Integrated display module and system

Abstract

Systems, methods, apparatuses, and devices provide an integrated display module or device comprising a liquid crystal assembly with highly integrated components, said highly integrated components including display driving circuitry and backplane circuitry. These methods provide packages for displays and microdisplays with small sizes and, in multiple aspects, provide access to virtual and augmented reality devices.

Description

[Technical Field]

[0001] This disclosure relates to a display. In particular, this disclosure relates to a system and method for providing an integrated display module having highly integrated components for display packaging, wherein the display includes a small display and a micro display. [Previous Technology]

[0002] Displays and microdisplays are used in many different applications. These applications include high-brightness projection systems, augmented reality (AR) or virtual reality (VR) headsets, automotive heads-up displays (HUDs), and mobile applications. These different applications can have significant differences in the size and weight constraints of display devices and related components. In mobile systems that include AR systems, VR systems, and head-mounted displays, size and weight are crucial for enabling the system to be worn comfortably for extended periods. The available volume of electronic and optical components in these systems is limited. Furthermore, the complexity of the display integrated circuitry (IC) can limit performance. [Summary of the Invention]

[0003] In one or more embodiments, the display device includes: a first substrate and a second substrate, wherein a liquid crystal material is disposed between the two, and wherein the second substrate includes or is coupled to an array of a plurality of pixel elements; a base circuit includes pixel circuits, wherein at least one of the pixel circuits is disposed and integrated in the second substrate, and wherein the pixel circuits are electrically coupled to at least one of the plurality of pixel electrodes; and a display driving circuit, wherein at least one of the display driving circuits is disposed and integrated in the second substrate, and wherein the display driving circuits are electrically coupled to the pixel circuits.

Implementation Method

[0006] Various examples of the present invention include systems, methods, apparatuses and devices for providing integrated displays with highly integrated components for use in packaging displays that include small displays and micro displays.

[0007] In the following detailed description, reference is made to the accompanying drawings, which form a part thereof, and embodiments that can be practiced are illustrated by way of illustration. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope. Therefore, the following detailed description should not be considered limiting, and the scope of the embodiments is defined by the appended patent claims and their equivalents.

[0008] Various operations may be described in a manner that helps to understand the embodiments as a plurality of discrete operations; however, the order of description should not be construed as implying that these operations are sequentially related.

[0009] This description may use perspective-based descriptions, such as up / down, back / front, and top / bottom. Such descriptions are for convenience of discussion only and are not intended to limit the application of the disclosed embodiments.

[0010] The terms "coupling" and "connection" and their derivatives may be used. It should be understood that these terms are not intended to be synonyms with each other. Rather, in certain embodiments, "connection" may be used to indicate that two or more elements are in direct physical contact with each other. "Coupling" may mean that two or more elements are in direct physical contact with each other. However, "coupling" may also mean that two or more elements are not in direct contact with each other, but still cooperate or interact with each other.

[0011] For the purposes of description, terms in the form of "A / B", "A or B" or "A and / or B" represent (A), (B), or (A and B). For the purposes of illustration, terms in the form of "at least one of A, B, and C" represent (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C). For the purposes of description, terms in the form of "(A)B" represent (B) or (AB), i.e., A is an optional element.

[0012] The terms "one embodiment" or "multiple embodiments" may be used in the description, which may refer to one or more of the same or different embodiments respectively. In addition, the terms "comprising," "including," "having," etc., used with respect to embodiments are synonymous and are generally intended to be "open" terms (e.g., the term "comprising" should be interpreted as "including but not limited to," the term "having" should be interpreted as "at least having," the term "including" should be interpreted as "including but not limited to," etc.).

[0013] Regarding the use of any plural and / or singular terms in this document, those skilled in the art can convert plural to singular and / or singular to plural according to the appropriate context and / or application. For clarity, various singular / plural substitutions may be explicitly set forth herein.

[0014] The detailed features and advantages of the present invention are described below in the embodiments. The content is sufficient to enable anyone skilled in the art to understand the technical content of the present invention and implement it accordingly. Based on the content disclosed in this specification, the scope of the patent application, and the drawings, anyone skilled in the art can easily understand the relevant objectives and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention, but are not intended to limit the scope of the present invention in any way.

[0015] The various means described herein provide devices, structures, and apparatuses that can be advantageously used in and housed in devices such as viewing glasses, smart glasses, or headphones. These devices, structures, and apparatuses are small enough to be fitted into the viewing glasses or headphones, and are lightweight, making them particularly suitable for use in these or similar devices.

[0016] Furthermore, observation or smart glasses, headphones, or other devices sometimes have curved or non-linear dimensions and unique shape factors. Several approaches in this invention provide structured IDMs that can be used in devices with non-linear shape factors or in devices where the IDM needs to be curved. In these respects, the IDMs described herein can be easily customized and can be installed in devices of various sizes.

[0017] As described above, these types of devices sometimes have parts that must bend or conform to movement or pressure. Therefore, some parts of the IDM need to bend. Despite the need for bending, some parts of the IDM need to maintain a certain rigidity or stability, for example, to support integrated circuitry that presents an image to the user. The IDM provided herein provides both flexible and rigid parts, such that when some parts of the device (in which the IDM is incorporated) bend, the IDM bends while simultaneously maintaining rigidity, for example, to support integrated circuitry.

[0018] In one embodiment, a display device for displaying images to a user in a virtual or augmented reality system includes flexible printed circuitry, at least one printed circuit board, and a liquid crystal assembly. The liquid crystal assembly includes a single silicon die (containing one or more integrated circuits), liquid crystal material, and a glass cover. The single silicon die includes display driving circuitry and baseboard circuitry (e.g., baseboard logic circuitry and / or control circuitry, such as pixel control circuitry). Pixels are driven to display data, such as image data. The image data can be still images or moving images (e.g., video data) and the images are collectively presented to the user in a display area.

[0019] The flexible printed circuit includes multiple wires. A "wire" includes a conductive element for transmitting data such as image data and control data. The multiple wires provide an electrical connection between the host device and the IDM. The data connection includes video content, and the control connection includes commands from the host device and the IDM (and in some examples, commands from the IDM to the host device).

[0020] The at least one printed circuit board is coupled to the flexible printed circuit. As used herein, "coupled" can mean two or more components in direct physical contact. However, "coupled" can also mean two or more components that are not in direct contact with each other, but still cooperate or interact with each other.

