of the groove is 70% to 85% of the length of the pin portion.

10. The discrete component assembly as claimed in claim 7, wherein the pin portion includes a plurality of recesses.

11. The discrete component assembly as claimed in claim 7, wherein the pin portion includes a metal body and a surface plating having a thickness of 1 to 25 μm.

12. The discrete component assembly as claimed in claim 11, wherein the metal body is copper (Cu) and the surface plating comprises at least one plating layer, each of the plating layers being selected from a combination of nickel (Ni), platinum (Pt), palladium (Pd), copper (Cu), gold (Au), silver (Ag), lead (Pb), tin (Sn), or alloys thereof.

Images