Ultrasonic fingerprint recognition module and method for manufacturing the same

Abstract

An ultrasonic fingerprint recognition module and its manufacturing method are disclosed. The method includes: providing a bare glass substrate; forming a first metal wire layer on the substrate, having a plurality of first wires extending along a first direction and integrally formed first contact areas and second contact areas; forming a piezoelectric layer in a portion of the first metal wire layer, exposing the first contact areas and the second contact areas; forming a second metal wire layer on the piezoelectric layer, including a plurality of second wires extending along a second direction and electrically connected to the second contact areas; and forming a protective layer on the second metal wire layer. The first contact areas and the second contact areas are respectively used to connect an algorithm chip and a power control chip. This invention simplifies the structure, reduces process precision requirements, and contributes to the thinning and improved stability of the module.

Claims

1. An ultrasonic fingerprint recognition module, comprising: a substrate made of plain glass and having an upper surface; a first metal conductive layer disposed on the upper surface, comprising: a plurality of first conductive lines extending along a first direction; a first contact area electrically connected to the first conductive lines; and a second contact area adjacent to the first contact area; a piezoelectric layer disposed on a portion of the first metal conductive layer and exposing the first contact area and the second contact area; a second metal conductive layer disposed on the piezoelectric layer, comprising: a plurality of second conductive lines extending along a second direction perpendicular to the first direction, and the second conductive lines electrically connected to the second contact area; and a protective layer covering the second metal conductive layer; wherein... The first contact area and the second contact area include multiple contacts for electrically connecting an algorithm chip and a power control chip, respectively, and are integrally formed from the first metal conductor layer.

2. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thickness of the substrate is between 50 and 150 micrometers.

3. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the first metal wire layer and the second metal wire layer are MoAlMo or Cu / Ti metal materials.

4. The ultrasonic fingerprint recognition module as claimed in claim 1 further includes an ITO conductive film disposed on the surface of the first metal conductor layer, the thickness of the ITO conductive film being between 0.05 and 0.1 micrometers.

5. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thicknesses of the first metal wire layer and the second metal wire layer are respectively between 0.5 and 1 micrometer.

6. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the thickness of the piezoelectric layer is between 5 and 15 micrometers.

7. The ultrasonic fingerprint recognition module as claimed in claim 1, wherein the protective layer is a polymer coating with a thickness between 5 and 20 micrometers.

8. A method for manufacturing an ultrasonic fingerprint recognition module, comprising the following steps: S10, providing a substrate, the substrate being made of plain glass and having an upper surface; S20, forming a first metal wire layer on the upper surface, the first metal wire layer comprising: a plurality of first wires extending along a first direction; a first contact area electrically connected to the first wires; and a second contact area adjacent to the first contact area; S30, forming a piezoelectric layer in a portion of the first metal wire layer, thereby exposing the first contact area and the second contact area; S40, forming a second metal wire layer on the piezoelectric layer, the second metal wire layer comprising a plurality of second wires extending along a second direction perpendicular to the first direction, and electrically connecting the second wires to the exposed second contact area; and S50, forming a protective layer on the second metal wire layer to cover the second metal wire layer; In step S20, the first contact area and the second contact area include a plurality of contacts for electrically connecting an algorithm chip and a power control chip, respectively, and are integrally formed during the formation of the first metal wire layer.

9. The method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S10 includes thinning the substrate so that the thickness of the substrate is between 50 and 150 micrometers.

10. A method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S20 comprises depositing MoAlMo or Cu / Ti metal material by PVD sputtering to form the first metal wire layer, the thickness of the first metal wire layer being between 0.5 and 1 micrometer.

11. The method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S20 includes forming an ITO conductive film on the surface of the first metal conductor layer, the thickness of the ITO conductive film being between 0.05 and 0.1 micrometers.

12. The method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S40 comprises depositing MoAlMo or Cu / Ti metal material by PVD sputtering to form the second metal wire layer, the thickness of the second metal wire layer being between 0.5 and 1 micrometer.

13. The method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S30 involves coating or printing a piezoelectric material onto the first metal wire layer to form the piezoelectric layer, the thickness of which is between 5 and 15 micrometers.

14. A method for manufacturing an ultrasonic fingerprint recognition module as claimed in claim 8, wherein step S50 comprises coating or printing a polymer material onto the second metal wire layer to form the protective layer, the protective layer having a thickness between 5 and 20 micrometers.

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