[0021] In one embodiment of the present invention, the structure of the at least one printed circuit board is more rigid than that of a flexible printed circuit (e.g., a flexible printed circuit cable or a circuit integrated into a flexible material). Specifically, the rigidity of the at least one printed circuit board is greater than that of a flexible printed circuit. Therefore, the display device is more rigid in the area where the printed circuit board is located. Generally, the area of ​​the display device where a printed circuit board is located is more rigid than the area where no printed circuit board is located.

[0022] The liquid crystal assembly also includes a display area (i.e., an area corresponding to the area where at least a portion of the liquid crystal material exists). The display area displays patterned light (e.g., an image).

[0023] In one embodiment of the present invention, the liquid crystal assembly includes a silicon wafer, a liquid crystal layer (disposed between an alignment layer and an electrode layer), and a glass cover. These components are assembled together to form a single wafer, device, or unit. The silicon wafer includes display driving circuitry and a baseboard circuit. The display driving circuit receives video data from an external source, parses the data, and forwards the data to the baseboard circuit. The baseboard circuit includes pixel driving circuitry and pixel logic, which together form a plurality of pixels. The pixels are driven to display video data and collectively present an image to the user in a display area. The display area is partially defined by the liquid crystal layer and its width and length.

[0024] In one embodiment of the present invention, the display driving circuit and the base circuit are integrated into a single silicon chip, which is physically separated from other components of the display device. The single silicon chip is disposed on a first side of the display device. In another embodiment, the display driving circuit and the base circuit are each formed as separate integrated circuits and disposed on a first side of the device.

[0025] The second side of the display device is arranged and formed in a relationship parallel or substantially parallel to the first side. The second side is at least partially covered with material to provide a flat or substantially flat surface. The flat surface facilitates the attachment of other components or devices and facilitates the handling and retention of the device during the manufacturing process.

[0026] In one embodiment, the at least one printed circuit board is arranged to extend along and parallel to the second side.

[0027] In one embodiment of the present invention, the at least one printed circuit board includes a first printed circuit board and a second printed circuit board. In a plurality of orientations, the first printed circuit board extends along a first side, the second printed circuit board extends along a second side, and a flexible printed circuit is disposed between the first printed circuit board and the second printed circuit board.

[0028] In one embodiment, the at least one printed circuit board includes a single printed circuit board, and the single integrated circuit is directly coupled to the single printed circuit board rather than the flexible printed circuit. For example, the single printed circuit board and the flexible printed circuit may be coupled at or near their ends.

[0029] In one embodiment, the display device further includes a microcontroller integrated circuit for managing the operation of the display device. In several examples, the microcontroller integrated circuit is used to perform one or more functions, including controlling the sequence of power supply voltage to the power supply of the display device, storing control programs, and responding to events external to the display device. Other examples of the microcontroller's functionality are possible.

[0030] In one embodiment of the present invention, the conductive power line transmitting power and voltage and the display device further include a power management device coupled to the conductive power line. The power management device is used to convert an external voltage source received through the conductive power line from an external power source or power supply into an internal voltage. In some aspects, the power management device is disposed on a second side of the device.

[0031] In other examples, the display device is located in viewing glasses or smart glasses, or in headphones. Other examples of devices equipped with the device are possible.

[0032] In one embodiment, the virtual or augmented reality display system includes an optical engine, a host, and an integrated display device or module (IDM).

[0033] The optical engine is used to generate, produce, direct, and / or control light presented to or exiting the integrated display device. The host of the display system (e.g., a virtual or augmented display system) is used to provide images or image data.

[0034] The IDM is coupled to the host. The IDM includes at least one printed circuit board and a liquid crystal assembly, and may or may not include flexible printed circuitry. The liquid crystal assembly includes, for example, a single silicon wafer (or one or more integrated circuits), liquid crystal material, and a glass cover. In one embodiment of the invention, these components are assembled together and integrated into a single device, wafer, or unit. In one embodiment of the invention, the single silicon device includes display driving circuitry and baseboard circuitry (e.g., baseboard logic and / or control circuitry).

[0035] The flexible printed circuit includes multiple conductive elements, such as wires. The wires contain data and control connections. The wires provide an electrical connection between the host and the IDM. In one embodiment of the invention, the flexible printed circuit transmits bidirectional data between the host and / or the IDM. In one embodiment of the invention, the flexible printed circuit transmits data (e.g., image and video data or content) and / or control data (e.g., commands) from the host to the IDM. In one embodiment of the invention, the flexible printed circuit transmits data from the IDM (i.e., its internal components or circuitry) to the host device. In one embodiment of the invention, the at least one printed circuit board is coupled to the flexible printed circuit. The at least one printed circuit board has a more rigid structure than the flexible circuit board. For example, it is made of fiberglass, while the flexible circuit board is made of a flexible polymer.

[0036] In multiple aspects, the display driving circuit and the baseboard circuit are integrated into a single silicon chip, which is physically separated from other components of the display device. The single silicon chip is disposed on the first side of the display device. In another embodiment, the display driving circuit and the baseboard circuit are each formed as separate integrated circuits and disposed on the first side of the device.

[0037] The second side of the display device is arranged and formed in a relationship parallel or substantially parallel to the first side. The second side is at least partially covered with material to provide a flat or substantially flat surface. The flat surface facilitates the attachment of other components or devices and facilitates the handling and retention of the device during the manufacturing process.

[0038] In one embodiment, a method of manufacturing a display system includes providing a flexible printed circuit and at least one printed circuit board. The flexible printed circuit is coupled to the at least one printed circuit board to form a structure, system, or device.

[0039] Holes or vias are selectively drilled through the at least one printed circuit board and the flexible printed circuit to provide electrical connections between the silicon wafer coupled to the flexible printed circuit and the components attached to the printed circuit board, as well as an improved thermal path for heat to escape from the wafer. The holes are plated with or filled with a conductive material.

[0040] Various connections are associated with these interconnections based on their colocation or position relative to the PCB, enabling small form factor presentation. These connections include flexible printed circuits to the printed circuit board, the base of the LCA as a silicon substrate with embedded pixel elements (e.g., aluminum mirror elements), mirror elements electrically coupled to baseboard circuitry (e.g., pixel circuitry), silicon substrate (including baseboard circuitry to the PCB, silicon pixel circuitry with baseboard circuitry), and power circuitry electrically coupled to the chip and chip components.

[0041] A liquid crystal assembly is formed and includes a silicon wafer, a glass cover, and a liquid crystal layer. These components are integrated together to form a single device. The liquid crystal layer is disposed between a transparent electrode layer and an alignment layer. The liquid crystal assembly forms a display area with respect to the liquid crystal layer.

