Thermal interface material

Abstract

This invention relates to a thermally conductive interface material, which is mainly formed by mixing a thermosetting matrix, a metal thermally conductive powder, and a catalyst. Specifically, this invention uses metal thermally conductive powder with micron- or even nano-sized particles, ensuring uniform distribution of the powder within the material and reducing gaps in the heat conduction path to improve heat transfer efficiency. Furthermore, the metal thermally conductive powder undergoes surface modification treatment to enhance its compatibility with the thermosetting matrix, reduce interfacial thermal resistance, and minimize powder agglomeration. Therefore, this invention effectively improves the processability and stability of the thermally conductive interface material.

Claims

1. A thermally conductive interface material comprising a thermosetting matrix, a metal thermally conductive powder, and a catalyst, wherein the thermosetting matrix, the metal thermally conductive powder, and the catalyst are mixed to form the thermally conductive interface material, the thermosetting matrix comprising a thermosetting resin, a reactive monomer, an inhibitor, and a dispersant, wherein the thermosetting resin, the reactive monomer, the inhibitor, and the dispersant are mixed to form the thermosetting matrix, the thermosetting resin comprising a combination of vinyl MQ resin, hydrogen-terminated polydimethylsiloxane, and methylhydrosiloxane, and the metal thermally conductive powder being surface-modified. The metal thermally conductive powder has a particle size of 100 nanometers to 20 micrometers, a D90 to D50 ratio of 3.0, a thermosetting resin weight percentage of 6.5 to 10 wt%, a reactive monomer weight percentage of 3 to 4 wt%, an inhibitor weight percentage of 0.2 to 0.3 wt%, a dispersant weight percentage of 0.2 to 0.5 wt%, a metal thermally conductive powder weight percentage of 85 to 90 wt%, and a catalyst weight percentage of 0.1 to 0.2 wt%.

2. The thermally conductive interface material as described in claim 1, wherein, The surface modification treatment of the thermally conductive metal powder is to coat the surface of the thermally conductive metal powder with an oxide layer.

3. The thermally conductive interface material as described in claim 1, wherein, The surface modification treatment of this thermally conductive metal powder is performed by modifying it with a silane coupling agent.

4. The thermally conductive interface material as described in claim 1, wherein, The thermally conductive metal powder is conductive copper powder.

5. The thermally conductive interface material as described in claim 1, wherein, The median particle size of this thermally conductive metal powder is 0.1~10 micrometers.

6. The thermally conductive interface material as described in claim 1, wherein, The particle morphology of this thermally conductive metal powder includes one or a combination of spherical, flake, and dendritic shapes.

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