[0042] A silicon wafer is formed to include a display driving circuit and a baseboard circuit. The display driving circuit is arranged to drive the baseboard circuit with data and commands, and the baseboard circuit is arranged to drive the liquid crystal layer.

[0043] The liquid crystal component is coupled to a first side of the at least one printed circuit board. An electronic component (or multiple electronic components) is coupled to a second, opposite side of the at least one printed circuit board. The coupling is achieved using at least one via.

[0044] In one embodiment of the present invention, components of a liquid crystal assembly are assembled together to form a single integrated device or circuit (e.g., a single integrated circuit, a standalone circuit, a circuit device, or a chip). In one embodiment of the present invention, components of, for example, display driving circuitry and baseboard circuitry may be included in a plurality of separate integrated circuits (e.g., standalone circuits, circuit devices, integrated circuits, or chips).

[0045] In one embodiment of the present invention, a cover glass coated with a transparent conductive material or at least a partially transparent conductive material is applied to or at least to a region of the LCA, the region corresponding to the location where at least a portion of the liquid crystal material of the liquid crystal assembly or single liquid crystal integrated circuit is present (here referred to as the display area).

[0046] In one embodiment of the invention, a second side of the structure is overmolded to encapsulate one or more components on the second side of the structure (i.e., the side opposite to the liquid crystal component or integrated circuit), and the overmolded component or portion provides at least a portion of a flat or substantially flat surface for attachment of other components or devices (e.g., including but not limited to power conversion circuitry) and, for example, device handling and retention during IDM manufacturing. Those skilled in the art to which this invention pertains will understand that an IDM or display system can be included in any system exhibiting modulated electromagnetic radiation (e.g., light) or coupled to (e.g., electrically and / or optically) any device exhibiting modulated electromagnetic radiation (e.g., light).

[0047] Referring to FIG1, the display system (e.g., virtual reality, augmented reality, mixed reality, or other display system 100) includes an optical engine 102, a host platform 104, flexible circuitry (e.g., flexible printed circuitry), and an integrated display module or device (IDM) 106. The display system 100 may be disposed in a consumer device 108, such as viewing glasses, smart glasses, or headphones. Other example devices are also possible. It should be understood that the components shown in FIG1 are not drawn or shown to scale. For example, the consumer device 108 may have various shapes or outlines not shown in FIG1.

[0048] The optical engine 102 is used to guide, direct, and / or control the light presented to the integrated display device 106. In various examples, the optical engine 102 includes light-generating elements such as LEDs or lasers, prisms, optical mirrors, polarizers, beam splitters, and / or other optical components for generating, guiding, controlling, and / or presenting light. Further configurations of the optical engine are known to those skilled in the art to which this application pertains and are therefore not described further here. In one example, the optical engine 102 may be an Iris Engine device manufactured by Compound Photonics US Corp.

[0049] The host platform 104 includes a CPU (or processing unit) 105 and memory 107. As illustrated in FIG1, the host can transmit data 109 (e.g., image or image data, video or video data) or commands 111 to the integrated display device or model 106. The CPU 105 (e.g., application processor) executes multiple applications or instructions 107a (e.g., software) stored in the memory device 107 of the host platform 104. The multiple instructions 107a can perform multiple functions, such as transmitting data to the IDM 106 through circuits (e.g., flexible circuits), or combining video data 109 with commands 111 and then transmitting the combined data and commands to the IDM 106.

[0050] In one embodiment of the present invention, the host platform 104 is disposed within the consumer device 108.

[0051] In another embodiment of the present invention, the host platform 104 may be located outside the consumer device 108 and may be, for example, a mobile device, such as a smartphone, tablet, laptop, head-up display system, head-mounted device or hybrid device (or some combination thereof).

[0052] In one embodiment of the present invention, the image, image data, and / or video data 109 are received by real-time data software or software module (instruction 107a), and the real-time data software or software module (instruction 107a) combines the data with commands parsed from a master sequence file containing the desired driving order. In one embodiment of the present invention, the data combined with the commands is combined data output from a data source (e.g., host platform 104) and transmitted to the IDM 106. The integrated display module or device (IDM) 106 is coupled to an optical engine and at least one processing device. In one embodiment of the present invention, the IDM 106 is electrically coupled to a flexible printed circuit, and the IDM includes at least one printed circuit board and a liquid crystal assembly. These components will be described and presented in detail elsewhere in this description.

[0053] In one example of the operation of the system in FIG1, an image from the host platform 104 is received by the display driver of the IDM 106 via flexible printed circuit 202 and displayed on a display area in part as light generated by, received from, and / or directed by the optical engine 102. A human user views the image on the display of the IDM 106 through or using the optical engine 102. In one embodiment of the invention, the liquid crystal component outputs modulated electromagnetic radiation, such as light.

[0054] Referring instead to Figures 2A and 2B (collectively referred to as Figure 2), a block diagram illustrating the connections and components of an embodiment of an integrated display module or device (IDM) 200 according to the present invention is shown. The IDM 200 includes at least one printed circuit board (PCB, not shown) coupled to a flexible circuit or flexible printed circuit (FPC) 202. The PCB is arranged such that the IDM 200 has a rigid region 204, and the IDM 200 is electrically coupled to a less rigid region or surface 206. In one embodiment of the invention, the IDM may include or be integrated with a less rigid region, wherein the less rigid region is, for example, a flexible circuit or flexible printed circuit (FPC) 202.

[0055] Surface 206 includes a power connector 292, a video data connector 296 (e.g., a MIPI DSI bus), and a control signal connector 294 (e.g., for transmitting USB, SPI, or I2C buses and interrupt signals). In one embodiment of the invention, surface 206 is an area of ​​IDM 200 providing electrical connections from host platform 104 (as described above with respect to FIG. 1) via flexible circuitry or flexible printed circuit (FPC) 202. In one embodiment, surface 206 may be electrically coupled to an external power supply 290. In one embodiment, the power supply may be internal to IDM 200. Connectors 292, 294, and 296 may be formed of any suitable conductive material (e.g., metal). Power connector 292 is used to supply power to components of IDM 200 from external power supply 290 (e.g., a battery). Control signal connector 294 and video data connector 296 are used to provide commands and video data from host platform 104 to IDM 200. The FPC 202 is made of a flexible or bendable material, allowing it to be installed in various devices with different form factors. The dimensions of the FPC 202 can be adjusted according to the requirements of, for example, the device on which it will be installed. For instance, the length of the FPC can be adjusted to accommodate various needs.

[0056] The liquid crystal assembly (LCA) 216 is formed of a silicon wafer (not shown), a liquid crystal layer (located between the alignment layer and the electrode layer and not shown), and a glass cover (not shown). The silicon wafer, the liquid crystal layer (and other layers) and the glass cover are discussed and described elsewhere herein. These components are integrated together to form a single device or unit (LCA 216).

[0057] The silicon chip 302 includes a display driving circuit 214 and a baseboard circuit 205. The display driving circuit 214 receives video data from the host platform 104, analyzes the data, and forwards the data to the baseboard circuit 205. The baseboard circuit 205 includes a pixel driving circuit 276 and a pixel logic circuit 272 that together form multiple pixels 270. The pixels 270 are driven by the combined operation of the display driving circuit 214 and the baseboard circuit 205 to display video data in the display area of ​​the LCA 216 and present the image to the user. The display area is defined by the liquid crystal layer and its length and width.

[0058] The display driver circuit (or logic) 214 includes a parser 224 and a cache 253. The baseboard circuit (or logic) 205 includes a loader 262 and a pixel array 240 (having multiple pixels 270).

[0059] In one embodiment of the invention, data and commands are combined on a single line (control signal connector 294 and video data connector 296), and the display driver circuit 214 receives the combined data from the host and converts the combined data into Serial Peripheral Interface (SPI) commands and bit-plane data. In one embodiment of the invention, the parser 224 receives the combined data, parses and / or separates the combined data into commands and image data. The data and commands may be stored at least temporarily in cache 253. The loader 262 and the SPI slave station receive SPI commands and convert them into parallel data and write strobes, and then transmit or output the data and strobes to multiple registers of the backplane circuitry. The pixel circuit 170 receives bit-plane data (e.g., the instantaneous brightness or intensity value of each pixel of the display) and modulates its output to control the intensity of the pixel. A pixel corresponds to a pixel electrode located on one side of the liquid crystal material and an electrode located on the other side of the liquid crystal material. In one embodiment of the present invention, the plurality of pixel electrodes are multiple independent electrodes, while the electrode located on the other side is a common electrode shared by the plurality of pixels. In one embodiment of the present invention, the pixel electrode is a reflective element. In one embodiment, the pixel electrode is a metal element. In one embodiment, the pixel electrode is a mirror element. In one embodiment, the pixel electrode is made of aluminum. In one embodiment, the common electrode is made of a conductive material. In one embodiment, the common electrode is made of indium tin oxide.

[0060] In one embodiment of the present invention, the SPI command is a command to write to an internal register or memory. In one embodiment of the present invention, the bit-plane data is data that determines or controls the pixel intensity when sequentially presented to the pixel array, and can be arranged into multiple word groups representing data of a series of pixels to be distributed in multiple rows, multiple columns, or multiple rectangular sub-regions in the pixel array 240.

[0061] In one embodiment of the present invention, each pixel (circuit) 270 includes a pixel logic circuit 272 connected to at least one transistor (memory element 274) and a pixel electrode (pixel driving circuit 276). In one embodiment of the present invention, the pixel logic circuit 272 includes logic elements (e.g., one or more logic gates or combinational logic circuits) that generate a digital output or value (e.g., an on or off value, or a one or zero value), which is output to one end of the transistor to which the logic element is connected. In one embodiment of the present invention, the transistor is a field-effect transistor (FET). In one embodiment of the present invention, the transistor is electrically coupled to a voltage source or a digital-to-analog converter (e.g., a biased digital-to-analog converter). In one embodiment of the present invention, the other end of the transistor is electrically coupled to a pixel electrode (pixel driving circuit 276) or a pixel element.

[0062] In one embodiment of the present invention, the pixel electrode is electrically coupled to a pixel element, such as a light-emitting diode or a micro light-emitting diode. For the purposes of this disclosure, reference to a light-emitting diode is also a reference to a micro light-emitting diode.

[0063] In one embodiment of the present invention, LCA 216 is a single integrated unit that integrates display driving circuitry 214 and substrate circuitry 205, as well as multiple pixel circuits. This integration can be accomplished by any suitable manufacturing process. The single integrated device or circuit (LCA 216) has multiple electronic components formed on, attached to, or associated with a silicon substrate or single-chip. The single integrated device or circuit (LCA 216) is practically separate from and distinct from other components of the IDM 200, such as PMICs and passive components. In several examples, the single integrated device or circuit (LCA 216) includes multiple (e.g., millions) transistors, resistors, capacitors, or other electrical or electronic components configured, arranged, and connected to implement the functions of all display driving circuitry 214, substrate circuitry 205, and pixel circuitry 270 within a silicon material, substrate, or wafer (e.g., a single silicon wafer). As described above, in one embodiment of the present invention, the single-integrated device or circuit (LCA 216) has a display area corresponding to at least a portion of the light emitted in the pixel array, or corresponding to a display area in the pixel array holding at least a portion of the liquid crystal material. Modulated light, patterned light, or an image is output from the liquid crystal component of the display area. In one embodiment of the present invention, the pixels 270 of the display generate images from the upper surface of the single-integrated circuit or output images in the display area. In one example, the single-integrated circuit has a size of 4 x 3 mm. Examples of other sizes are possible.

[0064] In other examples, IDM 200 includes power management circuitry 218 (e.g., one or more power management integrated circuits (PMICs)). The PMIC converts input voltage from, for example, an external power source (battery) 290 into one or more internal voltages, such as the internal voltages supplied to components of display driver circuitry 214 and backplane circuitry (logic) 205. The PMIC includes associated passive components, such as capacitors, inductors, and resistors, for programming and filtering these voltages. Other functions and components are possible.

[0065] In one embodiment of the present invention, the control circuitry or microcontroller integrated circuitry 220 may be included within the IDM. In one example, the microcontroller IC is used to manage multiple aspects of the operation of the integrated display module (IDM) 200 and / or the flexible printed circuit 202. These functions and operations of the control circuitry or microcontroller integrated circuitry 220 may include sequencing of power supply voltages (i.e., controlling the order of power-on), conversion of control signals or voltage-controlled inputs / outputs generated by the host, and storage and execution of control programs. In one embodiment of the present invention, the control program loads settings of one or both of the DDIC and DBIC and reacts to various events (e.g., temperature changes, lighting condition changes, etc.). In other examples, the microcontroller integrated circuitry 220 may generate alerts, information (e.g., regarding the temperature of the IDM 200), or other types of messages that the software on the host or in the embedded microcontroller will react to, such as turning off the display, changing operating parameters to adjust display performance under new conditions.

[0066] The IDM 200 may also include optional flash memory 221, which stores control programs executed by the microcontroller (microcontroller integrated circuit 220). As previously mentioned, the control programs can perform a variety of functions.

[0067] In one embodiment, the IDM 200 may additionally include a sensor coupled to the microcontroller (microcontroller integrated circuit 220). In another embodiment, the microcontroller (microcontroller integrated circuit 220) may receive information or instructions from the host platform 104 via data and / or control lines (control signal connector 294, video data connector 296).

[0068] Turning to Figures 3A, 3B, and 3C (collectively referred to as Figure 3), which show cross-sectional / side and top views of an embodiment of the IDM 300 according to the present invention. These figures depict the possible placement of some physical components in various aspects of the invention. It should be understood that the IDM 300 shown in Figure 3 (or the IDM shown in Figures 4 and 5) is not necessarily drawn to scale. Various sizes are possible and may depend in part on the requirements of the device using the IDM 300. In one embodiment, the IDM does not include flexible printed circuitry, while in other embodiments, it does include flexible printed circuitry.

[0069] The IDM of Figure 3 includes a single chip 302 (including display driver circuitry and baseboard circuitry). The chip 302 is integrated with pixel elements 340, alignment layer 398, liquid crystal layer 393, transparent electrode 399, and cover glass 312 to form an LCA 301 (e.g., LCA 216 of Figure 2A). The LCA 301 is mounted on one side of the FPC 306. In other respects, these components are mounted or coupled to the rigid portion 303 of the FPC 306, for example by soldering or other suitable electrical coupling methods. The functions of these components have been described above in conjunction with Figure 2 and will not be repeated here.

[0070] In several examples, the rigid portion 303 of FPC 306 refers herein to the portion of FPC 306 adjacent to, reinforced by, and / or strengthened by PCB 308. PCB 308 is made of a material such as BT epoxy resin.

[0071] A power management circuit 310 comprising multiple PMICs and / or passive components such as resistors, capacitors, inductors, and transistors is mounted on the other side of the FPC 306. This configuration allows for efficient use of surface area while reducing and optimizing the width and length required for the rigid portion. These dimensions depend on the desired size of the display area of ​​the LCA or display driver circuitry; two examples are mentioned to illustrate this.

[0072] The back side of FPC 306 is overmolded with a material, such as molding compound 304 (in one example, a composite material composed of, for example, epoxy resin, phenolic curing agent, silica, catalyst, pigment, and / or release agent), which mechanically and / or electrically protects the back side component. The molding compound also provides a flat surface for mounting one or more other components, such as heat dissipation devices, like radiators, pyrolytic graphite sheets, and / or thermoelectric coolers, to conduct heat away from heat sources (e.g., LCA 301 and PMICs 310) in IDM 300.

[0073] The LCA 301 comprises a silicon wafer having a display area 363, a peripheral seal (not shown), a cover glass 312, and a liquid crystal layer 393. In one example, the LCA 301 is mounted and then wire-bonded to the underlying FPC 306. Alternatively, the LCA may be mounted and wire-bonded to another rigid portion 303 of the PCB shown in FIG3 to provide a display area (shown in the top view of FIG3). In several orientations, wire bond members 316 are encapsulated to prevent or protect them from damage or corrosion. In several orientations, heat sinks 314 may be inserted to conduct heat from the wafer 302 to the overmolded component (i.e., the molding compound 304 on the back side of the FPC 306, which encapsulates the components on that side). A cross-connection (labeled "External X-over 311") from the back of the cover glass 312 to the FPC 306 or PCB 308 is provided to control the voltage on the cover glass 312 via the cross-connection (labeled "External X-over 311"). Through-holes 322 are drilled or punched to pass through the PCB 308 and FPC 306 for vertical electrical connections between components and also to provide heat dissipation for components such as chip 302.

[0074] In one embodiment, power is received through wire 305 and transmitted through via 322 to a power conversion circuit (power management circuit 310), where it is converted into a lower or higher voltage. The lower voltage is transmitted through another via 322B to wire 307, which transmits power to wire bonding and encapsulating adhesive 316 (wire). The wire bonding and encapsulating adhesive 316 (wire) are coupled to wafer 302. The lower voltage can then be applied to components within wafer 302.

[0075] The LCA 301 may be formed from a wafer 302, pixel elements 340, an alignment layer 398, a liquid crystal layer 393, a transparent electrode 399, and a cover glass 312. The pixel elements 340 may include reflective devices or layers, which may be an array of one or more pixels arranged on an aluminum layer (e.g., pixel array 240), or coupled or integrated with the wafer 302. The liquid crystal layer 393, the alignment layer 398, the transparent electrode (typically within an indium tin oxide layer) 399, and the cover glass 312 or other transparent material layers also form this structure.

[0076] Turning to Figures 4A, 4B, and 4C (collectively referred to as Figure 4), which depict another example of the IDM 400, including a cross-sectional / side view and a top view of the IDM 400. The components in Figure 4 correspond to the components with similar codes in Figure 3 (e.g., molding compound 404 in Figure 4 corresponds to molding compound 304 in Figure 3); the functions, operations, and structures of the similarly coded components are the same or similar, and will not be described further here.

[0077] In this embodiment, FPC 406 includes a rigid region 403. Here, the rigid region 403 of FPC 406 is a portion of FPC 406 sandwiched between two PCBs 408 and 409. The first PCB 408 is located on the front side of IDM 400, while the second PCB 409 is located on the rear side of IDM 400. In multiple orientations, the LCA is mounted and wire-bonded to another rigid PCB portion, as previously described. This embodiment provides additional rigidity to the rigid region 403, providing additional stability where the components of IDM 400 require extra stability.

[0078] Referring to Figures 5A, 5B, and 5C (collectively referred to as Figure 5), another example of the IDM 500 is depicted, including a cross-sectional / side view and a top view of the IDM 500. The components in Figure 5 correspond to the components with similar codes in Figures 3 and 4 (e.g., molding compound 504 in Figure 5 corresponds to molding compound 304 in Figure 3); the functions, operations, and structures of the similarly coded components are the same or similar, and will not be described further here.

[0079] In this example, FPC 506 is coupled to PCB 508, but the coupling occurs at end 530 of FPC 506 and end 532 of PCB 508. In other words, FPC 506 does not extend under the single integrated circuit 502. PCB 508 is a single printed circuit board and the single integrated circuit (including LCA) is directly coupled to PCB 508 without being coupled to FPC 506. In one embodiment, the attachment of PCB 508 to FPC 506 can be achieved via an anisotropic conductive film 523. Alternatively, other attachment methods may be used.

[0080] In several respects, the IDM described herein in Figures 3, 4, and 5 is a display system or device IDM. Compared to conventional systems and methods, the exemplary embodiments described herein offer numerous benefits and advantages. For example, the examples provide very small units that are easier to install and integrate into head-mounted augmented reality systems, requiring less external circuitry. This reduces the cost, size, and weight of the device, which is beneficial for various mobile applications. The IDM according to the invention described herein eliminates the need for an external driver IC (i.e., a driver IC outside the IDM). For example, some previous methods relied on external power conversion circuitry (outside the IDM), which resulted in excessively long power transmission paths, causing undesirable inductance and power loss. The PMIC provides local power regulation and power integrity to the components of the IDM, thus, for example, reducing undesirable inductance from long transmission lines and power loss from long or extended transmission lines. Furthermore, by establishing connections between the circuitry on both sides of the IDM, power and signal transmission is enhanced and routing congestion is reduced. The inclusion of multiple ICs and passive components within the IDM eliminates the burden of designing interconnections between them and the IDM's components, and ensures correct and consistent interaction between these components, making it easier for the IDM to be incorporated into other devices, such as smart glass or headphones.

[0081] Referring to Figure 6, manufacturing methods for IDM300, 400, and 500 are provided. Referring to Figure 6, a list of manufacturing steps that may be included in several examples of the manufacturing methods is described. It should be understood that the order of one or more of the following steps may be interchanged. Furthermore, one or more of these steps may be excluded.

[0082] In step 601, PCBs 308, 408, and 508 are manufactured or supplied in a multi-instance panel format using standard manufacturing methods to provide a rigid portion. A multi-instance panel format refers to multiple PCBs formed on a single structure and then separated into multiple independent boards. PCBs 308, 408, and 508 described herein can be single boards or multiple boards (PCBs 308 and 309, 408 and 409, 508 and 509).

[0083] In step 602, FPCs 306, 406 and 506 are manufactured or supplied. The FPCs may be supplied in a multi-sample panel format, with multiple independent FPCs separated from a single structure.

[0084] In step 603, FPCs 306, 406, and 506 are coupled or bonded to multiple PCB areas. In multiple areas, the bonding step is performed using mechanical means such as adhesives and pressure. It should be understood that the PCBs described herein can be single boards or multiple boards. In some examples, PCBs 308, 408, and 508 and FPCs 306, 406, and 506 are coupled to each other in a parallel relationship. In other examples, PCBs 308, 408, and 508 and FPCs 306, 406, and 506 can be coupled end-to-end. Other examples and arrangements for attaching PCBs and FPCs 306, 406, and 506 are also possible.

[0085] In step 604, through holes 322, 422, and 522 are drilled or punched to pass through PCBs 308, 408, and 508 and FPCs 306, 406, and 506 for vertical electrical connections between components. For this purpose, suitable drilling equipment or tools are used.

[0086] In step 605, through holes 322, 422, and 522 are plated or filled.

[0087] In step 606, LCA 301, 401, and 501 are provided. In one embodiment of the present invention, step 606 is performed using the following sub-steps: 1) forming silicon wafers 302, 402, 502 comprising all digital display circuits 214, base circuits 205, pixel elements 340, 440, 540, and alignment layers 398, 498, 598; 2) applying a peripheral sealing material by means of a roller and rolling on the wafer; 3) facing the silicon wafers with cover glass 312, 412, 512 coated with transparent conductive materials 399, 499, 599; 4) separating a plurality of LCAs from the wafer with the cover glass by a standard sawing method; and 5) filling the space enclosed by the glass, the silicon, and the peripheral seals 397, 497, 597 with liquid crystals 393, 493, 593, while filling the remaining openings of the peripheral seals 397, 497, 597 with a drop of adhesive to completely contain the liquid crystals 393, 493, 593.

[0088] In step 608, the back-side IC and passive components (power management circuit 310) are mounted on the panel of FPC 306, 406, 506 and PCB through standard soldering and / or reflow methods.

[0089] In step 609, the back side (second side 362) of the panel is overmolded to encapsulate one or more components on the back side (second side 362). The overmolding material (molding compound 304, 404, 504) may be epoxy resin and form a flat surface to facilitate attachment of other components or devices. Overmolding also protects the overmolded components.

[0090] In step 610, the separated LCA 301, 401, 501 are mounted to the front side (first side 361) of the panel using a suitable chip attachment material (e.g., epoxy resin or other materials).

[0091] In step 611, wire bonding members 316, 416, and 516 are wired from multiple pads on LCA (chip) 301, 401, and 501 to pins on FPC 306, 406, and 506 or PCB 308, 408, and 508. In step 612, the wire bonding members are encapsulated with encapsulating adhesive to provide mechanical protection. In step 613, IDM 300, 400, and 500 are separated from the panel using standard cutting or sawing methods. In step 614, cross-connections (external X-over 311, 411, and 511) are inserted using conductive epoxy resin, a combination of conductive epoxy resin and PCB material, or metal plated with Kovar (a nickel-cobalt alloy).

[0092] Referring to Figure 7, an example of a method for displaying images on a display area in a virtual or augmented reality system is illustrated.

[0093] In step 702, data or commands (such as images, videos or commands) transmitted through data and control connections are received at LCA 301, 401, and 501.

[0094] In step 704, LCA 301, 401, and 502 display images in display areas 363, 463, and 563. LCA 301, 401, and 501 are located on the first side of IDM 300, 400, and 500.

[0095] The second sides 362, 462, and 562 of IDM 300, 400, and 500 are arranged and formed generally parallel to the first sides 361, 461, and 561. The second sides 362, 462, and 562 are at least partially overmolded with a material to provide a generally flat surface. The generally flat surface facilitates attachment of the device to other components or devices.

[0096] In step 706, the image is viewed by the user. The user can view the image through the optical engine described herein.

[0097] Referring to Figure 8, a 3D depiction of IDM 800 and FPC 806 is shown. IDM 800 is similar to IDM 300 of Figure 3 and includes a single PCB 808. The LCA display area 801 is shown on the front side of IDM 800 and is used to present images to the user. Passive component 813 is located on the front side (while other passive components are located on the second side, which are not shown). Molding plastic 804 is disposed on the second side of IDM 800 and is the same as or similar to other molding plastics 304, 404, 504 described elsewhere herein. In addition, external cross-connects 811 and package leads 816 perform similar functions to external cross-connects (external X-overs 311, 411, 511) and wire bonding components and encapsulants 316, 416, and 516 described elsewhere herein.

[0098] As previously stated, a software module may contain logic executed by a processor. "Logic," as used herein and throughout this disclosure, means any information having instruction signals and / or data that can be applied to affect processor operation. Software is one example of such logic. Examples of processors include computer processors (processing units), microprocessors, digital signal processors, controllers, and microcontrollers. Logic may be formed from computer-readable instructions stored on a non-transitory computer-readable medium, such as memory or storage 25, including, for example, random access memory (RAM), read-only memory (ROM), erasable / electronically erasable rewritable read-only memory (EPROMs / EEPROMS), flash memory, etc. Logic may also contain digital and / or analog hardware circuitry, such as hardware circuitry containing logical AND, OR, XOR, NAND, NOR, and other logical operations. Logic may be formed by a combination of software and hardware. On a network, logic may be programmed on a server or a server complex. A specific logical unit is not limited to a single logical location on the network.

[0099] The processor may include commercially available processors, such as Intel's Celeron, Core, or Pentium processors, Sun Microsystems' SPARC processors, AMD's Athlon, Sempron, Phenom, or Opteron processors, other commercially available processors, and / or other available or future processors. Some embodiments of the processor may include so-called multi-core processors and / or be capable of employing parallel processing techniques in single-core or multi-core configurations. For example, a multi-core architecture typically includes two or more processor "execution cores." In this example, each execution core may execute as an independent processor, capable of executing multiple threads in parallel. Furthermore, those skilled in the art to which this application pertains will understand that the processor may be configured with an architecture commonly referred to as 32-bit or 64-bit, or other architectural configurations now known or potentially developed in the future. The operating system typically executed by the processor is, for example, an operating system of the type Windows from Microsoft; an operating system of the type Mac OS X from Apple; an operating system of the type Unix or Linux from many vendors or so-called open source; other or future operating systems; or some combination thereof. Operating systems connect to firmware and hardware in a well-known manner and facilitate the coordination and execution of various computer programs written in various programming languages ​​by the processor. Operating systems typically work in conjunction with the processor to coordinate and execute the functions of other computer components. Operating systems also provide scheduling, input / output control, file and data management, memory management, and communication control and related services based on known technologies. System memory may include any of a variety of known or future memory storage devices that can be used to store desired information and are accessible to the computer. Computer-readable storage media may include non-transitory and non-volatile, removable and non-removable media implemented in any way or by any technology to store information, such as computer-readable instructions, data structures, program modules, or other data. Examples include any commonly used random access memory (RAM), read-only memory (ROM), electronically eraseable rewritable read-only memory (EEPROM), optical disc (DVD), magnetic media such as resident hard disks or magnetic tapes, optical media such as read-write compressed discs, and / or other memory storage devices. Memory storage devices can include any of the various known or future devices, including optical disc drives, magnetic tape drives, removable disk drives, USB or flash drives, or floppy disk drives. This type of memory storage device typically reads and / or writes program storage media, such as optical discs, magnetic tapes, removable hard drives, USB or flash drives, or floppy disks. These program storage media, or any other program storage media currently in use or that may be developed in the future, can be considered computer program products. It is understood that these program storage media typically store computer software programs and / or data.Computer software programs, also known as computer control logic, are typically stored in system memory and / or a program storage device used in conjunction with memory storage. In some embodiments, the computer program product includes a computer-usable medium storing control logic (computer software containing program code). When the control logic is executed by a processor, it causes the processor to perform the various functions described herein. In other embodiments, some functions are implemented primarily in hardware using, for example, a hardware state machine. The implementation of a hardware state machine to perform the functions described herein is readily apparent to those skilled in the art. An input-output controller may include any of a variety of known devices for receiving or processing information from a user, whether the user is human or machine, and whether they are local or remote. Such devices include, for example, modem cards, wireless cards, network interface cards, audio cards, or other types of controllers for any of the various known input devices. An output controller may include a controller for presenting information to a user, whether the user is human or machine, and whether they are local or remote. In the embodiments described herein, the functional elements of the computer communicate with each other via system buses. Some embodiments of the computer may use networks or other types of remote communications to communicate with some functional elements. It will be apparent to those skilled in the art that instrument control and / or data processing applications, if implemented in software, can be loaded into and executed from system memory and / or memory storage devices. All or part of the instrument control and / or data processing applications may also reside in read-only memory or similar memory storage devices that do not require loading of the instrument control and / or data processing applications via an input-output controller. Those skilled in the art will understand that instrument control and / or data processing applications or portions thereof can be loaded by a processor into system memory or cache memory or both in a known manner to facilitate execution. Furthermore, the computer may include one or more library files, experimental data files, and Internet clients stored in system memory. For example, experimental data can include information about one or more experiments or measurements, such as detected signal values ​​or other values ​​related to experiments or processes involving sequencing by synthesis (SBS). Furthermore, the internet client can include applications that enable access to remote services on other computers via the internet, and may include, for example, something commonly referred to as a "web browser".In this example, some commonly used web browsers include Microsoft Internet Explorer, available from Microsoft Corporation; Mozilla Firefox, from Mozilla Corporation; Safari, from Apple Computer Corp.; Google Chrome, from Google Corporation; or other types of web browsers currently known in the art or to be developed in the future. Furthermore, in the same or other embodiments, the internet client may include (or may be a component thereof) a dedicated software application capable of accessing remote information over the network, such as a data processing application for biometric applications. A computer or processor may be part of a network. A network may include one or more of many types of networks known to those skilled in the art to which this applies. For example, a network may include a local or wide area network that may communicate using something commonly known as the TCP / IP protocol suite. A network may include a network of a global system comprising an interconnected computer network commonly known as the internet, or it may include various intranet architectures. Those skilled in the art will understand that some users in a network environment may prefer to use what is commonly known as a "firewall" (sometimes also called a packet, filter, or border protection device) to control the flow of information into and out of hardware and / or software systems. For example, a firewall can comprise hardware or software components or some combination thereof, and is typically designed to enforce security policies set by users (such as network administrators).

[0100] Those skilled in the art to which this case pertains will recognize that various modifications, alterations, and combinations can be made to the above embodiments without departing from the scope of the present invention, and such modifications, alterations, and combinations should be considered to be within the scope of the inventive concept. [Simplified Explanation of the Diagram]

[0004] This disclosure is illustrated and described with reference to various accompanying drawings, wherein, where appropriate, the same reference numerals are used to denote the same system components, wherein: FIG1 is a block diagram of a system using an integrated display module (IDM) according to various embodiments of the present invention; FIG2A is a block diagram of an IDM according to an embodiment of the present invention; FIG2B is a block diagram of a portion of the IDM depicted in FIG2A according to an embodiment of the present invention; FIG3A is a cross-sectional view of an embodiment of the IDM according to the present invention; FIG3B is a top view of the IDM of FIG3A according to the present invention; FIG3C is a cross-sectional view of the IDM of FIG3A and 3B according to the present invention; FIG4A is a cross-sectional view of another embodiment of the IDM according to the present invention; FIG4B is a top view of the IDM of FIG4A according to the present invention; FIG4C is a cross-sectional view of the IDM of FIG4A and 4B according to the present invention; FIG5A is a cross-sectional view of yet another embodiment of the IDM according to the present invention; FIG5B is a top view of the IDM of FIG5A according to the present invention. Figure 5C is a cross-sectional view of the IDM according to Figures 5A and 5B of the present invention; Figure 6 is a flowchart of a means of manufacturing an IDM according to an embodiment of the present invention; Figure 7 is an operation flowchart of an IDM according to an embodiment of the present invention; Figure 8 is a 3D view of an IDM according to an embodiment of the present invention.

[0005] For simplicity and clarity, the elements in the figures are illustrated, but not necessarily to scale. For example, the dimensions and / or relative positions of some elements in the figures may be exaggerated to aid in understanding the various embodiments of the invention. Furthermore, to facilitate a less obstructive understanding of these diverse embodiments of the invention, commonly known but useful or necessary elements in commercially viable embodiments are generally not depicted. Certain actions and / or steps may be described or depicted as occurring in a specific order; however, those skilled in the art will understand that such specificity of order is not practically necessary. Unless otherwise stated herein, the terminology and expressions used herein have their conventional technical meaning and are consistent with the terminology and expressions understood by those skilled in the art as described above.

Claims

1. An integrated display module, comprising: a liquid crystal assembly including a first substrate and a second substrate, wherein a liquid crystal material is disposed between the first substrate and the second substrate, and wherein the second substrate includes or is coupled to an array of a plurality of pixel elements, each of the pixel elements including a pixel electrode; a substrate circuit including a pixel circuit, wherein the pixel circuit is disposed and integrated in at least one of the second substrate, and wherein the pixel circuit is electrically coupled to at least one of the pixel electrodes; a display driving circuit electrically coupled to the pixel circuit, wherein the display driving circuit is disposed and integrated in at least one of the second substrate; and a printed circuit board including a first side and a second side opposite to the first side; A flexible printed circuit is coupled to the first side of the printed circuit board, such that at least a portion of the flexible printed circuit is disposed between the printed circuit board and the liquid crystal assembly, the liquid crystal assembly, the baseboard circuit, and the display driving circuit are coupled to the printed circuit board; the flexible printed circuit includes a plurality of conductive lines, wherein the conductive lines are coupled to the liquid crystal assembly, the baseboard circuit, and the display driving circuit; the conductive lines are configured to provide an electrical interface to a host outside the integrated display module; the second substrate is coupled to the first side of the printed circuit board; And a molding portion, the molding portion being such that the printed circuit board is coupled to the second side of the printed circuit board between the molding portion and the portion of the flexible printed circuit board, and is formed on the second side of the printed circuit board.

2. The integrated display module as claimed in claim 1, wherein the flexible printed circuit electrically couples an external power supply to a power management circuit on the printed circuit board.

3. The integrated display module as claimed in claim 2, wherein the flexible printed circuit is fixedly coupled to the printed circuit board.

4. The integrated display module as described in claim 2, wherein the molded portion encapsulates the power management circuitry.

5. The integrated display module as claimed in claim 1, wherein the molded portion is made of an insulating material.

6. The integrated display module as claimed in claim 1, wherein one end of each of the conductive lines is coupled to a first connector.

7. The integrated display module as claimed in claim 6, wherein the printed circuit board includes a second connector electrically coupled to the first connector.

8. The integrated display module as described in any of claims 1 to 7, wherein the structure of the printed circuit board is more rigid than the structure of the flexible printed circuit.

9. The integrated display module as claimed in any of claims 1 to 7, wherein a first portion of the flexible printed circuit covers and is attached to the printed circuit board to form a rigid portion of the integrated display module, and a second portion of the flexible printed circuit does not cover the printed circuit board and forms a flexible portion of the integrated display module, and the flexible portion is less rigid than the rigid portion.

10. A system comprising: a host computer; and an integrated display module coupled to the host computer, the integrated display module comprising: a liquid crystal assembly including a first substrate and a second substrate, wherein a liquid crystal material is disposed between the first substrate and the second substrate, and wherein the second substrate includes or is coupled to an array of a plurality of pixel elements, each of the pixel elements including a pixel electrode; a substrate circuit including a pixel circuit, wherein the pixel circuit is disposed and integrated in at least one of the second substrate, and wherein the pixel circuit is electrically coupled to at least one of the pixel electrodes; a display driving circuit electrically coupled to the pixel circuit, wherein the display driving circuit is disposed and integrated in at least one of the second substrate; and a printed circuit board including a first side and a second side opposite to the first side; A flexible printed circuit is coupled to the first side of the printed circuit board, such that at least a portion of the flexible printed circuit is disposed between the printed circuit board and the liquid crystal assembly, the liquid crystal assembly, the base circuit, and the display driving circuit are coupled to the printed circuit board; the flexible printed circuit includes a plurality of conductive lines, wherein the conductive lines are coupled to the liquid crystal assembly, the base circuit, and the display driving circuit; the conductive lines are configured to provide an electrical interface between the integrated display module and the host; the second substrate is coupled to the first side of the printed circuit board; And a molding portion, the molding portion being such that the printed circuit board is coupled to the second side of the printed circuit board between the molding portion and the portion of the flexible printed circuit board, and is formed on the second side of the printed circuit board.

Images